CN111855510A - Coil chip, preparation method thereof, detection chip and lubricating oil sensor - Google Patents
Coil chip, preparation method thereof, detection chip and lubricating oil sensor Download PDFInfo
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- CN111855510A CN111855510A CN202010797239.1A CN202010797239A CN111855510A CN 111855510 A CN111855510 A CN 111855510A CN 202010797239 A CN202010797239 A CN 202010797239A CN 111855510 A CN111855510 A CN 111855510A
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- 238000001514 detection method Methods 0.000 title claims abstract description 81
- 239000010687 lubricating oil Substances 0.000 title claims abstract description 61
- 238000002360 preparation method Methods 0.000 title claims abstract description 11
- 230000006698 induction Effects 0.000 claims abstract description 191
- 239000000758 substrate Substances 0.000 claims abstract description 48
- 229910052751 metal Inorganic materials 0.000 claims description 37
- 239000002184 metal Substances 0.000 claims description 37
- 239000003921 oil Substances 0.000 claims description 36
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 25
- 238000000034 method Methods 0.000 claims description 22
- 235000012239 silicon dioxide Nutrition 0.000 claims description 14
- 238000009413 insulation Methods 0.000 claims description 13
- 239000000377 silicon dioxide Substances 0.000 claims description 11
- 230000008569 process Effects 0.000 claims description 10
- 238000004519 manufacturing process Methods 0.000 claims description 8
- 239000004020 conductor Substances 0.000 claims description 7
- 238000005530 etching Methods 0.000 claims description 6
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 claims description 6
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 4
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical group [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims description 4
- 238000001312 dry etching Methods 0.000 claims description 4
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 4
- 239000010931 gold Substances 0.000 claims description 4
- 229910052737 gold Inorganic materials 0.000 claims description 4
- 229910052710 silicon Inorganic materials 0.000 claims description 4
- 239000010703 silicon Substances 0.000 claims description 4
- 239000010936 titanium Substances 0.000 claims description 4
- 229910052719 titanium Inorganic materials 0.000 claims description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 3
- 229910052581 Si3N4 Inorganic materials 0.000 claims description 3
- 229910052782 aluminium Inorganic materials 0.000 claims description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 3
- 229910052802 copper Inorganic materials 0.000 claims description 3
- 239000010949 copper Substances 0.000 claims description 3
- 238000005137 deposition process Methods 0.000 claims description 3
- 239000011521 glass Substances 0.000 claims description 3
- 238000003698 laser cutting Methods 0.000 claims description 3
- 230000003647 oxidation Effects 0.000 claims description 3
- 238000007254 oxidation reaction Methods 0.000 claims description 3
- 229910052697 platinum Inorganic materials 0.000 claims description 3
- 239000010453 quartz Substances 0.000 claims description 3
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 claims description 3
- 238000001039 wet etching Methods 0.000 claims description 3
- 238000003491 array Methods 0.000 claims 1
- 230000035945 sensitivity Effects 0.000 abstract description 10
- 239000010410 layer Substances 0.000 description 363
- 238000010586 diagram Methods 0.000 description 14
- 230000005284 excitation Effects 0.000 description 9
- 239000012790 adhesive layer Substances 0.000 description 6
- 230000001939 inductive effect Effects 0.000 description 4
- 239000000314 lubricant Substances 0.000 description 4
- 239000002356 single layer Substances 0.000 description 4
- 230000009471 action Effects 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 239000002245 particle Substances 0.000 description 3
- 239000013618 particulate matter Substances 0.000 description 3
- 230000000149 penetrating effect Effects 0.000 description 3
- 239000004519 grease Substances 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000006467 substitution reaction Methods 0.000 description 2
- 238000004804 winding Methods 0.000 description 2
- 229910001069 Ti alloy Inorganic materials 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 239000012777 electrically insulating material Substances 0.000 description 1
- 230000005674 electromagnetic induction Effects 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 230000004907 flux Effects 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 238000001259 photo etching Methods 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 230000001012 protector Effects 0.000 description 1
- 238000005096 rolling process Methods 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N15/00—Investigating characteristics of particles; Investigating permeability, pore-volume or surface-area of porous materials
- G01N15/02—Investigating particle size or size distribution
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N15/00—Investigating characteristics of particles; Investigating permeability, pore-volume or surface-area of porous materials
- G01N15/10—Investigating individual particles
- G01N15/1023—Microstructural devices for non-optical measurement
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N15/00—Investigating characteristics of particles; Investigating permeability, pore-volume or surface-area of porous materials
- G01N15/10—Investigating individual particles
- G01N15/1031—Investigating individual particles by measuring electrical or magnetic effects
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N33/00—Investigating or analysing materials by specific methods not covered by groups G01N1/00 - G01N31/00
- G01N33/26—Oils; Viscous liquids; Paints; Inks
- G01N33/28—Oils, i.e. hydrocarbon liquids
- G01N33/2835—Specific substances contained in the oils or fuels
- G01N33/2858—Metal particles
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N33/00—Investigating or analysing materials by specific methods not covered by groups G01N1/00 - G01N31/00
- G01N33/26—Oils; Viscous liquids; Paints; Inks
- G01N33/28—Oils, i.e. hydrocarbon liquids
- G01N33/2888—Lubricating oil characteristics, e.g. deterioration
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
- H01F41/02—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets
- H01F41/04—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets for manufacturing coils
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F5/00—Coils
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N15/00—Investigating characteristics of particles; Investigating permeability, pore-volume or surface-area of porous materials
- G01N15/10—Investigating individual particles
- G01N2015/1024—Counting particles by non-optical means
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N15/00—Investigating characteristics of particles; Investigating permeability, pore-volume or surface-area of porous materials
- G01N15/10—Investigating individual particles
- G01N2015/1029—Particle size
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Abstract
The embodiment of the application provides a coil chip, a preparation method of the coil chip, a detection chip and a lubricating oil sensor. The coil chip based on the micro electro mechanical system comprises a substrate with a first surface and a second surface which are oppositely arranged, wherein at least two induction areas are arranged on the substrate; the base is provided with a first insulating layer and a second insulating layer on a first surface and a second surface in each induction area respectively, the first insulating layer is provided with at least one layer of induction coil layer on the surface far away from the second insulating layer, and the inner ring position of the induction coil layer is provided with a detection through hole which penetrates through the whole coil chip and is used for lubricating oil to pass through, so that an induction coil structure unit is formed in each induction area. The embodiment of the application provides a coil chip, a preparation method of the coil chip, a detection chip and a lubricating oil sensor, and can improve the detection sensitivity of the lubricating oil sensor.
