CN111881331B - Brazing filler metal selecting method and device, computer equipment and storage medium - Google Patents
Brazing filler metal selecting method and device, computer equipment and storage medium Download PDFInfo
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Abstract
The application provides a method and a device for selecting brazing filler metal, computer equipment and a storage medium, wherein the method comprises the steps of obtaining attribute information of various brazing filler metals; determining a wettability parameter corresponding to each brazing filler metal based on the attribute information of each brazing filler metal; and selecting the brazing filler metal of which the corresponding wettability parameter meets the preset selection condition from a plurality of brazing filler metals as the target brazing filler metal based on the wettability parameter corresponding to each brazing filler metal. The solder with the best wettability is determined by calculating the spreading area coefficient of each solder as the corresponding wettability parameter and selecting the coefficient based on the wettability parameters of a plurality of solders, so that the use efficiency in the experiment or manufacturing process is improved.
Description
Technical Field
The present disclosure relates to the field of brazing technologies, and in particular, to a method and an apparatus for selecting a brazing filler metal, a computer device, and a storage medium.
Background
Brazing means that a brazing material with a melting point lower than that of a base material is adopted, the brazing material and the base material are heated to a temperature higher than a liquidus line of the brazing material and lower than a solidus line of the base material at the same time, the brazing material is melted into a liquid state, and the base material keeps a solid state, so that the liquid brazing material can play a role in wetting, filling, spreading and the like in gaps or on the surface of the base material or interact with the base material, such as dissolving, diffusing or generating intermetallic compounds, so that the liquid brazing material is cooled and solidified to form a firm joint to be connected with the base. Based on the principle, brazing is widely applied to military and civil industries such as aerospace, automobiles, chemical engineering, machinery, electronics, household appliances and the like, and can even be applied to the manufacture of microwave waveguides, electron tubes and electronic vacuum devices, so that the selection of a suitable brazing filler metal is particularly important.
The wetting property of the solder is usually evaluated by adopting a spreading coefficient, and the specific method is to measure the thickness of a copper plate before spreading the solder and the total height of a sample after spreading by adopting a micrometer, further measure the height of the solder after spreading, and calculate and obtain the spreading coefficient by utilizing a spreading coefficient calculation formula. However, with the development of new brazing structure design and new materials, the structural materials for brazing are diversified and heterogeneous, the requirements on the wettability of the brazing filler metal are very strict, and the requirements can be met by adopting multi-component alloy component design at present. The developed multi-element alloy solder has the characteristics of large melting temperature range, large influence of base metal components and surface states on the wettability of the solder, and the like, and is more irregular in shape after being spread under the actual working condition, so that the result deviation of the traditional measuring method is large, the calculated spreading coefficient cannot accurately reflect the wettability of the solder, the most suitable solder cannot be selected, and the subsequent experiment and manufacturing process is influenced.
Disclosure of Invention
In view of this, embodiments of the present application provide at least a method and an apparatus for selecting a solder, a computer device, and a storage medium, in which a spreading area coefficient of each solder is calculated as a wetting performance parameter corresponding to the spreading area coefficient, and the solder with the best wetting performance is selected based on the wetting performance parameters of a plurality of solders, so that the solder with the best wetting performance is determined, and the use efficiency in an experiment or a manufacturing process is improved.
The application mainly comprises the following aspects:
in a first aspect, an embodiment of the present application provides a method for selecting a brazing filler metal, where the method for selecting the brazing filler metal includes:
acquiring attribute information of various brazing fillers;
determining a wettability parameter corresponding to each brazing filler metal based on the attribute information of each brazing filler metal;
and selecting the brazing filler metal of which the corresponding wettability parameter meets the preset selection condition from a plurality of brazing filler metals as the target brazing filler metal based on the wettability parameter corresponding to each brazing filler metal.
In a possible implementation manner, the attribute information includes quality and density parameters corresponding to each brazing filler metal, and area data of each brazing filler metal after being spread on the surface of the base metal obtained through measurement;
the determining of the wettability parameter corresponding to each solder based on the attribute information of each solder comprises:
and determining the wettability parameter of each brazing filler metal based on the corresponding quality and density parameter of each brazing filler metal and the area data of each brazing filler metal after being spread on the surface of the base metal.
In a possible embodiment, the determining the wettability parameter of each brazing filler metal based on the corresponding quality and density parameter of each brazing filler metal and the data of the area of each brazing filler metal after being spread on the surface of the base metal comprises:
determining volume data corresponding to each brazing filler metal based on the mass and density parameters corresponding to each brazing filler metal;
obtaining the projection area of a sphere with volume data equal to that of each brazing filler metal based on the volume data corresponding to each brazing filler metal;
and obtaining the wetting property parameter of each brazing filler metal based on the projection area of the sphere with the same volume data as each brazing filler metal and the area data of each brazing filler metal after spreading on the surface of the base metal.
