CN111881753B - Backlight module and display device - Google Patents
Backlight module and display device Download PDFInfo
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- CN111881753B CN111881753B CN202010597265.XA CN202010597265A CN111881753B CN 111881753 B CN111881753 B CN 111881753B CN 202010597265 A CN202010597265 A CN 202010597265A CN 111881753 B CN111881753 B CN 111881753B
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
- G06V40/00—Recognition of biometric, human-related or animal-related patterns in image or video data
- G06V40/10—Human or animal bodies, e.g. vehicle occupants or pedestrians; Body parts, e.g. hands
- G06V40/12—Fingerprints or palmprints
- G06V40/13—Sensors therefor
- G06V40/1318—Sensors therefor using electro-optical elements or layers, e.g. electroluminescent sensing
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
- G06V10/00—Arrangements for image or video recognition or understanding
- G06V10/10—Image acquisition
- G06V10/12—Details of acquisition arrangements; Constructional details thereof
- G06V10/14—Optical characteristics of the device performing the acquisition or on the illumination arrangements
- G06V10/141—Control of illumination
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
- G06V10/00—Arrangements for image or video recognition or understanding
- G06V10/10—Image acquisition
- G06V10/12—Details of acquisition arrangements; Constructional details thereof
- G06V10/14—Optical characteristics of the device performing the acquisition or on the illumination arrangements
- G06V10/145—Illumination specially adapted for pattern recognition, e.g. using gratings
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Abstract
The invention discloses a backlight module and a display device, belonging to the technical field of display, wherein the backlight module comprises a shell, a plurality of light sources, a light guide plate and a reflector plate, wherein the plurality of light sources are arranged along a first direction; a first flexible circuit board extending along a first direction is fixedly arranged on the surface of one side, close to the light guide plate, of the back plate, and the plurality of light sources are electrically connected with the first flexible circuit board; the reflector plate is positioned on one side of the light guide plate close to the back plate; the backlight module further comprises an infrared emission assembly, and the infrared emission assembly is located between the back plate and the reflector plate. The display device comprises a display panel and the backlight module. The backlight module is of a reverse-assembly type backlight structure, is beneficial to further shrinking of the frame of the backlight module, and is beneficial to shortening the length of a glass cover plate of a display device using the backlight module in the related art under the condition that the overall thickness of the backlight module is not increased as much as possible, so that the frame is reduced.
Description
Technical Field
The invention relates to the technical field of display, in particular to a backlight module and a display device.
Background
With the rapid development of display technologies, liquid crystal display devices (such as lcd televisions, lcd displays, lcd screens, etc.) are increasingly widely used in production and life by virtue of low voltage driving, flat panel structure, large amount of display information, easy colorization, long service life, no radiation and no pollution. However, the lcd is a passive type display device, which cannot emit Light, and therefore a backlight Unit (BLU) is disposed below the lcd panel to provide a required Light source, thereby achieving the display effect. The backlight module is one of the key components of the liquid crystal display device, and has the main function of providing a uniform and high-brightness luminous body for the liquid crystal panel. With the gradual popularization of liquid crystal products, users are more and more critical to the products, higher and higher requirements are put forward on the quality of the products, and the users want the products to be light, thin and large in screen and more want the light-emitting effect of the products to be more perfect. With the popularity of full-screen mobile phones, liquid crystal display products are required to have smaller and smaller frames while pursuing higher and higher screen occupation ratios.
With the development of multimedia technology in the prior art, more and more intelligent portable electronic devices such as mobile phones, personal notebook computers, tablet computers and the like have become necessary tools in people's lives. These portable electronic devices usually include personal information of a large number of users, such as phone books, photos, etc., and in order to ensure the security of the personal information of the users, the identities or authorities of the users are usually verified. At present, the authentication method for the user identity or authority generally includes face recognition, fingerprint recognition, password input and the like. Because fingerprint identification is simple and fast, most of the existing electronic devices adopt a fingerprint identification mode to verify identity or authority. The current mainstream fingerprint identification technology comprises photoelectric fingerprint identification, capacitance type fingerprint identification and ultrasonic fingerprint identification. Photoelectric fingerprint identification generally includes a plurality of luminescence unit and a plurality of fingerprint sensing unit, and fingerprint sensing unit can carry out the discernment of fingerprint according to the light that the light source sent forms behind the reflection of touch main part, through the reflectivity difference of fingerprint valley and ridge, realizes that fingerprint sensing unit receives different fingerprint information differentiation, forms the fingerprint image.
However, in most of the current display devices with fingerprint identification technology, it is difficult to achieve the effect of narrow border and fingerprint identification under the screen at the same time. Therefore, it is an urgent technical problem to provide a backlight module and a display device that are not only beneficial to reducing the module frame, but also better realize the fingerprint identification function.
Disclosure of Invention
In view of the above, the present invention provides a backlight module and a display device to solve the problem of a wider frame of the module in the prior art of identifying the fingerprint under the screen.
The invention discloses a backlight module, comprising: the backlight module is a side-in type backlight module, and the plurality of light sources are arranged along a first direction; the shell at least comprises a back plate and a side plate which are connected with each other, the extending direction of at least part of the back plate is parallel to the light-emitting surface of the backlight module, and the plane where the side plate is located is intersected with the light-emitting surface of the backlight module; a first flexible circuit board extending along a first direction is fixedly arranged on the surface of one side, close to the light guide plate, of the back plate, the plurality of light sources are positioned on one side, far away from the back plate, of the first flexible circuit board, and the plurality of light sources are electrically connected with the first flexible circuit board; the reflector plate is positioned on one side of the light guide plate close to the back plate; the backlight module also comprises an infrared emission assembly, the reflecting sheet comprises a first subsection close to the plurality of light sources in the second direction, and the infrared emission assembly is positioned between the back plate and the reflecting sheet at the first subsection; the second direction and the first direction are both parallel to the light-emitting surface of the backlight module, and the second direction is intersected with the first direction.
Based on the same inventive concept, the invention also discloses a display device, which comprises a display panel and the backlight module, wherein the display panel is positioned on one side of the light-emitting surface of the backlight module.