Description
Technical Field
The application belongs to the technical field of coil chips, and particularly relates to a Micro-Electro-Mechanical System (MEMS) -based coil chip, a detection chip for detecting metal scraps of lubricating oil and a preparation method of the coil chip of a lubricating oil sensor.
Background
In order to reduce wear loss during operation of engines, bearings, gears, etc., it is often necessary to provide a lubricating oil system. Experience has shown that there is a strong correlation between the extent of damage to the wearing parts of the equipment (e.g. engines, rolling bearings, gears, etc.) and the metal filings in the lubricating oil system. Therefore, in order to evaluate the wear of the equipment, a lubricant sensor is often added to the lubricant system to monitor the whole wear process of the equipment.
In the conventional inductive oil sensor, as shown in fig. 1, an excitation coil 101 and an induction coil layer 102 are both disposed on an oil pipeline 103, and a shielding case 104 is disposed outside the excitation coil 101 and the induction coil layer 102. The two exciting coils 101 magnetize the metal scraps, when the metal scraps flow through the induction coil layer 102, the electromagnetic induction generates an eddy current, and finally the magnetic flux changes, thereby realizing the detection of the metal scraps. However, the conventional inductive oil sensor can only detect metal scraps of hundreds of micrometers, and cannot detect metal scraps of 100um or below, i.e., the detection sensitivity is poor.
Therefore, how to improve the detection sensitivity of the oil sensor is a technical problem that needs to be solved urgently by those skilled in the art.
Disclosure of Invention
The embodiment of the application provides a coil chip based on a micro-electro-mechanical system, a detection chip for detecting metal scraps of lubricating oil and a preparation method of the coil chip of a lubricating oil sensor, and the detection sensitivity of the lubricating oil sensor can be improved.
In a first aspect, an embodiment of the present application provides a coil chip based on a micro electro mechanical system, including a substrate having a first surface and a second surface disposed opposite to each other, on which at least two sensing regions are disposed; the base is provided with a first insulating layer and a second insulating layer on a first surface and a second surface in each induction area respectively, the first insulating layer is provided with at least one layer of induction coil layer on the surface far away from the second insulating layer, and the inner ring position of the induction coil layer is provided with a detection through hole which penetrates through the whole coil chip and is used for lubricating oil to pass through, so that an induction coil structure unit is formed in each induction area.
Optionally, at least one third insulating layer is disposed on the surface of the induction coil layer in each induction area, which is far away from the second insulating layer, the at least one induction coil layer and the at least one third insulating layer are sequentially and alternately disposed, and each third insulating layer surrounds the detection through hole and covers the induction coil layer of the corresponding layer.
Optionally, the induction coil layer and the third insulating layer are at least two layers, each layer of the third insulating layer is provided with a connecting hole for exposing the induction coil layer of the corresponding layer, and the tails of adjacent induction coil layers are electrically connected via the connecting holes.
Optionally, a lead coil layer and a fourth insulating layer are sequentially arranged on the surface, away from the second insulating layer, of the third insulating layer located at the topmost layer in each sensing region, a lead hole is formed in the fourth insulating layer, and the lead coil layer is used for leading out the head of the sensing coil layer located at the first layer and the tail of the sensing coil layer located at the topmost layer through the lead holes.
Optionally, the substrate is an intrinsic silicon piece, a quartz piece or a glass piece; or,
the first insulating layer and the second insulating layer are respectively a silicon dioxide layer or a silicon nitride layer or other electrically insulating material layers; or,
the induction coil layer is a titanium induction coil layer, a gold induction coil layer, a platinum induction coil layer, an aluminum induction coil layer or a copper induction coil layer.
Optionally, the thicknesses of the first insulating layer and the second insulating layer are 0.1um to 10um respectively; or,
the thickness of the induction coil layer is 0.01nm-10000 nm.
Optionally, at least two detection through holes are arranged in at least two sensing areas and distributed in an array manner.
In a second aspect, an embodiment of the present application provides a detection chip for detecting metal scraps of lubricating oil, including a substrate and at least two coils of conductive material, where the substrate is provided with at least two detection through holes for the lubricating oil to pass through, the at least two coils and the at least two detection through holes are respectively arranged in a one-to-one correspondence manner, and the coils are arranged on a hole periphery of the detection through holes.
Optionally, the coil fixing device further comprises an insulating connector for fixing the coil on the insulating substrate and/or a protecting piece arranged on the surface of the coil.
In a third aspect, an embodiment of the present application provides a lubricating oil sensor, which includes a lubricating oil conduit and two excitation coils disposed on an outer wall of the lubricating oil conduit, and further includes a coil chip based on a micro electro mechanical system as shown in the first aspect, or a detection chip for detecting lubricating oil metal debris as shown in the second aspect, which is disposed inside the lubricating oil conduit and between the two excitation coils.
Optionally, the oil sensor further comprises an insulating holder for fixing the coil chip or the detection chip on the oil passage.
In a fourth aspect, an embodiment of the present application provides a method for manufacturing a coil chip based on a micro electro mechanical system, including the following steps:
(1) dividing the substrate into at least two induction areas, and respectively carrying out thermal oxidation on a first surface and a second surface which are oppositely arranged of the substrate to sequentially and correspondingly form a first insulating layer and a second insulating layer;
(2) respectively forming at least one induction coil layer on the first insulating layer in each induction area; and a detection through hole which penetrates through the whole coil chip and is used for lubricating oil to pass is formed in the inner ring position of the induction coil layer.
