CN111880386A - Double-stage laser direct imaging equipment - Google Patents

Double-stage laser direct imaging equipment Download PDF

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Publication number
CN111880386A
CN111880386A CN202010724133.9A CN202010724133A CN111880386A CN 111880386 A CN111880386 A CN 111880386A CN 202010724133 A CN202010724133 A CN 202010724133A CN 111880386 A CN111880386 A CN 111880386A
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China
Prior art keywords
stage
alignment
alignment camera
direct imaging
optical system
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CN202010724133.9A
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Chinese (zh)
Inventor
温延培
祝锁
魏亚菲
刘长清
曹葵康
蔡雄飞
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Tztek Technology Co Ltd
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Tztek Technology Co Ltd
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Priority to CN202010724133.9A priority Critical patent/CN111880386A/en
Publication of CN111880386A publication Critical patent/CN111880386A/en
Pending legal-status Critical Current

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    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03GELECTROGRAPHY; ELECTROPHOTOGRAPHY; MAGNETOGRAPHY
    • G03G15/00Apparatus for electrographic processes using a charge pattern

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  • General Physics & Mathematics (AREA)
  • Laser Beam Processing (AREA)

Abstract

The invention provides a double-stage laser direct imaging device, which comprises: a base; the device comprises a stage arranged on a base along an X direction and a stage driving device connected with the stage to drive the stage to move along a Y direction, wherein the stage comprises a first stage and a second stage which are arranged in parallel; the support comprises two upright columns and a beam, the two upright columns are respectively arranged on two sides of the first carrying platform and the second carrying platform in the X direction, the beam is connected with the two upright columns, and the beam is positioned above the first carrying platform and the second carrying platform in the vertical direction; the alignment device is arranged on one side of the cross beam of the support in the Y direction; and the laser device is arranged on one side of the cross beam of the support, which is back to the aligning device, in the Y direction. According to the double-stage laser direct imaging equipment, the efficiency can be improved, the productivity can be increased, the etching precision is high, and the etching stability is good.

