CN111933621A - Electromagnetic shielding packaging structure and manufacturing method thereof - Google Patents
Electromagnetic shielding packaging structure and manufacturing method thereof Download PDFInfo
- Publication number
- CN111933621A CN111933621A CN202010627806.9A CN202010627806A CN111933621A CN 111933621 A CN111933621 A CN 111933621A CN 202010627806 A CN202010627806 A CN 202010627806A CN 111933621 A CN111933621 A CN 111933621A
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- chip
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- 238000004806 packaging method and process Methods 0.000 title claims abstract description 18
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 10
- 239000000758 substrate Substances 0.000 claims abstract description 52
- 239000002184 metal Substances 0.000 claims abstract description 28
- 239000005022 packaging material Substances 0.000 claims abstract description 12
- 238000000034 method Methods 0.000 claims description 11
- 239000000463 material Substances 0.000 claims description 5
- 238000003466 welding Methods 0.000 claims description 3
- 238000009434 installation Methods 0.000 claims description 2
- 238000000926 separation method Methods 0.000 claims description 2
- 238000012858 packaging process Methods 0.000 abstract 1
- 229940125898 compound 5 Drugs 0.000 description 3
- 238000004100 electronic packaging Methods 0.000 description 3
- 238000000465 moulding Methods 0.000 description 3
- 238000005192 partition Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 230000002093 peripheral effect Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 230000009466 transformation Effects 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/552—Protection against radiation, e.g. light or electromagnetic waves
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
- H01L21/4814—Conductive parts
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- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Health & Medical Sciences (AREA)
- Electromagnetism (AREA)
- Toxicology (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Abstract
The invention relates to an electromagnetic shielding packaging structure and a manufacturing method thereof, wherein the packaging structure comprises a substrate, a substrate circuit and a grounding pad are arranged on the surface of the substrate, a chip is arranged in the region of the grounding pad, the chip is installed laterally, the internal grounding circuit is exposed on the side surface of the chip, a metal layer covers the back surface of the chip, the grounding circuit and the metal layer exposed at the bottom of the chip are electrically connected with the grounding pad, a plurality of electronic elements are arranged on the substrate circuit, the chip is positioned among the plurality of electronic elements, a plastic packaging material is packaged at the periphery of the chip and the plurality of electronic elements, the top of the chip is exposed out of the surface of the plastic packaging material, an electromagnetic shielding layer is arranged on the surface of the plastic packaging material, and the grounding circuit and the metal layer exposed. The side-mounted chip is used as an inner electromagnetic shielding layer to isolate the influence among electronic elements, and the packaging process steps and the packaging size are reduced.
Description
Technical Field
The invention relates to an electromagnetic shielding packaging structure and a manufacturing method thereof, belonging to the technical field of semiconductor packaging.
Background
At present, most of common electronic packaging modules use packaging materials to package various electronic components, and under the trend of miniaturization, the density of the whole electronic packaging module is higher and higher, and in addition, electronic products have more and more functions, so that the types of the electronic components integrated in the electronic packaging module are more and more, and therefore, electromagnetic interference can occur among different electronic components.
To reduce the mutual influence between various electronic components, such as the electromagnetic interference effect, an inner electromagnetic shielding layer is usually designed in the electronic package module to isolate different electronic components. In the traditional mode, an independent electromagnetic shielding layer is used as an inner electromagnetic shielding layer to isolate the influence among electronic elements, the design elasticity of a product packaging structure is low, the product size is large, and the cost is high.
Disclosure of Invention
The technical problem to be solved by the present invention is to provide an electromagnetic shielding package structure and a method for manufacturing the same, wherein a metal layer is prepared on the back surface of a chip, the chip is laterally mounted, one end of the metal layer on the back surface of the chip is connected with a grounding circuit on a substrate, the other end of the metal layer is connected with an outer shielding layer, the laterally mounted chip is used as an inner electromagnetic shielding layer to isolate the influence among electronic elements, and the package process steps and the package size are reduced.
