CN111872750A - High-efficiency high-precision micro ferrite spherical harmonic oscillator mechanical polishing method - Google Patents
High-efficiency high-precision micro ferrite spherical harmonic oscillator mechanical polishing method Download PDFInfo
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- CN111872750A CN111872750A CN202010684107.8A CN202010684107A CN111872750A CN 111872750 A CN111872750 A CN 111872750A CN 202010684107 A CN202010684107 A CN 202010684107A CN 111872750 A CN111872750 A CN 111872750A
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B1/00—Processes of grinding or polishing; Use of auxiliary equipment in connection with such processes
Abstract
The invention discloses a high-efficiency high-precision micro ferrite spherical harmonic oscillator mechanical polishing method, which belongs to the technical field of magnetic material processing and comprises the following steps: uniformly coating a layer of boron carbide abrasive with the specification of M1.5-M0.5 on the surface of the asymmetric V-shaped groove of the lower polishing disc, and applying pressure through a pressurizing device; setting a polishing rotation program, turning on a rotation power supply, and rotating the spherical harmonic oscillator along with the lower polishing disk to finish a polishing process; according to the invention, by optimizing the processes of the abrasive particle size, the V-groove shape, the pressure, the polishing rotating speed and the like, the polishing process of a batch of miniature ferrite small-ball harmonic oscillators can be completed within 120 seconds on the premise of ensuring the sphericity and brightness of small balls, the polishing time is greatly shortened, the polishing efficiency is improved, and the requirement of high-efficiency and high-precision processing of the batch of miniature ferrite spherical harmonic oscillators can be met.
Description
Technical Field
The invention relates to the technical field of magnetic material processing, in particular to a high-efficiency high-precision micro ferrite spherical harmonic oscillator mechanical polishing method.
Background
In recent years, the rapid development of wireless communication technology brings great convenience to the life of people. Modern mobile communication technology is advancing to 5G technology, and at the same time, technologies such as bluetooth communication technology and wireless local area network make corresponding contributions in the field. With the faster and faster communication speed, the application frequency will be higher and higher, and the demand for the rf microwave device will be larger and larger. In addition, the continuous progress of the microwave radar technology makes the microwave radar widely applied to the military and civil fields. The microwave ferrite material has the characteristics of low loss and high application frequency, and has main application in the field of radio frequency microwaves.
The YIG magnetic tuning device is an important member of a radio frequency microwave device, almost all spherical harmonic oscillators made of microwave ferrite materials are used as tuning elements, and the YIG magnetic tuning device is widely applied to high-precision electronic equipment and instruments such as electronic warfare instruments, spectrum analyzers, network instruments and the like. As their core components, the sphericity, dimensional accuracy, etc. of the small spherical harmonic oscillator directly affect the tuning performance of the YIG device. However, the grinding and polishing difficulty of the spherical sample is far greater than that of the plane grinding and polishing, and the smaller the size is, the greater the processing difficulty is, and especially the batch processing of spherical products with the diameter less than 1.0mm is more difficult.
At present, the bulk polishing process means of small-size (less than 1.0 mm) ferrite spherical sample pieces is mainly V-shaped groove grinding and polishing, for example, chinese patent with patent application number 201711050821.6 and patent name "YIG pellet polishing device" discloses a device for polishing YIG pellets with a diameter of 0.3-1.0mm, which can improve grinding efficiency and yield, but at present, there is no process for polishing YIG pellets specially, and the current pellet polishing process can only refer to the traditional polishing process for large-size non-metal pellets even if the device disclosed by the above patent is used for grinding, and the polishing process needs to be completed by at least 5h of fine grinding, and the processing efficiency is still low.
Disclosure of Invention
The invention aims to provide a high-efficiency high-precision micro ferrite spherical harmonic oscillator mechanical polishing method to solve the problems.
In order to achieve the purpose, the technical scheme adopted by the invention is as follows: a high-efficiency high-precision micro ferrite spherical harmonic oscillator mechanical polishing method comprises the following steps:
(1) uniformly coating a layer of boron carbide abrasive with the specification of M1.5-M0.5 on the surface of a V-shaped groove of a lower polishing disc, and placing at least one ferrite spherical harmonic oscillator in the V-shaped groove;
(2) the upper polishing disk is contacted with the spherical harmonic oscillator through an adjusting rod, and pressure is applied through a pressurizing device;
(3) and setting a polishing rotation program, turning on a rotation power supply, and rotating the spherical harmonic oscillator along with the lower polishing disk to finish a polishing process.
