CN111923258B - 一种双态循环富集技术的硅片酸性切割方法 - Google Patents
一种双态循环富集技术的硅片酸性切割方法 Download PDFInfo
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- CN111923258B CN111923258B CN202010684234.8A CN202010684234A CN111923258B CN 111923258 B CN111923258 B CN 111923258B CN 202010684234 A CN202010684234 A CN 202010684234A CN 111923258 B CN111923258 B CN 111923258B
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- ball
- silicon wafer
- steel wire
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- 239000002253 acid Substances 0.000 title claims abstract description 53
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 title claims abstract description 46
- 229910052710 silicon Inorganic materials 0.000 title claims abstract description 46
- 239000010703 silicon Substances 0.000 title claims abstract description 46
- 238000005520 cutting process Methods 0.000 title claims abstract description 44
- 238000000034 method Methods 0.000 title claims abstract description 19
- 238000005516 engineering process Methods 0.000 title claims abstract description 12
- 239000002184 metal Substances 0.000 claims abstract description 46
- 229910000831 Steel Inorganic materials 0.000 claims abstract description 41
- 239000010959 steel Substances 0.000 claims abstract description 41
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 38
- 235000012431 wafers Nutrition 0.000 claims description 38
- 238000012216 screening Methods 0.000 claims description 36
- NLXLAEXVIDQMFP-UHFFFAOYSA-N Ammonia chloride Chemical compound [NH4+].[Cl-] NLXLAEXVIDQMFP-UHFFFAOYSA-N 0.000 claims description 34
- 239000004005 microsphere Substances 0.000 claims description 34
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 claims description 17
- 235000019270 ammonium chloride Nutrition 0.000 claims description 17
- 239000000843 powder Substances 0.000 claims description 17
- 230000008093 supporting effect Effects 0.000 claims description 16
- KRHYYFGTRYWZRS-UHFFFAOYSA-N Fluorane Chemical compound F KRHYYFGTRYWZRS-UHFFFAOYSA-N 0.000 claims description 14
- 239000000956 alloy Substances 0.000 claims description 14
- 239000007789 gas Substances 0.000 claims description 13
- 229910001030 Iron–nickel alloy Inorganic materials 0.000 claims description 7
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 claims description 7
- 238000010438 heat treatment Methods 0.000 claims description 7
- KHYBPSFKEHXSLX-UHFFFAOYSA-N iminotitanium Chemical compound [Ti]=N KHYBPSFKEHXSLX-UHFFFAOYSA-N 0.000 claims description 7
- 239000011810 insulating material Substances 0.000 claims description 7
- 229910001000 nickel titanium Inorganic materials 0.000 claims description 7
- 229910017604 nitric acid Inorganic materials 0.000 claims description 7
- 229910001285 shape-memory alloy Inorganic materials 0.000 claims description 7
- 239000004065 semiconductor Substances 0.000 claims description 6
- 238000009413 insulation Methods 0.000 claims description 5
- 230000009466 transformation Effects 0.000 claims description 4
- 230000009471 action Effects 0.000 claims description 3
- 230000007797 corrosion Effects 0.000 claims description 3
- 238000005260 corrosion Methods 0.000 claims description 3
- 229910000041 hydrogen chloride Inorganic materials 0.000 claims description 3
- IXCSERBJSXMMFS-UHFFFAOYSA-N hydrogen chloride Substances Cl.Cl IXCSERBJSXMMFS-UHFFFAOYSA-N 0.000 claims description 3
- 210000000110 microvilli Anatomy 0.000 claims description 3
- 238000002955 isolation Methods 0.000 claims 2
- 230000000694 effects Effects 0.000 abstract description 18
- 230000008859 change Effects 0.000 abstract description 7
- 230000005389 magnetism Effects 0.000 description 22
- 230000008014 freezing Effects 0.000 description 6
- 238000007710 freezing Methods 0.000 description 6
- 238000004519 manufacturing process Methods 0.000 description 4
- 238000007873 sieving Methods 0.000 description 4