The technical scheme adopted by the invention for solving the problems is as follows: the utility model provides an electromagnetic shielding packaging structure, it includes the base plate, including two at least divisions, arbitrary division sets up an electronic component at least, adjacent division is through the chip separation of a lateral direction installation, the chip back covers there is the metal level, the inside ground connection circuit is exposed to the chip side, the substrate surface is equipped with base plate circuit and ground pad, ground connection circuit and metal level and ground pad electric connection, chip and electronic component and base plate circuit electric connection, chip and electronic component peripheral encapsulation have the plastic envelope material.
The top of the optional chip is exposed out of the surface of the plastic packaging material, an electromagnetic shielding layer is arranged on the surface of the plastic packaging material, and the grounding circuit and the metal layer exposed out of the side face of the chip are connected with the electromagnetic shielding layer.
An optional electromagnetic shield layer covers the substrate sides.
Optionally, the substrate surface is provided with at least one groove, and the ground pad is disposed in the groove.
Optionally, the ground pad is lower than the top surface of the substrate.
Optionally, the width of the groove is greater than the thickness of the chip.
Optionally, the width of the groove is between 200 μm and 450 μm.
Optionally, the front surface of the chip is electrically connected to the substrate circuit through the bump.
Optionally, the thickness of the chip is between 100 μm and 350 μm.
A method of manufacturing an electromagnetically shielded package structure, the method comprising the steps of:
the method comprises the following steps that firstly, a substrate is taken, and the substrate comprises a substrate circuit and a grounding welding disc;
step two, mounting a plurality of electronic elements on a substrate line of the substrate;
step three, installing at least one chip on the side of the substrate grounding pad area, wherein the back surface of the side-installed chip is covered with a metal layer, the side surface of the chip exposes the internal grounding circuit, the side-installed chip is installed among a plurality of electronic elements, and the side grounding circuit and the back metal layer of the side-installed chip are electrically connected with the grounding pad;
encapsulating the side-mounted chip and the plurality of electronic elements through a plastic packaging material to form a packaging body, wherein the top of the side-mounted chip is exposed out of the plastic packaging material;
step five, dividing the whole packaged product into single packaged products;
and sixthly, forming an electromagnetic shielding layer on the periphery of the single packaged product, and connecting the side grounding circuit exposed from the top of the side-mounted chip and the back metal layer with the electromagnetic shielding layer to form a final electromagnetic shielding packaging structure.
Optionally, at least one groove is formed in the surface of the substrate in the first step, and the ground pad is disposed in the groove.
Optionally, the front surface of the side-mounted chip in the third step is electrically connected to the circuit of the substrate through the bump.
Compared with the prior art, the invention has the advantages that:
the invention relates to an electromagnetic shielding packaging structure and a manufacturing method thereof, wherein a metal layer is prepared on the back surface of a chip, the chip is laterally arranged, one end of the metal layer on the back surface of the chip is connected with a grounding bonding pad on a substrate, the other end of the metal layer is connected with a peripheral shielding layer, the laterally arranged chip is used as an inner electromagnetic shielding layer to isolate electromagnetic interference among electronic elements, the packaging flow steps are simple, and the packaging size is small.
Drawings
Fig. 1 is a schematic diagram of an electromagnetic shielding package structure according to the present invention.
Fig. 2 to 8 are schematic process flow diagrams of a method for manufacturing an electromagnetic shielding package structure according to the present invention, wherein fig. 4 is a top view of fig. 3, and fig. 6 is a top view of fig. 5.
Wherein:
An electromagnetic shield layer 6.
Detailed Description
The invention is described in further detail below with reference to the accompanying examples.
