CN111906399A - Single-side welding method for slab gain medium - Google Patents
Single-side welding method for slab gain medium Download PDFInfo
- Publication number
- CN111906399A CN111906399A CN202010620207.4A CN202010620207A CN111906399A CN 111906399 A CN111906399 A CN 111906399A CN 202010620207 A CN202010620207 A CN 202010620207A CN 111906399 A CN111906399 A CN 111906399A
- Authority
- CN
- China
- Prior art keywords
- welding
- film
- slab
- lath
- heat sink
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/008—Soldering within a furnace
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/04—Heating appliances
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S3/00—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
- H01S3/02—Constructional details
- H01S3/04—Arrangements for thermal management
- H01S3/0405—Conductive cooling, e.g. by heat sinks or thermo-electric elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S3/00—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
- H01S3/02—Constructional details
- H01S3/04—Arrangements for thermal management
- H01S3/042—Arrangements for thermal management for solid state lasers
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Mechanical Engineering (AREA)
- Plasma & Fusion (AREA)
- Optics & Photonics (AREA)
- Laser Beam Processing (AREA)
Abstract
The invention discloses a method for welding a single surface of a slab gain medium, which combines a heat sink and a slab laser medium after pretreatment in sequence from bottom to top to obtain a welding module; and carrying out vacuum welding on the welding module through electromagnetic heating. The method of the invention carries out vacuum welding on the welding module through electromagnetic heating, realizes the uniform heating of the heat sink, reduces the generation of welding stress and improves the beam quality and reliability of the welding module.
Description
Technical Field
The invention relates to the technical field of solid lasers, in particular to a single-side welding method for a slab gain medium.
Background
The slab laser is a high-power solid block laser, a gain medium of the slab laser has the shape of a slab, the width-thickness ratio of the slab is generally more than 2, and under the premise of uniform pumping and uniform cooling of a radiating surface, the thermal effect in the thickness direction of the slab can be effectively compensated due to the geometric symmetry and the zigzag light path of the slab gain medium. Therefore, the thermal performance of the strip is better than that of a rod-shaped gain medium, and high-power and high-beam-quality laser output is easy to realize. Thus, ideally, the first order thermal effects caused by the non-uniform temperature distribution across the thickness are eliminated and the slab laser can be operated at high power levels limited only by the material stress cracking limit.
Slab lasers are typically heat-dissipating using conduction cooling. The plate gain medium is directly arranged on the solid radiator, heat is conducted to the radiator through the plate, and then natural cooling or forced cooling is carried out to dissipate heat. In order to improve the heat dissipation performance of the strip gain medium, on one hand, pure copper with high heat conductivity and a micro-channel structure designed inside is used as a heat sink, on the other hand, indium solder with good heat conductivity and low melting point is used as a connecting layer of the strip and the heat sink, and the strip and the heat sink are combined through a vacuum brazing method. In a vacuum welding furnace, a welding module consisting of a lath and a heat sink is heated by controlling a heating element, the heat is conducted very slowly from outside to inside in a vacuum environment, the heating distribution of the module is uneven, the reaction degree of welding materials in all areas of a welding layer and a base material is different, and after welding is finished, the module has great welding stress. The existence of welding stress can cause severe thermal stress birefringence, thermal lens effect and other effects of the welding module, thereby influencing the beam quality and reliability of the slab laser.
Disclosure of Invention
The embodiment of the invention provides a method for welding a single surface of a slab gain medium, which utilizes an electromagnetic heating technology to realize uniform heating of a heat sink, melts solder on the surface of the heat sink, completes the welding process of the slab gain medium and the heat sink, reduces the generation of welding stress, and improves the beam quality and reliability of a welding module.
The embodiment of the invention provides a single-side welding method for a batten gain medium, which comprises the following steps:
combining the heat sink after pretreatment and the lath laser medium in sequence from bottom to top to obtain a welding module;
and carrying out vacuum welding on the welding module through electromagnetic heating.
Optionally, the pre-processing of the heat sink and slab laser medium comprises:
and carrying out film coating treatment on the welding surface of the heat sink and the surface of the lath laser medium.
Optionally, performing film plating treatment on the welding surface of the heat sink and the surface of the slab laser medium, including:
plating a first gold film and an indium film on the welding surface of the heat sink; and the number of the first and second groups,
and after the lath laser medium with the surface plated with the optical film is subjected to protection treatment, the lath laser medium is placed into a vacuum magnetron sputtering device to be plated with the metal film on the optical film.