Compared with the prior art, the backlight module and the display device provided by the invention at least realize the following beneficial effects:
the backlight module is a side-in type backlight module, the reflector plate is positioned on one side of the light guide plate close to the back plate and used for reflecting light rays incident to one side of the light guide plate far away from the light emitting surface of the backlight module back, and the brightness and the energy efficiency can be further improved. The shell of the backlight module at least comprises a back plate and a side plate, and the integrally formed shell comprising the back plate and the side plate is used as a bearing shell of the backlight module, so that the manufacturing efficiency of the backlight module can be improved, and the structural stability of the backlight module is enhanced. According to the invention, the first flexible circuit board extending along the first direction is fixedly arranged on the surface of one side, close to the light guide plate, of the back plate of the backlight module, and the plurality of light sources are positioned on one side, far away from the back plate, of the first flexible circuit board, namely, the reverse-assembly type backlight structure is beneficial to further shrinking of the frame of the backlight module, so that the screen occupation ratio of a display device using the backlight module is improved. Because in the backlight unit of the structure is shaded to the formula of the reflection, the reflector plate has certain space between its first position department and backplate, consequently will be used for the infrared emission subassembly of fingerprint identification to set up between the backplate and the reflector plate of reflector plate at first position department, under the condition that does not increase backlight unit whole thickness as far as possible, be favorable to dwindling the length of using this backlight unit's display device's glass apron among the correlation technique to be favorable to reducing the frame. And the first subsection position of the reflector plate is not provided with a shading part towards one side of the light-emitting surface of the backlight module, and the infrared emission component is arranged at the position, so that the light-emitting efficiency of the infrared emission component is improved, and the influence on the fingerprint identification precision can be avoided. And when setting up the fingerprint detection subassembly of accomplishing the fingerprint identification function with the cooperation of infrared emission subassembly, can make the distance increase at the edge of fingerprint detection subassembly and display area to can be favorable to enlarging effective fingerprint identification region, the finger operation of being convenient for.
Of course, it is not necessary for any product in which the present invention is practiced to be specifically designed to achieve all of the above-described technical effects simultaneously.
Other features of the present invention and advantages thereof will become apparent from the following detailed description of exemplary embodiments of the invention, which proceeds with reference to the accompanying drawings.
Drawings
The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments of the invention and together with the description, serve to explain the principles of the invention.
Fig. 1 is a schematic partial cross-sectional view of a display device in the related art;
fig. 2 is a schematic plan view illustrating a backlight module according to an embodiment of the present invention;
FIG. 3 isbase:Sub>A schematic sectional view taken along line A-A' of FIG. 2;
FIG. 4 isbase:Sub>A schematic view of another cross-sectional structure along the line A-A' in FIG. 2;
FIG. 5 is an enlarged view of a portion of the area C in FIG. 4;
FIG. 6 is a schematic plan view of another backlight module according to an embodiment of the present invention;
FIG. 7 is a schematic sectional view taken along line B-B' of FIG. 6;
FIG. 8 isbase:Sub>A schematic view of an alternative cross-sectional configuration taken along line A-A' of FIG. 2;
FIG. 9 isbase:Sub>A schematic view of an alternative cross-sectional configuration taken along line A-A' of FIG. 2;
FIG. 10 is an enlarged view of a portion of the area D in FIG. 9;
FIG. 11 is an enlarged view of a portion of the area M in FIG. 8;
fig. 12 is a schematic plan view illustrating a display device according to an embodiment of the present invention;
FIG. 13 is a schematic cross-sectional view taken along line C-C' of FIG. 12;
FIG. 14 is a schematic view of an alternative cross-sectional configuration in the direction of C-C' of FIG. 12;
fig. 15 is a schematic view of another cross-sectional structure in the direction of C-C' in fig. 12.
Detailed Description
Various exemplary embodiments of the present invention will now be described in detail with reference to the accompanying drawings. It should be noted that: the relative arrangement of the components and steps, the numerical expressions and numerical values set forth in these embodiments do not limit the scope of the present invention unless specifically stated otherwise.
The following description of at least one exemplary embodiment is merely illustrative in nature and is in no way intended to limit the invention, its application, or uses.
Techniques, methods, and apparatus known to one of ordinary skill in the relevant art may not be discussed in detail but are intended to be part of the specification where appropriate.
In all examples shown and discussed herein, any particular value should be construed as exemplary only and not as limiting. Thus, other examples of the exemplary embodiments may have different values.
It should be noted that: like reference numbers and letters refer to like items in the following figures, and thus, once an item is defined in one figure, it need not be discussed further in subsequent figures.
In the related art, as shown in fig. 1, fig. 1 is a schematic partial cross-sectional structure of a display device in the related art, a photoelectric fingerprint identification technology generally includes a light emitting unit (which may be an infrared light emitting source) 04 'and a fingerprint sensing unit 05', the display device 001 'includes a backlight module 01' and a display panel 02 'that are oppositely disposed, the display panel 02' is located on one side of a light-emitting surface of the backlight module 01', a glass cover 03' is disposed on one side of the display panel 02 'away from the backlight module 01', and in the related art, the photoelectric fingerprint identification technology is disposed in a side-view manner and a direct-view manner, i.e., the direct-view manner is that the infrared light emitting source 04 'and the fingerprint sensing unit 05' are both disposed directly below the display device, the side-view manner is that the infrared light emitting source 04 'is disposed on one side of an edge of the display panel 02' directly below the glass cover 03', and the fingerprint sensing unit 05' is disposed directly below the display device (as shown in fig. 1), when a fingerprint is detected, infrared light is emitted from the infrared light emitting source 04 'to a surface of a touch main body 06' (for example, a surface of a finger and a fingerprint is reflected by a fingerprint sensing unit, and a fingerprint is finally reflected by a fingerprint sensing unit, and a fingerprint is reflected fingerprint sensing a fingerprint is reflected back, and a fingerprint is reflected by a fingerprint valley, and a fingerprint is reflected fingerprint signal is formed. For such an under-screen fingerprint identification structure, since the ir light source 04' needs to be placed at the edge side of the display panel 02' right under the glass cover plate 03', the length of the glass cover plate 03' needs to be increased by 1-1.8mm (as shown in the area a ' in fig. 1) for disposing the ir light source 04', which results in a wider frame of the display device, the ir light source 04' needs to be placed at a certain angle, and it is likely that the Flexible Printed Circuit board 07' (FPC) at the edge side of the display panel 02' will block part of the infrared light, which affects the fingerprint identification accuracy. Moreover, because the transmission range of the light emitted by the infrared light source 04' is limited, and the fingerprint sensing unit 05' needs to be arranged in a range capable of ensuring the irradiation of the infrared light source, the area where the fingerprint sensing unit 05' is arranged needs to be as close to the infrared light source 04' as possible, that is, the maximum distance between the fingerprint sensing unit 05' and the edge (such as the edge B ' in fig. 1) of the display area of the display panel 02' close to the infrared light source 04' is reduced, and thus the area where the fingerprint sensing unit 05' is arranged is relatively limited.
Based on above-mentioned problem, this application has provided a backlight unit and display device, both can realize narrow frame, can improve fingerprint identification effect and discernment precision again. The backlight module and the display device provided by the present application are described in detail as follows.