In one possible embodiment, the calculation formula of the projected area of the sphere having the same volume data as each solder is as follows:
S＝0.604V2/3；
wherein S represents a projected area of a sphere having volume data equal to each solder, and V represents volume data corresponding to each solder.
In a possible embodiment, the obtaining the wettability parameter of each solder based on the projected area of the sphere with the same volume as each solder and the area data of each solder after spreading on the surface of the base metal comprises:
calculating the spreading area coefficient of each brazing filler metal based on the projection area of the sphere with the same volume data as each brazing filler metal and the area data of each brazing filler metal after spreading on the surface of the base metal;
and determining the wetting performance parameter based on the mapping relation between the spreading area coefficient and the wetting performance parameter.
In one possible embodiment, the formula for calculating the spreading area coefficient is as follows:
wherein M is the spreading area coefficient, C is the area data of each brazing filler metal after spreading on the surface of the base metal, and S is the projection area of a sphere with the same volume data as each brazing filler metal.
In one possible embodiment, the spreading area coefficient is mapped to the wettability parameter such that the spreading area coefficient is positively correlated to the wettability parameter;
the method comprises the following steps of selecting corresponding solder with the wettability parameter meeting preset selection conditions from various solders based on the wettability parameter corresponding to each solder, and taking the solder as a target solder, wherein the method comprises the following steps:
and selecting the corresponding brazing filler metal with the spreading area coefficient meeting the preset selection condition from a plurality of brazing filler metals as the target brazing filler metal based on the spreading area coefficient corresponding to each type of brazing filler metal.
In a second aspect, an embodiment of the present application further provides a solder selecting device, where the solder selecting device includes:
the acquisition module is used for acquiring attribute information of various brazing fillers;
the determining module is used for determining the wetting performance parameters corresponding to each brazing filler metal based on the attribute information of each brazing filler metal;
and the selection module is used for selecting the brazing filler metal of which the corresponding wettability parameter meets the preset selection condition from a plurality of brazing filler metals as the target brazing filler metal based on the wettability parameter corresponding to each type of brazing filler metal.
In a possible implementation manner, the attribute information includes quality and density parameters corresponding to each brazing filler metal, and area data of each brazing filler metal after being spread on the surface of the base metal obtained through measurement;
the determining module is specifically configured to:
and determining the wettability parameter of each brazing filler metal based on the corresponding quality and density parameter of each brazing filler metal and the area data of each brazing filler metal after being spread on the surface of the base metal.
In one possible embodiment, the determining module includes:
the first determining unit is used for determining the volume data corresponding to each brazing filler metal based on the mass and density parameters corresponding to each brazing filler metal;
the second determining unit is used for obtaining the projection area of a sphere with volume data equal to that of each brazing filler metal based on the volume data corresponding to each brazing filler metal;
and the third determining unit is used for obtaining the wetting performance parameter of each brazing filler metal based on the projection area of the sphere with the volume data equal to that of each brazing filler metal and the area data of each brazing filler metal after spreading on the surface of the base metal.
In one possible embodiment, the calculation formula of the projected area of the sphere having the same volume data as each solder is as follows:
S＝0.604V2/3；
wherein S represents a projected area of a sphere having volume data equal to each solder, and V represents volume data corresponding to each solder.
In a possible implementation manner, the third determining unit is specifically configured to:
calculating the spreading area coefficient of each brazing filler metal based on the projection area of the sphere with the same volume data as each brazing filler metal and the area data of each brazing filler metal after spreading on the surface of the base metal;
and determining the wetting performance parameter based on the mapping relation between the spreading area coefficient and the wetting performance parameter.
In one possible embodiment, the formula for calculating the spreading area coefficient is as follows:
wherein M is the spreading area coefficient, C is the area data of each brazing filler metal after spreading on the surface of the base metal, and S is the projection area of a sphere with the same volume data as each brazing filler metal.
In one possible embodiment, the spreading area coefficient is mapped to the wettability parameter such that the spreading area coefficient is positively correlated to the wettability parameter;
the selection module is specifically configured to:
and selecting the corresponding brazing filler metal with the spreading area coefficient meeting the preset selection condition from a plurality of brazing filler metals as the target brazing filler metal based on the spreading area coefficient corresponding to each type of brazing filler metal.
