CN111903186A - Display device and electronic device - Google Patents
Display device and electronic device Download PDFInfo
- Publication number
- CN111903186A CN111903186A CN201980021286.2A CN201980021286A CN111903186A CN 111903186 A CN111903186 A CN 111903186A CN 201980021286 A CN201980021286 A CN 201980021286A CN 111903186 A CN111903186 A CN 111903186A
- Authority
- CN
- China
- Prior art keywords
- cooling
- organic
- layer
- display device
- present technology
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000001816 cooling Methods 0.000 claims abstract description 144
- 239000000758 substrate Substances 0.000 claims abstract description 32
- 230000020169 heat generation Effects 0.000 claims description 8
- 239000007769 metal material Substances 0.000 claims description 7
- 230000002401 inhibitory effect Effects 0.000 claims description 4
- 238000005401 electroluminescence Methods 0.000 description 62
- 238000005516 engineering process Methods 0.000 description 49
- 238000010586 diagram Methods 0.000 description 34
- 230000000694 effects Effects 0.000 description 20
- 229910052782 aluminium Inorganic materials 0.000 description 4
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 4
- 239000011159 matrix material Substances 0.000 description 4
- 239000011521 glass Substances 0.000 description 3
- 230000017525 heat dissipation Effects 0.000 description 3
- 238000003384 imaging method Methods 0.000 description 2
- 238000009434 installation Methods 0.000 description 2
- 230000001681 protective effect Effects 0.000 description 2
- 238000007789 sealing Methods 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 230000000670 limiting effect Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 239000011368 organic material Substances 0.000 description 1
- 230000001151 other effect Effects 0.000 description 1
- 230000002829 reductive effect Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/80—Constructional details
- H10K59/8794—Arrangements for heating and cooling
-
- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
-
- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
- G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B33/00—Electroluminescent light sources
- H05B33/02—Details
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B33/00—Electroluminescent light sources
- H05B33/02—Details
- H05B33/06—Electrode terminals
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/80—Constructional details
- H10K59/88—Dummy elements, i.e. elements having non-functional features
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Theoretical Computer Science (AREA)
- Electroluminescent Light Sources (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
Abstract
The present invention suppresses the transfer of heat to an organic EL under a high-temperature environment occurring during mounting. The display device provides an organic EL layer; a cooling layer and a cooling pad. The organic EL layer is an organic EL element formed on a substrate. The cooling layer is provided in the substrate on which the organic EL layer is formed to suppress the transfer of heat to the organic EL layer. The cooling pad is connected to the cooling layer and is cooled from the outside. Therefore, the cooling layer is cooled to suppress the transfer of heat to the organic EL layer.
Description
Technical Field
The present technology relates to a display device. In particular, the present technology relates to a display device for displaying a video by light emission of an organic Electroluminescence (EL) element, and to an electronic device including the display device.
Background
The organic EL element requires wiring installation in order to input a signal for displaying video. In addition, other semiconductor devices may be mounted on the substrate of the organic EL element in order to improve yield and performance. In a conventional organic EL element, when a wiring board or a circuit board is mounted, the organic EL may be thermally denatured due to thermal influence during mounting, resulting in a decrease in efficiency and a change in chromaticity. Conventionally, as a countermeasure against heat generation in an organic EL element, for example, a countermeasure for dissipating heat inside a panel by forming a plurality of light-shielding portions having different thermal resistances has been proposed (for example, see patent document 1).
CITATION LIST
Patent document
Patent document 1: japanese patent application laid-open No.2008-234841
Disclosure of Invention
Technical problem
In the above-described related art, the light shielding portion in the organic EL element is used for heat dissipation. However, such a conventional heat dissipation mechanism is intended to promote heat dissipation of heat of the wiring through which current flows and heat of the light emitting element itself, and it is difficult to suppress transfer of heat to the organic EL under a high-temperature environment (for example, about 200 ℃) occurring during mounting.
The present technology has been developed in view of such circumstances, and aims to suppress heat transfer to the organic EL under a high-temperature environment occurring during mounting.