Description

Double-stage laser direct imaging equipment
Technical Field
The invention relates to the field of laser direct imaging, in particular to double-stage laser direct imaging equipment.
Background
The laser direct imaging equipment (LDI) directly images an image on a product to be etched by a laser scanning method, the image is finer, and the product to be etched can be a circuit board, a screen printing plate and the like.
In order to improve the productivity, the laser direct imaging device is provided with double carrying tables. However, the existing dual-stage laser direct imaging device has the problems of low efficiency, and low etching precision and stability.
Disclosure of Invention
In view of this, the present invention provides a dual-stage laser direct imaging apparatus, which can improve efficiency, increase throughput, and has high etching precision and good etching stability.
In order to solve the above technical problem, the present invention provides a dual-stage laser direct imaging apparatus, including:
a base;
the etching device comprises a stage arranged on the base along the X direction and a stage driving device connected with the stage to drive the stage to move along the Y direction, wherein the stage comprises a first stage and a second stage which are arranged in parallel and adjacent to each other, and the stage is used for bearing a product to be etched;
the support comprises two upright columns and a beam, the two upright columns are respectively arranged on two sides of the first carrying platform and the second carrying platform in the X direction, the beam is connected with the two upright columns, and the beam is positioned above the first carrying platform and the second carrying platform in the vertical direction;
the alignment device is arranged on one side of the cross beam of the support in the Y direction and is used for aligning the product to be etched;
and the laser device is arranged on one side of the cross beam of the support, which is back to the aligning device in the Y direction, and is used for etching the product to be etched.
Further, the aligning device comprises:
an alignment camera slide rail arranged along the X direction of the beam of the bracket;
the alignment camera is connected with the alignment camera slide rail in a sliding mode and used for aligning the product to be etched;
the alignment camera driving device drives the alignment camera to move along the alignment camera slide rail.
Further, the alignment cameras comprise a first alignment camera and a second alignment camera;
the alignment camera driving device comprises a first alignment camera driving device and a second alignment camera driving device, the first alignment camera driving device drives the first alignment camera to move along the alignment camera slide rail, and the second alignment camera driving device drives the second alignment camera to move along the alignment camera slide rail.
Further, the laser device includes:
an optical system slide rail disposed along an X direction of a beam of the bracket;
a mounting plate slidably coupled to the optical system slide;
the optical system is arranged on the mounting plate, and the laser device transmits laser through the optical system so as to etch the product to be etched;
an optical system driving device which drives the mounting plate to move along the optical system sliding rail.
Further, the optical system is provided in plurality, and the plurality of optical systems are arranged on the mounting plate at intervals uniformly.
Further, the laser device further includes:
the correcting device comprises a correcting camera, the correcting camera is arranged on the outer edge of the mounting plate and used for collecting an etched image, and the correcting device determines deviation according to the etched image to correct etching precision.
Further, the correction cameras have two adjacent to a first one and a last one of the optical systems arranged in the X direction, respectively.
Further, the stage driving device, the alignment camera driving device, and the optical system driving device each include a linear motor.
Further, the dual-stage laser direct imaging apparatus further includes:
the first lifting device is arranged on the base and connected below the first carrying platform so as to drive the first carrying platform to perform lifting movement;
and the second lifting device is arranged on the base and connected below the second carrying platform so as to drive the second carrying platform to perform lifting movement.
Further, the dual-stage laser direct imaging apparatus further includes:
the control system is connected with the stage driving devices, the alignment device and the laser device, the control system controls the stage driving devices to drive one of the stages to an etching station and carries out etching process through the laser device, and the control system also controls the stage driving devices to drive the other stage to wait for feeding at the feeding station, move from the feeding station to the etching station and carry out alignment through the alignment device.
The technical scheme of the invention at least has one of the following beneficial effects:
according to the double-stage laser direct imaging device, the double-stage laser direct imaging device comprises a base, stages, a stage driving device, a support, an alignment device and a laser device, wherein a product to be etched is carried by a first stage and a second stage to move on the base in the Y direction, the alignment device and the laser device are respectively arranged on two sides of a cross beam of the fixedly arranged support in the Y direction, the first stage and the second stage move in the Y direction, the support can be prevented from driving precision components (the alignment device and the laser device) arranged on the support to move in the Y direction, the situation that an etched image is deviated due to the fact that the position of the alignment device and the laser device is changed is avoided, the independently arranged alignment device has a larger movement stroke, all areas of the product can be aligned, the alignment precision is improved, the etching efficiency can be improved due to the automatic operation of the whole device, and the product to be etched can be independently operated through the first stage and, the operation time of a single product to be etched can be saved, the efficiency is improved, and the productivity is increased.
Drawings
Fig. 1 is a schematic structural diagram of a dual-stage laser direct imaging apparatus according to an embodiment of the present invention;
fig. 2 is a schematic structural diagram of the rear side of the dual-stage laser direct imaging apparatus in fig. 1.
Reference numerals:
100. a base; 210. a first stage; 220. a second stage; 300. a support; 310. a column; 320. a cross beam; 410. aligning a camera; 510. an optical system; 520. mounting a plate; 610. and correcting the camera.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the drawings of the embodiments of the present invention. It is to be understood that the embodiments described are only a few embodiments of the present invention, and not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the described embodiments of the invention, are within the scope of the invention.
