CN111921868A - Method and device for sorting multilayer ceramic capacitors - Google Patents
Method and device for sorting multilayer ceramic capacitors Download PDFInfo
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- CN111921868A CN111921868A CN202010737653.3A CN202010737653A CN111921868A CN 111921868 A CN111921868 A CN 111921868A CN 202010737653 A CN202010737653 A CN 202010737653A CN 111921868 A CN111921868 A CN 111921868A
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B07—SEPARATING SOLIDS FROM SOLIDS; SORTING
- B07B—SEPARATING SOLIDS FROM SOLIDS BY SIEVING, SCREENING, SIFTING OR BY USING GAS CURRENTS; SEPARATING BY OTHER DRY METHODS APPLICABLE TO BULK MATERIAL, e.g. LOOSE ARTICLES FIT TO BE HANDLED LIKE BULK MATERIAL
- B07B13/00—Grading or sorting solid materials by dry methods, not otherwise provided for; Sorting articles otherwise than by indirectly controlled devices
- B07B13/04—Grading or sorting solid materials by dry methods, not otherwise provided for; Sorting articles otherwise than by indirectly controlled devices according to size
- B07B13/05—Grading or sorting solid materials by dry methods, not otherwise provided for; Sorting articles otherwise than by indirectly controlled devices according to size using material mover cooperating with retainer, deflector or discharger
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B07—SEPARATING SOLIDS FROM SOLIDS; SORTING
- B07B—SEPARATING SOLIDS FROM SOLIDS BY SIEVING, SCREENING, SIFTING OR BY USING GAS CURRENTS; SEPARATING BY OTHER DRY METHODS APPLICABLE TO BULK MATERIAL, e.g. LOOSE ARTICLES FIT TO BE HANDLED LIKE BULK MATERIAL
- B07B13/00—Grading or sorting solid materials by dry methods, not otherwise provided for; Sorting articles otherwise than by indirectly controlled devices
- B07B13/14—Details or accessories
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Abstract
The invention relates to a sorting method and a sorting device for a multilayer ceramic capacitor, belonging to the technical field of electronic elements. The invention provides a sorting device which is composed of a guide plate provided with a plurality of straight cylindrical first through holes and a positioning plate provided with a plurality of truncated cone-shaped second through holes and is used for sorting multilayer ceramic capacitors, so that good products and defective products with small differences in thickness can be separated at different positions in the second through holes, high-precision sorting of the poor products with ultra-differences in thickness is realized, and the production qualification rate and the reliability of small-size multilayer ceramic capacitors are improved.
Description
Technical Field
The invention relates to a sorting method and a sorting device for a multilayer ceramic capacitor, belonging to the technical field of electronic elements.
Background
Generally, a process for manufacturing a multilayer ceramic capacitor includes forming an electrode pattern on a ceramic film which is not sintered by a screen printing method, laminating a plurality of ceramic films on which the electrode pattern is formed and a plurality of ceramic films on which the electrode pattern is not formed in a predetermined order, cutting the laminated body into rectangular parallelepiped bodies, removing a binder, sintering the laminated body to densify the laminated body into a ceramic body having dielectric properties, and forming external electrodes on both ends of the ceramic body to manufacture a multilayer ceramic capacitor.
In the manufacturing process of the multilayer ceramic capacitor, the thickness of a part of the capacitor is abnormal due to the occurrence of an abnormal number of stacked ceramic sheets during lamination, an abnormal thickness of the ceramic sheets, or the like, and a defective product having an excessive thickness may be present in the whole batch of capacitor products. These defective products are generally found in the manufacturing process until the capacitor is cut and molded into a rectangular parallelepiped laminate, and at this time, the defective products are mixed in a large amount of products, and the uniformity of the product size is deteriorated. For capacitors with larger size specifications, the thickness difference between good products and defective products is generally larger, and the sorting is easier, but for capacitors with small sizes such as 0201 specification, 01005 specification, 008004 specification, the thickness difference between good products and defective products is very small, the sorting is very difficult, and the conventional sorting device is difficult to meet the high precision requirement. Such defective products with an excessive thickness will eventually adversely affect the taping of the capacitor and the mounting of the wiring board.