In a third aspect, an embodiment of the present application further provides a computer device, including: a processor and a memory coupled to each other, the memory storing machine-readable instructions executable by the processor, the machine-readable instructions, when executed by the processor, performing the steps of the first aspect described above, or any possible implementation of the first aspect.
In a fourth aspect, this application further provides a computer-readable storage medium, on which a computer program is stored, where the computer program is executed by a processor to perform the steps in the first aspect or any one of the possible implementation manners of the first aspect.
According to the method and the device for selecting the brazing filler metal, the computer equipment and the storage medium, the attribute information of various brazing filler metals is obtained; determining a wettability parameter corresponding to each brazing filler metal based on the attribute information of each brazing filler metal; and selecting the brazing filler metal of which the corresponding wettability parameter meets the preset selection condition from a plurality of brazing filler metals as the target brazing filler metal based on the wettability parameter corresponding to each brazing filler metal. The solder with the best wettability is determined by calculating the spreading area coefficient of each solder as the corresponding wettability parameter and selecting the coefficient based on the wettability parameters of a plurality of solders, so that the use efficiency in the experiment or manufacturing process is improved.
In order to make the aforementioned objects, features and advantages of the present application more comprehensible, preferred embodiments accompanied with figures are described in detail below.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings that are required to be used in the embodiments will be briefly described below, it should be understood that the following drawings only illustrate some embodiments of the present application and therefore should not be considered as limiting the scope, and for those skilled in the art, other related drawings can be obtained from the drawings without inventive effort.
Fig. 1 is a flow chart illustrating a method for selecting a brazing filler metal according to an embodiment of the present disclosure;
fig. 2 is a schematic structural diagram illustrating a solder selecting apparatus provided in an embodiment of the present application;
FIG. 3 is a schematic structural diagram of a determination module provided in an embodiment of the present application;
FIG. 4 is a schematic structural diagram of a determination module provided in an embodiment of the present application;
fig. 5 shows a schematic structural diagram of a computer device provided in an embodiment of the present application.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present application clearer, the technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are only a part of the embodiments of the present application, and not all the embodiments. The components of the embodiments of the present application, as generally described and illustrated in the figures herein, may be arranged and designed in a wide variety of different configurations. Thus, the following detailed description of the embodiments of the present application, presented in the accompanying drawings, is not intended to limit the scope of the claimed application, but is merely representative of selected embodiments of the application. All other embodiments, which can be derived by a person skilled in the art from the embodiments of the present application without making any creative effort, shall fall within the protection scope of the present application.
According to research, the spreading coefficient is usually adopted to evaluate the wettability of the solder, and the specific method is to adopt a micrometer to measure the thickness of a copper plate before spreading the solder and the total height of a sample after spreading the solder, further measure the height of the solder after spreading, and calculate and obtain the spreading coefficient by utilizing a spreading coefficient calculation formula. However, the measurement result of the method is often deviated greatly, the calculated spreading coefficient cannot accurately reflect the wetting performance of the brazing filler metal, and further the most suitable brazing filler metal cannot be selected, so that the subsequent experiment and manufacturing process are influenced.
Based on the above research, the embodiment of the application provides a method for selecting brazing filler metals, which determines the brazing filler metal with the best wettability by calculating the spreading area coefficient of each brazing filler metal as the corresponding wettability parameter and selecting the brazing filler metal based on the wettability parameters of a plurality of brazing filler metals, so as to improve the use efficiency in the experiment or manufacturing process.
The discovery process for the above problems and the solution proposed by the present disclosure for the above problems should be the contribution of the inventors to the present disclosure in the process of the present disclosure.
The technical solutions in the present disclosure will be described clearly and completely with reference to the accompanying drawings in the present disclosure, and it is to be understood that the described embodiments are only a part of the embodiments of the present disclosure, and not all of the embodiments. The components of the present disclosure, as generally described and illustrated in the figures herein, may be arranged and designed in a wide variety of different configurations. Thus, the following detailed description of the embodiments of the present disclosure, presented in the figures, is not intended to limit the scope of the claimed disclosure, but is merely representative of selected embodiments of the disclosure. All other embodiments, which can be derived by a person skilled in the art from the embodiments of the disclosure without making creative efforts, shall fall within the protection scope of the disclosure.
It should be noted that: like reference numbers and letters refer to like items in the following figures, and thus, once an item is defined in one figure, it need not be further defined and explained in subsequent figures.
The execution subject of the solder selecting method provided by the embodiment of the application is generally a computer device with certain computing capability, and the computer device includes: a terminal device, which may be a User Equipment (UE), a mobile device, a User terminal, a cellular phone, a cordless phone, a Personal Digital Assistant (PDA), a handheld device, a computing device, a vehicle mounted device, a wearable device, or a server or other processing device. In some possible implementations, the solder selecting method may be implemented by a processor calling computer readable instructions stored in a memory.