As shown in fig. 1, the electromagnetic shielding package structure according to the present invention includes a substrate 1, where the substrate 1 includes at least two partitions, where at least one electronic component 3 is disposed in any partition, the adjacent partitions are separated by a chip 2 mounted in a lateral direction, a metal layer 22 covers a back surface of the chip 2, an internal ground circuit 21 is exposed at a side surface of the chip 2, a substrate circuit 11 and a ground pad 13 are disposed on a surface of the substrate 1, the ground circuit 21 and the metal layer 22 are electrically connected to the ground pad 13, the chip 2 and the electronic component 3 are electrically connected to the substrate circuit 11, and a molding compound 5 is encapsulated around the chip 2 and the electronic component 3;
the top of the chip 2 is exposed out of the upper surface of the plastic package material 5, the surface of the plastic package material 5 is provided with an electromagnetic shielding layer 6, and the grounding circuit 21 and the metal layer 22 exposed out of the side surface of the chip 2 are connected with the electromagnetic shielding layer 6;
the electromagnetic shielding layer 6 covers the side surface of the substrate 1;
the surface of the substrate is provided with at least one groove 12, the grounding pad 13 is arranged in the groove 12, and the chip 2 is laterally arranged in the groove 12 through the grounding pad 13;
the ground pad 13 is lower than the top surface of the substrate 1;
the width of the groove 12 is larger than the thickness of the chip 2;
the thickness of the chip 2 is between 100 and 350 μm;
optionally, the front surface of the chip is electrically connected with the substrate circuit through a bump;
the width of the groove 12 is between 200 μm and 450 μm.
The manufacturing method comprises the following steps:
step one, as shown in fig. 2, a substrate 1 is taken, the substrate 1 includes a substrate line 11 and a groove 12, a ground pad 13 is arranged in the groove 12, and the ground pad 13 is exposed on the surface of the substrate 1;
step two, as shown in fig. 3 and 4, mounting a plurality of electronic components 3 on a substrate circuit of a substrate, wherein the electronic components 3 are electrically connected with the substrate circuit;
step three, as shown in fig. 5 and fig. 6, at least one chip 2 is installed on the side of the ground pad area of the substrate, the back surface of the chip 2 is covered with a metal layer 22, the side surface of the chip 2 exposes the internal ground circuit 21, the chip 2 is installed among the plurality of electronic components 3, the side surface ground circuit 21 and the metal layer 22 exposed at the bottom of the chip 2 are electrically connected with the ground pad 13, the front surface of the chip 2 is electrically connected with the substrate circuit 11 through the bump 4, and the front surface of the chip 2 can also be electrically connected with the substrate circuit 11 through a bonding wire;
step four, as shown in fig. 7, encapsulating the chip 2 and the plurality of electronic elements 3 by using a molding compound 5 to form a package body, and exposing the top of the side-mounted chip to the molding compound 5 by using a mechanical grinding or laser removal mode;
step five, dividing the whole packaged product into single packaged products;
step six, as shown in fig. 8, an electromagnetic shielding layer 6 is formed on the periphery of the single packaged product by sputtering, and the side grounding circuit 21 exposed from the top of the side-mounted chip and the back metal layer are connected with the electromagnetic shielding layer 6, so as to form the final electromagnetic shielding packaging structure.
In addition, the present invention also includes other embodiments, and any technical solutions formed by equivalent transformation or equivalent replacement should fall within the protection scope of the claims of the present invention.
Claims (11)
1. An electromagnetic shielding packaging structure, characterized in that: it includes base plate (1), base plate (1) includes two at least divisions, arbitrary division sets up an electronic component (3) at least, adjacent division is through chip (2) separation of a side direction installation, chip (2) back cover has metal level (22), chip (2) side exposes inside ground connection (21), base plate (1) surface is equipped with base plate circuit (11) ground connection pad (13), ground connection (21) and metal level (22) and ground connection pad (13) electric connection, chip (2) and electronic component (3) and base plate circuit (11) electric connection, chip (2) and electronic component (3) periphery are sealed and are had plastic envelope material 5.
2. The electromagnetic shielding package structure of claim 1, wherein: the top of the chip (2) is exposed out of the upper surface of the plastic packaging material (5), an electromagnetic shielding layer (6) is arranged on the surface of the plastic packaging material (5), and a grounding circuit (21) and a metal layer (22) which are exposed out of the side surface of the chip (2) are connected with the electromagnetic shielding layer (6).
3. An electromagnetic shielding package as claimed in claim 2, wherein: the electromagnetic shielding layer (6) covers the side face of the substrate (1).