Optionally, the two ends of the injection pump of the slab gain medium are not coated with films.
Optionally, the metal film is a titanium film, a platinum film and a second gold film in sequence from the surface of the lath laser medium to the outside;
wherein the thickness of the titanium film is 100 nm-500 nm, the thickness of the platinum film is 100 nm-800 nm, and the thickness of the second gold film is 500 nm-1500 nm.
Optionally, the first gold film has a thickness of 500nm to 1500nm, and the indium film has a thickness of 10 μm to 200 μm.
Optionally, the slab gain medium includes: yb: YAG lath crystal, Yb: YAG lath ceramic, Nd: YAG lath crystal, Nd: YAG lath ceramic, Nd: YVO4Lath crystal, Nd: GdVO4A slab crystal, Nd: YLF slab crystal, or Yb: YLF slab crystal.
Optionally, the thickness of the slab gain medium is 1mm to 4mm, the width is 5mm to 80mm, and the length is 10mm to 300 mm.
Optionally, before performing vacuum welding on the welding module by electromagnetic heating, the method further includes: and vacuumizing the vacuum welding furnace to a preset air pressure value.
Optionally, vacuum welding is performed on the welding module by electromagnetic heating, including:
controlling the welding temperature to carry out vacuum welding within a preset temperature range;
and after preserving the heat for a preset time, cooling the welding module to room temperature in a vacuum state to finish welding.
The embodiment of the invention carries out vacuum welding on the welding module through electromagnetic heating, realizes uniform heating of the heat sink, reduces the generation of welding stress, improves the beam quality and reliability of the welding module, and achieves positive technical effects.
The foregoing description is only an overview of the technical solutions of the present invention, and the embodiments of the present invention are described below in order to make the technical means of the present invention more clearly understood and to make the above and other objects, features, and advantages of the present invention more clearly understandable.
Drawings
Various other advantages and benefits will become apparent to those of ordinary skill in the art upon reading the following detailed description of the preferred embodiments. The drawings are only for purposes of illustrating the preferred embodiments and are not to be construed as limiting the invention. Also, like reference numerals are used to refer to like parts throughout the drawings. In the drawings:
FIG. 1 is a flow chart of a first embodiment of the present invention;
FIG. 2 is a schematic view of a single-side welding process according to a first embodiment of the present invention.
Detailed Description
Exemplary embodiments of the present disclosure will be described in more detail below with reference to the accompanying drawings. While exemplary embodiments of the present disclosure are shown in the drawings, it should be understood that the present disclosure may be embodied in various forms and should not be limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the disclosure to those skilled in the art.
A first embodiment of the present invention provides a method for single-side welding of a slab gain medium, as shown in fig. 1, including the following specific steps:
s10, combining the heat sink after pretreatment and the lath laser medium in sequence from bottom to top to obtain a welding module;
and S20, performing vacuum welding on the welding module through electromagnetic heating.
The embodiment of the invention carries out vacuum welding on the welding module through electromagnetic heating, realizes uniform heating of the heat sink, reduces the generation of welding stress and improves the beam quality and reliability of the welding module.
Optionally, the pre-processing of the heat sink and slab laser medium comprises:
and carrying out film coating treatment on the welding surface of the heat sink and the surface of the lath laser medium.
Optionally, performing film plating treatment on the welding surface of the heat sink and the surface of the slab laser medium, including:
plating a first gold film and an indium film on the welding surface of the heat sink; and the number of the first and second groups,
and after the lath laser medium with the surface plated with the optical film is subjected to protection treatment, the lath laser medium is placed into a vacuum magnetron sputtering device to be plated with the metal film on the optical film.
Optionally, the two ends of the injection pump of the slab gain medium are not coated with films.
Optionally, the first gold film has a thickness of 500nm to 1500nm, and the indium film has a thickness of 10 μm to 200 μm.
Specifically, in this embodiment, the heat sink is an alloy heat sink having a microchannel water cooling structure inside, specifically, a copper-iron alloy material may be used to ensure good thermal conductivity, and the soldering surface of the heat sink is plated with a first gold film and an indium film, in this embodiment, the thickness of the first gold film is 500nm to 1500nm, and the thickness of the indium film is 10 μm to 200 μm.
For the processing of the slab laser medium, in this embodiment, first, the slab gain medium is put into an optical film plating device, and an optical film is plated on the surface of the slab gain medium, where the optical film of the slab gain medium is an evanescent wave suppression film. And then, protecting the batten gain medium coated with the optical film by using a clamp, and putting the batten gain medium into vacuum magnetron sputtering equipment to coat the optical film with a metal film.
