CN111856254A - High-low frequency active chip's testing arrangement that loads in mixture - Google Patents

High-low frequency active chip's testing arrangement that loads in mixture Download PDF

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Publication number
CN111856254A
CN111856254A CN202010909968.1A CN202010909968A CN111856254A CN 111856254 A CN111856254 A CN 111856254A CN 202010909968 A CN202010909968 A CN 202010909968A CN 111856254 A CN111856254 A CN 111856254A
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CN
China
Prior art keywords
fuzz button
frequency
active chip
substrate
low
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Pending
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CN202010909968.1A
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Chinese (zh)
Inventor
冯林涛
宋德柱
汪海英
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Shanghai Aerospace Science and Industry Appliance Co Ltd
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Shanghai Aerospace Science and Industry Appliance Co Ltd
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Application filed by Shanghai Aerospace Science and Industry Appliance Co Ltd filed Critical Shanghai Aerospace Science and Industry Appliance Co Ltd
Priority to CN202010909968.1A priority Critical patent/CN111856254A/en
Publication of CN111856254A publication Critical patent/CN111856254A/en
Pending legal-status Critical Current

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    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851Testing of integrated circuits [IC]

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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)

Abstract

The invention discloses a testing device for a high-frequency and low-frequency mixed active chip, which comprises a shell, a rough button substrate and a circuit system, wherein the shell is provided with a plurality of grooves; when the active chip is tested, the active chip can be tested only by arranging the active chip on the fuzz button substrate, buckling the substrate through the insulating pressing plate and the upper pressing cover plate and locking the substrate through the screw buckle without welding, and when a radio frequency signal is transmitted through surface mounting emission, the transmission of a microwave signal and an electric signal is good based on the compression joint and the telescopic transmission characteristic of the fuzz button, and a vertical signal is converted into a horizontal signal. In order to facilitate debugging, the upper pressure cover plate is provided with the skylight. The invention has the advantages of simple structure, convenient test, debugging in the test process, small insertion loss of radio frequency signals, good standing wave, stable performance and high test efficiency.