As a preferred technical scheme: the ferrite spherical harmonic oscillator in the step (1) is polycrystal and/or single crystal, and the diameter of the ferrite spherical harmonic oscillator is less than 1 mm.
As a further preferable technical scheme: the minimum diameter of the ferrite spherical harmonic oscillator is 0.15 mm.
As a preferred technical scheme: and (3) adopting asymmetric angle grooves as the V-shaped grooves of the lower polishing disc in the steps (1) and (2), wherein the depth of the V-shaped grooves is 3/5-4/5 of the diameter of the small balls to be polished.
In the prior art including the aforementioned patent application No. 201711050821.6, symmetrical V-shaped grooves (structure is shown in fig. 2 (a)), but in the present application, it is preferable to use asymmetrical V-shaped grooves (structure is shown in fig. 2(b), i.e. the two side lengths of the V-shaped grooves are not equal), and the use of the asymmetrical V-shaped grooves can make the ball rotate better during polishing, which is beneficial to further improve the geometric precision of small ball polishing.
As a preferred technical scheme: and (3) applying pressure of 1-5N.
The magnitude of the applied pressure is related to the material of the polishing disk and the hardness of the small balls, when the pressure is too large, the small balls processed in batches are easy to generate ring zones, the sphericity is over poor, the pressure is too small, and the surface of the small balls cannot achieve the polishing effect (the brightness is poor).
As a preferred technical scheme: the polishing rotation procedure in the step (3) is as follows: the rotation speed is 2000-3000 rpm, and the time is 90-120 s.
The working principle of V-shaped groove polishing processing is as follows: the ball to be processed is placed in a V-shaped groove between the fixed disc and the rotating disc, and after the grinding material is added, the ball moves along the disc groove under the action of the friction force of the rotating disc under the action of pressure; the rotating disc, the processing ball, the grinding material and the fixed disc are interacted, and the ball body is subjected to micro-cutting under the action of the grinding material to realize polishing;
the boron carbide with higher Mohs hardness (about 9.3) is selected as the abrasive, so that the cutting efficiency is better, and in the patent application with the application number of 201711050821.6, when the device disclosed by the patent is used for polishing YIG pellets, the iron oxide with the hardness of 6 is added as the abrasive in the polishing process.
The material of the polishing disc can influence the embedding depth of the abrasive on the surface of the disc, and in the polishing process, the higher the surface hardness of the polishing disc is, the shallower the depth of the abrasive embedded in the surface of the disc is, the cutting depth of the abrasive on the surface of a small ball is increased, and the roughness of the surface of the ball is reduced;
in addition, the inventors of the present application have confirmed through a number of experiments that: the influence of pressure on the polishing efficiency is large, and particularly, the pressure can change the depth of the grinding material pressed into the small ball sample, and the polishing quality and efficiency of the small ball are influenced: the pressure is too small, on one hand, a better contact arc is not easy to form, linear burn is easy to cause, and on the other hand, the polishing efficiency is low; too high pressure can seriously affect the movement flexibility of the small balls and cause the deterioration of the surface quality;
the inventor also proves through experiments that: the asymmetric V-shaped groove is adopted, so that the autorotation condition of the ball during polishing is better, and the improvement of the geometric precision of small ball polishing is facilitated;
in addition, the inventor also finds out through experiments that: polishing parameters such as polishing rotating speed have important influence on the polishing quality and efficiency of the small balls, generally, the higher the rotating speed is, the higher the polishing efficiency is, but the too high polishing speed can influence the polishing quality, a large number of 'pits' appear on the surfaces of the small balls, and part of the small balls are broken, so that the polishing purpose cannot be achieved.
However, the inventor also proves that the polishing efficiency is not significantly improved by only improving one of the factors, and the polishing efficiency can be improved by hundreds of times compared with the prior art on the premise of ensuring the YIG ball polishing quality by adopting the mutual cooperation of the factors such as the abrasive grain size, the V groove shape, the pressure, the polishing rotating speed and the like.