More specifically, in this embodiment, no metal films are plated at both end positions of the injection pump of the slab gain medium.
Optionally, the thickness of the slab gain medium is 1mm to 4mm, the width is 5mm to 80mm, and the length is 10mm to 300 mm.
Optionally, the metal film is a titanium film, a platinum film and a second gold film in sequence from the surface of the lath laser medium to the outside;
wherein the thickness of the titanium film is 100 nm-500 nm, the thickness of the platinum film is 100 nm-800 nm, and the thickness of the second gold film is 500 nm-1500 nm.
Specifically, in the present embodiment, the dimensions of the slab gain medium are: the thickness is 1-4 mm, the width is 5-80 mm, and the length is 10-300 mm.
The metal film system of the slab gain medium is sequentially made of titanium platinum from the surface of the slab gain medium, wherein the thickness of the titanium film is 100-500 nm, the thickness of the platinum film is 100-800 nm, and the thickness of the gold film is 500-1500 nm.
Optionally, the slab gain medium includes: yb: YAG lath crystal, Yb: YAG lath ceramic, Nd: YAG lath crystal, Nd: YAG lath ceramic, Nd: YVO4 lath crystal, Nd: GdVO4 lath crystal, Nd: YLF lath crystal, Yb: YLF lath crystal, or the like.
Optionally, before performing vacuum welding on the welding module by electromagnetic heating, the method further includes: and vacuumizing the vacuum welding furnace to a preset air pressure value.
Optionally, vacuum welding is performed on the welding module by electromagnetic heating, including:
controlling the welding temperature to carry out vacuum welding within a preset temperature range;
and after preserving the heat for a preset time, cooling the welding module to room temperature in a vacuum state to finish welding.
Specifically, in this embodiment, a welding scheme is shown in fig. 2, and includes a vacuum welding furnace 1, a bracket 2, an electromagnetic heating device 3, a heat sink 4, and a slab gain medium 5, in a specific implementation process, the heat sink and the slab gain medium facing upward in a welding surface are sequentially placed from bottom to top, and after the above components form a welding module, the welding module is then welded, which specifically includes:
the welding module is placed on an electromagnetic heating platform in a vacuum welding furnace, and a thermocouple can be placed on the surface of the heat sink to monitor the temperature of the surface of the heat sink.
Before welding, the vacuum welding furnace is vacuumized to 6 x 10-3~8×10-4And Pa, then turning on an electromagnetic heating power supply, controlling the welding temperature to be 175-220 ℃, and keeping the temperature for 1-5 min, and then turning off the heating power supply.
And cooling to room temperature in a vacuum state, taking the module out of the vacuum welding furnace, and completing the welding process of the module.
The method for welding the single side of the batten gain medium adopts the copper-iron alloy heat sink, utilizes the electromagnetic technology, and the heat sink self-heats, thereby realizing the rapid melting, uniform reaction and slow cooling of the indium solder between the batten gain medium and the heat sink under the vacuum condition, greatly reducing the generation of welding stress, and improving the beam quality and the reliability of a welding module. The method adopts a direct heating mode, has high heat conversion rate and has an energy-saving effect. The method of the embodiment also has the effects of simple operation and easy realization.
Example two
The second embodiment of the present invention provides an implementation case of a single-side welding method for a slab gain medium, including:
s201, combining the heat sink after pretreatment and a lath laser medium in sequence from bottom to top to obtain a welding module;
s202, carrying out vacuum welding on the welding module through electromagnetic heating.
Optionally, the pre-processing of the heat sink and slab laser medium comprises:
and carrying out film coating treatment on the welding surface of the heat sink and the surface of the lath laser medium.
Optionally, performing film plating treatment on the welding surface of the heat sink and the surface of the slab laser medium, including:
plating a first gold film and an indium film on the welding surface of the heat sink; and the number of the first and second groups,
and after the lath laser medium with the surface plated with the optical film is subjected to protection treatment, the lath laser medium is placed into a vacuum magnetron sputtering device to be plated with the metal film on the optical film.
Optionally, before performing vacuum welding on the welding module by electromagnetic heating, the method further includes: and vacuumizing the vacuum welding furnace to a preset air pressure value.