Means for solving the problems
The present technology has been made in order to solve the above-described problems, and a first aspect thereof is a display device and an electronic device each including: an organic Electroluminescence (EL) layer of an organic EL element formed on a substrate; a cooling layer provided in the substrate and suppressing transfer of heat to the organic EL layer; and a cooling pad connected to the cooling layer and cooled from the outside. This provides an effect of cooling the cooling layer by the cooling pad and suppressing transfer of heat to the organic EL layer.
Further, in the first aspect, it is desirable that the cooling layer is made of a metal material. For example, using a metal material having good thermal conductivity, such as aluminum, provides an effect of improving the cooling effect.
Further, in the first aspect, the cooling layer may be formed within the effective pixel region of the organic EL element, or may also be formed between the heat generation source outside the effective pixel region of the organic EL element and the effective pixel region of the organic EL element.
Further, in the first aspect, the cooling layer may be further formed in the vicinity of the anode electrode of the organic EL element. This provides an effect of cooling the anode electrode, thereby further suppressing the transfer of heat to the organic EL layer.
Further, in the first aspect, the cooling layer may have a larger area as the cooling layer is closer to the heat generation source outside the effective pixel area of the organic EL element. This provides an effect of increasing the cooling effect when the cooling layer is closer to the heat generation source, and improves the cooling efficiency.
Further, in the first aspect, the cooling layer may include a portion that is in contact with the organic EL layer. This provides an effect of directly performing cooling and improving the cooling effect.
Further, in the first aspect, the cooling layer may be connected to the anode electrode of a region within the effective pixel region of the organic EL element, a surface of which is covered with the light shielding layer. This provides an effect of suppressing the transfer of heat to the organic EL layer through the dummy pixels.
Further, in the first aspect, the cooling layer may be formed by further extending from the vicinity of the anode electrode. This provides an effect of cooling the ordinary pixels, thereby further suppressing the transfer of heat to the organic EL layer.
Further, in the first aspect, the cooling layer may be further connected to a cathode electrode of the organic EL element. This provides an effect of setting both ends of the dummy pixel to the same potential to suppress inter-pixel leakage and reduce color mixture.
Advantageous effects of the invention
According to the present technology, an excellent effect of suppressing heat transfer to the organic EL in a high-temperature environment occurring during mounting can be produced. Note that the effects described herein are not necessarily limiting, and any of the effects described in the present disclosure may be provided.
Drawings
Fig. 1 is a diagram showing an example of a plan view of a display device 10 in an embodiment of the present technology.
Fig. 2 is a diagram showing an example of a conceptual diagram of the display device 10 in the embodiment of the present technology.
Fig. 3 is a diagram showing an example of a plan view of the pixel array 100 in the first embodiment of the present technology.
Fig. 4 is a diagram showing an example of a cross-sectional view of the pixel array 100 in the first embodiment of the present technology.
Fig. 5 is a diagram showing an example of a plan view of the pixel array 100 in the second embodiment of the present technology.
Fig. 6 is a diagram showing an example of a cross-sectional view of the pixel array 100 in the second embodiment of the present technology.
Fig. 7 is a diagram showing an example of a plan view of the display device 10 in the third embodiment of the present technology.
Fig. 8 is a diagram showing an example of a cross-sectional view of the display device 10 in the third embodiment of the present technology.
Fig. 9 is a diagram showing an example of a cross-sectional view of a pixel array 100 in a fourth embodiment of the present technology.
Fig. 10 is a diagram showing an example of a plan view of a pixel array 100 in a fifth embodiment of the present technology.
Fig. 11 is a diagram showing an example of a cross-sectional view of a pixel array 100 in a fifth embodiment of the present technology.
Fig. 12 is a diagram showing an example of a cross-sectional view of the display device 10 in the sixth embodiment of the present technology.
Fig. 13 is a diagram showing an appearance of a smartphone 401 as a first application example of the embodiment of the present technology.
Fig. 14 is a diagram showing an appearance of a digital camera 411 as a second application example of the embodiment of the present technology, as viewed from the front (subject side).
Fig. 15 is a diagram showing an appearance of a digital camera 411 as a second application example of the embodiment of the present technology, viewed from the rear.