Unless defined otherwise, technical or scientific terms used herein shall have the ordinary meaning as understood by one of ordinary skill in the art to which this invention belongs. The use of "first," "second," and similar terms in the present application do not denote any order, quantity, or importance, but rather the terms are used to distinguish one element from another. Also, the use of the terms "a" or "an" and the like do not denote a limitation of quantity, but rather denote the presence of at least one. The terms "connected" or "coupled" and the like are not restricted to physical or mechanical connections, but may include electrical connections, whether direct or indirect. "upper", "lower", "left", "right", and the like are used merely to indicate relative positional relationships, and when the absolute position of the object being described is changed, the relative positional relationships are changed accordingly.
Hereinafter, a dual-stage laser direct imaging apparatus according to an embodiment of the present invention is described with reference to the drawings.
As shown in fig. 1 and 2, the dual stage laser direct imaging apparatus according to the present invention includes: base 100, stage driving device, support 300, alignment device, and laser device.
First, the base 100 is explained.
The base 100 is provided on a mounting surface for stabilizing other components provided on the base 100.
Further, the material of the base 100 is marble material.
The marble material has the characteristics of no deformation, high hardness and strong wear resistance, and the base 100 is made of the marble material, so that the vibration of a part borne on the base 100 is small in the motion process, the motion is stable, and the etching precision can be improved.
Next, the stage and the stage driving device will be described.
The etching device comprises a stage arranged on the base 100 along the X direction and a stage driving device connected with the stage to drive the stage to move along the Y direction, wherein the stage comprises a first stage 210 and a second stage 220 which are arranged in parallel and are adjacent to each other, and the stage is used for carrying a product to be etched.
The first stage 210 and the second stage 220 are disposed in parallel and adjacent along the X direction, and are used for carrying a product to be etched. The first stage 210 and the second stage 220 are driven by the two stage driving devices to move along the Y direction, respectively, so as to etch the product to be etched. The stage driving device may be a motor or the like. The first stage 210 and the second stage 220 can work independently, wherein one stage bears a product to be etched to perform laser etching operation, and the other stage bears another product to be etched to perform feeding operation, so that the efficiency can be improved.
Next, the holder 300 is explained.
The support 300 includes two columns 310 respectively disposed on two sides of the first stage 210 and the second stage 220 in the X direction, and a beam 320 connecting the two columns 310, and the beam 320 is located above the first stage 210 and the second stage 220 in the vertical direction.
The two uprights 310 of the support 300 provide a fixed and stable support, and the cross-member 320 can be provided with precision components. In the operation process of the laser direct imaging device, the position of the support 300 is always unchanged, the problem that the precision and the stability are reduced due to the fact that the part arranged on the support 300 vibrates along with the movement process of the support 300 is solved, and the etching precision and the etching stability are improved.
Next, the alignment device will be described.
The alignment device is disposed on one side of the cross beam 320 of the bracket 300 in the Y direction, and is used for aligning a product to be etched.
The aligning device sets up the one side in the Y direction of crossbeam 320 alone, because aligning device is small usually, and aligning device's motion stroke is great, and the counterpoint region can cover all regions of product completely, can improve the counterpoint precision, is needing under the multizone of product counterpoint's the condition, and the advantage is more obvious especially, avoids some regional unable counterpoints, and equipment can't discern this regional deformation and cause etching skew, the condemned phenomenon of product.
Finally, the laser device is explained.
The laser device is arranged on the side of the cross beam 320 of the bracket 300 opposite to the alignment device in the Y direction, and is used for etching a product to be etched.
Laser device sets up the one side that carries on the back with aligning device in the Y direction of crossbeam 320 of support 300 alone, can avoid laser device to follow aligning device and take place the motion at the counterpoint in-process, and the vibration appears and leads to aligning device and laser device to take place the condition that the position changed, and then improves etching precision and etching stability.
In the laser direct imaging apparatus formed above, the first stage 210 and the second stage 220 carry the product to be etched to perform Y-direction movement on the base 100, and the alignment device and the laser device are respectively arranged on two sides of the beam 320 of the fixedly arranged support 300 in the Y direction. Therefore, the first stage 210 and the second stage 220 move in the Y direction, the support 300 can be prevented from driving precision components (an alignment device and a laser device) arranged on the support 300 to move in the Y direction, the situation that the alignment device and the laser device change in position to cause etched image deviation is avoided, the movement stroke of the independently arranged alignment device is larger, all areas of a product can be aligned, the alignment precision is improved, the automatic operation of the whole equipment can improve the etching efficiency, the product to be etched is independently operated through the first stage 210 and the second stage 220, the operation time of a single product to be etched can be saved, the efficiency is improved, and the productivity is increased.
Further, the double-stage laser direct imaging device also comprises a control system.
The control system is connected with the platform driving devices, the alignment device and the laser device, controls the platform driving devices to drive one platform to the etching station, and controls the platform driving devices to drive the other platform to wait for loading at the loading station, move from the loading station to the etching station and perform alignment through the alignment device in the etching process through the laser device.
For example, under the control of the control system, the first stage 210 carries the product to be etched, the second stage 220 is located at the feeding station (two ends of the base 100 in the Y direction) during the laser etching process by the laser device, the operator can feed the product on the second stage 220, after the feeding process is finished, the control system drives the second stage 220 to carry the product to be etched to the etching station (the position facing the beam 320) by the stage driving device, the alignment device aligns the product to be etched carried on the second stage 220 (the alignment device and the laser device are separately arranged, so that the alignment device and the laser device can operate without influencing each other, usually, the product to be etched is aligned and then etched, in the technical scheme, the alignment device which is usually idle during the etching process is also fully utilized, after the product to be etched carried on the first stage 210 is finished, the laser device then performs laser etching on the product to be etched carried on the second stage 220, and the control system drives the first stage 210 to return to the feeding station through the stage driving device, and so on. Therefore, the laser device can continuously etch different products to be etched, the operation time of a single product to be etched can be shortened, the time that the laser device waits for an operator to take and place materials, the time that the carrying platform runs from the feeding station to the etching station and the time that the aligning device aligns are avoided, the efficiency can be improved, and the productivity is increased.
