CN111876629B - High-performance copper-based alloy material for lead frame and preparation method thereof - Google Patents

High-performance copper-based alloy material for lead frame and preparation method thereof Download PDF

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Publication number
CN111876629B
CN111876629B CN202010773056.6A CN202010773056A CN111876629B CN 111876629 B CN111876629 B CN 111876629B CN 202010773056 A CN202010773056 A CN 202010773056A CN 111876629 B CN111876629 B CN 111876629B
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copper
lead frame
alloy material
based alloy
temperature
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CN111876629A (en
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不公告发明人
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Tianshui Huayang Electronic Technology Co ltd
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Tianshui Huayang Electronic Technology Co ltd
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    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • C22C9/01—Alloys based on copper with aluminium as the next major constituent
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B21—MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
    • B21B—ROLLING OF METAL
    • B21B37/00—Control devices or methods specially adapted for metal-rolling mills or the work produced thereby
    • B21B37/74—Temperature control, e.g. by cooling or heating the rolls or the product
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C1/00—Making non-ferrous alloys
    • C22C1/02—Making non-ferrous alloys by melting
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
    • C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
    • C22F1/08—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of copper or alloys based thereon
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49579—Lead-frames or other flat leads characterised by the materials of the lead frames or layers thereon
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B21—MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
    • B21B—ROLLING OF METAL
    • B21B2201/00—Special rolling modes
    • B21B2201/06—Thermomechanical rolling

Abstract

The invention provides a high-performance copper-based alloy material for a lead frame and a preparation method thereof, belonging to the technical field of copper alloy processing for the lead frame. The copper-based alloy material comprises the following materials in percentage by weight: 0.14 to 0.22 wt% of aluminum, 0.02 to 0.05 wt% of zirconium, 0.01 to 0.03 wt% of platinum, 0.01 to 0.03 wt% of titanium, and the balance copper. The invention improves the hardness, tensile strength, thermal conductivity, high temperature softening resistance, elongation and electric conductivity of the copper-aluminum alloy by adding zirconium, platinum and titanium, and also meets the requirement of the thinning trend of lead frame materials; considering that the hardness and tensile strength of the lead frame are affected by thinning and lightening of the copper lead frame material, the addition of trace amounts of zirconium and platinum can affect the elongation and conductivity, and the conductivity and ductility of the copper lead frame are improved by adding trace amounts of titanium and aluminum.