Compared with the prior art, the invention has the advantages that: on the premise of ensuring the sphericity and brightness of the spheres, the polishing process of a batch of miniature ferrite sphere harmonic oscillators can be completed within 120 seconds, the polishing time is greatly shortened, the polishing efficiency is improved, and the requirement of high-efficiency and high-precision polishing processing of the batch of miniature ferrite sphere harmonic oscillators can be met; moreover, the method can realize the efficient and high-precision polishing of ferrite beads with the diameter as low as 0.15mm at minimum.
Drawings
FIG. 1 is a schematic structural diagram of a mechanical polishing device for a micro ferrite spherical resonator according to the present invention;
FIG. 2 is a structural comparison of a prior art symmetrical V-groove and an asymmetrical V-groove of the present invention;
fig. 3 is a picture of a small ball harmonic oscillator of example 1 of the present invention after mechanical polishing;
fig. 4 is a picture of the small ball harmonic oscillator of comparative example 1 of the present invention after mechanical polishing.
In the figure: 1 is a lower polishing disk, 2 is an upper polishing disk, 3 is a spherical harmonic oscillator, 4 is a pressure device, and 5 is an adjusting rod.
Detailed Description
The present invention will be further described with reference to the accompanying drawings and examples, but the present invention is not limited to the examples.
Example 1:
the mechanical polishing device for the miniature ferrite spherical harmonic oscillator shown in figure 1 is used for mechanically polishing a phi 0.15mm small-ball harmonic oscillator, and comprises the following specific steps:
uniformly coating a layer of boron carbide abrasive with the specification of M0.5 on the surface of a V-shaped groove of a lower polishing disc 1, and placing 60 ferrite spherical harmonic oscillators 3 with the diameter of 0.16mm in the asymmetric V-shaped groove (the depth of the V-shaped groove is 0.10 mm); the upper polishing disk 2 is contacted with the spherical harmonic oscillator 3 through an adjusting rod 5, and 2N pressure is applied through a pressurizing device 4; setting a polishing rotation program: the rotating speed is 2000rpm, the time is 120s, the rotating power supply is turned on, the spherical harmonic oscillator 3 rotates along with the lower polishing disk 1, and the polishing process is finished once.
Appearance and dimension detection are respectively carried out on the polished small ball by adopting an optical microscope and a high-precision micrometer, and the surface effect of the resonator of the small ball after mechanical polishing is carried out by adopting the method of the embodiment is shown in fig. 3: the surface of the small ball is bright and has no cracks, and the mirror surface effect is obvious. 10 beads were randomly selected for size testing and the data is shown in Table 1.
It should be noted that the aforementioned "prior art" and "prior art" in tables 1, 2 and 3 refer to that the polishing device disclosed in the patent application with application number 201711050821.6 is used, and polysulfone resin polishing disk with symmetrical V-shaped grooves and iron oxide abrasive are used to polish for 5-8 hours under the conditions of 0.5N pressure and 100r/min rotation speed;
randomly selected 10 beads for size testing, and the data is shown in table 1:
TABLE 1 Phi 0.15mm ferrite spherical harmonic oscillator size test data after mechanical polishing
As can be seen from table 1, the test results show a batch pellet size deviation of 0.003 mm. The batch of small ball products polished by the prior art have obvious uneven sizes, the size deviation exceeds +/-0.03 mm, the size consistency is out of tolerance, and the prior art can not be used for polishing phi 0.15mm small ball products.
