CN111863915B - Flexible display substrate and display panel - Google Patents
Flexible display substrate and display panel Download PDFInfo
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- CN111863915B CN111863915B CN202010743190.1A CN202010743190A CN111863915B CN 111863915 B CN111863915 B CN 111863915B CN 202010743190 A CN202010743190 A CN 202010743190A CN 111863915 B CN111863915 B CN 111863915B
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
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- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
- G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
- G09F9/301—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements flexible foldable or roll-able electronic displays, e.g. thin LCD, OLED
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
- Y02E10/549—Organic PV cells
Abstract
The invention provides a flexible display substrate and a display panel, belongs to the technical field of flexible display, and can solve the problem that an existing flexible display panel is easy to warp. The invention discloses a flexible display substrate, which is provided with a pad area, wherein the pad area comprises a binding pad area and a testing pad area; the flexible display substrate includes: the flexible substrate comprises a signal wire, an inorganic insulating layer, a binding pad and a testing pad, wherein the signal wire and the inorganic insulating layer are arranged on the flexible substrate; the binding pad is connected with the corresponding signal wire through a first via hole on the inorganic insulating layer; the inorganic insulating layer further includes: a second via located in the test pad region; the test bonding pad is connected with the corresponding signal line through the second through hole; the size of the second via hole is the same as the size of the first via hole; and the arrangement mode and the spacing of the second via holes are the same as the arrangement mode and the spacing of at least part of the first via holes.
Description
Technical Field
The invention belongs to the technical field of flexible display, and particularly relates to a flexible display substrate and a display panel.
Background
In a flexible display panel, a flexible substrate made of a material such as PI (Polyimide) is generally used instead of a hard substrate such as a glass substrate. Because the flexible display substrate does not have a rigid substrate as a support, after the flexible display substrate is cut into individual flexible display panels, stress differences are easily generated in various regions of the flexible display panels, and an edge warping phenomenon is often generated. The warping phenomenon of the display panel will have a great influence on aging, ET (electrical test), bonding, and other processes.
The inventor finds that, in the existing cut flexible display panel, the Pad region is prone to warp, and as shown in fig. 1, the Pad region generally includes a bonding Pad region 12 and test Pad regions 11 located at two sides of the bonding region. A plurality of binding pads 2 are provided in the binding pad region 12, and a plurality of test pads 3 are provided in the test pad region 11. The whole bonding pad region 12 is relatively flat, and the whole bonding pad region 12 extends to the test pad region 11, and the whole test pad region 11 is warped.
Disclosure of Invention
The invention aims to at least solve one of the technical problems in the prior art and provides a flexible display substrate with a flat pad area.
The technical scheme adopted for solving the technical problem is that the flexible display substrate is provided with a pad area, and the pad area comprises a binding pad area and a testing pad area; the flexible display substrate includes: the flexible substrate comprises a signal wire, an inorganic insulating layer, a binding pad and a testing pad, wherein the signal wire and the inorganic insulating layer are arranged on the flexible substrate; the binding pad is connected with the corresponding signal wire through a first via hole on the inorganic insulating layer;
the inorganic insulating layer further includes: a second via located in the test pad region; the test pad is connected with the corresponding signal line through the second via hole;
the size of the second via hole is the same as the size of the first via hole; and the arrangement mode and the interval of the second via holes are the same as those of at least part of the first via holes.
Optionally, the bonding pad region includes a first bonding pad region and a second bonding pad region that are symmetrically arranged; the first via holes in the first binding pad region and the first via holes in the second binding pad region are symmetrically arranged;
the test pad area comprises a first test pad area and a second test pad area; the first test pad region is positioned on one side of the first binding pad region away from the second binding pad region; the second test pad region is positioned on one side of the second binding pad region, which is far away from the first binding pad region;
the second via hole positioned in the first test bonding pad area and the first via hole positioned in the first binding bonding pad area are arranged in the same mode; the second via hole located in the second test pad region and the first via hole located in the second bonding pad region are arranged in the same manner.
Optionally, the second via hole has the same shape as the first via hole.
Optionally, an area of an orthographic projection of the test pad on the flexible substrate is larger than an area of an orthographic projection of the binding pad on the flexible substrate.
Further optionally, projections of the bonding pads on the flexible substrate correspond to projections of the first vias on the flexible substrate one to one;
the projection of the test pad on the flexible substrate corresponds to the projection of the second vias on the flexible substrate.
Optionally, the projection of the bonding pad on the flexible substrate corresponds to the projection of the first via hole on the flexible substrate one to one;
and the projection of the test pad on the flexible substrate corresponds to the projection of part of the second via hole on the flexible substrate.