Description

High-performance copper-based alloy material for lead frame and preparation method thereof
Technical Field
The invention belongs to the technical field of copper alloy processing for lead frames, and particularly relates to a high-performance copper-based alloy material for a lead frame and a preparation method thereof.
Background
The lead frame is an important basic material in the electronic information industry, is used as a chip carrier of an integrated circuit, is a key structural member for realizing the electrical connection between a leading-out end of an internal circuit of the chip and an external lead by means of a bonding material to form an electrical circuit, and plays a role of a bridge connected with an external lead.
Since the lead frame has a great influence on the reliability and durability of the integrated circuit, the lead frame material has strict performance requirements in the aspects of tensile strength, thermal conductivity, ductility, electrical conductivity and the like, and copper alloy has been widely applied to the lead frame due to the excellent electrical and thermal conductivity of the copper alloy in the past 80 years. The existing copper alloy is roughly divided into a copper-iron system, a copper-nickel-silicon system, a copper-chromium system, a copper-nickel-tin system and the like, ternary, quaternary and other multi-element copper alloys can obtain better performance and lower cost than the traditional binary alloys, and the copper-iron system alloy has the most brands, has better mechanical strength, stress relaxation resistance and low creep property, and is a good lead frame material. With the rapid development of the related information industry such as electronic communication, the performance requirements on the lead frame are higher and higher, and how to effectively improve the heat conduction, the electric conduction, the strength, the hardness, the high softening temperature, the heat resistance, the oxidation resistance, the corrosion resistance, the weldability, the plastic encapsulation, the repeated bending property, the processing and forming performance and the like of the lead frame material becomes a very prominent problem in the development process of integrated circuits. The lead frame copper alloy material with the strength of 450-500 MPa and the electric conductivity of 80% IACS can not meet the requirement of a super large scale integrated circuit, and the super large scale integrated circuit needs the copper alloy material with the strength of more than 500MPa and the electric conductivity of more than 80% IACS.
Disclosure of Invention
The invention aims to provide a high-performance copper-based alloy material for a lead frame and a preparation method thereof, aiming at the problem that the strength and the conductivity of the existing lead frame copper alloy material need to be improved.
The invention adopts the technical scheme that the high-performance copper-based alloy material for the lead frame comprises the following materials in parts by weight: 0.14 to 0.22 wt% of aluminum, 0.02 to 0.05 wt% of zirconium, 0.01 to 0.03 wt% of platinum, 0.01 to 0.03 wt% of titanium, and the balance copper.
Further, in some embodiments of the present invention, the high performance copper-based alloy material for the lead frame comprises the following materials by weight: 0.17 to 0.20 wt% of aluminum, 0.02 to 0.04 wt% of zirconium, 0.01 to 0.02 wt% of platinum, 0.01 to 0.02 wt% of titanium, and the balance of copper.
Preferably, in an embodiment of the present invention, the high-performance copper-based alloy material for lead frames comprises the following materials by weight: 0.18 wt% of aluminum, 0.03 wt% of zirconium, 0.02 wt% of platinum, 0.02 wt% of titanium and the balance of copper.
The technical scheme of the invention also provides a preparation method of the high-performance copper-based alloy material for the lead frame, which comprises the steps of smelting and casting, hot rough rolling, primary aging annealing, hot finish rolling, secondary aging annealing, finished product rolling, annealing and cooling.
The smelting temperature is 1240-1400 ℃.
The hot rough rolling temperature is 840-880 ℃.
The primary aging annealing temperature is 500-650 ℃, and the temperature is kept for 3-5 h.
The deformation amount of the hot finish rolling is 30-50%.
The secondary aging annealing temperature is 500-650 ℃, and the temperature is kept for 3-5 h.
The processing rate of finished product rolling is 30-50%.
When rolling the finished product, processing the finished product to the thickness of 0.05-0.15 mm.
And the annealing temperature during annealing and cooling is 360-400 ℃, and the annealing is cooled to room temperature after the annealing is finished.
Compared with the prior art, the invention has the beneficial technical effects that:
by adding zirconium, platinum and titanium, the hardness, tensile strength, thermal conductivity, high-temperature softening resistance, elongation and electric conductivity of the copper-aluminum alloy are improved, and the requirement of the thinning trend of the lead frame material is met; considering that the hardness and tensile strength of the lead frame are affected by thinning and lightening of the copper lead frame material, the addition of trace amounts of zirconium and platinum can affect the elongation and conductivity, and the conductivity and ductility of the copper lead frame are improved by adding trace amounts of titanium and aluminum.
Detailed Description
The present invention will be described in further detail with reference to the following preferred embodiments in conjunction with the technical solutions of the present invention.
Example 1
The high-performance copper-based alloy material for the lead frame provided by the embodiment comprises the following materials in parts by weight: 0.14 wt% of aluminum, 0.02 wt% of zirconium, 0.01 wt% of platinum, 0.01 wt% of titanium and the balance of copper; weighing the component materials according to the proportion, mixing, smelting at 1240 ℃, injecting into a casting mold to form an ingot after melting, heating to 840 ℃, and carrying out 8-pass hot rough rolling; carrying out primary aging annealing at 500 ℃, preserving heat for 3 hours, and carrying out hot finish rolling with the deformation of 30%; and (3) carrying out secondary aging annealing at 500 ℃, keeping the temperature for 3h, rolling a finished product with the processing rate of 30 percent, processing to the thickness of 0.15mm, then annealing at 360 ℃, keeping the temperature for 3h, and naturally cooling to room temperature to obtain the product. The product performance index is as follows: the tensile strength can reach 574MPa, and the electric conductivity can reach 82.5 percent IACS.
Example 2
The high-performance copper-based alloy material for the lead frame provided by the embodiment comprises the following materials in parts by weight: 0.22 wt% of aluminum, 0.05 wt% of zirconium, 0.03 wt% of platinum, 0.03 wt% of titanium and the balance of copper; weighing the component materials according to the proportion, mixing, smelting at 1400 ℃, injecting into a casting mold to form an ingot after melting, heating to 880 ℃, and carrying out 8-pass hot rough rolling; carrying out primary aging annealing at 650 ℃, preserving heat for 5 hours, and carrying out hot finish rolling with the deformation of 50%; and (3) carrying out secondary aging annealing at 650 ℃, keeping the temperature for 5h, rolling the finished product with the processing rate of 50% until the thickness is 0.12mm, then annealing at 400 ℃, keeping the temperature for 5h, and naturally cooling to room temperature to obtain the product. The product performance index is as follows: the tensile strength can reach 586MPa, and the electric conductivity can reach 81.6 percent IACS.
Example 3
The high-performance copper-based alloy material for the lead frame provided by the embodiment comprises the following materials in parts by weight: 0.18 wt% of aluminum, 0.03 wt% of zirconium, 0.02 wt% of platinum, 0.02 wt% of titanium and the balance of copper; weighing the component materials according to the proportion, mixing, smelting at 1310 ℃, injecting into a casting mold to form an ingot after melting, heating to 855 ℃, and carrying out 8-pass hot rough rolling; carrying out primary aging annealing at 600 ℃, preserving heat for 4 hours, and carrying out hot finish rolling with the deformation of 40%; and (3) carrying out secondary aging annealing at the temperature of 600 ℃, keeping the temperature for 4h, rolling the finished product with the processing rate of 40% until the thickness is 0.08mm, then carrying out annealing treatment at the temperature of 380 ℃ for 4h, and naturally cooling to room temperature to obtain the product. The product performance index is as follows: the tensile strength can reach 566MPa, and the electric conductivity can reach 83.7 percent IACS.
Example 4
The high-performance copper-based alloy material for the lead frame provided by the embodiment comprises the following materials in parts by weight: 0.16 wt% of aluminum, 0.03 wt% of zirconium, 0.02 wt% of platinum, 0.01 wt% of titanium and the balance of copper; weighing the component materials according to the proportion, mixing, smelting at the temperature of 1305 ℃, injecting into a casting mold to form an ingot after melting, heating to 865 ℃, and carrying out hot rough rolling for 8 times; carrying out primary aging annealing at 545 ℃ for 3.5h, and carrying out hot finish rolling with the deformation of 40%; and (3) carrying out secondary aging annealing at 545 ℃, preserving heat for 3.5h, rolling a finished product with the processing rate of 40% until the thickness is 0.05mm, then annealing at 360 ℃, preserving heat for 3h, and naturally cooling to room temperature to obtain the product. The product performance index is as follows: the tensile strength can reach 552MPa, and the electric conductivity can reach 84.1 percent IACS.