Referring to fig. 2 and fig. 3, fig. 2 isbase:Sub>A schematic plan view ofbase:Sub>A backlight module according to an embodiment of the present invention, and fig. 3 isbase:Sub>A schematic sectional view along the directionbase:Sub>A-base:Sub>A' in fig. 2 (it can be understood that, in order to clearly illustrate the film structure of the backlight module 000 of the present embodiment, transparency filling is performed on the light guide plate 30, the reflector 40, and the infrared emission assembly 60 in fig. 2),base:Sub>A backlight module 000 according to an embodiment of the present invention includes: the backlight module 000 is a side-in type backlight module, and the plurality of light sources 20 are arranged along a first direction X;
the housing 10 at least includes a back plate 101 and a side plate 102 connected to each other, at least a part of the back plate 101 extends in a direction parallel to the light-emitting surface E of the backlight module 000, and the plane of the side plate 102 intersects with the light-emitting surface E of the backlight module 000;
a first flexible circuit board 50 extending along the first direction X is fixedly arranged on the surface of one side of the back plate 101 close to the light guide plate 30, the plurality of light sources 20 are positioned on one side of the first flexible circuit board 50 far away from the back plate 101, and the plurality of light sources 20 are electrically connected with the first flexible circuit board 50; the reflective sheet 40 is positioned on one side of the light guide plate 30 close to the back plate 101;
the backlight module 000 further comprises an infrared emission assembly 60, in the second direction Y, the reflective sheet 40 comprises a first section 401 adjacent to the plurality of light sources 20, at the position of the first section 401, the infrared emission assembly 60 is located between the back plate 101 and the reflective sheet 40; the second direction Y and the first direction X are both parallel to the light emitting surface E of the backlight module 000, and the second direction Y intersects with the first direction X. Optionally, the second direction Y is perpendicular to the first direction X.
Specifically, the backlight module 000 in this embodiment is a side-in type backlight module, light emitted from the light source 20 of the side-in type backlight module is incident into the light guide plate 30 from the side of the light guide plate 30 to be mixed and converted into a surface light source, and is transmitted through the light guide plate 30 and then emitted from the front surface of the light guide plate 30, the luminance uniformity of the side-in type backlight module is mainly affected by the luminance uniformity of the incident light source 20 and the dots of the light guide plate 30, wherein the luminance uniformity of the light source 20 is most affected, the dots of the light guide plate 30 have the second effect, and the light source 20 of the side-in type backlight module is generally a linear light source. The reflective sheet 40 of the present embodiment is located on one side of the light guide plate 30 close to the back plate 101, and is configured to reflect light incident on one side of the light guide plate 30 away from the light exit surface E of the backlight module 000, so as to further improve brightness and energy efficiency. The housing 10 of the backlight module 000 of this embodiment at least includes a back plate 101 and a side plate 102, which are integrally formed, wherein at least a portion of the back plate 101 extends in a direction parallel to the light emitting surface E of the backlight module 000, or a direction of a plane where the back plate 101 is located is parallel to the light emitting surface E of the backlight module 000, and a plane where the side plate 102 is located intersects with a plane where the back plate 101 is located, optionally, as shown in fig. 3, the plane where the side plate 102 is located is perpendicular to the plane where the back plate 101 is located; it should be noted that, when the back plate 101 is a planar structure, the direction of the plane of the back plate 101 is parallel to the light emitting surface E of the backlight module 000; when the back plate 101 is not in a planar structure (with a concave-convex structure), the extending direction of the back plate 101 is parallel to the light emitting surface E of the backlight module 000, and the back plate 101 can be set according to the actual structure of the back plate 101 in the specific implementation. The integrally formed housing 10 including the back plate 101 and the side plates 102 serves as a carrying housing of the backlight module 000, so that the manufacturing efficiency of the backlight module 000 can be improved, and the structural stability of the backlight module 000 can be enhanced.
At present, along with the development of display technology, the narrow frame becomes one of main development directions, and whole display screen requires that the frame is narrow, then the inside backlight unit of display screen module also needs the narrow frame to match. Among the current backlight unit, the flexible line way board that is connected with the light source electricity usually is located the top (not shown in the figure) of light source (can be LED lamp area), because flexible line way board's glue position width is great, can't contract the distance of light source to casing curb plate, and this will be unfavorable for the shrink of backlight unit narrow limit to be unfavorable for improving the occupation of ratio of cell-phone screen.
A first flexible printed circuit board 50 extending along the first direction X is fixedly disposed on a surface of one side of the back plate 101 of the backlight module 000 of this embodiment, the plurality of light sources 20 are disposed on a side of the first flexible printed circuit board 50 away from the back plate 101, and the plurality of light sources 20 are electrically connected to the first flexible printed circuit board 50. In this embodiment, the first flexible printed circuit 50 extending along the first direction X is fixedly disposed on a surface of the back plate 101 of the backlight module 000 close to the light guide plate 30, and the plurality of light sources 20 are located on a side of the first flexible printed circuit 50 away from the back plate 101, that is, in a reverse-assembly type backlight structure, the integrally formed housing 10 including the back plate 101 and the side plate 102 is also used as a carrying housing of the backlight module 000, so as to implement reverse assembly of the backlight, which is beneficial to further shrinking of the frame of the backlight module 000, thereby improving the screen occupation ratio of the display device using the backlight module 000. In the backlight module 000 of the back-light assembly type backlight structure, in the second direction Y, the reflective sheet 40 includes the first sub-portion 401 close to the plurality of light sources 20, and the reflective sheet 40 in the related art is fixed to the back plate 101 at the position of the first sub-portion 401 by the double-sided adhesive tape, so that the reflective sheet 40 and the housing 10 are stable, and therefore, a certain space is formed between the reflective sheet 40 and the back plate 101 at the position of the first sub-portion 401, and therefore, in the embodiment, the infrared emission component 60 for fingerprint identification is disposed between the back plate 101 and the reflective sheet 40 at the position of the first sub-portion 401 of the reflective sheet 40, and under the condition that the overall thickness of the backlight module 000 is not increased as much as possible, the length of a glass cover plate of a display device using the backlight module in the related art is favorably reduced, and thus, a bezel is favorably reduced. Moreover, the first sub-section 401 of the reflector 40 has no light-blocking component at a side facing the light-emitting surface of the backlight module 000, so that the infrared emission component 60 is disposed at the position, which is beneficial to improving the light-emitting efficiency of the infrared emission component 60 and avoiding affecting the fingerprint identification precision. In the direction parallel to the light emitting surface E of the backlight module 000, compared with the structure in the related art shown in fig. 1, the position where the infrared emission component 60 of the embodiment is disposed is closer to the edge B of the display area of the display device using the backlight module 000, and optionally, the infrared emission component 60 may also overlap with the edge B of the display area, so that, when the fingerprint detection component 70 (as shown in fig. 3) is disposed to complete the fingerprint identification function in cooperation with the infrared emission component 60, the distance between the fingerprint detection component 70 and the edge of the display area can be increased, thereby being beneficial to expanding the effective fingerprint identification area and facilitating the finger operation.