According to some embodiments of the invention, the alignment device comprises: an alignment camera slide rail, an alignment camera 410 and an alignment camera driving device. The alignment camera slide rails are disposed along the X direction of the beam 320 of the bracket 300. The alignment camera 410 is slidably connected to the alignment camera slide rail, and the alignment camera 410 aligns the product to be etched. The alignment camera driving device drives the alignment camera 410 to move along the alignment camera slide rail.
The alignment camera driving device drives the alignment camera 410 to move along the X direction on the alignment camera slide rail. Therefore, the product to be etched can be stably aligned, and the alignment precision is improved.
Further, the alignment cameras 410 include a first alignment camera and a second alignment camera. The alignment camera driving device comprises a first alignment camera driving device and a second alignment camera driving device, the first alignment camera driving device drives the first alignment camera to move along the alignment camera slide rail, and the second alignment camera driving device drives the second alignment camera to move along the alignment camera slide rail.
The products to be etched are aligned simultaneously by two alignment cameras 410. Therefore, compared with the alignment of a single camera, the alignment time can be shortened, the equipment efficiency is improved, and the productivity is increased.
According to some embodiments of the invention, a laser apparatus comprises: an optical system slide, a mounting plate 520, an optical system 510, and an optical system driving device.
The optical system slide is disposed along the X direction of the beam 320 of the bracket 300. The mounting plate 520 is slidably coupled to the optical system slide. An optical system 510 is disposed on the mounting plate 520, and a laser device transmits laser light through the optical system 510 to etch a product to be etched. The optical system driving device drives the mounting plate 520 to move along the optical system slide.
The optical system driving device drives the mounting plate 520, and the mounting plate 520 carries the optical system 510 to move along the X direction on the optical system slide rail, so that the laser device can perform X-direction etching on a product to be etched through the optical system 510. The stage driving device drives the first stage 210 and the second stage 220 carrying the product to be etched to move along the Y direction, so that the laser device can perform Y-direction etching on the product to be etched through the optical system 510. Thus, the X-direction and Y-direction etching can be stably and accurately performed on the product to be etched by a simple structure. The optical system driving device may be a motor or the like.
Further, there are a plurality of optical systems 510, and the plurality of optical systems 510 are disposed on the mounting plate 520 at regular intervals.
The etching of the product to be etched can be synchronized by a plurality of optical systems 510 disposed on the mounting plate 520 at even intervals. Therefore, the time for etching the product to be etched can be shortened, and the efficiency can be improved.
Further, the laser device further comprises a correction device. The correcting means includes a correcting camera 610, the correcting camera 610 is disposed at an outer edge of the mounting plate 520 for capturing an etched image, and the correcting means determines a deviation from the etched image to correct the etching accuracy.
After the equipment runs for a period of time, the etching precision of the equipment is reduced due to some inevitable vibration of the laser direct imaging equipment, and the etching precision can comprise the precision of the center of a laser image and the center of a product, the up-down and left-right precision of different areas of laser etching and the like. For example, the laser device, the first stage 210, the second stage 220, and the stage driving device cooperate to etch a predetermined pattern in a predetermined region on a predetermined material, the predetermined pattern is acquired by the calibration camera 610, and the calibration device calculates a deviation based on the image acquired by the calibration camera 610 and compensates for the deviation by software. Therefore, the deviation of etching can be compensated in time, the etching precision is improved, product scrapping caused by insufficient etching precision is avoided, and the yield is improved. The laser device drives the calibration camera 610 of the calibration device to move, which is relatively simple.
Further, the correction camera 610 has two, respectively adjacent to the first optical system 510 and the last optical system 510 of the plurality of optical systems 510 arranged along the X direction.
The etching precision is corrected by the two correction cameras 610, so that the correction time can be shortened, the correction efficiency can be improved, the correction range can be increased, and the problem that the etching precision of a local area cannot be corrected because a single correction camera 610 cannot reach the local area due to insufficient stroke of the correction camera 610 is solved.
According to some embodiments of the present invention, the stage driving device, the alignment camera driving device, and the optical system driving device each include a linear motor.
The precision and stability of the linear motor are high. This improves the stability and accuracy of etching. It should be noted that, although the drive device is also a rotary motor, which is slightly lower in precision than a linear motor, but the cost is also lower, only one or two of the stage drive device, the alignment camera drive device, and the optical system drive device may include a linear motor, and the drive device may be configured according to actual requirements.
According to some embodiments of the invention, the laser direct imaging apparatus further comprises a first lifting device and a second lifting device.
The first lifting device is disposed on the base 100 and connected below the first stage 210 to drive the first stage 210 to move up and down. The second lifting device is disposed on the base 100 and connected below the second stage 220 to drive the second stage 220 to move up and down.
The first carrying platform 210 is driven by the first lifting device to move up and down, the second carrying platform 220 is driven by the second lifting device to move up and down, the focal length of the laser can be adjusted, the optimal focal length of the laser can be positioned on a product to be etched, and the etching effect is improved. The focal lengths of the first and second stages 210 and 220 can be adjusted respectively, so that the problem that the focal lengths of the two tables are inconsistent due to the fact that the tables are uneven in the traditional method which only depends on a laser device to adjust the focal lengths can be avoided, and the accuracy of the focal lengths is guaranteed.
While the foregoing is directed to the preferred embodiment of the present invention, it will be understood by those skilled in the art that various changes and modifications may be made without departing from the spirit and scope of the invention as defined in the appended claims.