Optionally, vacuum welding is performed on the welding module by electromagnetic heating, including:
controlling the welding temperature to carry out vacuum welding within a preset temperature range;
and after preserving the heat for a preset time, cooling the welding module to room temperature in a vacuum state to finish welding.
Specifically, in this embodiment, the slab gain medium is a Yb: YAG slab laser crystal with a size of 2mm × 11mm × 67mm, an optical film of the Yb: YAG slab laser crystal is an evanescent wave suppression film, the thickness of the metal titanium film is 300nm, the thickness of the platinum film is 300nm, the thickness of the gold film is 800nm, no metal film is plated at the positions of 3mm × 11mm at both ends, the thickness of the gold film of the heat sink in this embodiment is 1000nm, and the thickness of the indium film is 120 μm.
Then, the Yb: YAG lath laser crystal is placed on a copper-iron alloy heat sink coated with an indium film to form a welding module, the whole welding module is placed on an electromagnetic heating plate of a vacuum welding furnace, a thermocouple is placed on the surface of the heat sink, and the vacuum welding furnace is vacuumized to 3 multiplied by 10-3And Pa, turning on an electromagnetic heating power supply, controlling the welding temperature to be 180 ℃, keeping for 1min, turning off the heating power supply, cooling to room temperature, turning on a vacuum welding furnace, taking out a welding module, and finishing welding.
EXAMPLE III
The third embodiment of the present invention provides an implementation example of a single-side welding method for a slab gain medium,
s301, combining the heat sink after pretreatment and the slab laser medium in sequence from bottom to top to obtain a welding module;
s302, vacuum welding is carried out on the welding module through electromagnetic heating.
Optionally, the pre-processing of the heat sink and slab laser medium comprises:
and carrying out film coating treatment on the welding surface of the heat sink and the surface of the lath laser medium.
Optionally, performing film plating treatment on the welding surface of the heat sink and the surface of the slab laser medium, including:
plating a first gold film and an indium film on the welding surface of the heat sink; and the number of the first and second groups,
and after the lath laser medium with the surface plated with the optical film is subjected to protection treatment, the lath laser medium is placed into a vacuum magnetron sputtering device to be plated with the metal film on the optical film.
Optionally, before performing vacuum welding on the welding module by electromagnetic heating, the method further includes: and vacuumizing the vacuum welding furnace to a preset air pressure value.
Optionally, vacuum welding is performed on the welding module by electromagnetic heating, including:
controlling the welding temperature to carry out vacuum welding within a preset temperature range;
and after preserving the heat for a preset time, cooling the welding module to room temperature in a vacuum state to finish welding.
In the embodiment, the slab gain medium is Nd: YAG slab laser ceramic, the size is 2mm multiplied by 11mm multiplied by 121mm, the optical film of the Nd: YAG slab laser ceramic is an evanescent wave suppression film, the thickness of the titanium metal film is 200nm, the thickness of the platinum film is 500nm, the thickness of the gold film is 1200nm, metal films are not plated at the positions of 3mm multiplied by 11mm of two ends, in the embodiment, the thickness of the gold film of the heat sink is 1200nm, and the thickness of the indium film is 140 μm.
Then, the laser ceramic of the Nd: YAG lath is placed on a copper-iron alloy heat sink coated with indium film to form a welding module, the whole welding module is placed on an electromagnetic heating plate of a vacuum welding furnace, a thermocouple is placed on the surface of the heat sink, the vacuum welding furnace is vacuumized to 8 multiplied by 10-4Pa, turn on the electromagnetic heatingAnd controlling the welding temperature to 190 ℃, keeping for 2min, turning off a heating power supply, cooling to room temperature, opening a vacuum welding furnace, taking out a welding module, and finishing welding.
It should be noted that, in this document, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising an … …" does not exclude the presence of other like elements in a process, method, article, or apparatus that comprises the element.
The above-mentioned serial numbers of the embodiments of the present invention are merely for description and do not represent the merits of the embodiments.
Through the above description of the embodiments, those skilled in the art will clearly understand that the method of the above embodiments can be implemented by software plus a necessary general hardware platform, and certainly can also be implemented by hardware, but in many cases, the former is a better implementation manner. Based on such understanding, the technical solutions of the present invention may be embodied in the form of a software product, which is stored in a storage medium (such as ROM/RAM, magnetic disk, optical disk) and includes instructions for enabling a terminal (such as a mobile phone, a computer, a server, an air conditioner, or a network device) to execute the method according to the embodiments of the present invention.