The demand for small-sized multilayer ceramic capacitors for miniaturization and multi-functionalization of electronic devices is increasing, and multilayer ceramic capacitors of 008004 size, which are used in larger and smaller quantities, are also beginning to be applied to small-sized portable devices such as smart phones, so that the problem of poor product sorting due to the over-thickness of the small-sized multilayer ceramic capacitors is urgently needed to be solved.
Disclosure of Invention
The invention aims to overcome the defects of the prior art and provide a method and a device for sorting a multilayer ceramic capacitor, which can sort defective products with ultra-poor thickness of small-size multilayer ceramic capacitors with high precision.
In order to achieve the purpose, the invention adopts the technical scheme that: the sorting device for the multilayer ceramic capacitors comprises a guide plate and a positioning plate, wherein the guide plate is provided with a plurality of first through holes, the first through holes are in a straight cylindrical shape, and the depth of each first through hole is not less than one half of the length of each multilayer ceramic capacitor; the positioning plate is provided with a plurality of second through holes, the second through holes are in a round table shape, the diameter of the lower bottom surfaces of the second through holes is larger than the diagonal length of the multilayer ceramic capacitor, the difference between the diameter of the lower bottom surfaces of the second through holes and the diagonal length of the multilayer ceramic capacitor is not larger than 0.05mm, the diameter of the upper bottom surfaces of the second through holes is smaller than the diameter of the lower bottom surfaces of the second through holes, and the included angle between a bus of each second through hole and the axis of the second through hole is 1-5 degrees.
The invention provides a sorting device which is composed of a guide plate provided with a plurality of straight cylindrical first through holes and a positioning plate provided with a plurality of truncated cone-shaped second through holes and is used for sorting multilayer ceramic capacitors, so that good products and defective products with small differences in thickness can be separated at different positions in the second through holes, and high-precision sorting of the defective products with ultra-poor thicknesses is realized.
In a preferred embodiment of the sorting apparatus of the present invention, the depth of the first through hole is 0.8 to 1.2 times the length of the multilayer ceramic capacitor.
As a preferred embodiment of the sorting apparatus of the present invention, the number of the second through holes is equal to the number of the first through holes, and the distribution positions of the second through holes correspond to the first through holes one to one. That is, when the guide plate and the positioning plate are stacked up and down, all the first through holes and the second through holes can be completely aligned one by one.
In a preferred embodiment of the sorting apparatus of the present invention, an angle between a generatrix of the second through hole and an axis of the second through hole is 2 ° to 3 °.
In a preferred embodiment of the sorting apparatus according to the present invention, the diameter of the bottom surface of the first through-hole is 0.09mm to 0.73 mm. In order to facilitate the introduction of the multilayer ceramic capacitor having a small size, the diameter D1 of the bottom surface of the first via hole may be generally 0.09mm to 0.73 mm.
In a preferred embodiment of the sorting apparatus according to the present invention, the diameter of the lower bottom surface of the second through hole is 0.09mm to 0.68mm, and the diameter of the upper bottom surface of the second through hole is 0.08mm to 0.65 mm.
In a preferred embodiment of the sorting apparatus according to the present invention, the multilayered ceramic capacitor is a finished product of a multilayered ceramic capacitor or a semi-finished product of a multilayered ceramic capacitor, and the semi-finished product of a multilayered ceramic capacitor is an unsintered laminate or a sintered ceramic body.
The multilayer ceramic capacitor according to the present invention may be a finished product of a multilayer ceramic capacitor, or may be a semi-finished product of a multilayer ceramic capacitor such as an unsintered laminate or a sintered ceramic body, but preferably a laminate, that is, in order to achieve a good sorting effect, sorting should be performed after the division molding and before sintering in the process of manufacturing the multilayer ceramic capacitor. Because the ceramic body or the finished product of the multilayer ceramic capacitor shrinks after being sintered and has a smaller size than the laminated body, the size difference between a good product and a defective product is reduced, and the sorting difficulty is increased; the laminated body is not sintered, so that the sorting of defective products with ultra-poor thickness is relatively easy.