It should be noted that fig. 2 and fig. 3 of the present embodiment only schematically illustrate the structure of the backlight module 000 related to the technical solution of the present embodiment, it is to be understood that the structure of the backlight module 000 is not limited thereto, and may also include other structures capable of implementing a backlight function, and optionally, the backlight module 000 may further include at least a diffusion sheet and a brightness enhancement sheet (not numbered in the figures), the diffusion sheet is located on a side of the light guide plate 30 away from the back plate 101, the brightness enhancement sheet is located on a side of the diffusion sheet away from the light guide plate 30, and the diffusion sheet and the brightness enhancement sheet on the light guide plate 30 play roles of diffusing and collecting light.
In some alternative embodiments, please refer to fig. 2 and fig. 4 in combination, fig. 4 is another schematic cross-sectional structure diagram along the directionbase:Sub>A-base:Sub>A' in fig. 2, in this embodiment, in the direction Z perpendicular to the light emitting surface E of the backlight module 000, the infrared emitting assembly 60 is fixed to the surface of the reflective sheet 40 on the side away from the light guide plate 30 and the surface of the back plate 101 on the side close to the reflective sheet 40, respectively.
In the direction Z perpendicular to the light emitting surface E of the backlight module 000, the infrared emitting assembly 60 may include an upper surface 60A near one side of the reflective sheet 40 and a lower surface 60B near one side of the back plate 101 of the housing 10, the upper surface 60A of the infrared emitting assembly 60 and the reflective sheet 40 are fixed on the surface far away from the light guide plate 30, and the lower surface 60B of the infrared emitting assembly 60 and the surface of the back plate 101 near one side of the reflective sheet 40 are fixed on the surface, so as to stabilize the infrared emitting assembly 60, and improve the stability of the fingerprint identification effect.
It can be understood that, in this embodiment, the fixing manner of the infrared emission component 60 and the reflection sheet 40, and the fixing manner of the infrared emission component 60 and the back plate 101 are not specifically limited, and may be a fixing and attaching manner, or may be other fixing manners, and only needs to have an effect of stabilizing the infrared emission component 60. Optionally, with continuing reference to fig. 2 and fig. 4, in the present embodiment, the infrared emitting assembly 60 is respectively attached and fixed to the surface of the reflective sheet 40 far from the light guide plate 30 and the surface of the back plate 101 near the reflective sheet 40 through the double-sided adhesive tape 80.
In the direction Z perpendicular to the light emitting surface E of the backlight module 000, the infrared emission assembly 60 may include an upper surface 60A near one side of the reflective sheet 40 and a lower surface 60B near one side of the back plate 101 of the housing 10, the upper surface 60A of the infrared emission assembly 60 may be attached and fixed to the surface of the reflective sheet 40 far from the light guide plate 30 by a first double-sided adhesive 801, and the lower surface 60B of the infrared emission assembly 60 may be attached and fixed to the surface of the back plate 101 near one side of the reflective sheet 40 by a second double-sided adhesive 802, so as to stabilize the infrared emission assembly 60, which is beneficial to improving the stability of the fingerprint identification effect.
In some alternative embodiments, referring to fig. 2, fig. 4 and fig. 5 in combination, fig. 5 is a partial enlarged view of a region C in fig. 4, in this embodiment, the infrared emission assembly 60 includes a second flexible circuit board 601 and at least one infrared lamp 602, the infrared lamp 602 is located on a side of the second flexible circuit board 601 away from the back plate 101, and the infrared lamp 602 is electrically connected to the second flexible circuit board 601.
The present embodiment further explains that the structure of the infrared emission assembly 60 may include a second flexible circuit board 601 and at least one infrared lamp 602, the infrared lamp 602 is electrically connected to the second flexible circuit board 601, the second flexible circuit board 601 is used for providing a driving signal to make the infrared lamp 602 emit an infrared light with a desired brightness, during fingerprint identification detection, the infrared lamp 602 emits an infrared light for fingerprint detection, and the infrared light is emitted to a surface of a touch subject (such as a finger surface), and is identified by the fingerprint detection assembly 70 after being reflected back by valleys and ridges of a finger fingerprint, because the reflected infrared light signals of the valleys and ridges of the fingerprint are different, the fingerprint detection assembly 70 may receive different fingerprint information, and finally form a fingerprint image. Optionally, the infrared lamp 602 may be an infrared chip, and may be directly connected to the second flexible printed circuit board 601 through a fastener.
It should be noted that the infrared emitting assembly 60 of the present embodiment may include one infrared lamp 602 or a plurality of infrared lamps 602, and the present embodiment is not limited in particular, and may be set according to the actual light intensity requirement of fingerprint identification.
Optionally, with continuing to refer to fig. 2, fig. 4 and fig. 5, the infrared lamp 602 of this embodiment is wrapped by a transparent adhesive layer 603 (not filled in the drawing), and the transparent adhesive layer 603 is used for protecting the infrared lamp 602, and at the same time, the first double-sided adhesive 801 (not shown in fig. 5) on the upper surface 60A of the infrared emission assembly 60 and the surface of the reflective sheet 40 on the side far from the light guide plate 30 may also be cancelled, so that the upper surface 60A of the infrared emission assembly 60 and the surface of the reflective sheet 40 on the side far from the light guide plate 30 can be directly attached and fixed through the transparent adhesive layer 603, which is beneficial to thinning the module.
In some alternative embodiments, please refer to fig. 6 and 7, fig. 6 is a schematic plan structure diagram of another backlight module provided in the embodiments of the present invention, fig. 7 is a schematic sectional structure diagram along the direction B-B' in fig. 6 (it can be understood that, in order to clearly illustrate the film structure of the backlight module 000 of the present embodiment, transparency filling is performed on the light guide plate 30, the reflective sheet 40, and the infrared emission component 60 in fig. 6), in the present embodiment, the first flexible printed circuit board 50 electrically connected to the light source 20 is multiplexed into the second flexible printed circuit board 601 of the infrared emission component 60.
This embodiment further explains that the first flexible printed circuit board 50 for driving the light source 20 of the backlight module 000 can be shared with the second flexible printed circuit board 601 of the infrared emission assembly 60, because the first flexible printed circuit board 50 of the reverse-type backlight structure is located at the side of the light source 20 close to the back plate 101, and the second flexible printed circuit board 601 of the infrared emission assembly 60 is located at the side of the infrared lamp 602 close to the back plate 101, therefore, the first flexible printed circuit board 50 electrically connected with the light source 20 can extend to the side of the infrared lamp 602 close to the back plate 101 to form an integrated flexible printed circuit FPC, that is, the first flexible printed circuit board 50 electrically connected with the light source 20 is multiplexed to be used as the second flexible printed circuit board 601 for driving the infrared lamp 602 to emit light, and optionally, the first flexible printed circuit board 50 driving the light source 20 and the second flexible printed circuit board 601 driving the infrared lamp 602 to emit light have independent control circuits in the integrated flexible printed circuit FPC, so that the light source 602 and the light source 20 can be controlled to emit light respectively. In this embodiment, the first flexible printed circuit board 50 electrically connected to the light source 20 is multiplexed as the second flexible printed circuit board 601 of the infrared emitting assembly 60, and the control circuit for driving the light source 20 to emit light and the control circuit for driving the infrared lamp 602 to emit light can be integrated in the same flexible printed circuit board FPC, which is beneficial to simplifying the manufacturing process and improving the manufacturing efficiency.