Fig. 16 is a diagram showing an appearance of a Head Mounted Display (HMD)431 as a third application example of the embodiment of the present technology.
Detailed Description
Hereinafter, an embodiment for implementing the present technology (hereinafter, referred to as an embodiment) will be described. The description will be made in the following order.
1. First embodiment (example of Cooling Wiring)
2. Second embodiment (example of extending cooling wiring to the vicinity of anode)
3. Third embodiment (example of Cooling Wiring wall)
4. Fourth embodiment (example of Forming Cooling Wiring having Large area near Anode electrode)
5. Fifth embodiment (example of changing the layout of virtual pixels)
6. Sixth embodiment (example of setting both ends of a dummy pixel to the same potential)
7. Examples of the applications
<1 > first embodiment >
[ overview ]
Fig. 1 is a diagram showing an example of a plan view of a display device 10 in an embodiment of the present technology.
The display device 10 in this embodiment mode includes a pixel array 100, driver integrated circuits (driver ICs) 200 disposed on both sides of the pixel array 100, and a cooling pad 300.
The pixel array 100 is obtained by arranging pixels of organic Electroluminescence (EL) elements in a matrix (array). The organic EL element is a diode (organic light emitting diode, OLED) having a structure in which a film (organic EL layer) of an organic material is sandwiched between an anode (anode electrode) and a cathode (cathode electrode). The pixel array 100 is formed on a substrate 110, such as a silicon substrate.
The driver IC200 is an integrated circuit for controlling and driving the pixels. As in this exemplary embodiment, providing the driver IC200 independent of the pixel array 100 may improve yield and performance.
The cooling pad 300 is a pad that is subjected to cooling from the outside the effective pixel area of the pixel array 100. The cooling pad 300 is desirably formed of a thermally conductive metal material such as aluminum. The cooling pad 300 is connected to a cooling wiring provided in the substrate 110, as will be described later. When the driver IC200 is mounted, the mounting is performed while cooling the cooling pad 300 from the outside by a Peltier (Peltier) device or the like.
Fig. 2 is a diagram showing an example of a conceptual diagram of the display device 10 in the embodiment of the present technology.
In order to mount the driver IC200 on the substrate 110, an Anisotropic Conductive Film (ACF) or solder is used as a material of the junction 290. In order to thermocompressively bond the driver IC200 and the substrate 110, heat is applied by a heater having a temperature of about 350 ℃. At this time, the temperature applied to the substrate 110 during mounting is, for example, about 200 ℃.
The substrate 110 of the display device 10 includes the cooling wiring 120 connected to the cooling pad 300, and the cooling wiring 120 is configured to cool the substrate 110. Even when the temperature applied to the substrate 110 during mounting of the driver IC200 to the substrate 110 is, for example, about 200 ℃, cooling of about-10 ℃ is added on the cooling pad 300, and the transfer of heat to the organic EL layer can be suppressed.
[ configuration of display device ]
Fig. 3 is a diagram showing an example of a plan view of the pixel array 100 in the first embodiment of the present technology.
In the pixel array 100, normal pixels 101 for performing display are arranged in a matrix. Further, for example, dummy pixels 109 are formed along the column direction between the pixels 101. The dummy pixel 109 is a pixel which is not used for display, and light emission thereof to the outside is blocked. In the first embodiment, the cooling wiring is connected to the anode of the dummy pixel 109, thereby performing cooling. Note that the dummy pixels 109 may be formed along the row direction.
Fig. 4 is a diagram showing an example of a cross-sectional view of the pixel array 100 in the first embodiment of the present technology.
In the pixel array 100, the anode electrode 131 of the organic EL element is disposed on the substrate 110. The organic EL layer 132 is disposed on the anode electrode 131, and the cathode electrode 133 is disposed thereon. That is, the anode electrode 131, the organic EL layer 132, and the cathode electrode 133 constitute a diode of the organic EL element. Further, windows 139 are formed between the pixels to serve as barriers for separating the pixels. Note that in this example and the following examples, the cathode electrode 133 is shown in a pad shape for convenience, but the cathode electrode 133 actually has a concave-convex shape along the shape of the window 139.