In a preferred embodiment of the sorting apparatus according to the present invention, the multilayer ceramic capacitor is a 0201, 01005 or 008004-sized multilayer ceramic capacitor.
The invention also provides a method for sorting the multilayer ceramic capacitor, which comprises the following steps:
(1) sequentially overlapping the guide plate and the positioning plate from top to bottom to enable the guide plate and the positioning plate to be tightly attached, and enabling the positions of the first through hole and the second through hole to be staggered with each other, so that the first through hole is completely shielded by the positioning plate, and then leading the multilayer ceramic capacitors into the first through hole;
the guide plate and the positioning plate are sequentially overlapped from top to bottom, so that the guide plate and the positioning plate are tightly attached, and the positions of the first through hole and the second through hole are staggered, so that the first through hole is completely shielded by the positioning plate. If the guide plate and the positioning plate are not closely attached, the multilayer ceramic capacitor easily enters into the gap between the guide plate and the positioning plate, which hinders the introduction operation. Then, a plurality of multilayer ceramic capacitors are placed on a surface of the guide plate on a side thereof facing away from the positioning plate, and the multilayer ceramic capacitors are caused to jump by applying a vibrating force to the guide plate so as to easily fall into the first through-holes with the short side surfaces as front ends. At this time, since the first through hole is completely shielded by the positioning plate, the multilayer ceramic capacitor is held by the positioning plate.
The depth of the first through hole is 0.8-1.2 times of the length of the multilayer ceramic capacitor, and the depth of the first through hole is too small to be conveniently led into the multilayer ceramic capacitor; if the depth of the first through hole is too large, it is likely that two multilayer ceramic capacitors are housed in one through hole and overlapped up and down, and the sorting may be disturbed.
(2) The guide plate and the positioning plate are relatively moved while keeping a close fit state, so that the first through hole and the second through hole are completely aligned, and the multilayer ceramic capacitor falls into the second through hole;
the guide plate and the positioning plate move relatively while keeping a close fit state, and after all the first through holes and the second through holes are completely aligned one by one, vibration force can be applied to the guide plate, so that the multilayer ceramic capacitor jumps, and the multilayer ceramic capacitor is made to fall into the second through holes. Since the guide plate has corrected the orientation of the multilayer ceramic capacitor in step (1) such that the short side faces toward the second through-holes, the multilayer ceramic capacitor is relatively liable to fall into the second through-holes.
When the diameter of the lower bottom surface of the second through hole is greater than the diagonal length of the multilayer ceramic capacitor and the difference between the diameter of the lower bottom surface and the diagonal length of the multilayer ceramic capacitor is not greater than 0.05mm, the multilayer ceramic capacitor can easily enter the first through hole by taking the short side surface as the front end, and can not enter the first through hole by taking other surfaces which are not short side surfaces as the front end, and after the multilayer ceramic capacitor enters the first through hole, the multilayer ceramic capacitor does not have too much vacant active space, namely, the first through hole just holds the multilayer ceramic capacitor.
(3) Removing the guide plate, and applying a vibration force to the positioning plate to enable the multilayer ceramic capacitors with different thicknesses to be positioned at different height positions in the second through hole;
and removing the guide plate, and applying vibration force to the positioning plate to enable the multilayer ceramic capacitor to fall to the lowest position in the second through hole allowed by the size of the multilayer ceramic capacitor. That is, the multilayer ceramic capacitor having a larger thickness is located higher in the second through hole than the multilayer ceramic capacitor having a smaller thickness. Good products with qualified thickness and defective products with out-of-thickness are positioned at different heights in the second through hole and are separated.
The second through hole is in a circular truncated cone shape, the included angle theta between the generatrix of the circular truncated cone and the axis of the circular truncated cone is 1-5 degrees, preferably 2-3 degrees, good products and defective products with small thickness differences are easy to form enough distance in height in the second through hole, and sorting is convenient.