In some alternative embodiments, please refer to fig. 2 and 8 in combination, fig. 8 is another schematic cross-sectional view along the directionbase:Sub>A-base:Sub>A' in fig. 2, in this embodiment, the back plate 101 at least includesbase:Sub>A first connecting plate 1011 andbase:Sub>A second connecting plate 1012, and both the first connecting plate 1011 and the second connecting plate 1012 extend alongbase:Sub>A first direction;
in the direction parallel to the light emitting surface E of the backlight module 000, the first connecting plate 1011 is located on the side of the second connecting plate 1012 near the light source 20;
in a direction Z perpendicular to the light emitting surface E of the backlight module 000, a distance L1 from the first connecting plate 1011 to the light guide plate 30 is greater than a distance L2 from the second connecting plate 1012 to the light guide plate 30;
the orthographic projections of the first flexible circuit board 50, the infrared emission component 60 and at least part of the reflector 40 (which may be the first sub-part 401 of the reflector 40) to the back panel 101 are all located within the range of the first connecting board 1011.
The embodiment explains that the first connecting plate 1011 recessed to form the back plate 101 may be disposed at a position of the back plate 101 close to the light source 20, and the first connecting plate 1011 serves as a mounting position of the first flexible circuit board 50 (at this time, the back plate 101 is not a planar structure, and the extending direction of the back plate 101 is parallel to the light emitting surface E of the backlight module 000, or substantially parallel), so that the first connecting plate 1011 recessed to form at the position of the light source 20 through the back plate 101 plays a certain limiting role in mounting the first flexible circuit board 50 and the light source 20, that is, the orthographic projection of the first flexible circuit board 50 to the back plate 101 is located within the range of the first connecting plate 1011, thereby avoiding the risk that the light source 20 floats, dies the light, or the first flexible circuit board 50 is broken due to the impact force striking the light guide plate 30 in the process of a drop experiment. In addition, in the embodiment, the infrared emission component 60 and at least part of the reflective sheet 40 (which may be the first subsection 401 of the reflective sheet 40) are also disposed within the range of the first connection board 1011 in the orthogonal projection direction to the back panel 101, that is, in the embodiment, the light source 20 and the infrared emission component 60 are both disposed in the recessed position of the back panel 101, so that the optical films (such as the reflective sheet 40 and the light guide plate 30) of the backlight module 000 are relatively flat, which is beneficial to reducing the overall thickness of the backlight module and improving the backlight effect.
Optionally, with continuing to refer to fig. 2 and fig. 8, the plane of the first connecting plate 1011 and the plane of the second connecting plate 1012 of the back plate 101 of the present embodiment are both parallel to the light emitting surface E of the backlight module 000; the back plate 101 further comprises a connector plate 1013 between the first connector plate 1011 and the second connector plate 1012, the connector plate 1013 being integrally formed with the first connector plate 1011 and the second connector plate 1012.
The extension direction of the connecting plate 1013 of this embodiment intersects with the extension direction of the first connecting plate 1011, and by the arrangement of the connecting plate 1013, the first connecting plate 1011 and the second connecting plate 1012 of the back plate 101 are not on the same plane, and the plane of the first connecting plate 1011 and the plane of the second connecting plate 1012 are both parallel to the light-emitting surface E of the backlight module 000, so as to form a recess for placing the light source 20 and the infrared emitting component 60, so that the light source 20 is flatly arranged, and at the same time, the flatness of the optical films (such as the reflective sheet 40 and the light guide plate 30) of the backlight module 000 is ensured, which is beneficial to reducing the overall thickness of the backlight module and improving the backlight effect.
In some alternative embodiments, please refer to fig. 2 and fig. 9 in combination, fig. 9 is another schematic cross-sectional structure diagram along the direction ofbase:Sub>A-base:Sub>A' in fig. 2, in this embodiment, the first connection board 1011 of the back plate 101 includesbase:Sub>A first sub-board 1011base:Sub>A andbase:Sub>A second sub-board 1011B, and in the direction parallel to the light emitting surface E of the backlight module 000, the first sub-board 1011base:Sub>A is located onbase:Sub>A side of the second sub-board 1011B away from the second connection board 1012;
the plane of the first sub-board 1011A and the plane of the second connection board 1012 are both parallel to the light emitting surface E of the backlight module 000, the plane of the second sub-board 1011B intersects with the plane of the first sub-board 1011A, and the included angle α is an acute angle, and in the direction Z perpendicular to the light emitting surface E of the backlight module 000, the second sub-board 1011B is inclined towards the direction away from the light guide plate 30 to form the included angle α;
the orthographic projection of the infrared emission component 60 to the back panel 101 is located within the range of the second sub-panel 1011B.
The embodiment further explains that the first connection board 1011 of the back panel 101 may include a first sub-board 1011A and a second sub-board 1011B which are not located on the same plane, where the first sub-board 1011A is located on a side of the second sub-board 1011B away from the second connection board 1012, a plane where the first sub-board 1011A is located and a plane where the second connection board 1012 is located are both parallel to the light exit surface E of the backlight module 000, a forward projection of the light source 20 and the first flexible circuit board 50 to the back panel 101 may be located in the range of the first sub-board 1011A, a forward projection of the infrared emission component 60 to the back panel 101 is located in the range of the second sub-board 1011B, a plane where the second sub-board 1011B is located intersects with the plane where the first sub-board 1011A, and an included angle α is an acute angle, and the second sub-board 1011B is inclined away from the light guide plate 30 to form the included angle α, so that a part of the back panel 101 where the infrared emission component 60 is located may have a certain angle to control a light emitting angle of the infrared lamp 602 of the infrared emission component 60 to face an area where the fingerprint detection component 70, which is located, and is beneficial to further improve light efficiency of the infrared emission component 60.
It can be understood that the housing 10 of the present embodiment may be an iron frame, and the first sub-board 1011A, the second sub-board 1011B, the second connecting plate 1012 and the side plate 102 in the back plate 101 may be integrally formed, which is beneficial to reducing the process difficulty. It should be noted that, when the second sub-board 1011B is inclined toward a direction away from the light guide plate 30 to form the included angle α, the gap between the infrared emission assembly 60 and the reflective sheet 40 may be filled with the transparent adhesive layer 603, so as to improve the installation stability of the infrared emission assembly 60.