An adhesive and a protective film 141 are formed on the cathode electrode 133, and a color filter layer 142 is further formed thereon. The color filter layer 142 is an optical filter having a property of passing a predetermined color.
In a normal pixel 101 for display, the color filter layer 142 delivers colors, such as red, blue, or green, according to a specific placement rule. The color filter layer 142 includes a light shielding portion called a black matrix between pixels. Further, in the first embodiment, the dummy pixels 109 not intended for display are provided, and the color filter layer 142 shields the dummy pixels 109 by using a black matrix.
A glass substrate 143 is provided as a counter substrate on the color filter layer 142.
In the first embodiment, the cooling wiring 120 is provided in the substrate 110, and is connected to the anode electrode of the dummy pixel 109. That is, the cooling wiring 120 has a portion in contact with the organic EL layer 132. The anode electrode of the dummy pixel 109 and the cooling wiring 120 are desirably formed of a heat conductive metal material such as aluminum and a cooling pad 300. Since the cooling wiring 120 is connected to the cooling pad 300 as described above and the driver IC200 and the like are mounted while the cooling pad 300 is cooled, heat transfer to the organic EL layer 132 can be suppressed. Note that the cooling wiring 120 is an example of the cooling layer described in the scope of the claims.
As described above, according to the first embodiment of the present technology, the cooling wiring 120 is connected to the anode electrode of the dummy pixel 109, which makes it possible to quickly cool from the cooling pad 300 and suppress heat transfer to the organic EL layer 132.
<2 > second embodiment
Although the cooling wiring 120 is connected to the anode electrode of the dummy pixel 109 in the above-described first embodiment, the second embodiment further improves the cooling effect by pulling the cooling wiring 120 further near the anode electrode of the normal pixel 101.
[ configuration of display device ]
Fig. 5 is a diagram showing an example of a plan view of the pixel array 100 in the second embodiment of the present technology. Fig. 6 is a diagram showing an example of a cross-sectional view of the pixel array 100 in the second embodiment of the present technology.
In the second embodiment, the cooling wiring 122 is formed by extending further from the cooling wiring 120 connected to the anode electrode of the dummy pixel 109 to the vicinity of the anode electrode 131 of the normal pixel 101. The cooling area is further widened, and the cooling effect is improved.
As described above, according to the second embodiment of the present technology, the cooling wiring 122 is formed to extend to the vicinity of the anode electrode 131 of the normal pixel 101, which makes it possible to further suppress heat transfer to the organic EL layer 132.
<3 > third embodiment
In the first and second embodiments described above, the cooling wiring 120 has been provided in the effective pixel region of the substrate 110, but a similar cooling layer may be provided outside the effective pixel region. In the third embodiment, an example in which a cooling layer is provided outside an effective pixel region will be described.
[ configuration of display device ]
Fig. 7 is a diagram showing an example of a plan view of the display device 10 in the third embodiment of the present technology. Fig. 8 is a diagram showing an example of a cross-sectional view of the display device 10 in the third embodiment of the present technology.
In the third embodiment, the cooling wiring walls 310 are respectively disposed between the pixel array 100 and the driver ICs 200 disposed on the substrate 110. The cooling wiring wall 310 is connected to the cooling pad 300 and formed to separate the pixel array 100 from the driver IC200 in the substrate 110. The cooling wire wall 310 is desirably formed of a thermally conductive metal material, such as aluminum, similar to the cooling wires 120. Note that the cooling wiring wall 310 is an example of the cooling layer described in the scope of the claims.
Similar to the first embodiment described above, the mounting of the driver IC200 and the like is performed while the cooling pad 300 is cooled, thereby allowing blocking of heat transfer to the effective pixel area.
Note that, in the case where the cooling wiring wall 310 is provided, the cooling wiring 120 described above in the first and second embodiments may also be further provided.
As described above, according to the third embodiment of the present technology, the cooling wiring wall 310 is provided between the pixel array 100 and the driver IC200, which makes it possible to suppress the transfer of heat to the effective pixel area including the organic EL layer 132.