Optionally, in the step (2), at least one layer of the induction coil layer is alternately layered with at least one layer of the third insulating layer which completely covers the first surface, a connection hole exposing the induction coil layer of the corresponding layer is formed on each layer of the third insulating layer along the surrounding direction of the induction coil layer, and then the tails of two adjacent layers of the induction coil layer are electrically connected through the connection hole; and finally, sequentially forming detection through holes at the overlapped part of the second insulating layer, the substrate, the first insulating layer and the third insulating layer from bottom to top.
Optionally, in the step (2), a first connection hole exposing a tail portion of the induction coil layer of the corresponding layer and a second connection hole exposing a head portion of the induction coil layer of the first layer are respectively formed in the third insulating layer of the topmost layer along the surrounding direction of the induction coil layer, then a lead coil layer is formed on the third insulating layer of the topmost layer, the tail portion of the lead coil layer is electrically connected with the tail portion of the induction coil layer of the corresponding layer through the first connection hole, and the head portion of the lead coil layer is electrically connected with the head portion of the induction coil layer of the first layer through the second connection hole; a fourth insulating layer which completely covers the first surface is arranged on the upper layer of the lead coil layer, and then lead holes which expose the lead coil layer are formed on the fourth insulating layer along the surrounding direction of the induction coil layer; and finally, sequentially forming detection through holes at the overlapped parts of the second insulating layer, the substrate, the first insulating layer, the third insulating layer and the fourth insulating layer from bottom to top to obtain the coil chip.
Optionally, forming an induction coil layer by using a stripping or etching process; or,
forming a detection through hole, a connecting hole or a lead hole by adopting a dry etching, wet etching or laser cutting process; or,
and forming a first insulating layer, a second insulating layer, a third insulating layer or a fourth insulating layer by adopting a deposition process.
According to the coil chip based on the micro-electro-mechanical system, the detection chip for detecting the metal scraps of the lubricating oil, the lubricating oil sensor and the preparation method of the coil chip based on the micro-electro-mechanical system, the detection sensitivity of the lubricating oil sensor can be improved. The coil chip based on the micro electro mechanical system is characterized in that at least two induction areas are arranged on a substrate, a first insulating layer and a second insulating layer are correspondingly arranged on a first surface and a second surface in each induction area respectively, at least one induction coil layer is arranged on the surface, far away from the second insulating layer, of the first insulating layer, and a detection through hole, penetrating through the whole coil chip, for lubricating oil to pass through is formed in the inner ring position of each induction coil layer, so that an induction coil structure unit is formed in each induction area. That is to say, this coil chip based on micro-electro-mechanical system includes at least two induction coil constitutional units, and these induction coil constitutional units can divide into a plurality of detection regions with oil pipe cross-section, have greatly improved detection sensitivity, can detect the metal bits powder that the granularity is littleer.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings needed to be used in the embodiments of the present application will be briefly described below, and for those skilled in the art, other drawings can be obtained according to the drawings without creative efforts.
FIG. 1 is a schematic diagram of a conventional inductive oil sensor;
FIG. 2 is a schematic structural diagram of a coil chip based on a micro electro mechanical system according to an embodiment of the present disclosure;
FIG. 3 is a schematic structural diagram of a single induction coil structural unit provided in an embodiment of the present application;
FIG. 4 is a flow chart of a method for manufacturing a coil chip based on a micro electro mechanical system according to an embodiment of the present application;
FIG. 5 is a schematic structural diagram of a substrate provided in an embodiment of the present application;
FIG. 6 is a schematic diagram illustrating a first layer of induction coil layer peeling according to an embodiment of the present application;
FIG. 7 is a schematic diagram of a deposited silicon dioxide layer and an etched connection hole according to an embodiment of the present disclosure;
FIG. 8 is a schematic diagram of a second layer of induction coils peeling according to an embodiment of the present application;
FIG. 9 is a schematic view of a deposited silicon dioxide layer and an etched connection hole provided in an embodiment of the present application;
FIG. 10 is a schematic diagram of a metal stripping of a lead layer according to an embodiment of the present disclosure;
FIG. 11 is a schematic view of a deposited silicon dioxide layer and an etched connection hole provided in an embodiment of the present application;
FIG. 12 is a schematic release diagram of a substrate provided in an embodiment of the present application;
FIG. 13 is a schematic cross-sectional view of a single layer induction coil provided in accordance with an embodiment of the present application;
FIG. 14 is a schematic cross-sectional view of a three-layer induction coil provided in accordance with an embodiment of the present application;
FIG. 15a is a schematic structural diagram of a chip for detecting metal chips of lubricating oil according to an embodiment of the present disclosure;
FIG. 15b is a schematic structural diagram of a coil provided in an embodiment of the present application;
FIG. 16 is a schematic structural diagram of an oil sensor provided in an embodiment of the present application;
101-an excitation coil; 102-an induction coil layer; 103-a lubricating oil pipeline; 104-a shield;
201-a substrate; 202-induction coil structure unit; 203-detecting through holes;
601-a first insulating layer; 602-a second insulating layer; 701 — a third insulating layer of the first layer;
702-a connection hole; 901-a third insulating layer of the second layer; 902-a wire hole;
1001-lead coil layer; 1101-a fourth insulating layer; 1401-a third insulating layer of a third layer;
1501-a coil; 1601-a holder.
Detailed Description
Features and exemplary embodiments of various aspects of the present application will be described in detail below, and in order to make objects, technical solutions and advantages of the present application more apparent, the present application will be further described in detail below with reference to the accompanying drawings and specific embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the present application and are not intended to limit the present application. It will be apparent to one skilled in the art that the present application may be practiced without some of these specific details. The following description of the embodiments is merely intended to provide a better understanding of the present application by illustrating examples thereof.
It is noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising … …" does not exclude the presence of other identical elements in a process, method, article, or apparatus that comprises the element.