(4) Taking out the multilayer ceramic capacitor at the higher position in the second through hole, and leaving the multilayer ceramic capacitor at the lower position in the second through hole to finish the sorting of the multilayer ceramic capacitors;
the multilayer ceramic capacitor located higher in the second through-hole may be sucked out using a magnet while leaving the multilayer ceramic capacitor located lower, or the multilayer ceramic capacitor located higher may be caused to protrude a small portion from the surface of the aligning plate while the multilayer ceramic capacitor located lower is entirely within the second through-hole, so that the multilayer ceramic capacitor partially protruding from the surface of the aligning plate is stuck out using, for example, a film.
The invention is particularly suitable for small-size multilayer ceramic capacitors with the specifications of 0201, 01005, 008004 and the like, but the invention can also be used for multilayer ceramic capacitors with the specifications of 0201 and above, and only the relevant sizes of the guide plate, the positioning plate and the first through hole and the second through hole need to be adjusted. In addition, the present invention is not limited to the application to the multilayer ceramic capacitor, and may be applied to other kinds of chip-type ceramic electronic components such as a chip resistor and a chip inductor.
In the step (4), the multi-layer ceramic capacitor at the higher position in the second through hole is sucked out by using a magnet, or the multi-layer ceramic capacitor partially protruding from the surface of the positioning plate is stuck out by using a film.
Compared with the prior art, the invention has the beneficial effects that: the invention provides a sorting device which is composed of a guide plate provided with a plurality of straight cylindrical first through holes and a positioning plate provided with a plurality of truncated cone-shaped second through holes and is used for sorting multilayer ceramic capacitors, so that good products and defective products with small differences in thickness can be separated at different positions in the second through holes, high-precision sorting of the poor products with ultra-differences in thickness is realized, and the production qualification rate and the reliability of small-size multilayer ceramic capacitors are improved.
Drawings
Fig. 1 is an external view of a multilayer ceramic capacitor.
Fig. 2 is a plan view of a guide plate of the multilayer ceramic capacitor sorting apparatus.
FIG. 3 is a sectional view of a guide plate of a sorting apparatus for multilayer ceramic capacitors taken along the direction I-I.
Fig. 4 is a plan view of a positioning plate of the multilayer ceramic capacitor sorting apparatus.
FIG. 5 is a sectional view of the positioning plate of the multilayer ceramic capacitor sorting apparatus taken along the direction II-II.
Fig. 6 is a flow chart of a sorting method of the multilayer ceramic capacitor.
Fig. 7 is a sectional view of the multilayer ceramic capacitor introduced into the first via hole in step (1) of the sorting method of the multilayer ceramic capacitor.
Fig. 8 is a sectional view of the multilayer ceramic capacitor introduced into the second via hole in step (2) of the sorting method of the multilayer ceramic capacitor.
Fig. 9 is a plan view of the multilayer ceramic capacitor in the second via hole in step (3) of the sorting method of the multilayer ceramic capacitor.
Fig. 10 is a sectional view of the multilayer ceramic capacitor in the iii-iii direction in the second via hole in step (3) of the sorting method of the multilayer ceramic capacitor.
The multilayer ceramic capacitor comprises a substrate, a conducting plate, a locating plate, a multilayer ceramic capacitor, a first through hole, a second through hole and a conducting plate, wherein the conducting plate is 1, the conducting plate is 2, the locating plate is 3, the multilayer ceramic capacitor is 12, and the first through hole is 22.
Detailed Description
To better illustrate the objects, aspects and advantages of the present invention, the present invention will be further described with reference to specific examples.
Example 1
An external view of the multilayer ceramic capacitor is schematically shown in fig. 1, and for convenience of description, a surface formed by a width (W) and a thickness (T) of the rectangular parallelepiped multilayer ceramic capacitor is referred to as a short side surface. The length of the diagonal of the short side is S.
A sorting device for a multilayer ceramic capacitor comprises a guide plate and a positioning plate.