<4 > fourth embodiment
In the above-described first and second embodiments, the cooling wiring 120 is connected to the anode electrode of the dummy pixel 109, but the dummy pixel 109 is not necessarily provided. However, since the anode electrode 131 of the normal pixel 101 is an independent wiring, it is impossible to connect the cooling wiring 120 thereto. In this regard, in the fourth embodiment, a cooling wiring having a large area is provided in the vicinity of the anode electrode 131 of the normal pixel 101, thereby performing cooling.
[ configuration of display device ]
Fig. 9 is a diagram showing an example of a cross-sectional view of the pixel array 100 in the fourth embodiment of the present technology.
In the fourth embodiment, the cooling wiring 123 to be connected to the cooling wiring 120 is disposed in the vicinity of the anode electrode 131 of the normal pixel 101. The cooling wiring 123 is disposed closer to the anode electrode 131 than the cooling wiring 120.
Further, in the fourth embodiment, a wide area of the normal pixel 101 is ensured without providing the dummy pixel 109. Then, the cooling wiring 123 is formed near the anode electrode 131 of the normal pixel 101. Since the dummy pixel 109 is not provided, the light emitting area in the effective pixel area can be increased accordingly.
As described above, according to the fourth embodiment of the present technology, it is possible to suppress the transfer of heat to the organic EL layer 132 without narrowing the light emitting region in the effective pixel region by the dummy pixels.
<5 > fifth embodiment
Although the virtual pixels 109 are assumed to have the same size in the above-described first and second embodiments, the layout of the virtual pixels 109 is not limited thereto. In the fifth embodiment, the size of the dummy pixel 109 is changed so that the cooling area is wider in a portion near the junction 290 for mounting, thereby improving the cooling efficiency.
[ configuration of display device ]
Fig. 10 is a diagram showing an example of a plan view of the pixel array 100 in the fifth embodiment of the present technology. Fig. 11 is a diagram showing an example of a cross-sectional view of the pixel array 100 in the fifth embodiment of the present technology.
In the fifth embodiment, as the virtual pixel 109 is closer to the junction 290 for mounting, the size of the virtual pixel 109 increases. The cooling wiring 120 is connected to the anode electrode of the dummy pixel 109, thereby performing cooling. The area of the anode electrode of the dummy pixel 109 is wider as the dummy pixel 109 is closer to the junction 290, and the cooling effect is higher as the dummy pixel 109 is closer to the junction 290. Meanwhile, since the closer the dummy pixel 109 is to the junction 290, the higher the temperature at the time of mounting. Accordingly, the cooling effect is improved in the region near the junction 290 where the temperature is increased at the time of installation, which may improve the overall cooling efficiency.
As described above, according to the fifth embodiment of the present technology, as the dummy pixel 109 is closer to the junction 290 for mounting, the size of the dummy pixel 109 increases, which makes it possible to effectively suppress heat transfer to the organic EL layer 132.
<6 > sixth embodiment
In the first and second embodiments described above, the cooling wiring 120 is connected to the anode electrode of the dummy pixel 109, thereby performing cooling. In the sixth embodiment, the cooling wiring 120 is also connected to the cathode electrode of the dummy pixel 109 to set the anode potential and the cathode potential of the dummy pixel 109 to the same potential.
[ configuration of display device ]
Fig. 12 is a diagram showing an example of a cross-sectional view of the display device 10 in the sixth embodiment of the present technology.
In the sixth embodiment, the cathode electrode 133 and the cooling wiring 120 are connected to each other outside the effective pixel region. The connection portion between the cathode electrode 133 and the cooling wiring 120 is sealed by a sealing member 190.
The cathode electrode 133 is a common wiring, and is shared by all the normal pixels 101 and the dummy pixels 109. The anode electrode of the dummy pixel 109 is connected to the cooling wiring 120, and the cathode electrode 133 and the cooling wiring 120 are further connected to each other. Therefore, the anode electrode and the cathode electrode 133 of the dummy pixel 109 are set to the same potential. This can suppress inter-pixel leakage and reduce color mixing. Therefore, an organic EL element having high color purity can be formed.