Description

High-low frequency active chip's testing arrangement that loads in mixture
Technical Field
The invention relates to the technical field of chip testing, in particular to a testing device for a high-frequency and low-frequency mixed active chip.
Background
With the continuous development and progress of microwave technology, more and more microwave components are required to be integrated and miniaturized. The surface-mounted mode is undoubtedly the lowest cost and easy to operate, how to test the surface-mounted components becomes a bottleneck of radio frequency development, the traditional technology needs to test after welding, and after the test, a welding spot needs to be picked up, and the stability and reliability of the components cannot be guaranteed in the repeated welding process. Meanwhile, the mode can cause the welding spot to fall off, and has the defects of low testing efficiency, difficult operation and the like. Can not meet the requirement of mass production. When radio frequency signals are transmitted by adopting other connection modes, impedance matching cannot be achieved, inaccurate test is caused, debugging cannot be performed in the test process, the isolation between adjacent radio frequencies is not high, signal interference is serious, and the voltage of a power supply system is unstable. Based on the characteristics of compaction and expansion of the fuzz button, the microwave signal and the electric signal can be well transmitted in a compression joint mode, the vertical signal can be favorably converted into the horizontal signal, and therefore, the testing device which is transmitted by the fuzz button and is provided with the high-frequency and low-frequency mixed active chip is especially important.
Disclosure of Invention
The invention aims to provide a testing device for a high-frequency and low-frequency mixed active chip aiming at the defects of the prior art, and the testing device adopts a shell, a fuzz button substrate and a circuit system; when the active chip is tested, the active chip can be tested only by arranging the active chip on the fuzz button substrate, buckling the active chip with the base through the insulating pressing plate and the upper pressing cover plate and locking the active chip through the screw buckle without welding, and when a radio frequency signal is transmitted through surface mounting emission, the transmission of a microwave signal and an electric signal is good based on the compression joint and the telescopic transmission characteristic of the fuzz button, and a vertical signal is converted into a horizontal signal. In order to facilitate debugging, the upper pressure cover plate is provided with the skylight. The invention has the advantages of simple structure, convenient test, debugging in the test process, small insertion loss of radio frequency signals, good standing wave, stable performance and high test efficiency.
The specific technical scheme for realizing the purpose of the invention is as follows:
a testing device for a high-frequency and low-frequency mixed active chip is characterized by comprising a shell, a fuzz button substrate and a circuit system;
the shell consists of a base and an upper pressure cover plate; the base and the upper pressure cover plate are both plate-shaped pieces, one side between the base and the upper pressure cover plate is provided with a hinge shaft, and the other side is provided with a screw lock catch; a skylight is arranged on the upper pressure cover plate;
the wool button substrate is a plate-shaped piece, a plurality of single-hole wool button connectors are symmetrically arranged on two sides of the wool button substrate, a row of multi-hole wool button connectors are arranged on the other side of the wool button substrate, and isolating pieces are arranged among the single-hole wool button connectors; an insulating pressing plate covers the fuzz button substrate;
the circuit system consists of a radio frequency control pcb, an SMA connector, a voltage stabilizer, a resistance assembly and a low-frequency connector; the radio frequency control pcb is provided with a hair button substrate seat and two groups of contacts; the SMA connector, the voltage stabilizer, the resistance assembly and the low-frequency connector are electrically connected with the radio frequency control pcb; wherein, the SMA connector is several.
The fuzz button substrate is arranged on a fuzz button substrate seat of the circuit system, and a plurality of single-hole fuzz button connectors of the fuzz button substrate are respectively and correspondingly connected with a plurality of SMA connectors through a group of contacts on the radio frequency control pcb; a row of porous fuzz button connectors of the fuzz button substrate are correspondingly connected with the low-frequency connector through another group of contacts on the radio frequency control pcb;
the circuit system is arranged on the base of the shell, and the upper pressure cover plate is buckled with the base and locked through the screw buckle.
The base and the upper gland plate are made of brass HPb59-1 material, and the surface of the base and the upper gland plate is coated with nickel.
The insulating pressing plate is made of polyphenylene sulfide PPS material.
The single-hole fuzz button connector has the advantages that the throughput of radio-frequency signals is DC-18G, and the impedance matching characteristic is 50 omega.
The porous fuzz button connector can pass through a large current and a high-speed control signal.
The invention adopts the structure of a shell, a rough button substrate and a circuit system; when the active chip is tested, the active chip can be tested only by arranging the active chip on the fuzz button substrate, buckling the active chip with the base through the insulating pressing plate and the upper pressing cover plate and locking the active chip through the screw buckle without welding, and when a radio frequency signal is transmitted through surface mounting emission, the transmission of a microwave signal and an electric signal is good based on the compression joint and the telescopic transmission characteristic of the fuzz button, and a vertical signal is converted into a horizontal signal. In order to facilitate debugging, the upper pressure cover plate is provided with the skylight. The invention has the advantages of simple structure, convenient test, debugging in the test process, small insertion loss of radio frequency signals, good standing wave, stable performance and high test efficiency.
Drawings
FIG. 1 is a schematic structural view of the present invention;
fig. 2 is a schematic structural view of a substrate of a fuzz button and a circuit system.
Detailed Description
Referring to fig. 1 and 2, the present invention includes a housing 10, a substrate 20, and a circuit system 30;
the shell 10 is composed of a base 11 and an upper gland plate 12; the base 11 and the upper gland plate 12 are both plate-shaped pieces, one side between the base 11 and the upper gland plate 12 is provided with a hinge shaft 13, and the other side is provided with a screw lock 14; a skylight 15 is arranged on the upper pressure cover plate 12;
the fuzz button substrate 20 is a plate-shaped piece, a plurality of single-hole fuzz button connectors 21 are symmetrically arranged on two sides of the fuzz button substrate, a row of multi-hole fuzz button connectors 22 are arranged on the other side of the fuzz button substrate, and isolating pieces 23 are arranged among the single-hole fuzz button connectors 21; the fuzz button substrate 20 is covered with an insulating pressing plate 24;
the circuit system 30 is composed of a radio frequency control pcb board 31, an SMA connector 32, a voltage stabilizer 33, a resistance assembly 34 and a low-frequency connector 35; the radio frequency control pcb 31 is provided with a hair button substrate seat and two groups of contacts; the SMA connector 32, the voltage stabilizer 33, the resistance assembly 34 and the low-frequency connector 35 are electrically connected with the radio frequency control pcb board 31; among them, the SMA connector 32 is several pieces.
Referring to fig. 1 and 2, the fuzz button substrate 20 is disposed on a fuzz button substrate seat of the circuit system 30, and a plurality of single-hole fuzz button connectors 21 of the fuzz button substrate 20 are respectively and correspondingly connected with a plurality of SMA connectors 32 through a set of contacts on a radio frequency control pcb 31; the row of porous fuzz button connectors 22 of the fuzz button substrate 20 are connected with the low-frequency connector 35 through another group of contacts on the radio frequency control pcb board 31;
the circuit system 30 is disposed on the base 11 of the housing 10, and the upper cover plate 12 is fastened to the base 11 and locked by the screw fastener 14.
The base 11 and the upper gland plate 12 are made of brass HPb59-1 material, and the surface of the base is coated with nickel.
The insulating pressing plate 24 is made of polyphenylene sulfide PPS material.
The single-hole fuzz button connector 21 has the radio frequency signal throughput of DC-18G and the impedance matching characteristic of 50 omega.
The porous fuzz button connector 22 can pass high current and high speed control signals.
The invention works as follows:
referring to fig. 1 and 2, in the invention, for a soldering-free test, an active chip to be tested is directly placed on a rough button substrate 20, an insulating pressing plate 24 is placed on the active chip, an upper pressing cover plate 12 of a shell 10 is buckled with a base 11 and locked by a screw lock 14, then an SMA connector 32 is connected to a variable frequency vector network analyzer, a low-frequency connector 35 is provided with multiple interfaces, 2-4 paths are selected as power supplies optionally, the rest paths are used as signal controls, the active chip to be tested can be tested, and specific test indexes can be read on the variable frequency vector network analyzer.
Referring to fig. 1 and 2, in order to solve the problems of poor isolation and mutual interference of multiple radio frequency signals caused by small distance between radio frequency ports of the single-hole fuzz button connectors 21, the invention arranges the spacers 23 between the single-hole fuzz button connectors 21 of the fuzz button substrate 20, thereby avoiding mutual interference of multiple radio frequency signals and improving the detection accuracy.
Referring to fig. 1 and 2, the resistance assembly 34 is disposed on the rf control pcb 31, and the properties of the port between the low frequency connector 35 and the porous fuzz button connector 22 can be switched at will through the resistance assembly 34, so that the port can be switched between the power control port or the signal input port.
Referring to fig. 1 and 2, the voltage regulator 33 is further disposed on the rf control pcb 31, and the voltage of the transmission power supply is guaranteed to be stable by the voltage regulator 33.
Referring to fig. 1 and 2, in order to facilitate debugging of the active chip during the test process, the top cover plate 12 of the present invention is provided with the louvers 15, and the active chip can be debugged through the louvers 15 during the test process, so as to test the best state.