Further optionally, a portion of adjacent ones of the plurality of test pads are connected.
Further optionally, the test pad region further includes a redundant pad located in the test pad region;
the projection of the redundant pad on the flexible substrate corresponds to the projection of the second via hole which does not correspond to the test pad on the flexible substrate.
Further optionally, the bonding pad, the testing pad, and the redundant pad are disposed in the same layer and have the same material.
The technical scheme adopted for solving the technical problem of the invention is a display panel which comprises any one of the flexible display substrates.
Drawings
Fig. 1 is a schematic diagram of a pad region of a conventional flexible display substrate;
fig. 2 is a schematic plan view of a pad region of a flexible display substrate according to an embodiment of the present invention;
fig. 3 is a schematic structural diagram of a pad region of a flexible display substrate according to an embodiment of the invention;
fig. 4 is a schematic plan view of a pad region of another flexible display substrate according to an embodiment of the present invention;
fig. 5 is a schematic structural diagram of a pad region of another flexible display substrate according to an embodiment of the invention;
fig. 6 is a schematic plan view of a pad region of another flexible display substrate according to an embodiment of the present invention;
wherein the reference numbers are: 1. a substrate; 11. testing the pad area; 12. bonding a pad region; 2. bonding pads; 3. testing the bonding pad; 4. an inorganic insulating layer; 41. a first via hole; 42. a second via.
Detailed Description
In order to make the technical solutions of the present invention better understood, the present invention is further described in detail with reference to the accompanying drawings and the detailed description below.
The invention will be described in more detail below with reference to the accompanying drawings. Like elements in the various figures are denoted by like reference numerals. For purposes of clarity, the various features in the drawings are not necessarily drawn to scale. Moreover, certain well-known elements may not be shown in the figures.
In the following description, numerous specific details of the invention, such as structure, materials, dimensions, processing techniques and techniques of components, are set forth in order to provide a more thorough understanding of the invention. However, as will be understood by those skilled in the art, the present invention may be practiced without these specific details.
Example 1:
as shown in fig. 2 and 3, the present embodiment provides a flexible display substrate having a pad region including a binding pad region 12 and a test pad region 11; the flexible display substrate includes: a flexible substrate 1, a signal line, an inorganic insulating layer 4, a bonding pad 2 located in a bonding pad region 12, and a test pad 3 located in a test pad region 11, which are disposed on the flexible substrate 1; the bonding pad 2 is connected to a corresponding signal line through a first via hole 41 on the inorganic insulating layer 4.
As shown in fig. 1, the flexible display substrate further has a display area, and the pad area is located at one side of the display area. Typically, the pad region of the flexible display substrate is located at the IC end side of the display region (below as shown in fig. 2). The pad region includes: a binding pad region 12 and a test pad region 11. The binding pad region 12 is generally disposed at the center of the pad region, in which a plurality of binding pads 2 are disposed, the binding pads 2 being connected with corresponding signal lines, which may be connected with pixel cells of the display region. The driver Chip can be connected to the signal line by bonding a Chip On Flex (COF)/Chip On Film (FPC), or the like, to the bonding pad 2, so that the driving control signal is written in the pixel unit to control the display of each pixel unit. The test pad region 11 includes two, which are respectively disposed at both sides (right and left sides as shown in fig. 2) of the bonding pad region 12. The test pad region 11 is provided with a plurality of test pads 3, the test pads 3 are connected to corresponding signal lines, and in the detection stage of the flexible display substrate, the flexible display substrate can be electrically detected (ET detection) through the test pads 3.
In the existing flexible display substrate, generally, the bonding pads (including the bonding pads 2 and the testing pads 3) are located on the surface layer (at least the exposed outermost layer) of the flexible display substrate, so as to facilitate bonding or testing connection. The signal line is located on one side (below the layer where the bonding pad is located in fig. 3) of the layer where the bonding pad is located, which is close to the flexible substrate 1, and at least one inorganic insulating layer 4 is arranged between the two structural layers. The inorganic insulating layer 4 is provided with a via hole, and the bonding pad 2 and the testing pad 3 can be connected with a corresponding signal line through the via hole of the inorganic insulating layer 4. Specifically, the inorganic insulating layer 4 may include a first via hole 41 and a second via hole 42. The first via hole 41 is located in the bonding pad region 12, and the bonding pad 2 is connected with the corresponding signal line through the first via hole 41 on the inorganic insulating layer 4; the second via 42 is located in the test pad region 11; the test pad 3 is connected to a corresponding signal line through the second via 42.
