CN111892877A - Method for bonding plastic hollow plates - Google Patents

Method for bonding plastic hollow plates Download PDF

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Publication number
CN111892877A
CN111892877A CN202010757890.6A CN202010757890A CN111892877A CN 111892877 A CN111892877 A CN 111892877A CN 202010757890 A CN202010757890 A CN 202010757890A CN 111892877 A CN111892877 A CN 111892877A
Authority
CN
China
Prior art keywords
plastic hollow
hollow plate
bonding
adhesive
blind holes
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202010757890.6A
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Chinese (zh)
Inventor
程时先
戴勇
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hubei Boxing Composite Materials Co ltd
Original Assignee
Hubei Boxing Composite Materials Co ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hubei Boxing Composite Materials Co ltd filed Critical Hubei Boxing Composite Materials Co ltd
Priority to CN202010757890.6A priority Critical patent/CN111892877A/en
Publication of CN111892877A publication Critical patent/CN111892877A/en
Pending legal-status Critical Current

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    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J5/00Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
    • C09J5/02Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers involving pretreatment of the surfaces to be joined

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Lining Or Joining Of Plastics Or The Like (AREA)

Abstract

The invention provides a method for bonding plastic hollow plates. The blind holes are formed in the bonding surface of the plastic hollow plate, the bonding surface of the plastic hollow plate is bonded with a bonded piece through an adhesive, then after the plastic hollow plate and the bonded piece are pressed, the adhesive penetrates into the hollow plate through the blind holes, and a glue riveting structure is formed after curing. According to the method, the blind holes are formed in the bonding surface of the plastic hollow plate, so that the state of the bonding surface is changed, the adhesive is deeply inserted into the plastic hollow plate, the bonding area is increased, the bonding strength is increased, and the product can be effectively prevented from being peeled off and falling off.

Description

Method for bonding plastic hollow plates
Technical Field
The invention belongs to the technical field of bonding, and particularly relates to a bonding method of a plastic hollow plate.
Background
The plastic hollow plate is widely used in various aspects of daily life, the light and environment-friendly characteristics of the plastic hollow plate are favored by the automobile industry, most application products need to be combined structurally, and the common method is bonding and riveting. Although the surface of the adhesive has no mark, the adhesive is stripped; the riveting will cause the scar at the riveting position and affect the appearance.
Disclosure of Invention
The invention aims to provide a plastic hollow plate bonding method which can increase bonding strength and does not influence product appearance, aiming at the problems that the prior art has the phenomenon of glue stripping and riveting can cause part scars and influence appearance.
In order to achieve the purpose, the invention adopts the technical scheme that: a plastic hollow plate bonding method is characterized in that: the adhesive surface of the plastic hollow plate is pre-provided with blind holes, the adhesive is coated on the adhesive surface and then is attached to an adhered piece, and the adhesive enters the blind holes of the plastic hollow plate by applying pressure.
In addition, the plastic hollow plate bonding surface is provided with a blind hole formed by punching. The stamping processing has high production efficiency, convenient operation and easy realization of mechanization and automation, the stamping is a material-saving and energy-saving processing method, and the stamping part has lower cost.
The further improvement to above-mentioned technical scheme, the inboard equidistant a plurality of backup pads that are equipped with of cavity board in plastics, the handing-over position at backup pad and the cavity board bonding face in plastics is established to the blind hole. When the blind hole sets up the handing-over position of backup pad and the bonding surface at the cavity board in plastics, the adhesive area is bigger when the entering blind hole that receives pressure.
The invention has the beneficial effects that: according to the invention, the blind holes are formed in the bonding surface of the plastic hollow plate, so that the state of the bonding surface is changed, the adhesive is extended into the plastic hollow plate, the bonding area is increased, the adhesive can be extended into the hollow plate through the blind holes and cured to form a glue riveting structure, the bonding strength is increased, the parts can be effectively prevented from being peeled off and falling, the appearance surface is not required to be changed, and the influence on the appearance state of the product is reduced.
Drawings
FIG. 1 is a schematic structural diagram of the present invention.
Reference numeral 1 in the figure, plastic hollow plate; 2. an adhesive; 3. a member to be bonded; 4. and (4) blind holes.
Detailed Description
The technical solution of the present invention will be clearly and completely described below with reference to the accompanying drawings and embodiments, but the embodiment should not be construed as limiting the present invention.
The invention is shown in figure 1: the utility model provides a plastics cavity board bonding method, the bonding face of plastics cavity board 1 forms blind hole 4 through the punching press mode, scribbles on the bonding face of plastics cavity board 1 behind the coating adhesive 2 with by the laminating of bonding piece 3, through exerting pressure for inside adhesive 2 goes deep into plastics cavity board 1 through blind hole 4, forms the gluey structure of riveting after the solidification, the bonding area of increase, thereby can effectually prevent peeling off of part and drop and do not change product appearance.
It should be noted that, a plurality of support plates are arranged in the plastic hollow plate 1 at equal intervals, the optimal position of the blind hole 4 is arranged at the joint position of the support plates and the bonding surface of the plastic hollow plate 1, and when the blind hole 4 is arranged at the optimal position, the bonding area of the adhesive 2 entering the blind hole 4 is larger, so that the bonding strength is increased.