As described above, according to the sixth embodiment of the present technology, the cathode electrode 133 and the cooling wiring 120 are connected to each other, which makes it possible to set the anode potential and the cathode potential of the dummy pixel 109 to the same potential and suppress inter-pixel leakage. In addition, this makes it possible to provide an organic EL element having high color purity in which color mixing is reduced.
<7. application example >
Hereinafter, an example of an electronic device to which the display device according to each of the above embodiments can be applied will be described.
Fig. 13 is a diagram showing an appearance of a smartphone 401 as a first application example of the embodiment of the present technology. The smartphone 401 includes: an operation unit 403 that receives an operation input from a user; and a display unit 405 that displays various types of information. The display unit 405 may be configured by the display device of the above-described embodiment.
Fig. 14 is a diagram showing an appearance of a digital camera 411 as a second application example of the embodiment of the present technology, as viewed from the front (subject side). Fig. 15 is a diagram showing an appearance of a digital camera 411 as a second application example of the embodiment of the present technology, as viewed from the rear. The digital camera 411 includes a body portion (camera body) 413, an interchangeable lens unit 415, and a grip portion 417 gripped by a user at the time of imaging. Further, the digital camera 411 includes: a display 419 that displays various types of information; and an Electronic Viewfinder (EVF)421 that displays a through image that the user observes at the time of imaging. The monitor 419 and the EVF 421 may be configured by the display device of the above-described embodiment.
Fig. 16 is a diagram showing an appearance of a Head Mounted Display (HMD)431 as a third application example of the embodiment of the present technology. The HMD 431 includes: a glasses display unit 433 that displays various types of information; and an ear-hang unit 435 for hanging on the ear of the user when the user wears the HMD 431. The display unit 433 may be configured by the display device of the above-described embodiment.
In the above, several examples of electronic devices to which the display device according to each embodiment can be applied have been described above. Note that the electronic apparatus to which the display apparatus according to each embodiment can be applied is not limited to the electronic apparatus of the above example, and the display apparatus can be applied to a display apparatus installed in an electronic apparatus in any field to display according to an externally input image signal or an internally generated image signal, such as a television set, an electronic book, a PDA, a notebook computer, a video camera, or a game set.
Note that the above-described embodiments merely show examples for embodying the present technology, and the contents in the embodiments and the contents specifying the present invention within the scope of claims have a correspondence relationship. Similarly, it is specified that the contents of the present invention and the contents having the same name in the embodiments of the present technology have a correspondence relationship within the scope of the claims. However, the present technology is not limited to the embodiments, and may be embodied by making various modifications thereto without departing from the spirit of the present technology.
Note that the effects described in this specification are merely illustrative and not restrictive, and other effects may be produced.
Note that the present technology can adopt the following configuration.
(1) A display device, comprising:
an organic Electroluminescent (EL) layer of an organic EL element, the organic Electroluminescent (EL) layer being formed on a substrate;
a cooling layer provided in the substrate and inhibiting heat transfer to the organic EL layer; and
a cooling pad connected to the cooling layer and subjected to cooling from the outside.
(2) The display device according to (1), wherein
The cooling layer is made of a metal material.
(3) The display device according to (1) or (2), wherein
The cooling layer is formed in an effective pixel region of the organic EL element.
(4) The display device according to (1) or (2), wherein
The cooling layer is formed between a heat generation source outside the effective pixel area of the organic EL element and the effective pixel area of the organic EL element.
(5) The display device according to any one of (1) to (3), wherein
The cooling layer is also formed in the vicinity of the anode of the organic EL element.
(6) The display device according to any one of (1) to (3), wherein
The cooling layer has a larger area as the cooling layer is closer to a heat generation source outside the effective pixel area of the organic EL element.
(7) The display device according to any one of (1) to (3), wherein
The cooling layer includes a portion in contact with the organic EL layer.
(8) The display device according to any one of (1) to (3), wherein
The cooling layer is connected to an anode electrode in a region of the organic EL element in the effective pixel region, the surface of which is covered with a light-shielding layer.
(9) The display device according to (8), wherein
The cooling layer is formed by further extending from the vicinity of the anode electrode.