The following describes a method for selecting solder provided in the embodiments of the present application by taking an execution subject as a user equipment as an example.
Referring to fig. 1, which is a flowchart of a method for selecting a brazing filler metal provided in an embodiment of the present application, the method for selecting the brazing filler metal includes steps S101 to S103, where:
s101: acquiring attribute information of various brazing fillers;
s102: determining a wettability parameter corresponding to each brazing filler metal based on the attribute information of each brazing filler metal;
s103: and selecting the brazing filler metal of which the corresponding wettability parameter meets the preset selection condition from a plurality of brazing filler metals as the target brazing filler metal based on the wettability parameter corresponding to each brazing filler metal.
According to the embodiment of the application, the spreading area coefficient of each brazing filler metal is calculated to serve as the corresponding wettability parameter, and the brazing filler metal with the best wettability is determined based on the wettability parameters of the brazing filler metals, so that the use efficiency in an experiment or a manufacturing process is improved.
The following describes each of the above-mentioned steps S101 to S103 in detail.
In step S101, the property information is an inherent property and a measured property of the brazing filler metal, where the inherent property includes identification information such as a name of the brazing filler metal, for example, an a alloy brazing filler metal, or an XXX brazing filler metal, and further includes inherent property information such as a density of the brazing filler metal. The measurement attributes comprise the characteristics of the solder, such as quality and the like, and also comprise area data of each solder after spreading on the surface of the base metal, which is obtained through measurement.
The area data after spreading on the surface of the base material is that the brazing filler metal is placed on the base material, the brazing filler metal can present a certain shape after spreading, most of the brazing filler metal is irregular, and the corresponding graph area is the area data of the brazing filler metal after spreading on the surface of the base material.
In step S102, when the plurality of attribute information are acquired, the wettability parameter corresponding to each solder material can be calculated based on the attributes.
In the prior art, the method for calculating the wettability of the solder is generally as follows: the solder wettability is evaluated by adopting a spreading coefficient in the standard GB/T11364-2008 solder wettability test method.
The method specifically comprises the following steps: and (3) measuring the thickness of the copper plate before the solder is spread and the total height of the sample after the solder is spread by adopting a micrometer, further measuring the height of the solder after the solder is spread, calculating the spreading coefficient according to a formula (1), repeating the test for 5 times, and taking the average value of the result.
Wherein K represents a spreading factor; h represents the numerical value of the height of the brazing filler metal after spreading on the surface of the base metal; d represents the diameter of a sphere having the same volume as the solder, and D is 1.24V1/3(ii) a V represents the ratio of mass to density of the solder used in the test.
Under ideal conditions, the traditional classical binary or ternary alloy brazing filler metal is usually eutectic or near-eutectic alloy, the melting temperature range of the brazing filler metal is small, the fluidity is good, the brazing filler metal is mostly in a spherical segment shape or an approximate spherical segment shape after being spread, and the height H of the brazing filler metal after being spread on the surface of a base metal can be accurately measured. However, with the development of new structural design and new materials for brazing, structural materials for brazing are diversified and heterogeneous, the requirements on the wettability of brazing filler metal are very strict, and the requirements can be met by adopting multi-component alloy component design at present. The developed multi-element alloy solder has the characteristics of large melting temperature range, large influence of base metal components and surface states on the wettability of the solder and the like, and the spread solder is in an irregular shape under the actual working condition, so that the spread height of the solder is large in numerical deviation, and the calculated spreading coefficient cannot accurately reflect the wettability of the solder. Therefore, in order to solve the above problems, a new calculation method for evaluating the wettability of the solder is needed to evaluate the wettability of the solder in practical tests more accurately.
Because the spreading area of the solder is measured accurately, whether the detected area can be utilized or not is assumed in the embodiment of the application, and the wetting performance is represented by the calculated spreading area coefficient.
The assumed spreading area coefficient calculation method specifically comprises the following steps: and determining the solder spreading area coefficient, namely the wetting property parameter of each solder based on the corresponding quality and density parameter of each solder and the area data of each solder spread on the surface of the base metal.
Specifically, the volume data corresponding to each solder can be determined based on the mass and density parameters corresponding to each solder, and the projection area of the data sphere having the same volume as each solder can be obtained based on the volume data corresponding to each solder.
Wherein, the calculation formula of the projection area of the sphere with the same volume data with each solder is shown as formula (2):
S＝0.604V2/3； (2)
wherein S represents a projected area of a sphere having volume data equal to each solder, and V represents volume data corresponding to each solder.