Claims (3)

1. A plastic hollow plate bonding method is characterized in that: the adhesive surface of the plastic hollow plate is pre-provided with blind holes, the adhesive is coated on the adhesive surface and then is attached to an adhered piece, and the adhesive enters the blind holes of the plastic hollow plate by applying pressure.
2. The method for bonding plastic hollow plates according to claim 1, wherein: the blind holes formed in the bonding surface of the plastic hollow plate are formed through punching.
3. The method for bonding plastic hollow plates according to claim 1 or 2, wherein: the hollow plate is equipped with a plurality of backup pads at equidistant inside the plastics, the handing-over position at backup pad and plastics hollow plate bonding face is established to the blind hole.
CN202010757890.6A 2020-07-31 2020-07-31 Method for bonding plastic hollow plates Pending CN111892877A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202010757890.6A CN111892877A (en) 2020-07-31 2020-07-31 Method for bonding plastic hollow plates

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202010757890.6A CN111892877A (en) 2020-07-31 2020-07-31 Method for bonding plastic hollow plates

Publications (1)

Publication Number Publication Date
CN111892877A true CN111892877A (en) 2020-11-06

Family

ID=73182854

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202010757890.6A Pending CN111892877A (en) 2020-07-31 2020-07-31 Method for bonding plastic hollow plates

Country Status (1)

Country Link
CN (1) CN111892877A (en)

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103132703A (en) * 2013-03-12 2013-06-05 金陵科技学院 Construction insulation fastener rapid construction method
JP2017124577A (en) * 2016-01-15 2017-07-20 岐阜プラスチック工業株式会社 Laminated structure
CN107761971A (en) * 2016-08-15 2018-03-06 中国二十冶集团有限公司 The adhering method of skin warming plate
CN211033411U (en) * 2019-11-15 2020-07-17 永发印务(四川)有限公司 Paper-plastic composite plastic hollow plate packaging box

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103132703A (en) * 2013-03-12 2013-06-05 金陵科技学院 Construction insulation fastener rapid construction method
JP2017124577A (en) * 2016-01-15 2017-07-20 岐阜プラスチック工業株式会社 Laminated structure
CN107761971A (en) * 2016-08-15 2018-03-06 中国二十冶集团有限公司 The adhering method of skin warming plate
CN211033411U (en) * 2019-11-15 2020-07-17 永发印务(四川)有限公司 Paper-plastic composite plastic hollow plate packaging box

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PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination
WD01 Invention patent application deemed withdrawn after publication

Application publication date: 20201106

WD01 Invention patent application deemed withdrawn after publication