Example 2:
the mechanical polishing device for the miniature ferrite spherical harmonic oscillator shown in figure 1 is used for mechanically polishing a phi 0.5mm small-ball harmonic oscillator, and comprises the following specific steps:
uniformly coating a layer of boron carbide abrasive with the specification of M1 on the surface of a V-shaped groove of a lower polishing disc 1, and placing 30 ferrite spherical harmonic oscillators 3 with the diameter of 0.51mm in the asymmetric V-shaped groove (the depth of the V-shaped groove is 0.4 mm); the upper polishing disk 2 is contacted with the spherical harmonic oscillator 3 through an adjusting rod 5, and 3N pressure is applied through a pressurizing device 4; setting a polishing rotation program: the rotating speed is 2500rpm, the time is 100s, a rotating power supply is turned on, the spherical harmonic oscillator 3 rotates along with the lower polishing disk 1, and a polishing process is completed;
and (5) respectively detecting the appearance and the size of the polished small ball by adopting an optical microscope and a high-precision micrometer. The surface effect of the small ball harmonic oscillator after mechanical polishing by the method of the embodiment is the same as that of fig. 2: the surface is bright and has no cracks, and the mirror surface effect is obvious. Randomly selected 10 beads for size testing, and the data is shown in table 2:
TABLE 2 Phi 0.50mm ferrite spherical harmonic oscillator size test data after mechanical polishing
As can be seen from Table 1, the test results show that the deviation of the batch bead size of 0.002mm is slightly better than that of the prior art (deviation of 0.003mm), and the polishing efficiency of the present example is improved by hundreds of times.
Example 3:
the mechanical polishing device for the miniature ferrite spherical harmonic oscillator shown in figure 1 is used for mechanically polishing a phi 1.0mm small-ball harmonic oscillator, and comprises the following specific steps:
uniformly coating a layer of boron carbide abrasive with the specification of M1.5 on the surface of a V-shaped groove of a lower polishing disc 1, and placing 10 ferrite spherical harmonic oscillators 3 with the diameter of 1.01mm in the asymmetric V-shaped groove (the depth of the V-shaped groove is 0.8 mm); the upper polishing disk 2 is contacted with the spherical harmonic oscillator 3 through an adjusting rod 5, and 5N pressure is applied through a pressurizing device 4; setting a polishing rotation program: the rotating speed is 3000rpm, the time is 90s, the rotating power supply is turned on, the spherical harmonic oscillator 3 rotates along with the lower polishing disk 1, and a polishing process is completed;
and (5) respectively detecting the appearance and the size of the polished small ball by adopting an optical microscope and a high-precision micrometer. The surface effect of the small ball harmonic oscillator after mechanical polishing by the method of the embodiment is the same as that of fig. 2: the surface is bright and has no cracks, and the mirror surface effect is obvious. Randomly 10 pellets were selected for size testing and the data are shown in table 3:
TABLE 3 measurement data of mechanically polished ferrite spherical harmonic oscillator with diameter of 1.0mm
As can be seen from Table 1, the test results show that the deviation of the size of the batch bead of 0.003mm is slightly better than that of the prior art (deviation of 0.004mm), and the polishing efficiency of this example is improved by hundreds of times.
The results of the above embodiments show that the polishing method provided by the invention can ensure the precision and surface brightness of the small ball processing, and the polishing efficiency is significantly better than that of the existing grinding and polishing process.
In order to demonstrate the improvement point of the polishing process technology proposed in the present invention, the inventors of the present application made a corresponding single-factor comparative test.
Comparative example 1
Influence of abrasive particle size
Compared with the example 1, the grain size of the boron nitride abrasive is changed, the abrasive of M3.5 is selected for testing, and the rest process conditions are the same. The polished small balls were subjected to appearance and size detection by an optical microscope and a high-precision micrometer, and the results are shown in fig. 3. As can be seen from fig. 3, the small ball harmonic oscillator mechanically polished by the method of the present comparative example has a rough surface and poor brightness, which does not achieve the effect of example 1;
as shown in Table 4, the size of the pellet was decreased more, the average diameter was reduced to about 0.14mm, which was out of the use requirement of the device (1.5. + -. 0.005mm), and the variation in the lot size was large (0.005 mm).
Table 4 comparative example 1 pellet size test data after mechanical polishing
Comparative example 2
Influence of the shape of the V-grooves
This comparative example compared to example 1, only the V-groove shape was changed: the symmetrical V-shaped grooves in the prior art are selected, and the other process conditions are the same. And (5) respectively detecting the appearance and the size of the polished small ball through an optical microscope and a high-precision micrometer. The surface effect of the beads after mechanical polishing by the method of this comparative example was not significantly different from that of fig. 2, and the results of the dimensional test are shown in table 5, in which the average diameter of the beads was reduced to about 0.15mm and the dimensional deviation (0.005mm) was larger than that (0.003mm) of example 1.