As known from the background art, the traditional inductive oil sensor can only detect metal chips with the size of hundreds of micrometers, and can not detect the metal chips with the size of 100um or below, namely, the detection sensitivity is poor.
In order to solve the problems in the prior art, embodiments of the present application provide a coil chip based on a micro electro mechanical system, a detection chip for detecting metal debris of grease, a grease sensor, and a method for manufacturing a coil chip based on a micro electro mechanical system. The following first describes a coil chip based on a micro electro mechanical system provided in an embodiment of the present application.
Fig. 2 and fig. 3 are a schematic structural diagram of a coil chip based on a mems and a schematic structural diagram of a single induction coil structural unit 202 according to an embodiment of the present application.
As shown in fig. 2 and 3, the coil chip based on the mems includes a substrate 201 having a first surface and a second surface disposed opposite to each other, wherein at least two sensing regions are disposed on the substrate 201; the substrate 201 is provided with a first insulating layer 601 and a second insulating layer 602 on a first surface and a second surface of each induction area, respectively, the first insulating layer 601 is provided with at least one induction coil layer 102 on a surface far away from the second insulating layer 602, and a detection through hole 203 for passing lubricating oil penetrating through the whole coil chip is provided at an inner ring position of the induction coil layer 102, so that an induction coil structure unit 202 is formed in each induction area.
The coil chip based on the micro electro mechanical system is characterized in that at least two induction areas are arranged on a substrate 201, a first insulating layer 601 and a second insulating layer 602 are correspondingly arranged on a first surface and a second surface in each induction area respectively, at least one induction coil layer 102 is arranged on the surface, far away from the second insulating layer 602, of the first insulating layer 601, and a detection through hole 203, penetrating through the whole coil chip, for allowing lubricating oil to pass through is formed in the inner ring position of the induction coil layer 102, so that an induction coil structure unit 202 is formed in each induction area. That is to say, the coil chip based on the micro electro mechanical system comprises at least two induction coil structural units 202, and the induction coil structural units 202 can divide the section of the oil pipe into a plurality of detection areas, so that the detection sensitivity is greatly improved, and metal scraps with smaller particle size can be detected.
In one embodiment, the surface of the induction coil layer 102 in each induction area away from the second insulation layer 602 is provided with at least one third insulation layer, the at least one induction coil layer 102 and the at least one third insulation layer are sequentially and alternately arranged, and each third insulation layer is arranged around the detection through hole 203 and covers the corresponding induction coil layer 102. In one embodiment, an adhesive layer is further disposed between each third insulating layer and the induction coil layer 102 covering the corresponding layer, and the thickness of the adhesive layer is 0.01nm to 10000 nm.
In one embodiment, the induction coil layer 102 and the third insulating layer are at least two layers, each layer of the third insulating layer is provided with a connection hole 702 for exposing the induction coil layer 102 of the corresponding layer, and the tail portions of the adjacent induction coil layers 102 are electrically connected via the connection hole 702. In one embodiment, the winding directions of the at least two layers of induction coil layers 102 are the same.
In one embodiment, the third insulating layer at the topmost layer in each sensing region is sequentially provided with a lead coil layer 1001 and a fourth insulating layer 1101 on the surface far away from the second insulating layer 602, the fourth insulating layer 1101 is provided with a lead hole 902, and the lead coil layer 1001 is used for leading out the head portion of the induction coil layer 102 at the first layer and the tail portion of the induction coil layer 102 at the topmost layer through the lead hole 902.
In one embodiment, the substrate 201 is an intrinsic silicon piece, a quartz piece, or a glass piece; alternatively, the first insulating layer 601 and the second insulating layer 602 are a silicon dioxide layer or a silicon nitride layer, respectively; alternatively, the induction coil layer 102 is a titanium induction coil layer, a gold induction coil layer, a platinum induction coil layer, an aluminum induction coil layer, or a copper induction coil layer.
In one embodiment, the first insulating layer 601 and the second insulating layer 602 have a thickness of 0.1um to 10um, respectively; alternatively, the thickness of the induction coil layer 102 is 0.01nm to 10000 nm.
In one embodiment, at least two sensing vias 203 are disposed in at least two sensing regions.
The embodiment of the application further provides a detection chip for detecting metal chips of lubricating oil, which comprises a substrate 201 and at least two coils 1501 made of conductive materials, wherein the substrate 201 is provided with at least two detection through holes 203 for the lubricating oil to pass through, the at least two coils 1501 and the at least two detection through holes 203 are respectively arranged in a one-to-one correspondence manner, and the coils 1501 are arranged on the hole peripheral edges of the detection through holes 203.
This a detect chip for detecting lubricating oil metal bits end is equipped with two at least confession lubricating oil on the base 201 and passes through the detection through-hole 203, and two at least coils 1501 and two at least detection through-holes 203 respectively one-to-one set up, and the coil is located the hole periphery that detects through-hole 203, so this a detect chip for detecting lubricating oil metal bits end can divide into a plurality of detection area with the oil pipe cross-section, has greatly improved detectivity, can detect out the metal bits end that the granularity is littleer.
In one embodiment, the chip for detecting metal debris of oil further comprises an insulating connector for fixing the coil 1501 on the insulating substrate 201 and/or a protective member disposed on the surface of the coil 1501.
The embodiment of the application further provides a lubricating oil sensor, which comprises a lubricating oil pipeline 103, two exciting coils 101 arranged on the outer wall of the lubricating oil pipeline 103, and a coil chip based on a micro-electro-mechanical system as shown in any embodiment of the invention and arranged in the lubricating oil pipeline 103 and located between the two exciting coils 101, or a detection chip for detecting lubricating oil metal debris as shown in any embodiment of the invention.
Since the lubricating oil sensor comprises the coil chip based on the micro-electro-mechanical system or the detection chip for detecting lubricating oil metal chips, the lubricating oil sensor can detect the metal chips with smaller particle size.
In one embodiment, the oil sensor further includes an insulating holder 1601 for securing the coil chip or the detection chip on the oil passage.