The method for acquiring the area data of each brazing filler metal after spreading on the surface of the base metal comprises the following steps: firstly, measurement scanning is carried out through an integrator, and software measurement calculation is carried out on a graph obtained by scanning, and the method specifically comprises the following steps:
referring to fig. 2, fig. 2 is a schematic view of solder spreading in an ideal case. As shown in fig. 2, the solder spreading pattern Δ ABO has the following relationship, as shown in formulas (3) and (4):
from equation (4), C, S related to the spreading area coefficient can be expressed by m and H, as shown in the following equations (5), (6), (7):
C＝πL2＝π(2m-1)H2； (6)
wherein C represents the numerical value of the area of the brazing filler metal spread on the surface of the base material; s represents the projection area of a sphere with the volume equal to that of the brazing filler metal; m represents the solder mass.
After all target parameters, namely the projection area of a sphere with the same volume data as each solder and the area data of each solder after spreading on the surface of the base metal are obtained, the spreading area coefficient of each solder can be calculated.
Wherein, the calculation formula of the spreading area coefficient is as follows:
wherein M is the spreading area coefficient, C is the area data of each brazing filler metal after spreading on the surface of the base metal, and S is the projection area of a sphere with the same volume data as each brazing filler metal.
In order to verify the relationship between the area spreading coefficient and the spreading coefficient in the conventional calculation method, in the embodiment of the present application, the spreading coefficients are substituted by the formulas (3), (4), (6), and (7), and the corresponding spreading coefficient and spreading area coefficient are respectively expressed as shown in formula (9):
it can be found that both the spreading factor and the spreading area factor are quantities related only to the wetting angle θ, and decrease as θ increases, and thus it can be found that there is a certain correlation between the spreading factor and the spreading area factor.
In order to further verify the reliability of the spreading area coefficient for verifying the wettability, in the embodiment of the present application, different qualities of the Sn58Bi alloy and the solder paste were respectively taken to perform the spreading test, and the K and M values were calculated. It was found that the spreading area coefficient was substantially the same as the spreading tendency of Sn58Bi, to which the spreading coefficient is reflected. And linear fitting is carried out on the spreading area coefficient and the spreading coefficient, and the reliability of the fitting result is high. The good corresponding relation between the spreading area coefficient M and the spreading coefficient K is demonstrated, so that the spreading area coefficient can be used as one of indexes for measuring the wettability of the brazing filler metal, namely, the positive correlation between the spreading area coefficient and the wettability is verified.
Thirdly, in the above S103, since there is a certain mapping relationship between the spreading area coefficient and the wetting performance parameter, the wetting performance parameter can be determined by the spreading area coefficient of the solder.
Specifically, the mapping relation between the spreading area coefficient and the wettability parameter is that the spreading area coefficient is positively correlated with the wettability parameter, and the corresponding solder with the spreading area coefficient meeting the preset selection condition is selected from various solders based on the corresponding spreading area coefficient of each solder to serve as the target solder.
According to the embodiment of the application, the spreading area coefficient of each brazing filler metal is calculated to serve as the corresponding wettability parameter, and the brazing filler metal with the best wettability is determined based on the wettability parameters of the brazing filler metals, so that the use efficiency in an experiment or a manufacturing process is improved.
It will be understood by those skilled in the art that in the method of the present invention, the order of writing the steps does not imply a strict order of execution and any limitations on the implementation, and the specific order of execution of the steps should be determined by their function and possible inherent logic.
Based on the same inventive concept, the embodiment of the present disclosure further provides a device for selecting a brazing filler metal corresponding to the method for selecting a brazing filler metal provided by the above embodiment, and since the principle of solving the problem of the device in the embodiment of the present disclosure is similar to the method for selecting a brazing filler metal provided by the above embodiment of the present disclosure, the implementation of the device may refer to the implementation of the method, and repeated details are omitted.
Referring to fig. 3 and 4, fig. 3 is a schematic structural diagram of a solder selecting apparatus provided in an embodiment of the present application, and fig. 4 is a schematic structural diagram of a determining module provided in the embodiment of the present application. The selecting device comprises: an obtaining module 310, a determining module 320, and a selecting module 330, wherein:
an obtaining module 310, configured to obtain attribute information of multiple types of brazing filler metals;
a determining module 320, configured to determine, based on the attribute information of each solder, a wetting performance parameter corresponding to each solder;
a selecting module 330, configured to select, from multiple brazing filler metals, a brazing filler metal whose corresponding wettability parameter meets a preset selecting condition based on the wettability parameter corresponding to each brazing filler metal, as a target brazing filler metal.