Specifically, in the present embodiment, the size of the second via hole 42 is the same as the size of the first via hole 41; and the arrangement and pitch of the second vias 42 are the same as those of at least a portion of the first vias 41.
In the prior art, the pad area needs to transmit signals by pressing and connecting the pad. The crimping precision and the number of the test pads 3 are lower than those of the binding pads 2, the number of the test pads is smaller, and the area of a single test pad 3 is usually larger in order to ensure the product yield and the detection precision as much as possible. Therefore, as shown in fig. 1, in the prior art, the area occupied by the whole bonding pad region 12 is large, the number of bonding pads 2 is large, and the area of a single bonding pad 2 is small and is arranged closely. In the test pad region 11, the number of the test pads 3 is relatively small, and the single test pad 3 occupies a large area and is sparsely spaced. The inventors found that in the conventional flexible display substrate, the inorganic insulating layer 4 has a large influence on the stress uniformity of the entire flexible display substrate product. Meanwhile, in the conventional flexible display substrate, the shape of the first via 41 in the inorganic insulating layer 4 is generally the same as or similar to the shape and size of the corresponding pad, that is, the second via 42 in the test pad region 11 has a relatively large size and is sparsely arranged. Therefore, stress differences occur due to different positions of the inorganic insulating layer 4 of the test pad region 11, which causes a problem of severe warpage of the test pad region 11, and seriously affects alignment precision during aging and ET detection and fine cutting. In the bonding pad region 12, the second via holes 42 are smaller in shape and size, and the second via holes 42 are distributed and arranged densely, so that the stress distribution of the inorganic insulating layer 4 in the bonding pad region 12 is uniform, and warping is not easy to occur. Meanwhile, the difference of the distribution of the via holes in the test pad area 11 and the bonding pad area 12 is large, so that the stress difference of the joint area of the two areas is large, and warping is easy to occur.
In this embodiment, the second via holes 42 in the inorganic insulating layer 4 are redesigned, so that compared with the prior art, the size of the first via holes 41 is reduced, and the arrangement pitch between the second via holes 42 is reduced, thereby improving the problem of uneven stress distribution of the inorganic insulating layer 4 in the test pad region 11, and further improving the problem of overall warpage of the flexible display substrate. Specifically, in the present embodiment, the size and the arrangement manner of the second via holes 42 are directly designed to be the same as the size arrangement manner of the first via holes 41, so that the problem of stress difference of the inorganic insulating layer 4 is alleviated, and the design difficulty is simplified as much as possible.
It should be noted that, in the present embodiment, the size of the first via hole 41 refers to a parameter that defines the first via hole 41 in a minimum rectangle, and the length and the width of the minimum rectangle are parameters. Specifically, in the present embodiment, the fact that the first via hole 41 and the second via hole 42 have the same size means that the length and the width of the minimum rectangle defined by the first via hole 41 and the second via hole 42 are respectively the same. That is, in the present embodiment, the shapes of the first via hole 41 and the second via hole 42 may be the same or different, as long as the occupied rectangular areas have the same size. It is understood that, in the present embodiment, the size of the second via 42 is mainly reduced, so that the stress distribution on the inorganic insulating layer 4 is more uniform, and the shape of the via is not particularly limited.
Of course, alternatively, the second via hole 42 may have the same shape as the first via hole 41. The via hole on the inorganic insulating layer 4 is usually formed by an etching process, and on the basis of the existing mature first via hole 41 preparation technology, the second via hole 42 is designed to have the same shape as the first via hole 41, so that the design difficulty can be reduced, and the complexity of the preparation process can be simplified.
Optionally, the bonding pad region 12 includes a first bonding pad region 12 and a second bonding pad region 12 that are symmetrically disposed; the first via 41 located in the first bonding pad region 12 and the first via 41 located in the second bonding pad region 12 are symmetrically arranged; the test pad region 11 includes a first test pad region 11 and a second test pad region 11; the first test pad region 11 is located at a side of the first binding pad region 12 away from the second binding pad region 12; the second test pad region 11 is located at a side of the second bond pad region 12 away from the first bond pad region 12; the second via hole 42 in the first test pad region 11 is arranged in the same manner as the first via hole 41 in the first bond pad region 12; the second via 42 located in the second test pad region 11 is arranged in the same manner as the first via 41 located in the second binding pad region 12.
That is, as shown in fig. 2, in the present embodiment, the pad arrangement in the first bonding pad region 12 and the first test pad region 11 and the pad arrangement in the second bonding pad region 12 and the second test pad region 11 are in a symmetrical pattern.