A top view of a guide plate of a multilayer ceramic capacitor sorting apparatus is shown in FIG. 2, and a cross-sectional view of the guide plate of the multilayer ceramic capacitor sorting apparatus taken along the direction I-I is shown in FIG. 3, the guide plate being provided with a plurality of first through-holes 12. The first through hole is in the shape of a right cylinder. In order to facilitate the introduction of the multilayer ceramic capacitor having a small size, the diameter D1 of the bottom surface of the first via hole may be generally 0.09mm to 0.73 mm.
The depth of the first through hole, namely the thickness of the guide plate, is H which is more than or equal to 0.5L, preferably, H is more than or equal to 0.8L and less than or equal to 1.2L.
A plan view of the positioning plate of the multilayer ceramic capacitor sorting apparatus is shown in FIG. 4, a sectional view of the positioning plate of the multilayer ceramic capacitor sorting apparatus in a direction II-II is shown in FIG. 5, and the positioning plate is provided with a plurality of second through holes. Preferably, the number of the second through holes 22 is equal to the number of the first through holes 12, and the distribution positions of the second through holes correspond to the first through holes one by one, that is, when the guide plate and the positioning plate are stacked up and down, all the first through holes and the second through holes may be completely aligned one by one.
The shape of the second through hole is a circular truncated cone, the diameter of the lower bottom surface of the second through hole is D2, and S is more than D2 and less than or equal to S +0.05 mm. D2 may be generally in the range 0.09mm to 0.68 mm. The diameter of the upper bottom surface of the second through hole is D3, D3 < D2. D3 may be generally in the range 0.08mm to 0.65 mm. The included angle theta between the generatrix of the second through hole and the axis of the second through hole is 1-5 degrees, preferably 2-3 degrees.
The multilayer ceramic capacitor according to the present invention may be a finished product of a multilayer ceramic capacitor, or may be a semi-finished product of a multilayer ceramic capacitor such as an unsintered laminate or a sintered ceramic body, but preferably a laminate, that is, in order to achieve a good sorting effect, sorting should be performed after the division molding and before sintering in the process of manufacturing the multilayer ceramic capacitor. Because the ceramic body or the finished product of the multilayer ceramic capacitor shrinks after being sintered and has a smaller size than the laminated body, the size difference between a good product and a defective product is reduced, and the sorting difficulty is increased; the laminated body is not sintered, so that the sorting of defective products with ultra-poor thickness is relatively easy.
As shown in fig. 6, the flow chart of the sorting method of the multilayer ceramic capacitor includes the following steps:
As shown in fig. 7, a sectional view of the multilayer ceramic capacitor introduced into the first through hole is shown, and the guide plate 1 and the positioning plate 2 are sequentially stacked from top to bottom so that the guide plate and the positioning plate are closely attached, and the positions of the first through hole 12 and the second through hole 22 are shifted from each other, so that the first through hole is completely blocked by the positioning plate. If the guide plate and the positioning plate are not closely attached, the multilayer ceramic capacitor easily enters into the gap between the guide plate and the positioning plate, which hinders the introduction operation. Then, a plurality of multilayer ceramic capacitors 3 are placed on the surface of the lead plate on the side thereof facing away from the positioning plate, and the multilayer ceramic capacitors are caused to jump by applying a vibrating force to the lead plate so as to easily fall into the first through-holes with the short side surfaces as the front ends. At this time, since the first through hole is completely shielded by the positioning plate, the multilayer ceramic capacitor is held by the positioning plate.
The depth H of the first through hole is preferably more than or equal to 0.8L and less than or equal to 1.2L, and H is too small to be conveniently led into the multilayer ceramic capacitor; if H is too large, two multilayer ceramic capacitors stacked one on top of the other are likely to be accommodated in one through hole, and this may disturb the sorting.
And 2, relatively moving the guide plate and the positioning plate while keeping the guide plate and the positioning plate in a tightly attached state, and completely aligning the first through hole and the second through hole, so that the multilayer ceramic capacitor falls into the second through hole.