(10) The display device according to (8), wherein
The cooling layer is also connected to a cathode electrode of the organic EL element.
(11) An electronic device comprises
A display unit comprising:
an organic Electroluminescent (EL) layer of an organic EL element, the organic Electroluminescent (EL) layer being formed on a substrate,
a cooling layer provided in the substrate and inhibiting heat transfer to the organic EL layer, an
A cooling pad connected to the cooling layer and subjected to cooling from the outside.
List of reference numerals
10 display device
100 pixel array
101 ordinary pixel
109 virtual pixel
110 substrate
120. 122, 123 cooling wiring
131 anode electrode
132 organic EL layer
133 cathode electrode
139 window
141 protective film
142 color filter layer
143 glass substrate
190 sealing member
200 driver IC
290 knot
300 Cooling pad
310 cooling wiring wall
405 display the cells.
Claims (11)
1. A display device, comprising:
an organic EL layer of an organic EL element, the organic EL layer being formed on a substrate;
a cooling layer provided in the substrate and inhibiting heat transfer to the organic EL layer; and
a cooling pad connected to the cooling layer and subjected to cooling from the outside.
2. The display device according to claim 1, wherein
The cooling layer is made of a metal material.
3. The display device according to claim 1, wherein
The cooling layer is formed in an effective pixel region of the organic EL element.
4. The display device according to claim 1, wherein
The cooling layer is formed between a heat generation source outside the effective pixel area of the organic EL element and the effective pixel area of the organic EL element.
5. The display device according to claim 1, wherein
The cooling layer is also formed in the vicinity of the anode of the organic EL element.
6. The display device according to claim 1, wherein
The cooling layer has a larger area as the cooling layer is closer to a heat generation source outside the effective pixel area of the organic EL element.
7. The display device according to claim 1, wherein
The cooling layer includes a portion in contact with the organic EL layer.
8. The display device according to claim 1, wherein
The cooling layer is connected to an anode electrode in a region of the organic EL element in the effective pixel region, the surface of which is covered with a light-shielding layer.
9. The display device according to claim 8, wherein
The cooling layer is formed by further extending from the vicinity of the anode electrode.
10. The display device according to claim 8, wherein
The cooling layer is also connected to a cathode electrode of the organic EL element.
11. An electronic device comprises
A display unit comprising:
an organic EL layer of an organic EL element, the organic EL layer being formed on a substrate,
a cooling layer provided in the substrate and inhibiting heat transfer to the organic EL layer, an
A cooling pad connected to the cooling layer and subjected to cooling from the outside.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2018-063794 | 2018-03-29 | ||
| JP2018063794 | 2018-03-29 | ||
| PCT/JP2019/006003 WO2019187790A1 (en) | 2018-03-29 | 2019-02-19 | Display device and electronic device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN111903186A true CN111903186A (en) | 2020-11-06 |
Family
ID=68059815
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201980021286.2A Pending CN111903186A (en) | 2018-03-29 | 2019-02-19 | Display device and electronic device |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JP7230904B2 (en) |
| CN (1) | CN111903186A (en) |
| WO (1) | WO2019187790A1 (en) |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005134756A (en) * | 2003-10-31 | 2005-05-26 | Seiko Epson Corp | Electrooptical device and electronic equipment |
| CN1741115A (en) * | 2004-08-23 | 2006-03-01 | 株式会社半导体能源研究所 | Display device, driving method of the same, and electronic device |
| WO2010016512A1 (en) * | 2008-08-06 | 2010-02-11 | 昭和電工株式会社 | Organic electroluminescent element, display device and illuminating device |
| JP2016184124A (en) * | 2015-03-26 | 2016-10-20 | 大日本印刷株式会社 | Hologram sheet and card having hologram |
