CN110125732A - A kind of polycrystalline diamond bead grinding method - Google Patents
A kind of polycrystalline diamond bead grinding method Download PDFInfo
- Publication number
- CN110125732A CN110125732A CN201910387112.XA CN201910387112A CN110125732A CN 110125732 A CN110125732 A CN 110125732A CN 201910387112 A CN201910387112 A CN 201910387112A CN 110125732 A CN110125732 A CN 110125732A
- Authority
- CN
- China
- Prior art keywords
- polycrystalline diamond
- abrasive disk
- bead
- lower abrasive
- diamond bead
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B1/00—Processes of grinding or polishing; Use of auxiliary equipment in connection with such processes
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/02—Lapping machines or devices; Accessories designed for working surfaces of revolution
- B24B37/025—Lapping machines or devices; Accessories designed for working surfaces of revolution designed for working spherical surfaces
Abstract
The invention belongs to diamond ball manufacturing technology fields, disclose a kind of polycrystalline diamond bead grinding method, including slightly grind and lappingout two procedures.Firstly, uniformly smearing one layer of diamond paste in the V-groove of lower abrasive disk and top lap bottom surface；Secondly, polycrystalline diamond bead is put into the V-groove of lower abrasive disk；Top lap is connect by guide post with plant bottom case by third, while one pressure F of surface application on it, and top lap is fixed at this time, lower abrasive disk rotation, and drives the small revolutions of polycrystalline diamond and revolution, is completed it and is slightly ground and lappingout processing；Finally, cleaning drying to the polycrystalline diamond bead after lappingout, and carry out circularity and surface roughness detection.The processing method can guarantee that the circularity of bead and roughness meet processing request, and processing unit (plant) structure is simple, and the process-cycle is short, precision is high, be suitble to the sphere part grinding and polishing processing of high rigidity, small size, small lot.
Description
Technical field
The invention belongs to diamond ball manufacturing technology fields, and in particular to a kind of polycrystalline diamond bead attrition process side
Method.
Background technique
Polycrystalline diamond bead is the key part of super-precision bearing, which is widely used in the Shenzhou spacecraft, the goddess in the moon
In the Space Equipments such as lunar orbiter and military tip equipment.Polycrystalline diamond bead has items because of the particularity of its material
The opposite sex, hardness are big, its size is small (diameter is less than 3mm) in addition, are allowed to process extremely difficult.
The processing method of general spherical shape part has vehicle, Milling Process and grinding and polishing at present.Vehicle, Milling Process mainly for
Larger-size part, processing technology is simple, but needs to process part one by one, and processing efficiency is low, and is difficult to hard
Spend big steel ball；Grinding and polishing processing needs to design corresponding raceway for various sizes of steel ball, and time processing needs
A parts to be processed up to a hundred, current grinding and polishing processing are primarily directed to the common material such as aluminium alloy, stainless steel, hard alloy
The diameter of the steel ball of matter, ball is generally higher than 5mm.
In summary, just current processing method, ball-type part few for quantity, that hardness is high, size is small almost can not
Processing, to solve this problem, the present invention provides a kind of processing methods of polycrystalline diamond bead, and in processing unit (plant)
Critical component design provides calculation formula, can meet the precise high-efficiency processing of high rigidity small lot polycrystalline diamond bead.
Summary of the invention
Problem to be solved by this invention is to provide a kind of grinding method of polycrystalline diamond bead, existing to solve
There is the technical problem that technology small batch high-hardness polycrystalline diamond bead circularity and roughness cannot be up to standard.
In order to solve the above technical problems, the technical solution adopted by the present invention:
A kind of polycrystalline diamond bead grinding method, steps are as follows:
Processing unit (plant) used in the processing method include top lap, the lower abrasive disk with V-groove, pressurizing device, guide post,
Pedestal and driving rotating device；
Step 1: uniformly smearing a layer thickness in the V-groove of lower abrasive disk and top lap bottom surface is 0.5~1mm's
Diamond paste；
Step 2: polycrystalline diamond bead is put into the V-groove of lower abrasive disk；
Step 3: top lap is connect by guide post with plant bottom case, while surface is applied by pressurizing device on it
Add a pressure F, top lap is fixed at this time, lower abrasive disk rotation, and drives the small revolutions of polycrystalline diamond and revolution, complete
It slightly grinds at it and is processed with lappingout；
The both sides contacted in V-groove with bead on lower abrasive disk are equal, and the length is l, the angle of both sides composition is θ, should
Length l and angle theta and the small radius of a ball r of polycrystalline diamond being ground, should meet relationship:
Slightly when grinding, diamond paste granularity is W10~28, single polycrystalline diamond bead pressure F is 20~
30N, lower lap speed W are 50~80rpm；
When lappingout, diamond paste granularity be W0.5~5, single polycrystalline diamond bead pressure F be 10~
20N, lower lap speed W are 80~120rpm；
Step 4: cleaning drying to the polycrystalline diamond bead after lappingout, and carries out circularity and surface roughness detection.
The material of the top lap and lower abrasive disk is hard alloy.
Beneficial effects of the present invention: polycrystalline diamond bead grinding method of the invention, by under hard alloy
The suitable V-groove of abrasive disk design size cooperates the lesser diamond paste of granularity, while applying a size to top lap
Reasonable pressure is completed to process the high-precision high-efficiency grinding and polishing of the polycrystalline diamond bead of high rigidity small lot, makes its processing
Circularity and surface roughness reach processing request.Polycrystalline diamond bead grinding method of the present invention is suitble to small quantities of
The ball machine parts'precise grinding and polishing processing of amount, high rigidity, small size.
Detailed description of the invention
Fig. 1 is polycrystalline diamond bead attrition process schematic illustration.
Fig. 2 is the small radius of a ball of polycrystalline diamond and V-groove size geometric graph.
In figure: 1 polycrystalline diamond bead；2 top laps；3 guide posts；4 lower abrasive disks；5 firm bankings；F pressure；It is ground under W
Speed of grinding plate；R polycrystalline diamond minor radius；θ V-groove angle；The length on the side lV type groove AB.
Specific embodiment
With reference to the accompanying drawing and technical solution, the invention will be further described.
As shown in Figs. 1-2.
Example
A kind of polycrystalline diamond bead grinding method, comprising the following steps:
Slightly grind:
Step 1: the gold that a layer thickness is 0.6mm is uniformly smeared in the V-groove of lower abrasive disk 4 and 2 bottom surface of top lap
Hard rock abrasive pastes, abrasive pastes granularity are W14, and upper and lower abrasive disk material is hard alloy.
Step 2: the polycrystalline diamond bead 1 that radius r is 0.5mm is put into the V-groove of lower abrasive disk 4, wherein V-type
Angle theta is 90 ° in slot, and side length l is 0.7mm.
Step 3: top lap 2 is connect by guide post 3 with plant bottom case 5, while surface applies a pressure on it, makes
Single polycrystalline diamond bead pressure is 28N.
Step 4: keep top lap 2 fixed, lower abrasive disk 4 rotates counterclockwise, and drives polycrystalline diamond bead
Rotation and revolution, wherein lower lap speed W is 65rpm.
Step 5: it after slightly grinding, shuts down and cleans upper and lower abrasive disk and polycrystalline diamond bead 1.
Lappingout: repeating the above steps one to five, and wherein abrasive pastes granularity is W0.5, suffered by single polycrystalline diamond bead 1
Pressure is 15N, and lower lap speed W is 100rpm.
Detection: after lappingout, using roundness measuring instrument and surface roughometer to the polycrystalline diamond for cleaning and drying up
Stone bead 1 detect, and circularity is 0.034 μm, and surface roughness is 0.0552 μm.
By being polished directly Design Processing to polycrystalline diamond bead, equipment key part designs the present invention,
And then realize the efficient high finishing of high rigidity small lot polycrystalline diamond bead.
The above description is merely a specific embodiment, but scope of protection of the present invention is not limited thereto, any
Those familiar with the art in the technical scope disclosed by the present invention, can easily think of the change or the replacement, and should all contain
Lid is within protection scope of the present invention.Therefore, protection scope of the present invention should be based on the protection scope of the described claims.
Claims (2)
1. a kind of polycrystalline diamond bead grinding method, which is characterized in that steps are as follows:
Processing unit (plant) used in the processing method includes top lap, lower abrasive disk, pressurizing device, guide post, pedestal with V-groove
And driving rotating device；
Step 1: the Buddha's warrior attendant that a layer thickness is 0.5~1mm is uniformly smeared in the V-groove of lower abrasive disk and top lap bottom surface
Stone abrasive pastes；
Step 2: polycrystalline diamond bead is put into the V-groove of lower abrasive disk；
Step 3: top lap is connect by guide post with plant bottom case, while surface passes through pressurizing device application one on it
Pressure F, top lap is fixed at this time, lower abrasive disk rotation, and drives the small revolutions of polycrystalline diamond and revolution, completes it
It slightly grinds and is processed with lappingout；
The both sides contacted in V-groove with bead on lower abrasive disk are equal, and the length is l, the angle of both sides composition is θ, length l
With angle theta and the small radius of a ball r of polycrystalline diamond being ground, relationship should be met:
When slightly grinding, diamond paste granularity is W10~28, and single polycrystalline diamond bead pressure F is 20~30N, under
Lap speed W is 50~80rpm；
When lappingout, diamond paste granularity is W0.5~5, and single polycrystalline diamond bead pressure F is 10~20N, under
Lap speed W is 80~120rpm；
Step 4: cleaning drying to the polycrystalline diamond bead after lappingout, and carries out circularity and surface roughness detection.
2. polycrystalline diamond bead grinding method according to claim 1, which is characterized in that the top lap
Material with lower abrasive disk is hard alloy.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910387112.XA CN110125732A (en) | 2019-05-10 | 2019-05-10 | A kind of polycrystalline diamond bead grinding method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910387112.XA CN110125732A (en) | 2019-05-10 | 2019-05-10 | A kind of polycrystalline diamond bead grinding method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN110125732A true CN110125732A (en) | 2019-08-16 |
Family
ID=67576979
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910387112.XA Withdrawn CN110125732A (en) | 2019-05-10 | 2019-05-10 | A kind of polycrystalline diamond bead grinding method |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN110125732A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111872750A (en) * | 2020-07-16 | 2020-11-03 | 中国电子科技集团公司第九研究所 | High-efficiency high-precision micro ferrite spherical harmonic oscillator mechanical polishing method |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH1190811A (en) * | 1997-09-16 | 1999-04-06 | Advantest Corp | Ball machining device |
| JP2000042908A (en) * | 1998-07-23 | 2000-02-15 | Ntn Corp | Polishing method and device for silicone ball |
| CN201227764Y (en) * | 2008-05-04 | 2009-04-29 | 浙江工业大学 | Double-disk rotation eccentric V shaped groove grinding miller |
| CN103991018A (en) * | 2014-05-21 | 2014-08-20 | 浙江工业大学 | High-accuracy sphere machining device based on eccentric variable-curvature V-shaped grooved disc |
| CN107052987A (en) * | 2017-06-05 | 2017-08-18 | 南京航空航天大学 | Applied to it is synchronous slightly grind, lappingout, the processing unit (plant) for polishing spheroid |
| CN107150264A (en) * | 2017-05-24 | 2017-09-12 | 上海市轴承技术研究所 | Sphere precision machining method after ceramic coated |
-
2019
- 2019-05-10 CN CN201910387112.XA patent/CN110125732A/en not_active Withdrawn
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH1190811A (en) * | 1997-09-16 | 1999-04-06 | Advantest Corp | Ball machining device |
| JP2000042908A (en) * | 1998-07-23 | 2000-02-15 | Ntn Corp | Polishing method and device for silicone ball |
| CN201227764Y (en) * | 2008-05-04 | 2009-04-29 | 浙江工业大学 | Double-disk rotation eccentric V shaped groove grinding miller |
| CN103991018A (en) * | 2014-05-21 | 2014-08-20 | 浙江工业大学 | High-accuracy sphere machining device based on eccentric variable-curvature V-shaped grooved disc |
| CN107150264A (en) * | 2017-05-24 | 2017-09-12 | 上海市轴承技术研究所 | Sphere precision machining method after ceramic coated |
| CN107052987A (en) * | 2017-06-05 | 2017-08-18 | 南京航空航天大学 | Applied to it is synchronous slightly grind, lappingout, the processing unit (plant) for polishing spheroid |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111872750A (en) * | 2020-07-16 | 2020-11-03 | 中国电子科技集团公司第九研究所 | High-efficiency high-precision micro ferrite spherical harmonic oscillator mechanical polishing method |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP6378437B2 (en) | Cylindrical parts polishing equipment, workpiece propulsion apparatus, and polishing method | |
| JP6352541B2 (en) | Double disc linear groove cylindrical part surface polishing disc | |
| CN102049714A (en) | Method for processing edge of glass plate | |
| US7588482B2 (en) | Apparatus and method for manufacturing liquid crystal display device | |
| WO2008044408A1 (en) | Grindstone | |
| CN103029033A (en) | Grinding apparatus and grinding method | |
| CN103537981B (en) | A kind of superfine processing method of high accuracy circular cylindrical parts cylindrical | |
| CN101332584A (en) | Grinding method of sheet metal | |
| CN100553876C (en) | The method that is used for the material removal process of semiconductor crystal wafer | |
| CN107263267A (en) | A kind of wafer attenuated polishing device | |
| CN110125732A (en) | A kind of polycrystalline diamond bead grinding method | |
| CN109983562A (en) | Double-side polishing apparatus carrier, double-side polishing apparatus and double-side grinding method | |
| JPH11349354A (en) | Substrate for information recording medium and its production | |
| Walker et al. | A quantitative comparison of three grolishing techniques for the Precessions process | |
| CN102152193B (en) | Method for grinding superhard mini-hemispheric coupling parts | |
| KR101362242B1 (en) | Work edge grinding apparatus and method using the same | |
| JPH11347843A (en) | Electrolytic composite polishing method for metal pipe peripheral face and photosensitive drum substrate formed by this method | |
| CN105834885A (en) | Hemispherical dynamic pressure bearing part grinding tool and grinding method | |
| JP6963075B2 (en) | Wafer surface treatment equipment | |
| JP2016182661A (en) | Chamfered substrate and liquid crystal display device | |
| CN205703712U (en) | Dome-type hydrodynamic bearing part grinding tool | |
| CN108081030A (en) | A kind of thin rounded flakes part flat surface grinding method of free sticky adhesive process | |
| US20160354895A1 (en) | Substrate polishing device and method thereof | |
| JP6843554B2 (en) | Wafer surface treatment equipment | |
| JP6717706B2 (en) | Wafer surface treatment equipment |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| WW01 | Invention patent application withdrawn after publication |
Application publication date: 20190816 |
|
| WW01 | Invention patent application withdrawn after publication |