According to the device for selecting the brazing filler metal, the attribute information of various brazing filler metals is obtained; determining a wettability parameter corresponding to each brazing filler metal based on the attribute information of each brazing filler metal; and selecting the brazing filler metal of which the corresponding wetting performance parameter meets the preset selection condition from a plurality of brazing filler metals as the target brazing filler metal based on the wetting performance parameter corresponding to each brazing filler metal. The solder with the best wettability is determined by calculating the spreading area coefficient of each solder as the corresponding wettability parameter and selecting the coefficient based on the wettability parameters of a plurality of solders, so that the use efficiency in the experiment or manufacturing process is improved.
In a possible implementation manner, the attribute information includes quality and density parameters corresponding to each brazing filler metal, and area data of each brazing filler metal after being spread on the surface of the base metal obtained through measurement;
the determining module 320 is specifically configured to:
and determining the wettability parameter of each brazing filler metal based on the corresponding quality and density parameter of each brazing filler metal and the area data of each brazing filler metal after being spread on the surface of the base metal.
In one possible implementation, as shown in fig. 4, the determining module 320 includes:
a first determining unit 321, configured to determine volume data corresponding to each solder based on the mass and density parameters corresponding to each solder;
a second determining unit 322, configured to obtain a projection area of a sphere having a volume equal to that of each solder based on the volume data corresponding to each solder;
and a third determining unit 323, configured to obtain a wetting performance parameter of each solder based on the projection area of the sphere having the same volume data as each solder and the area data of each solder spread on the surface of the base material.
In one possible embodiment, the calculation formula of the projected area of the sphere having the same volume data as each solder is as follows:
S＝0.604V2/3；
wherein S represents a projected area of a sphere having volume data equal to each solder, and V represents volume data corresponding to each solder.
In a possible implementation manner, the third determining unit 323 is specifically configured to:
calculating the spreading area coefficient of each brazing filler metal based on the projection area of the sphere with the same volume data as each brazing filler metal and the area data of each brazing filler metal after spreading on the surface of the base metal;
and determining the wetting performance parameter based on the mapping relation between the spreading area coefficient and the wetting performance parameter.
In one possible embodiment, the formula for calculating the spreading area coefficient is as follows:
wherein M is the spreading area coefficient, C is the area data of each brazing filler metal after spreading on the surface of the base metal, and S is the projection area of a sphere with the same volume data as each brazing filler metal.
In one possible embodiment, the spreading area coefficient is mapped to the wettability parameter such that the spreading area coefficient is positively correlated to the wettability parameter;
the selecting module 330 is specifically configured to:
and selecting the corresponding brazing filler metal with the spreading area coefficient meeting the preset selection condition from a plurality of brazing filler metals as the target brazing filler metal based on the spreading area coefficient corresponding to each type of brazing filler metal.
The embodiment of the present disclosure further provides a computer device 10, as shown in fig. 5, which is a schematic structural diagram of the computer device 10 provided in the embodiment of the present disclosure, and includes:
a processor 11 and a memory 12; the memory 12 stores machine-readable instructions executable by the processor 11 which, when executed by a computer device, are executed by the processor to perform the steps of:
acquiring attribute information of various brazing fillers;
determining a wettability parameter corresponding to each brazing filler metal based on the attribute information of each brazing filler metal;
and selecting the brazing filler metal of which the corresponding wettability parameter meets the preset selection condition from a plurality of brazing filler metals as the target brazing filler metal based on the wettability parameter corresponding to each brazing filler metal.
In an alternative embodiment, in the instructions executed by the processor 11, the attribute information includes quality and density parameters corresponding to each brazing filler metal, and area data of each brazing filler metal after spreading on the surface of the base metal obtained by measurement;
the determining of the wettability parameter corresponding to each solder based on the attribute information of each solder comprises:
and determining the wettability parameter of each brazing filler metal based on the corresponding quality and density parameter of each brazing filler metal and the area data of each brazing filler metal after being spread on the surface of the base metal.
In an alternative embodiment, the determining, by the processor 11, the wettability parameter of each solder based on the mass and density parameters corresponding to each solder and the data of the area of each solder after spreading on the surface of the base metal, includes:
determining volume data corresponding to each brazing filler metal based on the mass and density parameters corresponding to each brazing filler metal;
obtaining the projection area of a sphere with volume data equal to that of each brazing filler metal based on the volume data corresponding to each brazing filler metal;
and obtaining the wetting property parameter of each brazing filler metal based on the projection area of the sphere with the same volume data as each brazing filler metal and the area data of each brazing filler metal after spreading on the surface of the base metal.