As shown in fig. 4, a method for manufacturing a coil chip based on a micro electro mechanical system according to an embodiment of the present application includes the following steps:
s401, dividing the substrate 201 into at least two induction areas, and respectively performing thermal oxidation on a first surface and a second surface of the substrate 201, which are oppositely arranged, to form a first insulating layer 601 and a second insulating layer 602 correspondingly in sequence;
s402, respectively forming at least one induction coil layer 102 on the first insulating layer 601 in each induction area; a detection through hole 203 for passing the lubricant is formed through the entire coil chip at the inner ring position of the induction coil layer 102.
In one embodiment, step S402 may include: at least one layer of third insulating layer completely covering the first surface is alternately arranged on at least one layer of the induction coil layer 102, a connecting hole 702 exposing the induction coil layer 102 of the corresponding layer is formed on each layer of the third insulating layer along the surrounding direction of the induction coil layer 102, and then the tail parts of the induction coil layers 102 of the two adjacent layers are electrically connected through the connecting hole 702; finally, the detection through hole 203 is formed in the overlapping position of the second insulating layer 602, the substrate 201, the first insulating layer 601 and the third insulating layer from bottom to top in sequence.
In one embodiment, step S402 may include: forming a first layer of the induction coil layer 102 on the first insulating layer 601 in each induction area, then forming a third insulating layer 701 on the first layer of the induction coil layer 102 to completely cover the first layer of the first surface, then forming a connection hole 702 exposing the first layer of the induction coil layer 102 on the third insulating layer 701 of the first layer along the surrounding direction of the induction coil layer 102, then forming a second layer of the induction coil layer 102 on the third insulating layer 701 of the first layer to completely cover the first surface, then forming a third insulating layer 901 on the second layer of the induction coil layer 102 to completely cover the second layer of the first surface, then forming a connection hole exposing the second layer of the induction coil layer 102 on the third insulating layer 901 of the second layer along the surrounding direction of the induction coil layer 102, and electrically connecting the tail portions of the induction coil layer 102 of the first layer and the induction coil layer 102 of the second layer through the connection hole 702 provided on the third insulating layer 701 of the first layer, the above layering operation is repeated to obtain at least one layer of the induction coil layer 102 and the third insulation layer in alternating layers.
In one embodiment, step S402 may include: forming a first connection hole 702 exposing a tail portion of the induction coil layer 102 of the corresponding layer and a second connection hole 702 exposing a head portion of the induction coil layer 102 of the first layer on the third insulating layer of the topmost layer along the surrounding direction of the induction coil layer 102, respectively, then forming a lead coil layer 1001 on the third insulating layer of the topmost layer, electrically connecting the tail portion of the lead coil layer 1001 with the tail portion of the induction coil layer 102 of the corresponding layer through the first connection hole 702, and electrically connecting the head portion of the lead coil layer 1001 with the head portion of the induction coil layer 102 of the first layer through the second connection hole 702; then, a fourth insulating layer 1101 completely covering the first surface is formed on the lead coil layer 1001, and then a lead hole 902 exposing the lead coil layer 1001 is formed on the fourth insulating layer 1101 along the surrounding direction of the induction coil layer 102; finally, the detection through hole 203 is formed in the overlapped part of the second insulating layer 602, the substrate 201, the first insulating layer 601, the third insulating layer and the fourth insulating layer 1101 from bottom to top in sequence, and the coil chip is obtained.
In one embodiment, the induction coil layer 102 is formed using a lift-off or etching process; or, a detection through hole 203, a connection hole 702 or a lead hole 902 is formed by adopting a dry etching, wet etching or laser cutting process; alternatively, the first insulating layer 601, the second insulating layer 602, the third insulating layer, or the fourth insulating layer 1101 is formed using a deposition process.
According to the preparation method of the coil chip based on the micro-electro-mechanical system, the MEMS preparation process is used for replacing the traditional coil winding mode, the weight and the volume of the induction coil layer 102 are reduced, and the preparation method is particularly suitable for the fields of aerospace and the like which have strict requirements on the weight and the volume of components.
Since the number of the induction coil layers 102 is at least one, the following description will take two induction coil layers 102 as an example to describe in detail the processing flow of the coil chip based on the mems.
(1) Intrinsic silicon may be selected as a material for forming the substrate 201, and the thickness of the substrate 201 may be 0.5mm, and may be adjusted according to the requirement, which is not limited herein. The substrate 201 can be seen in fig. 5.
(2) The substrate 201 is thermally oxidized on both sides, and a first insulating layer 601 and a second insulating layer 602 are formed on the upper surface and the lower surface of the substrate 201, respectively. The first insulating layer 601 and the second insulating layer 602 may be silicon dioxide layers, and the thickness may be 0.1um to 10 um.
As shown in fig. 6, a first layer of the induction coil layer 102 is formed on the first insulating layer 601 by a peeling method. In one embodiment, an adhesive layer may be further disposed between the first insulating layer 601 and the induction coil layer 102 of the first layer. The material of the induction coil layer 102 can be gold, the material of the adhesive layer can be titanium, and the thickness of the induction coil layer 102 and the adhesive layer can be 0.01nm-10000 nm. Optionally, the thickness of the induction coil layer 102 is 400nm, and the thickness of the adhesive layer is 20 nm.
(3) As shown in fig. 7, after the first layer of the induction coil layer 102 is prepared, the first layer of the third insulating layer 701 is deposited to a certain thickness to electrically isolate the two induction coil layers 102, and then a connection hole 702 for electrically connecting the first layer of the induction coil layer 102 and the second layer of the induction coil layer 102 (i.e., the top induction coil layer in this embodiment) is etched on the first layer of the third insulating layer 701. The third insulating layer 701 of the first layer may be a silicon dioxide layer, and the thickness may be 0.1um to 10 um.
(4) After the etching of the connection hole 702 is completed, the second layer of the induction coil layer 102 is formed by a lift-off method, as can be seen in fig. 8.