The sectional view of the multilayer ceramic capacitor introduced into the second through hole is shown in fig. 8, so that the guide plate and the positioning plate move relatively while keeping a close fit state, and after all the first through holes and the second through holes are completely aligned one by one, a vibration force can be applied to the guide plate to bounce the multilayer ceramic capacitor, and the multilayer ceramic capacitor is enabled to fall into the second through hole. Since the orientation of the multilayer ceramic capacitor has been corrected by the jig in step 1 such that the short side faces toward the second via hole, the multilayer ceramic capacitor is relatively liable to fall into the second via hole.
When S is more than D2 and is less than or equal to S +0.05mm, the multilayer ceramic capacitor can easily enter the first through hole by taking the short side face as the front end, but can not enter the first through hole by taking other faces which are not short side faces as the front ends, and after the multilayer ceramic capacitor enters the first through hole, no too much vacant active space exists, namely, the first through hole just holds the multilayer ceramic capacitor.
And 3, removing the guide plate, and applying vibration force to the positioning plate to enable the multilayer ceramic capacitors with different thicknesses to be positioned at different heights in the second through hole.
A plan view of the multilayer ceramic capacitor in the second through-hole is shown in FIG. 9, a sectional view of the multilayer ceramic capacitor in the second through-hole in the III-III direction is shown in FIG. 10, and the guide plate is removed and a vibrating force is applied to the positioning plate to allow the multilayer ceramic capacitor to fall to the lowest position in the second through-hole allowed by its own size. That is, the multilayer ceramic capacitor having a larger thickness is located higher in the second through hole than the multilayer ceramic capacitor having a smaller thickness. Good products with qualified thickness and defective products with out-of-thickness are positioned at different heights in the second through hole and are separated.
The second through hole is in a circular truncated cone shape, the included angle theta between the generatrix of the circular truncated cone and the axis of the circular truncated cone is 1-5 degrees, preferably 2-3 degrees, good products and defective products with small thickness differences are easy to form enough distance in height in the second through hole, and sorting is convenient.
And 4, taking out the multilayer ceramic capacitor at the higher position in the second through hole, and leaving the multilayer ceramic capacitor at the lower position in the second through hole to finish the sorting of the multilayer ceramic capacitors.
The multilayer ceramic capacitor located higher in the second through-hole may be sucked out using a magnet while leaving the multilayer ceramic capacitor located lower, or the multilayer ceramic capacitor located higher may be caused to protrude a small portion from the surface of the aligning plate while the multilayer ceramic capacitor located lower is entirely within the second through-hole, so that the multilayer ceramic capacitor partially protruding from the surface of the aligning plate is stuck out using, for example, a film.
The invention is particularly suitable for small-size multilayer ceramic capacitors with the specifications of 0201, 01005, 008004 and the like, but the invention can also be used for multilayer ceramic capacitors with the specifications of 0201 and above, and only the relevant sizes of the guide plate, the positioning plate and the first through hole and the second through hole need to be adjusted. In addition, the present invention is not limited to the application to the multilayer ceramic capacitor, and may be applied to other kinds of chip-type ceramic electronic components such as a chip resistor and a chip inductor.
Finally, it should be noted that the above embodiments are only used for illustrating the technical solutions of the present invention and not for limiting the protection scope of the present invention, and although the present invention is described in detail with reference to the preferred embodiments, it should be understood by those skilled in the art that modifications or equivalent substitutions can be made on the technical solutions of the present invention without departing from the spirit and scope of the technical solutions of the present invention.
Claims (10)
1. The sorting device for the multilayer ceramic capacitors is characterized by comprising a guide plate and a positioning plate, wherein the guide plate is provided with a plurality of first through holes, the first through holes are in a straight cylindrical shape, and the depth of each first through hole is not less than one half of the length of each multilayer ceramic capacitor; the positioning plate is provided with a plurality of second through holes, the second through holes are in a round table shape, the diameter of the lower bottom surfaces of the second through holes is larger than the diagonal length of the multilayer ceramic capacitor, the difference between the diameter of the lower bottom surfaces of the second through holes and the diagonal length of the multilayer ceramic capacitor is not larger than 0.05mm, the diameter of the upper bottom surfaces of the second through holes is smaller than the diameter of the lower bottom surfaces of the second through holes, and the included angle between a bus of each second through hole and the axis of the second through hole is 1-5 degrees.