In some alternative embodiments, please refer to fig. 2, 9 and 10 in combination, fig. 10 is a partially enlarged view of a region D in fig. 9, in this embodiment, in a direction parallel to the light emitting surface E of the backlight module 000, the second sub-board 1011B includes a first side 1011B1 close to the first sub-board 1011A and a second side 1011B2 far away from the first sub-board 1011A;
in a direction Z perpendicular to the light emitting surface E of the backlight module 000, a distance L3 from the first side 1011B1 to the light guide plate 30 is smaller than a distance L4 from the second side 1011B2 to the light guide plate 30.
The present embodiment further explains that the plane of the second sub-board 1011B intersects the plane of the first sub-board 1011A, and the included angle α is an acute angle, at this time, in the direction parallel to the light emitting surface E of the backlight module 000, the second sub-board 1011B includes a first side 1011B1 close to the first sub-board 1011A and a second side 1011B2 far away from the first sub-board 1011A, and in the direction Z perpendicular to the light emitting surface E of the backlight module 000, the distance L3 from the first side 1011B1 to the light guide plate 30 is smaller than the distance L4 from the second side 1011B2 to the light guide plate 30, that is, the first side 1011B1 of the second sub-board 1011B is higher than the second side 1011B2, and the second sub-board 1011B is inclined toward the direction far away from the light guide plate 30 to form the included angle α, so that a part of the back plate 101 at the position of the infrared emitting assembly 60 has a certain angle, so as to control the light emitting angle of the infrared lamp 602 of the infrared emitting assembly 60 toward the area of the fingerprint detecting assembly 70, which is favorable for further improving the light efficiency of the infrared emitting assembly 60.
Optionally, please refer to fig. 2, 9 and 10 in combination, in this embodiment, the plane where the second sub-board 1011B is located intersects with the plane where the first sub-board 1011A is located, and the included angle is α, where α is greater than 0 ° and less than or equal to 10 °, the included angle α formed by the second sub-board 1011B inclining towards the direction away from the light guide plate 30 is an acute angle, and the range is greater than 0 ° and less than or equal to 10 °, so as to avoid that the projection of the back plate 101 at the position is caused by an excessively large inclination angle of the second sub-board 1011B, which affects the overall thin design of the backlight module 000, and also avoid that the light-emitting angle of the infrared lamp 602 cannot better face the area where the fingerprint detection assembly 70 is located due to an excessively small inclination angle of the second sub-board 1011B, which causes waste of the emitted light. Therefore, the range of the included angle α is set to be more than 0 degree and less than or equal to 10 degrees, which is beneficial to the overall thin design of the backlight module 000 and can further improve the light efficiency utilization rate of the infrared emission component 60.
In some alternative embodiments, please refer to fig. 2, fig. 8 and fig. 11 in combination, fig. 11 is a partially enlarged view of the area M in fig. 8, in this embodiment, the distance H between the first connecting plate 1011 and the second connecting plate 1012 in the direction Z perpendicular to the light emitting surface E of the backlight module 000 is in the range of 0.24-0.26mm.
In this embodiment, a recess is formed at a position of the back plate 101 close to the light source 20 to form the first connecting plate 1011 of the back plate 101, the depth of the recess may be 0.24-0.26mm, and the first connecting plate 1011 is used as a mounting position of the first flexible circuit board 50 (at this time, the back plate 101 is not a planar structure, and the extending direction of the back plate 101 is parallel to or substantially parallel to the light emitting surface E of the backlight module 000), so that the first connecting plate 1011 formed by the recess at the position of the light source 20 through the back plate 101 can play a certain limiting role in mounting the first flexible circuit board 50 and the light source 20. Meanwhile, the position of the first connecting plate 1011 is also used for placing the infrared emission component 60, the thickness range of the double-sided adhesive tape 80 used for fixing the infrared emission component 60 is generally 0.03-0.05mm, the thickness of the second flexible circuit board 601 is generally about 0.08mm, the thickness of the infrared lamp 602 (infrared chip) is generally about 0.1mm, and the sealing height of the transparent adhesive layer 603 is generally about 0.03mm (the sealing height of the transparent adhesive layer 603 exceeds the surface of the infrared chip), so that the double-sided adhesive tape 80 (referring to the second double-sided adhesive tape 802, the sum of the sealing thicknesses of the upper surface 60A of the infrared emission component 60 and the surface of the reflection sheet 40 far away from the light guide plate 30 can be eliminated because the adhesive layer 603 can directly realize the bonding and fixing of the upper surface 60A of the infrared emission component 60 and the surface of the reflection sheet 40 far away from the light guide plate 30, the second flexible circuit board 601, the infrared lamp 602 (infrared chip) and the transparent adhesive layer 603 is 0.24-0.26mm, therefore, the infrared emission module 60 for fingerprint identification is disposed in the space between the back plate 101 and the reflective sheet 40 at the first portion 401 of the reflective sheet 40, the first connection plate 1011 of the back plate 101 is formed by disposing the recess at the position of the back plate 101 close to the light source 20, and the infrared emission module 60 can be stably disposed within the depth range of 0.24-0.26mm, so as to ensure the flatness of the optical films (such as the reflective sheet 40 and the light guide plate 30) of the backlight module 000 and facilitate the reduction of the overall thickness of the backlight module at the same time, the backlight effect is improved.
It should be noted that, the upper and lower surfaces of the first flexible circuit board 50 at the position of the light source 20 may also be fixedly attached to the light source 20 and the back plate 101 respectively through a double-sided adhesive (shown by black filling in the figure), the thickness of the double-sided adhesive is generally 0.08mm, the thickness of the first flexible circuit board 50 is generally about 0.12mm, the height of the space between the surface of the light source 20 close to the side of the back plate 101 and the surface of the back plate 101 close to the side of the light source is (0.08 +0.12+ 0.08) mm =0.28mm, while the thickness of the reflective sheet 40 of the embodiment is generally 0.082mm, the thickness of the integral reflective sheet 40 and the space required for placing the infrared emitting assembly 60 is (0.24 + 0.082) mm- (0.26 + 0.082) mm, that is, i.0.322-0.342 mm, so as can be known, in the embodiment, the infrared emission component 60 for fingerprint identification is disposed in the space between the back plate 101 and the reflective sheet 40 of the reflective sheet 40 at the position of the first sub-portion 401, and the overall thickness of the backlight module 000 is only increased by (0.322-0.28) mm- (0.342-0.0.28) mm, that is, the overall thickness of the backlight module 000 is only increased by 0.042-0.062mm, which proves that the influence on the overall thickness of the backlight module 000 is small, therefore, in the embodiment, the infrared emission component 60 for fingerprint identification is disposed between the back plate 101 and the reflective sheet 40 of the reflective sheet 40 at the position of the first sub-portion 401, and under the condition that the overall thickness of the backlight module 000 is not increased as much as possible, the length of a glass cover plate of a display device using the backlight module in the related art is favorably reduced, thereby being favorable for reducing a bezel.