4. The electromagnetic shielding package structure of claim 1, wherein: the surface of the substrate (1) is provided with at least one groove (12), and the grounding pad (13) is arranged in the groove (12).
5. An electromagnetic shielding package structure according to claim 4, wherein: the grounding pad (13) is lower than the top surface of the substrate (1).
6. An electromagnetic shielding package structure according to claim 4, wherein: the width of the groove (12) is larger than the thickness of the chip (2).
7. The electromagnetic shielding package structure of claim 1, wherein: the front surface of the chip (2) is electrically connected with the substrate circuit (11) through the bump (4).
8. The electromagnetic shielding package structure of claim 1, wherein: the thickness of the chip (2) is between 100 and 350 μm.
9. A method for manufacturing an electromagnetic shielding package structure, the method comprising the steps of:
the method comprises the following steps that firstly, a substrate is taken, and the substrate comprises a substrate circuit and a grounding welding disc;
step two, mounting a plurality of electronic elements on a substrate line of the substrate;
step three, installing at least one chip on the side of the substrate grounding pad area, wherein the back surface of the side-installed chip is covered with a metal layer, the side surface of the chip exposes the internal grounding circuit, the side-installed chip is installed among a plurality of electronic elements, and the side grounding circuit and the back metal layer of the side-installed chip are electrically connected with the grounding pad;
encapsulating the side-mounted chip and the plurality of electronic elements through a plastic packaging material to form a packaging body, wherein the top of the side-mounted chip is exposed out of the plastic packaging material;
step five, dividing the whole packaged product into single packaged products;
and sixthly, forming an electromagnetic shielding layer on the periphery of the single packaged product, and connecting the side grounding circuit exposed from the top of the side-mounted chip and the back metal layer with the electromagnetic shielding layer to form a final electromagnetic shielding packaging structure.
10. The method of claim 9, wherein: the surface of the substrate in the first step is provided with at least one groove, and the grounding welding disc is arranged in the groove.
11. The method of claim 10, wherein: and in the third step, the front surface of the chip is electrically connected with the circuit of the substrate through the bump.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010627806.9A CN111933621A (en) | 2020-07-01 | 2020-07-01 | Electromagnetic shielding packaging structure and manufacturing method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010627806.9A CN111933621A (en) | 2020-07-01 | 2020-07-01 | Electromagnetic shielding packaging structure and manufacturing method thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN111933621A true CN111933621A (en) | 2020-11-13 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202010627806.9A Pending CN111933621A (en) | 2020-07-01 | 2020-07-01 | Electromagnetic shielding packaging structure and manufacturing method thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN111933621A (en) |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20100219522A1 (en) * | 2009-03-02 | 2010-09-02 | Shinko Electric Industries Co., Ltd. | Semiconductor device and method of manufacturing the same, and electronic apparatus |
| CN104347595A (en) * | 2013-07-31 | 2015-02-11 | 环旭电子股份有限公司 | Electronic packaging module and manufacturing method thereof |
| CN104659022A (en) * | 2015-02-12 | 2015-05-27 | 苏州日月新半导体有限公司 | Wire-bonded shielding structure and preparation method thereof |
| CN106653703A (en) * | 2015-11-04 | 2017-05-10 | 美光科技公司 | Package-on-package structure |
-
2020
- 2020-07-01 CN CN202010627806.9A patent/CN111933621A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20100219522A1 (en) * | 2009-03-02 | 2010-09-02 | Shinko Electric Industries Co., Ltd. | Semiconductor device and method of manufacturing the same, and electronic apparatus |
| CN104347595A (en) * | 2013-07-31 | 2015-02-11 | 环旭电子股份有限公司 | Electronic packaging module and manufacturing method thereof |
| CN104659022A (en) * | 2015-02-12 | 2015-05-27 | 苏州日月新半导体有限公司 | Wire-bonded shielding structure and preparation method thereof |
| CN106653703A (en) * | 2015-11-04 | 2017-05-10 | 美光科技公司 | Package-on-package structure |
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Application publication date: 20201113 |
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| RJ01 | Rejection of invention patent application after publication |