Preferably, in the present embodiment, the first via hole 41 and the second via hole 42 have the same shape. As shown in fig. 2, the first via 41 and the second via 42 may be parallelograms with the same size. Specifically, the first via hole 41 located in the first bonding pad region 12 and the first via hole 41 located in the second bonding pad region 12 are symmetrically arranged with respect to the central axis of the flexible display substrate; the second via hole 42 located in the first test pad region 11 and the second via hole 42 located in the second test pad region 11 are symmetrically disposed about the central axis of the flexible display substrate.
Optionally, in this embodiment, the test pad 3 and the bonding pad 2 may be made of a metal material, and both may be disposed in the same layer and formed by a one-step patterning process, so as to simplify the manufacturing process of the flexible display substrate as much as possible.
As an embodiment, as shown in fig. 4 and 5, optionally, an area of an orthographic projection of the test pad 3 on the flexible substrate 1 is larger than an area of an orthographic projection of the bonding pad 2 on the flexible substrate 1. In this embodiment, the size of the test pad 3 (i.e., the orthographic projection on the flexible substrate 1) is related to the accuracy of the ET inspection apparatus. In the present embodiment, the stress of the inorganic insulating layer 4 is changed mainly by reducing the size of the second via hole 42. For the test pad 3, in order to avoid higher requirements on the existing ET detection accuracy, the size of the test pad 3 may not be reduced, and the original design scheme in the prior art is directly adopted, at this time, the area of the orthographic projection of the test pad 3 on the flexible substrate 1 is larger than the area of the orthographic projection of the binding pad 2 on the flexible substrate 1.
Further optionally, the projections of the bonding pads 2 on the flexible substrate 1 correspond to the projections of the first vias 41 on the flexible substrate 1 one to one; the projection of the test pad 3 on the flexible substrate 1 corresponds to the projection of the plurality of second vias 42 on the flexible substrate 1.
As another embodiment, as shown in fig. 2 and 3, the projection of the bonding pad 2 on the flexible substrate 1 corresponds to the projection of the first via 41 on the flexible substrate 1 one by one; the projection of the test pad 3 on the flexible substrate 1 corresponds to the projection of a part of the second via 42 on the flexible substrate 1. That is, in the present embodiment, the first via 41 and the second via 42 have the same size, and the test pad 3 and the bonding pad 2 may have the same size.
When the testing bonding pad 3 and the binding bonding pad 2 are made of metal materials, the metal layer formed by the testing bonding pad and the binding bonding pad can also influence the overall stress distribution uniformity of the flexible display substrate. In this embodiment, the test pad 3 is designed to have a size corresponding to the second via hole 42, so that the stress distribution uniformity of the entire pad layer can be ensured as much as possible, and the stress distribution uniformity of the entire flexible display substrate can be ensured as much as possible.
Preferably, the test pad 3 and the bonding pad 2 may have the same shape.
Further alternatively, in the present embodiment, as shown in fig. 6, a part of the adjacent test pads 3 is connected. In this embodiment, by connecting a plurality of adjacent test pads 3, the area of the whole single test pad 3 is increased by changing the phase, thereby avoiding the requirement for higher accuracy of the existing ET detection as much as possible.
Further optionally, the present embodiment further includes a redundant pad (not shown in the figure), which is located in the test pad region 11; the projection of the redundant pad on the flexible substrate 1 corresponds to the projection of the second via 42 on the flexible substrate 1 that does not correspond to the test pad 3.
That is, the redundant pad corresponds to a portion of some of the second vias 42, and the test pad 3 does not overlap with the test pad 3 for some of the second vias 42. Preferably, in the slave test pad region 11, all the second vias 42 have a corresponding pad, or a corresponding test pad 3, or a corresponding redundant pad.
In the present embodiment, the number of the test pads 3 is relatively small because the required amount is not large. The metal layer formed by the test bonding pad 3 and the binding bonding pad 2 has a certain influence on the stress distribution of the whole flexible display substrate. In this embodiment, by additionally providing the redundant pad, the stress distribution of the physical layer where the bonding pad 2, the testing pad 3, and the redundant pad are located is more uniform.
Further preferably, the bonding pad 2, the testing pad 3 and the redundant pad are arranged in the same layer and made of the same material. Namely, the three components are formed by adopting a one-step composition process, so that the preparation process is simplified, the preparation cost is saved, and the stress distribution uniformity of the flexible display substrate is ensured at best.
Example 2:
the present embodiment provides a display panel including any one of the flexible display substrates provided in embodiment 1.
Preferably, the display panel is an organic light emitting diode display panel.
Specifically, the display panel can be any product or component with a display function, such as electronic paper, a mobile phone, a tablet computer, a television, a display, a notebook computer, a digital photo frame, a navigator and the like.