In some optional embodiments, referring to fig. 12, fig. 12 is a schematic plan view illustrating a display device according to an embodiment of the present invention, in which a display device 111 according to this embodiment includes a display panel 001 and a backlight module 000 according to the above embodiment of the present invention, in which the display panel 001 is a liquid crystal display panel, and the display panel 001 is located on one side of a light emitting surface E of the backlight module 000. The embodiment of fig. 12 is only an example of a mobile phone, and the display device 111 is described, it is understood that the display device 111 provided in the embodiment of the present invention may be another display device 111 having a display function, such as a computer, a television, and a vehicle-mounted display device, and the present invention is not limited thereto. The display device 111 provided in the embodiment of the present invention has the beneficial effects of the backlight module 000 provided in the embodiment of the present invention, and specific descriptions of the backlight module 000 in the above embodiments may be specifically referred to, and details of the embodiment are not repeated herein.
In some optional embodiments, please refer to fig. 12, 13 and 14 in combination, fig. 13 is a schematic cross-sectional structure view along the direction C-C 'in fig. 12, and fig. 14 is a schematic cross-sectional structure view along the direction C-C' in fig. 12, in this embodiment, the display device 111 further includes a fingerprint detection assembly 70, the fingerprint detection assembly 70 is located on a side of the backlight module 000 away from the display panel 001, and the fingerprint detection assembly 70 is fixedly connected to the backlight module 000.
The present embodiment further explains that the fingerprint detection assembly 70 for fingerprint detection can be externally hung on the backlight module 000 and fixedly connected to the backlight module 000, and the backlight module 000 can be provided with a light-transmitting blind hole 701 at a corresponding position of the fingerprint detection assembly 70 for light to pass through (as shown in fig. 13). Optionally, the fingerprint detection assembly 70 for fingerprint detection may be further disposed in the backlight module 000, and is fixedly connected to the backlight module 000, the backlight module 000 may further include a light-transmitting through hole 702 at a position corresponding to the position of the housing 10 where the fingerprint detection assembly 70 is to be disposed, and the fingerprint detection assembly 70 is embedded in the through hole (as shown in fig. 14), which is beneficial to further thinning of the entire display device.
In some alternative embodiments, please refer to fig. 12, 13 and 14, in this embodiment, a light shielding tape 90 is further attached between the display panel 001 and the backlight module 000, the light shielding tape 90 is disposed to extend along the first direction X, and a forward projection of the light shielding tape 90 to the light exit plane E of the backlight module 000 and a forward projection of the light source 20 and at least a portion of the light guide plate 30 to the light exit plane E of the backlight module 000 are overlapped with each other.
The present embodiment further explains that a light-shielding tape 90 extending along the first direction X is further disposed between the backlight module 000 and the display panel 001, an extending direction of the light-shielding tape 90 is parallel to the light-emitting surface E of the backlight module 000, and along a direction Z perpendicular to the light-emitting surface E of the backlight module 000, a forward projection of the light-shielding tape 90 to the light-emitting surface E of the backlight module 000 and a forward projection of the light source 20 and at least a portion of the light guide plate 30 to the light-emitting surface E of the backlight module 000 are overlapped with each other, when the backlight module 000 and the display panel 001 (optionally, when the backlight module 000 is assembled with the substrate of the display panel 001), the light-shielding tape 90 not only can play a role of fixing the backlight module 000 and the display panel 001, but also can play a role of light shielding, thereby avoiding light leakage at the position of the light source 20, and being beneficial to improving the product quality of the display device 111.
It should be noted that one side of the light-shielding tape 90 close to the back plate 101 can be attached to a portion of the brightness enhancement sheet 100 of the backlight module 000, so that the light-shielding tape 004 can have a light-shielding effect, and can be fixedly attached to the brightness enhancement sheet 100, thereby preventing the brightness enhancement sheet 100 from moving, and facilitating the improvement of the stability of the entire display device 111.
In some optional embodiments, please refer to fig. 12 and fig. 15 in combination, fig. 15 is another schematic cross-sectional structure view along direction C-C' in fig. 12, in this embodiment, one side of the side plate 102 away from the back plate 101 further includes an extending portion 103, the extending portion 103 and the side plate 102 are integrally formed, the extending portion 103 extends toward the accommodating space, a plane where the extending portion 103 is located is parallel to the light emitting surface E of the backlight module 000, and the light shielding tape 90 is attached and fixed to a surface of the extending portion 103 away from the back plate 101.
The embodiment further explains that the side of the side plate 102 far from the back plate 101 further includes an extension portion 103 integrally formed with the side plate 102, the extension portion 103 extends toward the direction of the accommodating space, the plane where the extension portion 103 is located is parallel to the light emitting surface E of the backlight module 000, the light shielding tape 90 is fixed to the surface of the side of the extension portion 103 far from the back plate 101, the arrangement of the extension portion 103 of the embodiment is equivalent to further extending the side plate 102 of the housing 10 toward the direction of the accommodating space, and when the backlight module 000 is attached to the display panel 001, the risk of breaking the glass substrate edge of the display panel 001 due to the collision of the end of the side plate 102 of the housing 10 can be avoided, the light shielding tape 90 can have a lapped surface on the backlight module 000, which is beneficial to enhancing the attaching effect of the light shielding tape 90.
By the embodiment, the backlight module and the display device at least realize the following beneficial effects:
the backlight module is a side-in type backlight module, the reflector plate is positioned on one side of the light guide plate close to the back plate and used for reflecting light rays incident to one side of the light guide plate far away from the light emitting surface of the backlight module, and the brightness and the energy efficiency can be further improved. The shell of the backlight module at least comprises a back plate and a side plate, and the integrally formed shell comprising the back plate and the side plate is used as a bearing shell of the backlight module, so that the manufacturing efficiency of the backlight module can be improved, and the structural stability of the backlight module is enhanced. The first flexible circuit board extending along the first direction is fixedly arranged on the surface of one side, close to the light guide plate, of the back plate of the backlight module, and the plurality of light sources are positioned on one side, far away from the back plate, of the first flexible circuit board, namely, the reverse-assembly type backlight structure is favorable for further shrinking of the frame of the backlight module, so that the screen occupation ratio of the display device using the backlight module is improved. Because in the backlight unit of the structure is shaded to the formula of the reflection, the reflector plate has certain space between its first position department and backplate, consequently will be used for the infrared emission subassembly of fingerprint identification to set up between the backplate and the reflector plate of reflector plate at first position department, under the condition that does not increase backlight unit whole thickness as far as possible, be favorable to dwindling the length of using this backlight unit's display device's glass apron among the correlation technique to be favorable to reducing the frame. And the first subsection position of the reflector plate is not provided with a shading part towards one side of the light-emitting surface of the backlight module, and the infrared emission component is arranged at the position, so that the light-emitting efficiency of the infrared emission component is improved, and the influence on the fingerprint identification precision can be avoided. And when setting up the fingerprint detection subassembly of accomplishing the fingerprint identification function with the cooperation of infrared emission subassembly, can make the distance increase of the edge of fingerprint detection subassembly and display area to can be favorable to enlarging effective fingerprint identification region, the finger operation of being convenient for.