In an alternative embodiment, the processor 11 executes instructions that calculate the projected area of the sphere of equal volume data for each solder according to the following formula:
S＝0.604V2/3；
wherein S represents a projected area of a sphere having volume data equal to each solder, and V represents volume data corresponding to each solder.
In an alternative embodiment, the processor 11 executes instructions to obtain the wettability parameter of each solder based on the projected area of the sphere having the same volume data as each solder and the area data of each solder after spreading on the surface of the parent metal, and the instructions include:
calculating the spreading area coefficient of each brazing filler metal based on the projection area of the sphere with the same volume data as each brazing filler metal and the area data of each brazing filler metal after spreading on the surface of the base metal;
and determining the wetting performance parameter based on the mapping relation between the spreading area coefficient and the wetting performance parameter.
In an alternative embodiment, in the instruction executed by the processor 11, the calculation formula of the spreading area coefficient is as follows:
wherein M is the spreading area coefficient, C is the area data of each brazing filler metal after spreading on the surface of the base metal, and S is the projection area of a sphere with the same volume data as each brazing filler metal.
In an alternative embodiment, processor 11 executes instructions in which the spreading area factor is mapped to the wettability parameter such that the spreading area factor is positively correlated to the wettability parameter;
the method comprises the following steps of selecting corresponding solder with the wettability parameter meeting preset selection conditions from various solders based on the wettability parameter corresponding to each solder, and taking the solder as a target solder, wherein the method comprises the following steps:
and selecting the corresponding brazing filler metal with the spreading area coefficient meeting the preset selection condition from a plurality of brazing filler metals as the target brazing filler metal based on the spreading area coefficient corresponding to each type of brazing filler metal.
The specific execution process of the above instructions may refer to the steps of the solder selecting method described in the embodiments of the present disclosure, and details are not described here.
The disclosed embodiment also provides a computer readable storage medium, which stores a computer program, and when the computer program is executed by a processor, the computer program executes the steps of the solder selecting method described in the above method embodiment.
The computer program product of the method for selecting solder provided in the embodiments of the present disclosure includes a computer-readable storage medium storing a program code, where instructions included in the program code may be used to execute steps of the method for selecting solder described in the above method embodiments, which may be specifically referred to in the above method embodiments and are not described herein again.
It is clear to those skilled in the art that, for convenience and brevity of description, the specific working processes of the system and the apparatus described above may refer to the corresponding processes in the foregoing method embodiments, and are not described herein again. In the several embodiments provided in this disclosure, it should be understood that the disclosed systems, devices, and methods may be implemented in other ways. The above-described embodiments of the apparatus are merely illustrative, and for example, the division of the units is only one type of division of logical functions, and there may be other divisions in actual implementation, and for example, a plurality of units or components may be combined or integrated into another system, or some features may be omitted, or not executed. In addition, the shown or discussed mutual coupling or direct coupling or communication connection may be an indirect coupling or communication connection of devices or units through some communication interfaces, and may be in an electrical, mechanical or other form.
The units described as separate parts may or may not be physically separate, and parts displayed as units may or may not be physical units, may be located in one place, or may also be distributed on a plurality of network units. Some or all of the units can be selected according to actual needs to achieve the purpose of the solution of the embodiment.
In addition, functional units in the embodiments of the present disclosure may be integrated into one processing unit, or each unit may exist alone physically, or two or more units are integrated into one unit.
The functions, if implemented in the form of software functional units and sold or used as a stand-alone product, may be stored in a non-volatile computer-readable storage medium executable by a processor. Based on such understanding, the technical solution of the present disclosure may be embodied in the form of a software product, which is stored in a storage medium and includes several instructions for causing a computer device (which may be a personal computer, a server, or a network device) to execute all or part of the steps of the method according to the embodiments of the present disclosure. And the aforementioned storage medium includes: various media capable of storing program codes, such as a usb disk, a removable hard disk, a Read-Only Memory (ROM), a Random Access Memory (RAM), a magnetic disk, or an optical disk.
Finally, it should be noted that: the above-mentioned embodiments are merely specific embodiments of the present disclosure, which are used for illustrating the technical solutions of the present disclosure and not for limiting the same, and the scope of the present disclosure is not limited thereto, and although the present disclosure is described in detail with reference to the foregoing embodiments, those skilled in the art should understand that: any person skilled in the art can still modify or easily conceive of changes in the technical solutions described in the foregoing embodiments or equivalent substitutions of some technical features within the technical scope of the present disclosure; such modifications, changes or substitutions do not depart from the spirit and scope of the embodiments of the present disclosure, and should be construed as being included therein. Therefore, the protection scope of the present disclosure shall be subject to the protection scope of the claims.
