CN111855029B - Flexible pressure sensor, preparation method thereof and electronic device - Google Patents
Flexible pressure sensor, preparation method thereof and electronic device Download PDFInfo
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- CN111855029B CN111855029B CN202010723154.9A CN202010723154A CN111855029B CN 111855029 B CN111855029 B CN 111855029B CN 202010723154 A CN202010723154 A CN 202010723154A CN 111855029 B CN111855029 B CN 111855029B
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L1/00—Measuring force or stress, in general
- G01L1/14—Measuring force or stress, in general by measuring variations in capacitance or inductance of electrical elements, e.g. by measuring variations of frequency of electrical oscillators
- G01L1/142—Measuring force or stress, in general by measuring variations in capacitance or inductance of electrical elements, e.g. by measuring variations of frequency of electrical oscillators using capacitors
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L1/00—Measuring force or stress, in general
- G01L1/20—Measuring force or stress, in general by measuring variations in ohmic resistance of solid materials or of electrically-conductive fluids; by making use of electrokinetic cells, i.e. liquid-containing cells wherein an electrical potential is produced or varied upon the application of stress
- G01L1/22—Measuring force or stress, in general by measuring variations in ohmic resistance of solid materials or of electrically-conductive fluids; by making use of electrokinetic cells, i.e. liquid-containing cells wherein an electrical potential is produced or varied upon the application of stress using resistance strain gauges
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L9/00—Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means
- G01L9/02—Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means by making use of variations in ohmic resistance, e.g. of potentiometers, electric circuits therefor, e.g. bridges, amplifiers or signal conditioning
- G01L9/04—Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means by making use of variations in ohmic resistance, e.g. of potentiometers, electric circuits therefor, e.g. bridges, amplifiers or signal conditioning of resistance-strain gauges
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L9/00—Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means
- G01L9/12—Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means by making use of variations in capacitance, i.e. electric circuits therefor
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- Measuring Fluid Pressure (AREA)
Abstract
The invention provides a flexible pressure sensor, a preparation method thereof and an electronic device. The flexible pressure sensor comprises a first electrode and a second electrode which are oppositely arranged, a first dielectric layer and a second dielectric layer are arranged between the first electrode and the second electrode, the second dielectric layer is positioned between the first dielectric layer and the second electrode, and the elastic modulus of the first dielectric layer is different from that of the second dielectric layer; at least one of the first dielectric layer and the second dielectric layer has a hollow structure inside. The flexible pressure sensor has the advantages of high sensitivity and wide range. The flexible pressure sensor can be used for preparing the hollow structure in the dielectric layer through a template, and the preparation method is simple.
Description
Technical Field
The invention relates to the technical field of sensors, in particular to a flexible pressure sensor, a preparation method of the flexible pressure sensor and an electronic device.
Background
The flexible pressure sensor replaces the traditional sensing technology with the flexible sensing technology, brings revolutionary changes to multiple aspects of social life, and is expected to be widely applied to the fields of robots, medical diagnosis, wearable electronic equipment, even artificial organs, human-computer interaction, intelligent skin and the like.
However, limited by the compressive properties of the flexible material, the prior art flexible pressure sensors still suffer from the disadvantage of being sensitive at low pressures, becoming insensitive or even completely unresponsive at higher pressures.
It is to be noted that the information invented in the above background section is only for enhancing the understanding of the background of the present invention, and therefore, may include information that does not constitute prior art known to those of ordinary skill in the art.
Disclosure of Invention
The invention aims to provide a flexible pressure sensor, a preparation method thereof and an electronic device, and solves one or more problems in the prior art.
According to an aspect of the present invention, there is provided a flexible pressure sensor comprising:
a first electrode;
a second electrode disposed opposite to the first electrode;
a first dielectric layer disposed between the first electrode and the second electrode,
the second dielectric layer is arranged between the first electrode and the second electrode and positioned between the first dielectric layer and the second electrode, and the elastic modulus of the first dielectric layer is different from that of the second dielectric layer;
at least one of the first dielectric layer and the second dielectric layer has a hollow structure inside.
In an exemplary embodiment of the invention, an elastic modulus of the first dielectric layer is greater than an elastic modulus of the second dielectric layer, and the hollow structure is located inside the first dielectric layer.
In an exemplary embodiment of the present invention, an elastic modulus of the first dielectric layer is greater than an elastic modulus of the second dielectric layer, the hollow structures are respectively located inside the first dielectric layer and the second dielectric layer, and a total volume of the hollow structures in the first dielectric layer is greater than a total volume of the hollow structures in the second dielectric layer.
In an exemplary embodiment of the invention, the hollow structure comprises a plurality of hollow units, and the hollow units are irregular in shape.