While the present invention has been described with reference to the embodiments shown in the drawings, the present invention is not limited to the embodiments, which are illustrative and not restrictive, and it will be apparent to those skilled in the art that various changes and modifications can be made therein without departing from the spirit and scope of the invention as defined in the appended claims.
Claims (10)
1. A single-side welding method for a slab gain medium is characterized by comprising the following steps:
combining the heat sink after pretreatment and the lath laser medium in sequence from bottom to top to obtain a welding module;
and carrying out vacuum welding on the welding module through electromagnetic heating.
2. The method of single-sided welding of slab gain media of claim 1, wherein pre-processing the heat sink and slab laser media, comprises:
and carrying out film coating treatment on the welding surface of the heat sink and the surface of the lath laser medium.
3. The method for single-side welding of slab gain media according to claim 2, wherein the step of coating the welding surface of the heat sink and the surface of the slab laser media comprises:
plating a first gold film and an indium film on the welding surface of the heat sink; and the number of the first and second groups,
and after the lath laser medium with the surface plated with the optical film is subjected to protection treatment, the lath laser medium is placed into a vacuum magnetron sputtering device to be plated with the metal film on the optical film.
4. The method for single-side welding of slab gain media according to claim 3, wherein the slab gain media is uncoated at both ends of the injection pump.
5. The slat gain medium single-side welding method according to claim 3 or 4, wherein the metal film is a titanium film, a platinum film and a second gold film in sequence from the surface of the slat laser medium to the outside;
wherein the thickness of the titanium film is 100 nm-500 nm, the thickness of the platinum film is 100 nm-800 nm, and the thickness of the second gold film is 500 nm-1500 nm.
6. The method of one-sided soldering of a lath gain medium according to claim 3 or 4, wherein the first gold film has a thickness of 500nm to 1500nm and the indium film has a thickness of 10 μm to 200 μm.
7. The slat gain medium single-side welding method as claimed in claim 1, wherein said slat gain medium comprises: yb: YAG lath crystal, Yb: YAG lath ceramic, Nd: YAG lath crystal, Nd: YAG lath ceramic, Nd: YVO4Lath crystal, Nd: GdVO4A slab crystal, Nd: YLF slab crystal, or Yb: YLF slab crystal.
8. The method of one-side welding of slab gain media according to claim 1, wherein the slab gain media has a thickness of 1mm to 4mm, a width of 5mm to 80mm, and a length of 10mm to 300 mm.
9. The method for single-sided welding of lath gain media according to claim 1, wherein before vacuum welding the welding module by electromagnetic heating, further comprising: and vacuumizing the vacuum welding furnace to a preset air pressure value.
10. The lath gain medium single-sided welding method of claim 1, wherein the welding module is vacuum welded by electromagnetic heating, comprising:
controlling the welding temperature to carry out vacuum welding within a preset temperature range;
and after preserving the heat for a preset time, cooling the welding module to room temperature in a vacuum state to finish welding.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202010620207.4A CN111906399A (en) | 2020-07-01 | 2020-07-01 | Single-side welding method for slab gain medium |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202010620207.4A CN111906399A (en) | 2020-07-01 | 2020-07-01 | Single-side welding method for slab gain medium |
Publications (1)
Publication Number | Publication Date |
---|---|
CN111906399A true CN111906399A (en) | 2020-11-10 |
Family
ID=73227120
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN202010620207.4A Pending CN111906399A (en) | 2020-07-01 | 2020-07-01 | Single-side welding method for slab gain medium |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN111906399A (en) |
Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101431207A (en) * | 2008-12-03 | 2009-05-13 | 中国科学院上海光学精密机械研究所 | Method for welding laser crystal plate strip and heat sink |
US20110051758A1 (en) * | 2007-09-20 | 2011-03-03 | Oclaro Technology Plc | High power semiconductor laser diodes |
CN106238849A (en) * | 2016-08-22 | 2016-12-21 | 中国电子科技集团公司第十研究所 | A kind of laser slab and the welding method of heat sink two-sided joint |