Claims (4)

1. A high-performance copper-based alloy material for a lead frame comprises the following materials in parts by weight: 0.14 to 0.22 wt% of aluminum, 0.02 to 0.05 wt% of zirconium, 0.01 to 0.03 wt% of platinum, 0.01 to 0.03 wt% of titanium and the balance of copper; the preparation method of the high-performance copper-based alloy material for the lead frame comprises the steps of smelting and casting, hot rough rolling, primary aging annealing, hot finish rolling, secondary aging annealing, finished product rolling and annealing cooling, and is characterized in that the smelting temperature is 1240-1400 ℃, the hot rough rolling temperature is 840-880 ℃, the primary aging annealing temperature is 500-650 ℃, the temperature is kept for 3-5 hours, the deformation of the hot finish rolling is 30-50%, the secondary aging annealing temperature is 500-650 ℃, the temperature is kept for 3-5 hours, the processing rate of the finished product rolling is 30-50%, the annealing temperature during annealing cooling is 360-400 ℃, and the finished product is obtained after annealing and then is cooled to room temperature.
2. The high-performance copper-based alloy material for the lead frame according to claim 1, which is characterized by comprising the following materials in percentage by weight: 0.17 to 0.20 wt% of aluminum, 0.02 to 0.04 wt% of zirconium, 0.01 to 0.02 wt% of platinum, 0.01 to 0.02 wt% of titanium, and the balance of copper.
3. The high-performance copper-based alloy material for the lead frame according to claim 1, which is characterized by consisting of the following materials in percentage by weight: 0.18 wt% of aluminum, 0.03 wt% of zirconium, 0.02 wt% of platinum, 0.02 wt% of titanium and the balance of copper.
4. The high-performance copper-based alloy material for the lead frame according to claim 1, wherein the thickness of the finished product is 0.05-0.15mm during rolling.
CN202010773056.6A 2020-08-04 2020-08-04 High-performance copper-based alloy material for lead frame and preparation method thereof Active CN111876629B (en)

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Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1161294A (en) * 1997-08-06 1999-03-05 Sumitomo Light Metal Ind Ltd Copper alloy reinforced by dispersion of alumina and its production
CN1681960A (en) * 2002-07-16 2005-10-12 霍尼韦尔国际公司 Copper sputtering targets and methods of forming copper sputtering targets
WO2006104152A1 (en) * 2005-03-28 2006-10-05 Sumitomo Metal Industries, Ltd. Copper alloy and process for producing the same
CN1930314A (en) * 2004-03-12 2007-03-14 住友金属工业株式会社 Copper alloy and process for producing the same
CN102804352A (en) * 2009-06-12 2012-11-28 三菱综合材料株式会社 Wiring layer structure and process for manufacture thereof
CN108602128A (en) * 2016-01-13 2018-09-28 株式会社丰山控股 The method and its Preparation equipment of the copper metal nanometer powder with uniform oxygen passivation layer are prepared by using hot plasma

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1161294A (en) * 1997-08-06 1999-03-05 Sumitomo Light Metal Ind Ltd Copper alloy reinforced by dispersion of alumina and its production
CN1681960A (en) * 2002-07-16 2005-10-12 霍尼韦尔国际公司 Copper sputtering targets and methods of forming copper sputtering targets
CN1930314A (en) * 2004-03-12 2007-03-14 住友金属工业株式会社 Copper alloy and process for producing the same
WO2006104152A1 (en) * 2005-03-28 2006-10-05 Sumitomo Metal Industries, Ltd. Copper alloy and process for producing the same
CN102804352A (en) * 2009-06-12 2012-11-28 三菱综合材料株式会社 Wiring layer structure and process for manufacture thereof
CN108602128A (en) * 2016-01-13 2018-09-28 株式会社丰山控股 The method and its Preparation equipment of the copper metal nanometer powder with uniform oxygen passivation layer are prepared by using hot plasma

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