Claims (5)

1. A testing device for a high-frequency and low-frequency mixed active chip is characterized by comprising a shell (10), a fuzz button substrate (20) and a circuit system (30);
the shell (10) is composed of a base (11) and an upper gland plate (12); the base (11) and the upper gland plate (12) are both plate-shaped pieces, one side between the base (11) and the upper gland plate (12) is provided with a hinge shaft (13), and the other side is provided with a screw lock catch (14); a skylight (15) is arranged on the upper pressure cover plate (12);
the fuzz button substrate (20) is a plate-shaped piece, a plurality of single-hole fuzz button connectors (21) are symmetrically arranged on two sides of the fuzz button substrate, a row of multi-hole fuzz button connectors (22) are arranged on the other side of the fuzz button substrate, and isolating pieces (23) are arranged among the single-hole fuzz button connectors (21); an insulating pressing plate (24) is covered on the fuzz button substrate (20);
the circuit system (30) is composed of a radio frequency control pcb board (31), an SMA connector (32), a voltage stabilizer (33), a resistance assembly (34) and a low-frequency connector (35); the radio frequency control pcb (31) is provided with a hair button substrate seat and two groups of contacts; the SMA connector (32), the voltage stabilizer (33), the resistor assembly (34) and the low-frequency connector (35) are electrically connected with the radio frequency control pcb (31); wherein, the SMA connector (32) is provided with a plurality of pieces;
the fuzz button substrate (20) is arranged on a fuzz button substrate seat of the circuit system (30), and a plurality of single-hole fuzz button connectors (21) of the fuzz button substrate (20) are correspondingly connected with a plurality of SMA connectors (32) respectively through a group of contacts on a radio frequency control pcb (31); a row of porous fuzz button connectors (22) of the fuzz button substrate (20) are correspondingly connected with a low-frequency connector assembly (35) through another group of contacts on the radio frequency control pcb board (31);
the circuit system (30) is arranged on a base (11) of the shell (10), and the upper pressure cover plate (12) is buckled with the base (11) and locked by a screw lock catch (14).
2. The testing device for the mixed active chips of high and low frequencies as claimed in claim 1, wherein the base (11) and the upper gland plate (12) are made of brass HPb59-1 material and are plated with nickel on the surface.
3. The testing device for the high-frequency and low-frequency mixed active chip as claimed in claim 1, wherein the insulating pressing plate (24) is made of polyphenylene sulfide (PPS) material.
4. The testing device for the high-frequency and low-frequency mixed active chip as claimed in claim 1, wherein the single-hole fuzz button connector (21) has a throughput of DC-18G and an impedance matching characteristic of 50 Ω.
5. The testing device for the high-low frequency mixed active chip as claimed in claim 1, wherein the porous fuzz button connector (22) can pass a large current and a high-speed control signal.
CN202010909968.1A 2020-09-02 2020-09-02 High-low frequency active chip's testing arrangement that loads in mixture Pending CN111856254A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202010909968.1A CN111856254A (en) 2020-09-02 2020-09-02 High-low frequency active chip's testing arrangement that loads in mixture

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202010909968.1A CN111856254A (en) 2020-09-02 2020-09-02 High-low frequency active chip's testing arrangement that loads in mixture

Publications (1)

Publication Number Publication Date
CN111856254A true CN111856254A (en) 2020-10-30

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113346301A (en) * 2021-05-17 2021-09-03 中航光电科技股份有限公司 Maintainable thin chip switching base

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113346301A (en) * 2021-05-17 2021-09-03 中航光电科技股份有限公司 Maintainable thin chip switching base

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