(5) As shown in fig. 9, a second layer of third insulating layer 901 is deposited on the second layer of induction coil layer 102 to a certain thickness, and the metal at the head of the first layer of induction coil layer 102 and the metal at the tail of the second layer of induction coil layer 102 are extracted by etching the connection hole 702. The third insulating layer 901 of the second layer may be a silicon dioxide layer, and the thickness may be 0.1um to 10 um.
(6) As shown in fig. 10, the lead wire and the electrode of the top induction coil layer 102 are again produced by peeling, and a lead coil layer 1001 is obtained.
(7) In order to protect the top layer leads, a thickness of a fourth insulating layer 1101 needs to be deposited again on the lead coil layer 1001 as shown in fig. 11. For the subsequent connection of the lead, the fourth insulating layer 1101 on the electrode needs to be etched to form a lead hole 902 to expose the electrode. The leads may be routed to the substrate 201 through the lead holes 902. The fourth insulating layer 1101 may be a silicon dioxide layer and may have a thickness of 0.1um to 10 um.
(8) As shown in fig. 12, the substrate 201, the first insulating layer 601, the second insulating layer 602, the third insulating layer 701 of the first layer, the third insulating layer 901 of the second layer, and the fourth insulating layer 1101 inside the induction coil layer 102 are removed by dry etching to form a channel for lubricating oil.
The structure of the single-layer induction coil layer 102 is similar to that of the single-layer induction coil layer 102, except that after the first-layer induction coil layer 102 is manufactured, the metal at the head of the first-layer induction coil layer 102 and the metal at the tail of the first-layer induction coil layer 102 are led out directly on the third insulating layer 701 of the first layer by etching the connecting hole 702. Then, the lead coil layer 1001 is obtained by peeling. A thickness of the fourth insulating layer 1101 is then again deposited over the lead coil layer 1001. The fourth insulating layer 1101 on the electrode is etched to form a lead hole 902 exposing the electrode. A cross-sectional schematic view of a single layer induction coil layer 102 can be seen in FIG. 13
The three-layer induction coil layer 102 structure is obtained by repeating the superposition of the three induction coil layers 102 and finally connecting the lead wires. A cross-sectional view of a coil chip having three layers of the induction coil layer 102 can be seen in fig. 14, the top layer is a fourth insulation layer 1101, and the first layer of the induction coil layer 102, the second layer of the induction coil layer 102, the third layer of the induction coil layer 103, the first layer of the third insulation layer 701, the second layer of the third insulation layer 901, and the third layer of the third insulation layer 1401 are respectively seen in fig. 14. The fourth insulating layer 1101 may be a silicon dioxide layer and may have a thickness of 0.1um to 10 um.
The following describes a detection chip for detecting metal chips of lubricating oil provided in the embodiments of the present application.
Referring to fig. 15a-b, fig. 16 and fig. 3, the detecting chip includes a substrate 201, at least two coils 1501 of conductive material, an insulating connector for fixing the coils 1501 on the insulating substrate 201, and a protecting member disposed on the surface of the coils 1501, wherein at least two detecting through holes 203 for allowing oil to pass through are disposed on the substrate 201, the at least two coils 1501 and the at least two detecting through holes 203 are disposed in one-to-one correspondence, and the coils 1501 are disposed on the hole peripheries of the detecting through holes 203.
The coil 1501 is made of a conductive material, and in principle, any conventional conductive material can be used for the coil 1501 in the present embodiment as long as an induction signal can be generated; the connecting piece is generally made of an insulating material which does not interfere with the induction signal, and the connecting mode can be bonding, such as insulating glue and the like; the protection member may be made of titanium alloy, etc. to protect the surface structure of the coil 1501 and prevent the damage to the coil 1501 due to the flow of oil. The specific shape and structure of the connector and the protector are not limited, and may be a plate-like structure, for example.
The following describes a method for manufacturing a detection chip for detecting metal chips of lubricating oil provided in the embodiments of the present application.
The detection chip can be manufactured by a photoetching machine, a plurality of detection through holes 203 are formed on a substrate 201, specifically, a plurality of detection through holes 203 which are uniformly distributed at intervals in an array are formed, a plurality of spiral coils 1501 of conductive materials are engraved on the outer portion of each detection through hole 203, for example, conductive wires meeting specification requirements are led to the edge of the chip, and then signal wires are connected to a circuit board, so that each detection through hole 203 is equivalent to an independent induction coil. The chip is respectively pasted with a protection plate in front and at back by adopting an adhesive mode for packaging, so that the chip has good fluid impact resistance and cannot be easily deformed or cracked. After being manufactured, the device is inserted into an oil pipe, and the inner diameter of the oil pipe is divided into a plurality of small detection areas (see figure 16).
Next, a description will be given of the oil sensor provided in the embodiment of the present application.
Referring to fig. 16, the oil sensor, especially a large-diameter oil sensor, includes an oil conduit 103, two exciting coils 101 disposed on an outer wall of the oil conduit 103, the above-mentioned mems-based coil chip or the above-mentioned detection chip for detecting metal debris of oil disposed inside the oil conduit 103 and located between the two exciting coils 101, and an insulating holder 1601 for fixing the coil chip or the detection chip on the oil conduit. The holder 1601 may be selected from existing structures as long as the coil chip or the detection chip can be stably fixed on the lubricant duct 103.
Specifically, when a central oil pipe of the sensor is designed, the oil slide pipe 103 is divided into two parts from the middle position along the radial direction, enameled wires with the same specification and the same number of turns are independently wound on each part, and the enameled wires are respectively connected with an excitation signal source to generate excitation signals. The packaged coil chip or the detection chip is fixed between the two oil pipes, and the two oil pipes 103 are fixed and sealed together in a welding mode.