- 230000002209 hydrophobic effect Effects 0.000 description 3
- 239000011148 porous material Substances 0.000 description 3
- 238000000926 separation method Methods 0.000 description 3
- 230000002902 bimodal effect Effects 0.000 description 2
- 239000008188 pellet Substances 0.000 description 2
- 230000001737 promoting effect Effects 0.000 description 2
- 230000003134 recirculating effect Effects 0.000 description 2
- 230000002378 acidificating effect Effects 0.000 description 1
- 238000004364 calculation method Methods 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 238000000354 decomposition reaction Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/04—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Magnetic Treatment Devices (AREA)
Abstract
Description
Claims (6)
Priority Applications (1)
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CN202010684234.8A CN111923258B (zh) | 2020-07-16 | 2020-07-16 | 一种双态循环富集技术的硅片酸性切割方法 |
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CN202010684234.8A CN111923258B (zh) | 2020-07-16 | 2020-07-16 | 一种双态循环富集技术的硅片酸性切割方法 |
Publications (2)
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CN111923258A CN111923258A (zh) | 2020-11-13 |
CN111923258B true CN111923258B (zh) | 2021-12-14 |
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CN202010684234.8A Active CN111923258B (zh) | 2020-07-16 | 2020-07-16 | 一种双态循环富集技术的硅片酸性切割方法 |
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Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102172998A (zh) * | 2011-03-04 | 2011-09-07 | 郑州人造金刚石及制品工程技术研究中心有限公司 | 钢丝芯线游离切割线及其制备方法 |
CN103286867A (zh) * | 2013-06-04 | 2013-09-11 | 衡水英利新能源有限公司 | 硅片切割用钢线及其制备方法 |
CN105856444A (zh) * | 2015-02-06 | 2016-08-17 | 黄炳照 | 基板及其加工方法与装置 |
CN110281408A (zh) * | 2019-07-02 | 2019-09-27 | 西安奕斯伟硅片技术有限公司 | 一种硅棒的多线切割方法及装置 |
CN110625835A (zh) * | 2019-09-12 | 2019-12-31 | 西安奕斯伟硅片技术有限公司 | 一种硅片成型加工方法 |
-
2020
- 2020-07-16 CN CN202010684234.8A patent/CN111923258B/zh active Active
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102172998A (zh) * | 2011-03-04 | 2011-09-07 | 郑州人造金刚石及制品工程技术研究中心有限公司 | 钢丝芯线游离切割线及其制备方法 |
CN103286867A (zh) * | 2013-06-04 | 2013-09-11 | 衡水英利新能源有限公司 | 硅片切割用钢线及其制备方法 |
CN105856444A (zh) * | 2015-02-06 | 2016-08-17 | 黄炳照 | 基板及其加工方法与装置 |
CN110281408A (zh) * | 2019-07-02 | 2019-09-27 | 西安奕斯伟硅片技术有限公司 | 一种硅棒的多线切割方法及装置 |
CN110625835A (zh) * | 2019-09-12 | 2019-12-31 | 西安奕斯伟硅片技术有限公司 | 一种硅片成型加工方法 |
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CN111923258A (zh) | 2020-11-13 |
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Effective date of registration: 20211126 Address after: 222000 No. 14, Keji Second Road, private park, high tech Industrial Development Zone, Lianyun District, Lianyungang City, Jiangsu Province Applicant after: Lianyungang Qixiang Electronics Co.,Ltd. Address before: 556600 No.20 Jianglou village, Tianzhu County, Qiandongnan Miao and Dong Autonomous Prefecture, Guizhou Province Applicant before: Li Jiaxing |
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GR01 | Patent grant | ||
PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of invention: An acid cutting method for silicon wafers with dual-state cyclic enrichment technology Effective date of registration: 20230113 Granted publication date: 20211214 Pledgee: Lianyungang Branch of Suzhou Bank Co.,Ltd. Pledgor: Lianyungang Qixiang Electronics Co.,Ltd. Registration number: Y2023320010046 |
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PE01 | Entry into force of the registration of the contract for pledge of patent right | ||
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Granted publication date: 20211214 Pledgee: Lianyungang Branch of Suzhou Bank Co.,Ltd. Pledgor: Lianyungang Qixiang Electronics Co.,Ltd. Registration number: Y2023320010046 |
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PC01 | Cancellation of the registration of the contract for pledge of patent right |