Although some specific embodiments of the present invention have been described in detail by way of examples, it should be understood by those skilled in the art that the above examples are for illustrative purposes only and are not intended to limit the scope of the present invention. It will be appreciated by those skilled in the art that modifications can be made to the above embodiments without departing from the scope and spirit of the invention. The scope of the invention is defined by the appended claims.
Claims (17)
1. A backlight module, comprising: the backlight module comprises a shell, a plurality of light sources, a light guide plate and a reflector plate, wherein the shell forms an accommodating space for accommodating the light sources, the light guide plate and the reflector plate, the backlight module is a side-in type backlight module, and the light sources are arranged along a first direction;
the shell at least comprises a back plate and a side plate which are connected with each other, the extending direction of at least part of the back plate is parallel to the light-emitting surface of the backlight module, and the plane of the side plate is intersected with the light-emitting surface of the backlight module;
a first flexible circuit board extending along the first direction is fixedly arranged on the surface of one side, close to the light guide plate, of the back plate, the plurality of light sources are positioned on one side, far away from the back plate, of the first flexible circuit board, and the plurality of light sources are electrically connected with the first flexible circuit board; the reflector plate is positioned on one side of the light guide plate close to the back plate;
the backlight module also comprises an infrared emission assembly, and in the second direction, the reflecting sheet comprises a first subsection close to the plurality of light sources, and at the first subsection position, the infrared emission assembly is positioned between the back plate and the reflecting sheet; the second direction and the first direction are both parallel to a light emitting surface of the backlight module, and the second direction is intersected with the first direction.
2. The backlight module as claimed in claim 1, wherein the infrared emission component is fixed to a surface of the reflector plate away from the light guide plate and a surface of the back plate close to the reflector plate respectively in a direction perpendicular to a light emitting surface of the backlight module.
3. The backlight module according to claim 2, wherein the infrared emitting assembly is attached and fixed to the surface of the reflector plate on the side away from the light guide plate and the surface of the back plate on the side close to the reflector plate by double-sided adhesive tapes.
4. The backlight module according to claim 1, wherein the infrared emitting assembly comprises a second flexible circuit board and at least one infrared lamp, the infrared lamp is located on a side of the second flexible circuit board away from the back plate, and the infrared lamp is electrically connected with the second flexible circuit board.
5. The backlight module as claimed in claim 4, wherein the infrared lamp is wrapped with a transparent glue layer.
6. The backlight module as claimed in claim 4, wherein the first flexible circuit board is multiplexed into the second flexible circuit board.
7. The backlight module according to claim 1, wherein the back plate comprises at least a first connecting plate and a second connecting plate, and the first connecting plate and the second connecting plate both extend along the first direction;
in the direction parallel to the light-emitting surface of the backlight module, the first connecting plate is positioned on one side of the second connecting plate, which is close to the light source;
in a direction perpendicular to a light emitting surface of the backlight module, the distance from the first connecting plate to the light guide plate is greater than the distance from the second connecting plate to the light guide plate;
the orthographic projections of the first flexible circuit board, the infrared emission assembly and at least part of the reflector plate to the back plate are all located within the range of the first connecting plate.
8. The backlight module as claimed in claim 7, wherein the plane of the first connecting plate and the plane of the second connecting plate are both parallel to the light emitting surface of the backlight module.
9. The backlight module according to claim 7, wherein the first connection board comprises a first sub-board and a second sub-board, and the first sub-board is located on a side of the second sub-board away from the second connection board in a direction parallel to the light emitting surface of the backlight module;
the plane where the first sub-board is located and the plane where the second connecting board is located are both parallel to the light emitting surface of the backlight module, the plane where the second sub-board is located is intersected with the plane where the first sub-board is located, an included angle is an acute angle, and in the direction perpendicular to the light emitting surface of the backlight module, the second sub-board inclines towards the direction away from the light guide plate to form the included angle;
the orthographic projection of the infrared emission assembly to the back plate is located within the range of the second sub-plate.
10. The backlight module according to claim 9, wherein the second sub-board comprises a first side close to the first sub-board and a second side far from the first sub-board in a direction parallel to the light emitting surface of the backlight module;
in a direction perpendicular to a light emitting surface of the backlight module, a distance from the first side to the light guide plate is smaller than a distance from the second side to the light guide plate.
11. The backlight module according to claim 9, wherein the plane of the second sub-board intersects with the plane of the first sub-board at an included angle α, and α is greater than 0 ° and less than or equal to 10 °.
12. The backlight module according to claim 7, wherein the back plate further comprises a connector plate between the first connector plate and the second connector plate, the connector plate being integrally formed with the first connector plate and the second connector plate.
13. The backlight module according to claim 7, wherein the distance between the first connecting plate and the second connecting plate is in the range of 0.24-0.26mm in the direction perpendicular to the light exit surface of the backlight module.
14. A display device, comprising a display panel and the backlight module as claimed in any one of claims 1 to 13, wherein the display panel is located at one side of the light-emitting surface of the backlight module.
15. The display device according to claim 14, further comprising a fingerprint detection assembly, wherein the fingerprint detection assembly is located on a side of the backlight module away from the display panel, and the fingerprint detection assembly is fixedly connected to the backlight module.
16. The display device according to claim 14, wherein a light shielding tape is further attached between the display panel and the backlight module, the light shielding tape extends along the first direction, and an orthogonal projection of the light shielding tape to the light exit surface of the backlight module overlaps with an orthogonal projection of the light source and at least a portion of the light guide plate to the light exit surface of the backlight module.
17. The display device according to claim 16, wherein the side of the side plate away from the back plate further comprises an extending portion, the extending portion and the side plate are integrally formed, the extending portion extends toward the accommodating space, a plane where the extending portion is located is parallel to the light emitting surface of the backlight module, and the light shielding tape is fixedly attached to the surface of the extending portion away from the back plate.
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| CN112987403B (en) * | 2021-03-05 | 2022-05-17 | 厦门天马微电子有限公司 | Backlight module and display device |
| CN113539203B (en) * | 2021-06-29 | 2022-08-23 | 北海惠科光电技术有限公司 | Display panel's drive arrangement, display device |
| CN114387871A (en) * | 2021-11-30 | 2022-04-22 | 重庆惠科金渝光电科技有限公司 | Backlight module and display device |
| CN115685437A (en) * | 2022-08-24 | 2023-02-03 | 厦门天马微电子有限公司 | Backlight module and display device |
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