It is noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising a … …" does not exclude the presence of another identical element in a process, method, article, or apparatus that comprises the element.
It will be understood that the above embodiments are merely exemplary embodiments taken to illustrate the principles of the present invention, which is not limited thereto. It will be apparent to those skilled in the art that various modifications and improvements can be made without departing from the spirit and scope of the invention, and such modifications and improvements are also considered to be within the scope of the invention.
Claims (9)
1. A flexible display substrate having a pad region, the pad region including a binding pad region and a test pad region; the flexible display substrate includes: the flexible substrate comprises a signal wire, an inorganic insulating layer, a binding pad and a testing pad, wherein the signal wire and the inorganic insulating layer are arranged on the flexible substrate; the binding pad is connected with the corresponding signal wire through a first via hole on the inorganic insulating layer; it is characterized in that the preparation method is characterized in that,
the inorganic insulating layer further includes: a second via located in the test pad region; the test pad is connected with the corresponding signal line through the second via hole;
the size of the second via hole is the same as the size of the first via hole; the arrangement mode and the spacing of the second via holes are the same as those of at least part of the first via holes;
the area of the orthographic projection of the test pad on the flexible substrate is larger than the area of the orthographic projection of the binding pad on the flexible substrate.
2. The flexible display substrate of claim 1, wherein the bonding pad regions comprise a first bonding pad region and a second bonding pad region that are symmetrically disposed; the first via holes in the first binding pad region and the first via holes in the second binding pad region are symmetrically arranged;
the test pad region comprises a first test pad region and a second test pad region; the first test pad region is positioned on one side of the first binding pad region away from the second binding pad region; the second test pad region is positioned on one side of the second bonding pad region away from the first bonding pad region;
the second via hole positioned in the first test bonding pad area and the first via hole positioned in the first binding bonding pad area are arranged in the same mode; the second via hole in the second test pad region and the first via hole in the second bonding pad region are arranged in the same manner.
3. The flexible display substrate of claim 1, wherein the second via is the same shape as the first via.
4. The flexible display substrate of claim 1, wherein a projection of the bonding pad on the flexible substrate corresponds to a projection of the first via on the flexible substrate one to one;
the projection of the test pad on the flexible substrate corresponds to the projection of the second vias on the flexible substrate.
5. The flexible display substrate according to claim 1, wherein a projection of the bonding pad on the flexible substrate corresponds to a projection of the first via on the flexible substrate one to one;
the projection of the test pad on the flexible substrate corresponds to the projection of part of the second via on the flexible substrate.
6. The flexible display substrate of claim 5, wherein a portion of adjacent ones of the test pads are connected.
7. The flexible display substrate of claim 5, further comprising a redundant pad located at the test pad region;
and the projection of the redundant pad on the flexible substrate corresponds to the projection of the second via hole which does not correspond to the test pad on the flexible substrate.
8. The flexible display substrate of claim 7, wherein the bonding pad, the testing pad and the redundancy pad are arranged in the same layer and are made of the same material.
9. A display panel comprising the flexible display substrate according to any one of claims 1 to 8.
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| CN114397786A (en) * | 2022-01-25 | 2022-04-26 | 北京京东方显示技术有限公司 | Display substrate and display device |
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| CN206311727U (en) * | 2016-12-27 | 2017-07-07 | 信利（惠州）智能显示有限公司 | Contactor control device |
| CN109426040A (en) * | 2017-08-22 | 2019-03-05 | 三星显示有限公司 | Electronic equipment |
| CN208722489U (en) * | 2018-09-11 | 2019-04-09 | 昆山龙腾光电有限公司 | A kind of binding component and display device |
| CN209314136U (en) * | 2018-09-28 | 2019-08-27 | 广州兴森快捷电路科技有限公司 | Loss test structure for wiring board |
| CN109445649A (en) * | 2018-10-08 | 2019-03-08 | 武汉华星光电半导体显示技术有限公司 | A kind of touch-control display panel and binding method |
| CN110289225A (en) * | 2019-06-28 | 2019-09-27 | 京东方科技集团股份有限公司 | Test device and method, display device |
| CN110676268A (en) * | 2019-09-29 | 2020-01-10 | 武汉华星光电半导体显示技术有限公司 | Array substrate and display panel |
| CN110910804A (en) * | 2019-12-26 | 2020-03-24 | 厦门天马微电子有限公司 | Display panel and display device |
| CN111367125A (en) * | 2020-02-28 | 2020-07-03 | 上海中航光电子有限公司 | Array substrate and display panel |
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