CN106270872A (en) * | 2016-08-31 | 2017-01-04 | 郑州机械研究所 | A kind of vacuum induction composite brazing method |
CN106392235A (en) * | 2016-11-21 | 2017-02-15 | 郑州航空工业管理学院 | Diversified heating method for vacuum diffusion brazing furnace |
CN107394571A (en) * | 2017-08-07 | 2017-11-24 | 中国电子科技集团公司第十研究所 | The method for packing and slab laser crystal of a kind of slab laser crystal |
CN107453191A (en) * | 2017-07-18 | 2017-12-08 | 中国电子科技集团公司第十研究所 | A kind of lath gain media and its manufacture method with radiator structure |
CN109361138A (en) * | 2018-11-16 | 2019-02-19 | 中国电子科技集团公司第十研究所 | A kind of slab laser gain media packaging method |
-
2020
- 2020-07-01 CN CN202010620207.4A patent/CN111906399A/en active Pending
Patent Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20110051758A1 (en) * | 2007-09-20 | 2011-03-03 | Oclaro Technology Plc | High power semiconductor laser diodes |
CN101431207A (en) * | 2008-12-03 | 2009-05-13 | 中国科学院上海光学精密机械研究所 | Method for welding laser crystal plate strip and heat sink |
CN106238849A (en) * | 2016-08-22 | 2016-12-21 | 中国电子科技集团公司第十研究所 | A kind of laser slab and the welding method of heat sink two-sided joint |
CN106270872A (en) * | 2016-08-31 | 2017-01-04 | 郑州机械研究所 | A kind of vacuum induction composite brazing method |
CN106392235A (en) * | 2016-11-21 | 2017-02-15 | 郑州航空工业管理学院 | Diversified heating method for vacuum diffusion brazing furnace |
CN107453191A (en) * | 2017-07-18 | 2017-12-08 | 中国电子科技集团公司第十研究所 | A kind of lath gain media and its manufacture method with radiator structure |
CN107394571A (en) * | 2017-08-07 | 2017-11-24 | 中国电子科技集团公司第十研究所 | The method for packing and slab laser crystal of a kind of slab laser crystal |
CN109361138A (en) * | 2018-11-16 | 2019-02-19 | 中国电子科技集团公司第十研究所 | A kind of slab laser gain media packaging method |
Non-Patent Citations (1)
Title |
---|
朱艳 等: "《钎焊》", 31 March 2018, 哈尔滨工业大学出版社 * |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN106238849B (en) | A kind of welding method of laser slab and heat sink two-sided engagement | |
CN109361138B (en) | Slab laser gain medium packaging method | |
US4698486A (en) | Method of heating semiconductor wafers in order to achieve annealing, silicide formation, reflow of glass passivation layers, etc. | |
US4649261A (en) | Apparatus for heating semiconductor wafers in order to achieve annealing, silicide formation, reflow of glass passivation layers, etc. | |
US5296674A (en) | Laser processing method for a thin-film structure | |
EP2218109B1 (en) | Methods for manufacturing solar cell module and apparatus for manufacturing the same | |
CN103521869B (en) | Multi-layer planar leaky antenna solder pre-setting method | |
US9114467B2 (en) | Method of smoothing and/or bevelling an edge of a substrate | |
CN107511586A (en) | A kind of method of laser assisted welding target and backboard | |
CN115558922A (en) | Short wavelength ultra high speed laser cladding method and device for high reflection material | |
CN107717216B (en) | Femtosecond laser micromachining method and device | |
CN111906399A (en) | Single-side welding method for slab gain medium | |
CN107931830A (en) | Method for laser welding, aluminium sheet and laser welding apparatus | |
CN106654820B (en) | A kind of double-faced packaging method of slab laser crystal | |
JPH028333A (en) | Method for forming fiber-reinforced metal | |
US20170260088A1 (en) | Heat treatment of a silicate layer with pulsed carbon dioxide laser | |
CN108321665A (en) | A kind of encapsulating structure inhibiting lath and Static wavefront distortion after cooler welding | |
CN109244803B (en) | Tubular laser gain medium and packaging method thereof | |
JPS6130658A (en) | Surface treatment of thermally sprayed substrate | |
CN105014171A (en) | Quick connection method for tungsten/copper in electron beam braze welding manner | |
CN114243439B (en) | Can reduce lath laser gain medium ASE suppression device of marginal wavefront distortion | |
JP3094688B2 (en) | Manufacturing method of insulating film | |
RU2439761C1 (en) | Active element of disc laser | |
Tsunekane et al. | Design and performance of compact heatsink for high-power diode edge-pumped, microchip lasers | |
JP2013119510A (en) | Method for processing glass substrate with laser |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
PB01 | Publication | ||
PB01 | Publication | ||
SE01 | Entry into force of request for substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
RJ01 | Rejection of invention patent application after publication | ||
RJ01 | Rejection of invention patent application after publication |
Application publication date: 20201110 |