2. The sorting apparatus according to claim 1, wherein the depth of the first through-hole is 0.8 to 1.2 times the length of the multilayer ceramic capacitor.
3. The sorting device according to claim 1, wherein the number of the second through holes is equal to the number of the first through holes, and the distribution positions of the second through holes correspond to the first through holes one to one.
4. The sorting device according to claim 1, wherein the generatrix of the second through-hole has an angle of 2 ° to 3 ° with the axis of the second through-hole.
5. The sorting apparatus according to claim 1, wherein the first through-hole has a bottom surface diameter of 0.09mm to 0.73 mm.
6. The sorting apparatus according to claim 1, wherein the diameter of the lower bottom surface of the second through hole is 0.09mm to 0.68mm, and the diameter of the upper bottom surface of the second through hole is 0.08mm to 0.65 mm.
7. The sorting apparatus according to claim 1, wherein the multilayer ceramic capacitor is a finished product of a multilayer ceramic capacitor or a semi-finished product of a multilayer ceramic capacitor, and the semi-finished product of a multilayer ceramic capacitor is an unsintered laminate or a sintered ceramic body.
8. The sorting apparatus of claim 1, wherein the multilayer ceramic capacitor is a small size multilayer ceramic capacitor of 0201, 01005, or 008004 gauge.
9. A method for sorting a multilayer ceramic capacitor, comprising the steps of:
(1) sequentially overlapping the guide plate and the positioning plate from top to bottom to enable the guide plate and the positioning plate to be tightly attached, and enabling the positions of the first through hole and the second through hole to be staggered with each other, so that the first through hole is completely shielded by the positioning plate, and then leading the multilayer ceramic capacitors into the first through hole;
(2) the guide plate and the positioning plate are relatively moved while keeping a close fit state, so that the first through hole and the second through hole are completely aligned, and the multilayer ceramic capacitor falls into the second through hole;
(3) removing the guide plate, and applying a vibration force to the positioning plate to enable the multilayer ceramic capacitors with different thicknesses to be positioned at different height positions in the second through hole;
(4) and taking out the multilayer ceramic capacitor at the higher position in the second through hole, and leaving the multilayer ceramic capacitor at the lower position in the second through hole to finish the sorting of the multilayer ceramic capacitors.
10. The method as set forth in claim 9, wherein in the step (4), the removing operation is to suck out the multilayer ceramic capacitor located at a higher position in the second through hole by using a magnet or to stick out the multilayer ceramic capacitor partially protruding from the surface of the positioning plate by using a film.
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| CN213001282U (en) * | 2020-07-28 | 2021-04-20 | 广东风华高新科技股份有限公司 | Sorting unit of multilayer ceramic capacitor |
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2020
- 2020-07-28 CN CN202010737653.3A patent/CN111921868B/en active Active
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
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| US3698552A (en) * | 1969-12-29 | 1972-10-17 | Paul Wittmann | Sorting machine |
| JPS5919574A (en) * | 1982-07-23 | 1984-02-01 | 株式会社日立製作所 | Selector for surface and back of press punched disk part |
| WO2014053820A1 (en) * | 2012-10-01 | 2014-04-10 | Baird Nicholas Basil | Fruit and vegetable sorting device |
| CN104525485A (en) * | 2014-12-25 | 2015-04-22 | 常州商瑞服饰有限公司 | Circular-truncated-cone workpiece sorting mechanism |
| CN105000334A (en) * | 2015-06-10 | 2015-10-28 | 北京领邦仪器技术有限公司 | Gravity separating mechanism of vibrating disk |
| CN207056975U (en) * | 2017-06-01 | 2018-03-02 | 广东风华高新科技股份有限公司 | Ceramic body sorting unit |
| CN213001282U (en) * | 2020-07-28 | 2021-04-20 | 广东风华高新科技股份有限公司 | Sorting unit of multilayer ceramic capacitor |
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