Claims (10)

1. A dual stage laser direct imaging apparatus, comprising:
a base (100);
the etching device comprises a stage arranged on the base (100) along the X direction and a stage driving device connected with the stage to drive the stage to move along the Y direction, wherein the stage comprises a first stage (210) and a second stage (220) which are arranged in parallel and are adjacent to each other, and the stages are used for bearing products to be etched;
the support (300) comprises two upright columns (310) which are respectively arranged on two sides of the first carrying platform (210) and the second carrying platform (220) in the X direction and a beam (320) which is used for connecting the two upright columns (310), wherein the beam (320) is positioned above the first carrying platform (210) and the second carrying platform (220) in the vertical direction;
the alignment device is arranged on one side of a cross beam (320) of the bracket (300) in the Y direction and is used for aligning the product to be etched;
the laser device is arranged on one side, opposite to the aligning device, of the cross beam (320) of the support (300) in the Y direction and used for etching the product to be etched.
2. The dual stage laser direct imaging apparatus of claim 1, wherein the alignment means comprises:
an alignment camera slide rail disposed along an X direction of a beam (320) of the bracket (300);
the alignment camera (410), the alignment camera (410) is connected with the alignment camera slide rail in a sliding mode, and the product to be etched is aligned through the alignment camera (410);
an alignment camera drive device that drives the alignment camera (410) to move along the alignment camera slide rail.
3. The dual stage laser direct imaging apparatus of claim 2,
the alignment cameras (410) comprise a first alignment camera and a second alignment camera;
the alignment camera driving device comprises a first alignment camera driving device and a second alignment camera driving device, the first alignment camera driving device drives the first alignment camera to move along the alignment camera slide rail, and the second alignment camera driving device drives the second alignment camera to move along the alignment camera slide rail.
4. The dual stage laser direct imaging apparatus of claim 1, wherein the laser device comprises:
an optical system sled disposed along an X-direction of a beam (320) of the rack (300);
a mounting plate (520), the mounting plate (520) slidably coupling the optical system sled;
an optical system (510), wherein the optical system (510) is arranged on the mounting plate (520), and the laser device transmits laser through the optical system (510) to etch the product to be etched;
an optical system drive that drives the mounting plate (520) along the optical system sled.
5. The dual stage laser direct imaging apparatus according to claim 4, wherein the optical system (510) is plural, and the plural optical systems (510) are arranged on the mounting board (520) at regular intervals.
6. The dual stage laser direct imaging apparatus of claim 5, wherein the laser device further comprises:
a correction device comprising a correction camera (610), the correction camera (610) being disposed at an outer edge of the mounting plate (520) for capturing a post-etch image, the correction device determining a deviation from the post-etch image to correct an etch accuracy.
7. The dual stage laser direct imaging apparatus according to claim 6, wherein the correction camera (610) has two, respectively adjacent to a first said optical system (510) and a last said optical system (510) of a plurality of said optical systems (510) arranged along the X direction.
8. The dual stage laser direct imaging apparatus of claim 1, wherein the stage driving device comprises a linear motor.
9. The dual stage laser direct imaging apparatus of claim 1, further comprising:
the first lifting device is arranged on the base (100) and connected below the first carrying platform (210) so as to drive the first carrying platform (210) to move up and down;
and the second lifting device is arranged on the base (100) and connected below the second carrying platform (220) so as to drive the second carrying platform (220) to move up and down.
10. The dual stage laser direct imaging apparatus of claim 1, further comprising:
the control system is connected with the stage driving devices, the alignment device and the laser device, the control system controls the stage driving devices to drive one of the stages to an etching station and carries out etching process through the laser device, and the control system also controls the stage driving devices to drive the other stage to wait for feeding at the feeding station, move from the feeding station to the etching station and carry out alignment through the alignment device.
CN202010724133.9A 2020-07-24 2020-07-24 Double-stage laser direct imaging equipment Pending CN111880386A (en)