The two groups of excitation coils 101 on the oil conduit 103 generate a magnetic field inside the oil conduit after passing through the excitation signal, and when the particulate matter passes through the oil conduit, the particulate matter also passes through at least one detection area (i.e., the detection through hole 203) on the coil chip or the detection chip. And a group of coils 1501 or induction coil structure units 202 wound around each detection through hole 203 plays a role in signal induction, and by detecting the electric signals of all the detection through holes 203, as long as the electric signals of one group of coils 1501 or induction coil structure units 202 change, the passing of particulate matter can be judged. And then the size and the number of the particles can be obtained through algorithm analysis.
Therefore, the large-diameter lubricating oil pipeline 103 is divided into a plurality of small-diameter sub-lubricating oil pipelines 103, and the induction signals of the sub-lubricating oil pipelines 103 are detected respectively, so that the detection sensitivity of the sensor can be greatly improved.
In addition, the coil chip or the detection chip is directly arranged in the lubricating oil pipeline 103, and the sensitivity of the lubricating oil quality sensor can be greatly improved due to no metal shielding.
The foregoing is only an embodiment of the present application, and it should be understood that the scope of the present application is not limited thereto, and any person skilled in the art can easily conceive various equivalent modifications or substitutions within the technical scope of the present application, and these modifications or substitutions should be covered by the scope of the present application.
Claims (15)
1. A coil chip based on a micro electro mechanical system is characterized by comprising a substrate with a first surface and a second surface which are oppositely arranged, wherein at least two induction areas are arranged on the substrate; the base is provided with a first insulating layer and a second insulating layer on a first surface and a second surface in each induction area respectively, the first insulating layer is provided with at least one induction coil layer on the surface far away from the second insulating layer, and the inner ring position of the induction coil layer is provided with a detection through hole which penetrates through the whole coil chip and is used for lubricating oil to pass through, so that an induction coil structure unit is formed in each induction area.
2. The mems-based coil chip as claimed in claim 1, wherein the induction coil layer in each induction region is provided with at least one third insulation layer on a surface away from the second insulation layer, the at least one induction coil layer and the at least one third insulation layer are sequentially and alternately disposed, and each third insulation layer is disposed around the sensing via and covers the corresponding induction coil layer.
3. The coil chip based on the mems of claim 2, wherein the induction coil layer and the third insulating layer are at least two layers, each layer of the third insulating layer has a connection hole for exposing the induction coil layer of the corresponding layer, and the tail portions of the adjacent induction coil layers are electrically connected through the connection hole.
4. The coil chip based on the mems of claim 2 or 3, wherein the third insulating layer at the topmost layer in each sensing region is sequentially provided with a lead coil layer and a fourth insulating layer on the surface away from the second insulating layer, the fourth insulating layer is provided with lead holes, and the lead coil layer is used for leading out the head of the induction coil layer at the first layer and the tail of the induction coil layer at the topmost layer through the lead holes.
5. The mems-based coil chip of claim 1, wherein the substrate is an intrinsic silicon piece, a quartz piece, or a glass piece; or,
the first insulating layer and the second insulating layer are respectively a silicon dioxide layer or a silicon nitride layer; or,
the induction coil layer is a titanium induction coil layer, a gold induction coil layer, a platinum induction coil layer, an aluminum induction coil layer or a copper induction coil layer.
6. The mems-based coil chip of claim 1, wherein the first insulating layer and the second insulating layer have a thickness of 0.1um to 10um, respectively; or,
the thickness of the induction coil layer is 0.01nm-10000 nm.
7. The mems-based coil chip of any one of claims 1-3 and 5-6, wherein at least two sensing via arrays are disposed in at least two sensing regions.
8. The detection chip for detecting the metal scraps of the lubricating oil is characterized by comprising a substrate and at least two coils made of conductive materials, wherein at least two detection through holes for the lubricating oil to pass through are formed in the substrate, the at least two coils and the at least two detection through holes are respectively arranged in a one-to-one correspondence manner, and the coils are arranged on the periphery of the detection through holes.
9. The detecting chip for detecting metal chips of lubricating oil according to claim 8, further comprising an insulating connector for fixing the coil on the insulating substrate and/or a protecting member provided on the surface of the coil.
10. A lubricating oil sensor, comprising a lubricating oil pipeline and two exciting coils arranged on the outer wall of the lubricating oil pipeline, characterized by further comprising the coil chip based on the micro-electro-mechanical system in any one of claims 1 to 7 or the detection chip for detecting lubricating oil metal chips in any one of claims 8 to 9, which is arranged in the lubricating oil pipeline and between the two exciting coils.
11. The oil sensor of claim 10, further comprising an insulating holder for fixing the coil chip or the detection chip to the oil passage.
12. A preparation method of a coil chip based on a micro-electro-mechanical system is characterized by comprising the following steps:
(1) dividing the substrate into at least two induction areas, and respectively carrying out thermal oxidation on a first surface and a second surface which are oppositely arranged of the substrate to sequentially and correspondingly form a first insulating layer and a second insulating layer;
(2) respectively forming at least one induction coil layer on the first insulating layer in each induction area; and a detection through hole which penetrates through the whole coil chip and is used for lubricating oil to pass is formed in the inner ring position of the induction coil layer.
13. The method for manufacturing a coil chip based on a micro electro mechanical system according to claim 12, wherein in the step (2), at least one layer of the induction coil layer is alternately layered with at least one layer of the third insulating layer completely covering the first surface, a connection hole exposing the induction coil layer of the corresponding layer is formed on each layer of the third insulating layer along a surrounding direction of the induction coil layer, and then the tail portions of the adjacent two layers of the induction coil layers are electrically connected through the connection hole; and finally, sequentially forming the detection through holes at the overlapped part of the second insulating layer, the substrate, the first insulating layer and the third insulating layer from bottom to top.