Table 5 comparative example 2 pellet size test data after mechanical polishing
Comparative example 3
Influence of pressure
In comparison with example 1, the present comparative example was carried out under the same conditions except that the applied pressure was changed. When 6N polishing pressure is selected, appearance and size detection is respectively carried out on the polished small balls through an optical microscope and a high-precision micrometer, and the fact that the ring belt phenomenon and poor sphericity occur on the surfaces of the small balls subjected to mechanical polishing by the method of the comparative example is found; the size deviation of the small ball reaches 0.010mm, which is far greater than that in the embodiment 1; when the polishing pressure of 0.3N is selected, the polishing time is about 30min and the deviation of the batch size is 0.004mm to achieve the polishing effect shown in FIG. 1.
Table 6 comparative example 3 pellet size test data after mechanical polishing
Comparative example 4
Influence of the rotational speed
Compared with example 1, the comparative example only changes the polishing rotation speed: the rotation speeds of 1000r/min and 3500r/min are respectively selected, and the other process conditions are the same. As a result, when the rotation speed is 1000r/min, the polishing time used is about 1h and the lot size deviation becomes large (0.006mm) to achieve the polishing effect shown in FIG. 1; when the rotating speed is 3500r/min, a large number of small pits appear on the surface of the small balls, and part of the small balls are crushed, so that the polishing purpose is not achieved.
Table 7 comparative example 4 pellet size test data after mechanical polishing
Comparative example 5
Influence of abrasive type
In comparison with example 1, the present comparative example only changed the boron nitride abrasive of example 1 to the iron oxide abrasive of patent application No. 201711050821.6, and the remaining process conditions were not changed, so that the polishing time was about 1.5h and the batch size deviation was large (0.008mm) to achieve the polishing effect shown in fig. 1.
Table 8 comparative example 5 pellet size test data after mechanical polishing
The above description is only for the purpose of illustrating the preferred embodiments of the present invention and is not to be construed as limiting the invention, and any modifications, equivalents and improvements made within the spirit and principle of the present invention are intended to be included within the scope of the present invention.
Claims (6)
1. A high-efficiency high-precision micro ferrite spherical harmonic oscillator mechanical polishing method is characterized by comprising the following steps: the method comprises the following steps:
(1) uniformly coating a layer of boron carbide abrasive with the specification of M1.5-M0.5 on the surface of a V-shaped groove of a lower polishing disc, and placing at least one ferrite spherical harmonic oscillator in the V-shaped groove;
(2) the upper polishing disk is contacted with the spherical harmonic oscillator through an adjusting rod, and pressure is applied through a pressurizing device;
(3) and setting a polishing rotation program, turning on a rotation power supply, and rotating the spherical harmonic oscillator along with the lower polishing disk to finish a polishing process.
2. The mechanical polishing method for the high-efficiency high-precision miniature ferrite spherical harmonic oscillator according to claim 1, characterized in that: the ferrite spherical harmonic oscillator in the step (1) is polycrystal and/or single crystal, and the diameter of the ferrite spherical harmonic oscillator is less than 1 mm.
3. The mechanical polishing method for the high-efficiency high-precision miniature ferrite spherical harmonic oscillator according to claim 2, characterized in that: the minimum diameter of the ferrite spherical harmonic oscillator is 0.15 mm.
4. The mechanical polishing method for the high-efficiency high-precision miniature ferrite spherical harmonic oscillator according to claim 1, characterized in that: and (3) adopting asymmetric angle grooves as the V-shaped grooves of the lower polishing disc in the steps (1) and (2), wherein the depth of the V-shaped grooves is 3/5-4/5 of the diameter of the small balls to be polished.
5. The mechanical polishing method for the high-efficiency high-precision miniature ferrite spherical harmonic oscillator according to claim 1, characterized in that: and (3) applying pressure of 1-5N.
6. The mechanical polishing method for the high-efficiency high-precision miniature ferrite spherical harmonic oscillator according to claim 1, characterized in that: the polishing rotation procedure in the step (3) is as follows: the rotation speed is 2000-3000 rpm, and the time is 90-120 s.
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN117182720A (en) * | 2023-11-06 | 2023-12-08 | 四川图林科技有限责任公司 | Precision machining equipment and machining method for hemispherical resonant gyroscope harmonic oscillator |
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