Claims (8)
1. A method for selecting brazing filler metal is characterized by comprising the following steps:
acquiring attribute information of various brazing fillers;
determining a wettability parameter corresponding to each brazing filler metal based on attribute information of each brazing filler metal, wherein the attribute information comprises a mass parameter and a density parameter corresponding to each brazing filler metal and area data of each brazing filler metal after being spread on the surface of a base metal obtained through measurement;
selecting a brazing filler metal of which the corresponding wettability parameter meets a preset selection condition from a plurality of brazing filler metals as a target brazing filler metal based on the wettability parameter corresponding to each brazing filler metal;
the method comprises the following steps of determining a wetting performance parameter corresponding to each brazing filler metal based on the attribute information of each brazing filler metal, wherein the wetting performance parameter corresponding to each brazing filler metal comprises the following steps:
determining volume data corresponding to each brazing filler metal based on the mass and density parameters corresponding to each brazing filler metal;
obtaining the projection area of a sphere with volume data equal to that of each brazing filler metal based on the volume data corresponding to each brazing filler metal;
and obtaining the wetting property parameter of each brazing filler metal based on the projection area of the sphere with the same volume data as each brazing filler metal and the area data of each brazing filler metal after spreading on the surface of the base metal.
2. The solder selecting method according to claim 1, wherein the calculation formula of the projected area of the sphere having the same volume data as each solder is as follows:
S＝0.604V2/3；
wherein S represents a projected area of a sphere having volume data equal to each solder, and V represents volume data corresponding to each solder.
3. The method for selecting the brazing filler metal according to claim 1, wherein the obtaining of the wettability parameter of each brazing filler metal based on the projected area of the sphere with the same volume data as each brazing filler metal and the area data of each brazing filler metal after spreading on the surface of the base metal comprises:
calculating the spreading area coefficient of each brazing filler metal based on the projection area of the sphere with the same volume data as each brazing filler metal and the area data of each brazing filler metal after spreading on the surface of the base metal;
and determining the wetting property parameter based on the mapping relation between the spreading area coefficient and the wetting property parameter.
4. The method for selecting a brazing filler metal according to claim 3, wherein the spreading area coefficient is calculated as follows:
wherein M is the spreading area coefficient, C is the area data of each brazing filler metal after spreading on the surface of the base metal, and S is the projection area of a sphere with the same volume data as each brazing filler metal.
5. The method for selecting the brazing filler metal according to claim 3, wherein the mapping relation between the spreading area coefficient and the wettability parameter is that the spreading area coefficient is positively correlated with the wettability parameter;
the method comprises the following steps of selecting corresponding solder with the wettability parameter meeting preset selection conditions from various solders based on the wettability parameter corresponding to each solder, and taking the solder as a target solder, wherein the method comprises the following steps:
and selecting the corresponding brazing filler metal with the spreading area coefficient meeting the preset selection condition from a plurality of brazing filler metals as the target brazing filler metal based on the spreading area coefficient corresponding to each type of brazing filler metal.
6. A brazing filler metal selects device, characterized in that, select the device and include:
the acquisition module is used for acquiring attribute information of various brazing fillers;
the determining module is used for determining the wettability parameters corresponding to each brazing filler metal based on the attribute information of each brazing filler metal, wherein the attribute information comprises the quality and density parameters corresponding to each brazing filler metal and the area data of each brazing filler metal after being spread on the surface of the base metal obtained through measurement;
the selecting module is used for selecting the brazing filler metal of which the corresponding wettability parameter meets the preset selecting condition from a plurality of brazing filler metals as the target brazing filler metal based on the wettability parameter corresponding to each brazing filler metal;
the determining module is further specifically configured to:
determining volume data corresponding to each brazing filler metal based on the mass and density parameters corresponding to each brazing filler metal;
obtaining the projection area of a sphere with volume data equal to that of each brazing filler metal based on the volume data corresponding to each brazing filler metal;
and obtaining the wetting property parameter of each brazing filler metal based on the projection area of the sphere with the same volume data as each brazing filler metal and the area data of each brazing filler metal after spreading on the surface of the base metal.
7. A computer device, comprising: a processor, a memory and a bus, the memory storing machine readable instructions executable by the processor, the processor and the memory communicating over the bus when a computer device is run, the machine readable instructions when executed by the processor performing the steps of the method of solder pick-up according to any one of claims 1 to 5.
8. A computer-readable storage medium, characterized in that the computer-readable storage medium has stored thereon a computer program which, when being executed by a processor, performs the steps of the method for solder selection according to any one of claims 1 to 5.
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