14. The method for manufacturing a coil chip based on a micro electro mechanical system according to claim 13, wherein in the step (2), a first connection hole exposing a tail portion of the induction coil layer of the corresponding layer and a second connection hole exposing a head portion of the induction coil layer of the first layer are respectively formed on the third insulating layer of the topmost layer in the surrounding direction of the induction coil layer, and then a lead coil layer is formed on the third insulating layer of the topmost layer, the tail portion of the lead coil layer is electrically connected to the tail portion of the induction coil layer of the corresponding layer through the first connection hole, and the head portion of the lead coil layer is electrically connected to the head portion of the induction coil layer of the first layer through the second connection hole; a fourth insulating layer which completely covers the first surface is arranged on the upper layer of the lead coil layer, and then lead holes which expose the lead coil layer are formed on the fourth insulating layer along the surrounding direction of the induction coil layer; and finally, sequentially forming the detection through holes at the overlapped parts of the second insulating layer, the substrate, the first insulating layer, the third insulating layer and the fourth insulating layer from bottom to top to obtain the coil chip.
15. The method of manufacturing a mems-based coil chip as claimed in claim 14, wherein the induction coil layer is formed by a lift-off or etching process; or,
forming the detection through hole, the connecting hole or the lead hole by adopting a dry etching, wet etching or laser cutting process; or,
and forming the first insulating layer, the second insulating layer, the third insulating layer or the fourth insulating layer by adopting a deposition process.
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| CN202010797239.1A CN111855510A (en) | 2020-08-10 | 2020-08-10 | Coil chip, preparation method thereof, detection chip and lubricating oil sensor |
| PCT/CN2020/109059 WO2022032610A1 (en) | 2020-08-10 | 2020-08-14 | Coil chip and manufacturing method therefor, detection chip, and lubricating oil sensor |
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| CN202010797239.1A CN111855510A (en) | 2020-08-10 | 2020-08-10 | Coil chip, preparation method thereof, detection chip and lubricating oil sensor |
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Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN202119695U (en) * | 2011-03-01 | 2012-01-18 | 北京工业大学 | Micro inductive sensor for detecting metal scraps in oil liquid |
| CN102376693A (en) * | 2010-08-23 | 2012-03-14 | 香港科技大学 | Monolithic magnetic induction device |
| US20120212919A1 (en) * | 2011-02-18 | 2012-08-23 | Ibiden Co., Ltd. | Inductor component and printed wiring board incorporating inductor component and method for manufacturing inductor component |
| CN102721738A (en) * | 2012-06-12 | 2012-10-10 | 大连理工大学 | Miniature eddy current sensor with structure consisting of silicon substrate and multilayer coils |
| CN103674787A (en) * | 2013-11-27 | 2014-03-26 | 上海交通大学 | Miniaturized integration induction type on-line monitoring sensor for slide oil grains |
| CN206194738U (en) * | 2016-11-23 | 2017-05-24 | 无锡吉迈微电子有限公司 | Integrated inductor structure |
| CN106768116A (en) * | 2017-01-23 | 2017-05-31 | 卓度计量技术（深圳）有限公司 | Micro electronmechanical mass flow sensor component and preparation method thereof |
| CN212674712U (en) * | 2020-08-10 | 2021-03-09 | 西人马联合测控（泉州）科技有限公司 | Coil chip, detection chip and lubricating oil sensor based on micro-electro-mechanical system |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101253404A (en) * | 2004-04-13 | 2008-08-27 | 哈佛大学 | Manipulation and/or detection of biological samples and other objects |
| US8522604B2 (en) * | 2008-10-31 | 2013-09-03 | The University Of Akron | Metal wear detection apparatus and method employing microfluidic electronic device |
| CN102147230A (en) * | 2011-03-01 | 2011-08-10 | 北京工业大学 | Micro-inductance sensor used for detecting metal fragments in oil liquid |
| WO2017141566A1 (en) * | 2016-02-18 | 2017-08-24 | 富士電機株式会社 | Signal transmission device |
| CN111474218B (en) * | 2020-04-23 | 2022-07-01 | 北京信息科技大学 | Integrated micro-fluidic electrochemical sensor chip for BOD rapid detection, preparation method thereof and BOD detection method |
-
2020
- 2020-08-10 CN CN202010797239.1A patent/CN111855510A/en active Pending
- 2020-08-14 WO PCT/CN2020/109059 patent/WO2022032610A1/en active Application Filing
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102376693A (en) * | 2010-08-23 | 2012-03-14 | 香港科技大学 | Monolithic magnetic induction device |
| US20120212919A1 (en) * | 2011-02-18 | 2012-08-23 | Ibiden Co., Ltd. | Inductor component and printed wiring board incorporating inductor component and method for manufacturing inductor component |
| CN202119695U (en) * | 2011-03-01 | 2012-01-18 | 北京工业大学 | Micro inductive sensor for detecting metal scraps in oil liquid |
| CN102721738A (en) * | 2012-06-12 | 2012-10-10 | 大连理工大学 | Miniature eddy current sensor with structure consisting of silicon substrate and multilayer coils |
| CN103674787A (en) * | 2013-11-27 | 2014-03-26 | 上海交通大学 | Miniaturized integration induction type on-line monitoring sensor for slide oil grains |
| CN206194738U (en) * | 2016-11-23 | 2017-05-24 | 无锡吉迈微电子有限公司 | Integrated inductor structure |
| CN106768116A (en) * | 2017-01-23 | 2017-05-31 | 卓度计量技术（深圳）有限公司 | Micro electronmechanical mass flow sensor component and preparation method thereof |
| CN212674712U (en) * | 2020-08-10 | 2021-03-09 | 西人马联合测控（泉州）科技有限公司 | Coil chip, detection chip and lubricating oil sensor based on micro-electro-mechanical system |
Non-Patent Citations (2)
| Title |
|---|
| NIE YONGZHONG 等: "Temperature characteristics of a Bi4Ti3O12-LiNbO3compound piezoelectric ceramic sensor", JOURNAL OF XIAMEN UNIVERSITY (NATURAL SCIENCE), vol. 55, no. 03, 18 May 2016 (2016-05-18), pages 441 - 444 * |
| 任艺军: "高灵敏金属磨粒感应式探测器研究", 中国博士学位论文全文数据库 工程科技Ⅰ辑, no. 08, 15 August 2019 (2019-08-15), pages 1 - 117 * |
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|---|---|
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