| JP2016221014A (en) * | 2015-06-01 | 2016-12-28 | コニカミノルタ株式会社 | Optical treatment device |
| JP2017006347A (en) * | 2015-06-22 | 2017-01-12 | コニカミノルタ株式会社 | Optical treatment apparatus |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4886540B2 (en) * | 2006-03-01 | 2012-02-29 | キヤノン株式会社 | Organic EL element panel |
| JP5033505B2 (en) * | 2007-06-21 | 2012-09-26 | ローム株式会社 | Display panel |
| KR101695317B1 (en) * | 2010-05-18 | 2017-01-12 | 엘지디스플레이 주식회사 | Organic electro luminescent device |
| JP2014127648A (en) * | 2012-12-27 | 2014-07-07 | Pioneer Electronic Corp | Light emitting device and manufacturing method for light emitting device |
| JP2014178616A (en) * | 2013-03-15 | 2014-09-25 | Rohm Co Ltd | Image display unit and fitting structure of image display unit |
| JP2016105183A (en) * | 2016-01-07 | 2016-06-09 | 大日本印刷株式会社 | Substrate for thin film element, thin film element, organic electroluminescence display device, and electronic paper |
-
2019
- 2019-02-19 CN CN201980021286.2A patent/CN111903186A/en active Pending
- 2019-02-19 JP JP2020510415A patent/JP7230904B2/en active Active
- 2019-02-19 WO PCT/JP2019/006003 patent/WO2019187790A1/en active Application Filing
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005134756A (en) * | 2003-10-31 | 2005-05-26 | Seiko Epson Corp | Electrooptical device and electronic equipment |
| CN1741115A (en) * | 2004-08-23 | 2006-03-01 | 株式会社半导体能源研究所 | Display device, driving method of the same, and electronic device |
| WO2010016512A1 (en) * | 2008-08-06 | 2010-02-11 | 昭和電工株式会社 | Organic electroluminescent element, display device and illuminating device |
| JP2016184124A (en) * | 2015-03-26 | 2016-10-20 | 大日本印刷株式会社 | Hologram sheet and card having hologram |
| JP2016221014A (en) * | 2015-06-01 | 2016-12-28 | コニカミノルタ株式会社 | Optical treatment device |
| JP2017006347A (en) * | 2015-06-22 | 2017-01-12 | コニカミノルタ株式会社 | Optical treatment apparatus |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2019187790A1 (en) | 2019-10-03 |
| JPWO2019187790A1 (en) | 2021-04-15 |
| JP7230904B2 (en) | 2023-03-01 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP6756508B2 (en) | Display device | |
| TWI829715B (en) | Display panel and large format display apparatus using the same | |
| US20220028325A1 (en) | Electro-optical module, power supply substrate, wiring substrate, and electronic apparatus | |
| US11217625B2 (en) | Display module including micro light-emitting diodes and reflective layer, display apparatus including the same and method of manufacturing display module | |
| JP4686643B2 (en) | Semiconductor light emitting element mounting substrate, backlight chassis, display device, and television receiver | |
| KR20180025669A (en) | Control unit and display device comprising it | |
| JP6105911B2 (en) | OLED display panel | |
| US20090267526A1 (en) | Organic light-emitting diode display device | |
| KR20110092063A (en) | Organic light emitting diode display | |
| KR20190077878A (en) | Display apparatus | |
| US9263510B2 (en) | EL display device | |
| KR102363792B1 (en) | A touch display panel, a flexible display device, and a method for manufacturing a touch display panel | |
| KR20150134142A (en) | Organic light emitting diode | |
| JP6719948B2 (en) | Display device | |
| TWI743707B (en) | Display device | |
| JP2009272073A (en) | Organic el device and electronic equipment | |
| JP2011101054A (en) | Substrate for mounting semiconductor light emitting element, backlight chassis, display device, and television receiver | |
| JP7230904B2 (en) | Displays and electronics | |
| KR20060124912A (en) | Integrated circuit chip package and a display device provided with the same | |
| KR20220075554A (en) | Display apparatus | |
| US11581395B2 (en) | Display device and electronic device | |
| EP4025021A1 (en) | Display apparatus and fabrication method, heat dissipation film layer, and electronic device | |
| CN112740414A (en) | Display device, preparation method and electronic equipment | |
| US10121721B2 (en) | Heat dissipation bump electrode for chip on film | |
| TW202009561A (en) | Diplay device |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination |