CN111867230A - Heat conducting piece embedded circuit board and manufacturing method thereof - Google Patents
Heat conducting piece embedded circuit board and manufacturing method thereof Download PDFInfo
- Publication number
- CN111867230A CN111867230A CN201910348251.1A CN201910348251A CN111867230A CN 111867230 A CN111867230 A CN 111867230A CN 201910348251 A CN201910348251 A CN 201910348251A CN 111867230 A CN111867230 A CN 111867230A
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- China
- Prior art keywords
- plate
- circuit board
- metal sheets
- heat conducting
- embedded circuit
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
- H05K1/021—Components thermally connected to metal substrates or heat-sinks by insert mounting
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
- H05K1/0204—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
- H05K3/0061—Laminating printed circuit boards onto other substrates, e.g. metallic substrates onto a metallic substrate, e.g. a heat sink
Abstract
The invention discloses a heat-conducting piece embedded circuit board and a manufacturing method thereof, wherein the manufacturing method comprises the following steps: forming through holes in the plate, the two metal sheets and the two rubber sheets respectively; arranging two metal sheets on two opposite sides of a plate, and clamping a rubber sheet between the plate and each metal sheet; the heat conducting piece is arranged in the perforation of the plate, the perforation of each rubber sheet and the perforation of each metal sheet in a penetrating way, and an annular gap is reserved between the side surface of the ring of the heat conducting piece and the perforation hole wall of the plate; hot-pressing the plate, the two metal sheets and the two rubber sheets to enable the two rubber sheets to be in a molten state and to partially flow to and fill the annular gap; and solidifying the two films in a molten state to form an adhesion body, and adhering the plate, the two metal sheets and the heat conducting piece to each other through the adhesion body to form the heat conducting piece embedded circuit board. Through the planning of the implementation sequence and the implementation mode of the steps, the manufacturing of the embedded circuit board of the heat conducting element can be realized through a more efficient and lower-cost process.
Description
Technical Field
The present disclosure relates to circuit boards, and particularly to a heat-conducting embedded circuit board and a method for manufacturing the same.
Background
Since the application of high-heat-value products (such as high-brightness LEDs) is becoming popular, the requirements for heat dissipation efficiency and heat resistance of circuit boards are also becoming higher and higher. Therefore, in recent years, heat conductive circuit boards have been gradually applied to high-heat-value products to meet the heat dissipation efficiency and heat resistance requirements of the high-heat-value products.
However, in the conventional heat conductive circuit board, a required conductive circuit is formed on the entire heat conductive substrate, and high heat-generating electronic components are disposed on a part of the heat conductive circuit board; that is, the above-mentioned high-heat-generating electronic component only needs to use a part of the heat-conducting circuit board block, and the heat-conducting circuit board block not used by the high-heat-generating electronic component will form unnecessary waste of the heat-conducting material.
The present inventors have considered that the above-mentioned defects can be improved, and as a result, they have made intensive studies and have conducted scientific principles to provide the present invention which is designed reasonably and effectively to improve the above-mentioned defects.
Disclosure of Invention
The embodiment of the invention provides a heat-conducting piece embedded circuit board and a manufacturing method thereof, which can effectively overcome the defects possibly generated by the existing circuit board.
The embodiment of the invention discloses a method for manufacturing a heat-conducting piece embedded circuit board, which comprises the following steps: a preparation step: a plate, two metal sheets and two films are respectively provided with a through hole; a stacking step: arranging the two metal sheets on two opposite sides of the plate, and clamping a film between the plate and each metal sheet, wherein the through holes of the plate, the through holes of each film and the through holes of each metal sheet jointly form a through hole along a thickness direction; an embedding step: a heat conducting piece is arranged in the through hole in a penetrating mode, and an annular gap is reserved between one annular side face of the heat conducting piece and the wall of the through hole of the plate; a hot pressing step: hot-pressing the plate, the two metal sheets and the two rubber sheets to enable the two rubber sheets to be in a molten state and to partially flow to and fill the annular gap; a forming step: and solidifying the two films in a molten state to form an adhesion body, and adhering the plate, the two metal sheets and the heat conducting piece to each other through the adhesion body to form the heat conducting piece embedded circuit board.
Preferably, in the preparing step, the hole diameters of the perforations of the plate material, the two metal sheets, and the two films are all the same; and in the stacking step, the perforations of each of the plate material, the two metal sheets, and the two film sheets are aligned in the thickness direction.
Preferably, in the embedding step, the depth of the through hole is greater than the height of the heat conducting member; in the hot pressing step, each film part in a molten state flows to the annular gap, so that the depth of the through hole is reduced and is equal to the height of the heat conducting member.
Preferably, in the forming step, the adhesive is attached to the entire ring side of the heat-conductive member, the entire hole wall of the through-hole of the plate material, and the entire hole wall of the through-hole of each of the metal sheets.
Preferably, in the forming step, two opposite end surfaces of the heat conducting member are exposed outside the adhesion body and are disposed coplanar with the two metal sheets respectively.
Preferably, the heat conducting member comprises a ceramic body and two bonding layers, and the two bonding layers are respectively bonded on two opposite end faces of the ceramic body by adhesion; in the forming step, the two bonding layers are disposed coplanar with the two metal sheets, respectively.
Preferably, the ceramic body is of bulk aluminum nitride construction and each of the bonding layers is a titanium plating.
Preferably, the plate is a multilayer plate and includes a plurality of conductive circuits located on different planes, and at least two of the conductive circuits are located on two plate surfaces on opposite sides of the plate respectively; in the stacking step, a gap is formed between any one of the films and at least one of the conductive circuits on one of the plate surfaces of the adjacent plate materials; in the hot pressing step, any film is in a molten state and partially flows to and fills the corresponding gap; in the forming step, at least two conductive circuits respectively positioned on two plate surfaces of the plate are embedded in the adhesion body.
The embodiment of the invention also discloses a heat-conducting piece embedded circuit board which is manufactured by the manufacturing method of the heat-conducting piece embedded circuit board.
Preferably, the heat conducting member includes a ceramic body and two bonding layers, the two bonding layers are respectively bonded to two opposite end faces of the ceramic body by adhesion, and the two bonding layers are respectively disposed in a coplanar manner with the two metal sheets; the board is a multilayer board body and comprises a plurality of conducting circuits positioned on different planes; at least part of the conductive circuits in the plurality of conductive circuits are positioned on two opposite surfaces of the plate and are embedded in the adhesion body.
In summary, the embedded circuit board with heat conducting element and the manufacturing method thereof disclosed in the embodiments of the present invention can greatly reduce the occupation ratio of the heat conducting material and can be applied to high heat generation products, compared with the existing heat conducting circuit board. In addition, the manufacturing method of the embedded circuit board of the heat conducting piece can realize the manufacturing of the embedded circuit board of the heat conducting piece through a flow with higher efficiency and lower cost by planning the step implementation sequence and the step implementation mode.
For a better understanding of the nature and technical content of the present invention, reference should be made to the following detailed description of the invention and the accompanying drawings, which are provided for illustration purposes only and are not intended to limit the scope of the invention in any way.
Drawings
Fig. 1 and 2 are schematic diagrams illustrating preparation steps of a method for manufacturing a heat-conducting-member-embedded circuit board according to the present invention.
Fig. 3 is a schematic diagram illustrating the stacking steps of the method for manufacturing the embedded circuit board with the heat-conducting member according to the present invention.
Fig. 4 is a schematic view of the embedding step of the method for manufacturing the embedded circuit board with the heat-conducting member according to the present invention.
Fig. 5 is a schematic diagram of the hot-pressing step and the forming step of the method for manufacturing the embedded circuit board with the heat-conducting member according to the present invention.
Detailed Description
Please refer to fig. 1 to 5, which are exemplary embodiments of the present invention, and it should be noted that, in the embodiments, the related numbers and shapes mentioned in the accompanying drawings are only used for describing the embodiments of the present invention in detail, so as to facilitate the understanding of the contents of the present invention, and not for limiting the scope of the present invention.
[ manufacturing method of Embedded Circuit Board of Heat-conducting Member ]
As shown in fig. 1 to 5, the present embodiment discloses a method for manufacturing a thermal conductive embedded circuit board, and for facilitating understanding of the method for manufacturing the thermal conductive embedded circuit board, the drawings of the present embodiment are schematically shown in partial cross-sectional views.
It should be noted that the method for manufacturing the embedded circuit board of the heat conducting member in the embodiment has the steps implemented sequence and the steps implemented mode, so as to realize the manufacturing of the embedded circuit board of the heat conducting member through a more efficient and lower-cost process. That is, the manufacturing method different from the following step implementation sequence or step implementation method is different from the manufacturing method of the embedded circuit board of the heat conducting member in the embodiment.
The manufacturing method of the embedded circuit board of the heat conducting member sequentially comprises a preparation step S110, a stacking step S120, an embedding step S130, a hot pressing step S140 and a forming step S150. Each step S110 to E of the manufacturing method of the embedded circuit board with heat-conducting member will be described below
S150。
As shown in fig. 1 and 2, the preparation step S110 is implemented: providing a plate 1, two metal sheets 2 and two rubber sheets 3; next, a perforation 11, a perforation 21, and a perforation 31 are formed in each of the plate material 1, the two metal sheets 2, and the two films 3. The hole diameters of the through holes 11, 21, 31 of the plate 1, the two metal sheets 2, and the two films 3 are preferably the same, but the present invention is not limited thereto. For example, in other embodiments not shown in the present invention, the apertures of the perforations 11, 21, 31 of the plate 1, the two metal sheets 2, and the two films 3 may be slightly different.
It should be noted that the selection of the above components can be adjusted according to the design requirement, and the following components are illustrated in the present embodiment, but the present invention is not limited thereto. In the present embodiment, the board 1 is a multi-layer board (e.g., FR-4 laminate) and includes a plurality of conductive traces 12 located on different planes. The conductive traces 12 are used for transmitting signals, and at least two of the conductive traces 12 are respectively located on two opposite sides of the board 1 on the board surface 13. That is, the board 1 of the present embodiment corresponds to the completed wiring layout.
Further, the sheet 1 is formed by, for example, prepreg layers (prepreg materials) which may be Glass fiber prepreg (Glass fiber prepreg), Carbon fiber prepreg (Carbon fiber prepreg), Epoxy resin (Epoxy resin) or the like according to different reinforcing materials. However, the plate 1 may be formed of a flexible plate material, that is, the plate 1 is mostly made of a Polyester material (PET) or a Polyimide resin (PI) without containing glass fiber, carbon fiber, or the like. However, the material of the plate material 1 is not limited in this embodiment.
In the present embodiment, the metal sheet 2 is a copper foil, the film 3 is a prepreg (prepreg), and the thickness of the metal sheet 2 is smaller than the thickness of the plate 1 and smaller than the thickness of the film 3, but the present invention is not limited thereto. Wherein the film 3 is solid to facilitate its formation with perforations 31 and to facilitate the implementation of the subsequent steps. In addition, the forming manner of the through holes 11, 21, 31 can be changed according to the processing requirements, for example: chemical etching or non-chemical etching (such as laser drilling, plasma etching, or milling).
As shown in fig. 3, the stacking step S120 is implemented: the two metal sheets 2 are arranged on two opposite sides of the plate 1, a film 3 is sandwiched between the plate 1 and each metal sheet 2, and the through hole 11 of the plate 1, the through hole 31 of each film 3, and the through hole 21 of each metal sheet 2 jointly form a through hole T along a thickness direction H. In the present embodiment, the thickness direction H is perpendicular to any one of the plate surfaces 13 of the plate 1, but the present invention is not limited thereto.
In more detail, the perforations 11, 21, 31 of the plate 1, the two metal sheets 2, and the two films 3 are aligned in the thickness direction H; that is, the aperture of the through hole T at any portion in the thickness direction H is substantially the same. However, in other embodiments of the present invention, which are not shown, the through holes 11, 21, 31 of the plate 1, the two metal sheets 2, and the two films 3 may be non-aligned along the thickness direction H, as long as the through holes T are suitable for the following heat-conducting members to pass through.
Furthermore, a gap G1 is formed between any film 3 and at least one of the conductive traces 12 on one of the plate surfaces 13 of the adjacent plate 1. The gap G1 is formed to facilitate the effective improvement of the bonding strength between the film 3 and the plate 1 in the subsequent steps, but the invention is not limited thereto.
As shown in fig. 4, the embedding step S130 is performed: a heat conducting member 4 is inserted into the through hole T, and an annular gap G2 is left between a ring side surface 4c of the heat conducting member 4 and the hole wall of the through hole 11 of the plate 1. The plate 1, the two metal sheets 2, and the two films 3 together form a through hole T for accommodating the heat conducting member 4, so the through hole T and the heat conducting member 4 preferably have a structure corresponding to each other. In addition, the depth of the through hole T is preferably greater than the height of the heat conducting member 4, so that the heat conducting member 4 can be entirely located in the through hole T.
In more detail, when the heat conduction member 4 is a single component, the heat conduction member 4 has a first surface 4a, a second surface 4b opposite to the first surface 4a, and the ring side surface 4c connecting the peripheries of the first surface 4a and the second surface 4 b. In this embodiment, the heat conducting member 4 includes a ceramic body 41 and two bonding layers 42, and the two bonding layers 42 are respectively bonded to two opposite end surfaces of the ceramic body 41 by adhesion. That is, the two bonding layers 42 respectively constitute the first surface 4a and the second surface 4b of the heat conductive member 4 by being formed on the ceramic body 41.
In the present embodiment, the ceramic body 41 is a block-shaped aluminum nitride structure, and each bonding layer 42 is a titanium plating layer, but the present invention is not limited thereto. For example, in other embodiments of the present invention, which are not shown, the heat-conducting member 4 may not need to be formed with the above-described bonding layer 42, or the heat-conducting member 4 may be a metal block.
As shown in fig. 5, the hot pressing step S140 is performed: and hot-pressing the plate 1, the two metal sheets 2 and the two rubber sheets 3 to make the two rubber sheets 3 in a molten state partially flow to and fill the annular gap G2. In the state where any of the films 3 is in a molten state, it is preferable that the film partially flows toward and fills the corresponding gap G1. Further, each part of the film 3 passing through the above molten state flows toward the annular gap G2 (and the gap G1) so that the depth of the through hole T is reduced and equal to the height of the heat-conducting member 4.
As shown in fig. 5, the forming step S150 is performed: the two films 3 are solidified to form an adhesive 3a, and the plate 1, the two metal sheets 2, and the heat conductor 4 are bonded to each other through the adhesive 3a to form a heat conductor embedded circuit board 100. The adhesive 3a is attached to the entire ring side surface 4c of the heat conducting member 4, the entire hole wall of the through hole 11 of the plate 1, and the entire hole wall of the through hole 21 of each metal sheet 2, and at least two conductive traces 12 respectively located on the two plate surfaces 13 of the plate 1 are embedded in the adhesive 3 a.
More specifically, two opposite end surfaces of the heat conducting member 4 are exposed outside the adhesion body 3a and are disposed coplanar with the two metal sheets 2 respectively; that is, the two bonding layers 42 of the heat-conducting member 4 are disposed coplanar with the two metal sheets 2, respectively, and each bonding layer 42 is separated from the adjacent metal sheet 2 by the adhesive body 3 a.
[ Embedded Circuit Board of Heat conduction Member ]
As shown in fig. 5, the present embodiment also discloses a thermal conductive embedded circuit board 100, which is limited to be manufactured by the above-mentioned manufacturing method of the thermal conductive embedded circuit board; that is, any circuit board not manufactured by the method for manufacturing the heat-conducting-member embedded circuit board is different from the heat-conducting-member embedded circuit board 100 of the present embodiment. Since the structure and material of each component of the embedded circuit board 100 are described in the above manufacturing method, they are not described herein again.
[ technical effects of embodiments of the present invention ]
In summary, the embedded circuit board with heat conducting element and the manufacturing method thereof disclosed in the embodiments of the present invention can greatly reduce the occupation ratio of the heat conducting material and can be applied to high heat generation products, compared with the existing heat conducting circuit board. In addition, the manufacturing method of the embedded circuit board of the heat conducting piece can realize the manufacturing of the embedded circuit board of the heat conducting piece through a flow with higher efficiency and lower cost by the limitation of the step implementation sequence and the step implementation mode.
The disclosure is only a preferred embodiment of the invention and should not be taken as limiting the scope of the invention, which is defined by the appended claims.
Claims (10)
1. A method for manufacturing a heat conduction member embedded circuit board is characterized by comprising the following steps:
a preparation step: a plate, two metal sheets and two films are respectively provided with a through hole;
a stacking step: arranging the two metal sheets on two opposite sides of the plate, and clamping a film between the plate and each metal sheet, wherein the through holes of the plate, the through holes of each film and the through holes of each metal sheet jointly form a through hole along a thickness direction;
an embedding step: a heat conducting piece is arranged in the through hole in a penetrating mode, and an annular gap is reserved between one annular side face of the heat conducting piece and the hole wall of the through hole of the plate;
a hot pressing step: hot-pressing the plate, the two metal sheets and the two rubber sheets to enable the two rubber sheets to be in a molten state and to partially flow to and fill the annular gap; and
A forming step: and solidifying the two films in a molten state to form an adhesion body, and adhering the plate, the two metal sheets and the heat conducting piece to each other through the adhesion body to form the heat conducting piece embedded circuit board.
2. The method for manufacturing a thermally conductive embedded circuit board as claimed in claim 1, wherein in the preparing step, the apertures of the through holes of the plate, the two metal sheets and the two films are the same; and in the stacking step, the perforations of each of the plate material, the two metal sheets, and the two film sheets are aligned in the thickness direction.
3. The method for manufacturing a thermally conductive embedded circuit board as claimed in claim 1, wherein in the embedding step, the depth of the through hole is greater than the height of the thermally conductive component; and in the hot pressing step, each film part in a molten state flows to the annular gap, so that the depth of the through hole is reduced and is equal to the height of the heat conducting member.
4. The method of manufacturing a thermally conductive embedded circuit board as claimed in claim 1, wherein in the forming step, the adhesive is attached to the entire ring side of the thermally conductive member, the entire hole wall of the through hole of the plate material, and the entire hole wall of the through hole of each of the metal sheets.
5. The method as claimed in claim 1, wherein in the step of forming, two opposite end surfaces of the thermal conductive member are exposed outside the adhesive body and are coplanar with the two metal sheets, respectively.
6. The method as claimed in claim 1, wherein the thermal conduction member comprises a ceramic body and two bonding layers, and the two bonding layers are respectively bonded to opposite end surfaces of the ceramic body by adhesion; in the forming step, the two bonding layers are disposed coplanar with the two metal sheets, respectively.
7. The method as claimed in claim 6, wherein the ceramic body is a block of AlN and each of the bonding layers is a Ti plating layer.
8. The method as claimed in claim 1, wherein the board is a multi-layer board and includes a plurality of conductive traces on different planes, at least two of the conductive traces being located on two opposite sides of the board; in the stacking step, a gap is formed between any one of the films and at least one of the conductive circuits on one of the adjacent plate surfaces of the plate material; in the hot pressing step, any film is in a molten state and partially flows to and fills the corresponding gap; in the forming step, at least two conductive circuits respectively positioned on two plate surfaces of the plate are embedded in the adhesion body.
9. A heat-conductive-member-embedded circuit board produced by the method according to claim 1.
10. The embedded circuit board of claim 9, wherein the thermal conductor comprises a ceramic body and two bonding layers, and the two bonding layers are respectively bonded to two opposite end surfaces of the ceramic body by adhesion, and are respectively disposed coplanar with the two metal sheets; the plate is a multilayer plate body and comprises a plurality of conducting circuits positioned on different planes; at least part of the conductive circuits in the plurality of conductive circuits are positioned on two opposite surfaces of the plate and are embedded in the adhesion body.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910348251.1A CN111867230A (en) | 2019-04-28 | 2019-04-28 | Heat conducting piece embedded circuit board and manufacturing method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910348251.1A CN111867230A (en) | 2019-04-28 | 2019-04-28 | Heat conducting piece embedded circuit board and manufacturing method thereof |
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| Publication Number | Publication Date |
|---|---|
| CN111867230A true CN111867230A (en) | 2020-10-30 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910348251.1A Pending CN111867230A (en) | 2019-04-28 | 2019-04-28 | Heat conducting piece embedded circuit board and manufacturing method thereof |
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| CN (1) | CN111867230A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114666969A (en) * | 2020-12-23 | 2022-06-24 | 健鼎（无锡）电子有限公司 | Circuit board structure and manufacturing method thereof |
| CN114828438A (en) * | 2021-01-22 | 2022-07-29 | 健鼎（无锡）电子有限公司 | Composite circuit board and manufacturing method thereof |
-
2019
- 2019-04-28 CN CN201910348251.1A patent/CN111867230A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114666969A (en) * | 2020-12-23 | 2022-06-24 | 健鼎（无锡）电子有限公司 | Circuit board structure and manufacturing method thereof |
| CN114666969B (en) * | 2020-12-23 | 2024-03-01 | 健鼎（无锡）电子有限公司 | Circuit board structure and manufacturing method thereof |
| CN114828438A (en) * | 2021-01-22 | 2022-07-29 | 健鼎（无锡）电子有限公司 | Composite circuit board and manufacturing method thereof |
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Application publication date: 20201030 |