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CN202010724133.9A CN111880386A (en) 2020-07-24 2020-07-24 Double-stage laser direct imaging equipment

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Application Number Priority Date Filing Date Title
CN202010724133.9A CN111880386A (en) 2020-07-24 2020-07-24 Double-stage laser direct imaging equipment

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113031400A (en) * 2021-01-28 2021-06-25 苏州天准科技股份有限公司 Laser direct-writing type image forming apparatus

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CN108710266A (en) * 2018-05-18 2018-10-26 无锡影速半导体科技有限公司 A kind of the write-through exposure system and method for trigger-type aligning structure
CN108762009A (en) * 2018-07-18 2018-11-06 苏州源卓光电科技有限公司 A kind of double-station direct putting type litho machine and its exposure method
CN111316173A (en) * 2017-11-29 2020-06-19 科磊股份有限公司 Measurement of overlay error using device verification system

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN206378688U (en) * 2016-12-20 2017-08-04 湖北凯昌光电科技有限公司 A kind of single table surface write-through exposure machine
CN111316173A (en) * 2017-11-29 2020-06-19 科磊股份有限公司 Measurement of overlay error using device verification system
CN108710266A (en) * 2018-05-18 2018-10-26 无锡影速半导体科技有限公司 A kind of the write-through exposure system and method for trigger-type aligning structure
CN108762009A (en) * 2018-07-18 2018-11-06 苏州源卓光电科技有限公司 A kind of double-station direct putting type litho machine and its exposure method

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113031400A (en) * 2021-01-28 2021-06-25 苏州天准科技股份有限公司 Laser direct-writing type image forming apparatus

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