In one exemplary embodiment of the present invention, conductive particles are distributed inside at least one of the first dielectric layer and the second dielectric layer.
According to another aspect of the present invention, there is provided a method of manufacturing a flexible pressure sensor, comprising:
providing a first substrate, and forming a plurality of particles on the first substrate to form a first hollow template;
forming a first dielectric layer on the first hollow template, and forming a first electrode on one side of the first dielectric layer, which is far away from the hollow template;
stripping the first hollowed-out template to obtain a first flexible layer;
forming a second dielectric layer on one side of the first dielectric layer, which is far away from the first electrode, wherein the elastic modulus of the first dielectric layer is different from that of the second dielectric layer; and forming a second electrode on one side of the second dielectric layer, which is far away from the first dielectric layer.
In one exemplary embodiment of the present invention, forming the second dielectric layer and the second electrode includes:
providing a second substrate, and forming a plurality of particles on the second substrate to form a second hollow template;
forming a second dielectric layer on the second hollow template;
forming a second electrode on one side of the second dielectric layer, which is far away from the second hollow template;
stripping the second hollow template to obtain a second flexible layer with a hollow structure;
and oppositely bonding the first flexible layer and the second flexible layer, so that the first dielectric layer and the second dielectric layer are positioned between the first electrode and the second electrode.
In an exemplary embodiment of the invention, the material of the substrate is an organic material, a metal, or an inorganic non-metal material, and the material of the particles is a metal oxide material.
In an exemplary embodiment of the invention, forming the first stencil or the second stencil comprises:
the particles are formed on the substrate by a deposition method, a sputtering method, or an evaporation method.
According to a further aspect of the present invention, there is provided an electronic device comprising the flexible pressure sensor described above.
The flexible pressure sensor is provided with a first dielectric layer and a second dielectric layer, wherein the elastic modulus of the first dielectric layer is different from that of the second dielectric layer; at least one of the first dielectric layer and the second dielectric layer has a hollow structure inside. The dielectric layer with lower elastic modulus can respond to smaller force first, and when the pressure is increased, the dielectric layer with higher elastic modulus responds to larger force, so that the sensor can have higher sensitivity under smaller or larger pressure, and the measuring range is increased. Meanwhile, the hollow structure arranged in the dielectric layer ensures that the dielectric layer can be further compressed, so that the deformation space of the dielectric layer and the contact area of the dielectric layer material are increased, a higher mechanical resolution range and response sensitivity can be further provided, and the advantages of high sensitivity and wide range can be taken into account by the flexible pressure sensor.
It is to be understood that both the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the invention, as claimed.
Drawings
The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the invention and together with the description, serve to explain the principles of the invention. It is obvious that the drawings in the following description are only some embodiments of the invention, and that for a person skilled in the art, other drawings can be derived from them without inventive effort.
FIG. 1 is a schematic structural diagram of a flexible pressure sensor according to an embodiment of the present disclosure;
FIG. 2 is a schematic structural diagram of another flexible pressure sensor in accordance with an embodiment of the present application;
FIG. 3 is a flow chart of a method of a flexible pressure sensor according to an embodiment of the present application;
fig. 4 is a schematic structural diagram of a hollow template according to an embodiment of the present application;
fig. 5-8 are schematic diagrams of steps for manufacturing a flexible pressure sensor by using a hollow template.
In the figure: 10. a first electrode; 20. a first dielectric layer; 30. a second dielectric layer; 40. a second electrode; 50. a hollow unit; 60. a substrate; 70. and (3) granules.
Detailed Description
Example embodiments will now be described more fully with reference to the accompanying drawings. Example embodiments may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein; rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the concept of example embodiments to those skilled in the art. The same reference numerals in the drawings denote the same or similar structures, and thus a detailed description thereof will be omitted.
In the embodiment of the present invention, there is provided a flexible pressure sensor, as shown in fig. 1, the flexible pressure sensor includes a first electrode 10 and a second electrode 40 which are oppositely arranged, a first dielectric layer 20 and a second dielectric layer 30 are arranged between the first electrode 10 and the second electrode 40, the second dielectric layer 30 is arranged between the first dielectric layer 20 and the second electrode 40, and the elastic modulus of the first dielectric layer 20 is different from that of the second dielectric layer 30; at least one of the first dielectric layer 20 and the second dielectric layer 30 has a hollow structure inside.
When the direction of the applied pressure is from the dielectric layer with lower elastic modulus to the dielectric layer with higher elastic modulus, the dielectric layer with lower elastic modulus can respond to smaller force first, so that when smaller pressure is applied, the stressed position with lower elastic modulus deforms, and the method is suitable for detecting smaller acting force. When the pressure is higher, the dielectric layer with higher elastic modulus can respond to larger force, so that when larger pressure is applied, the stressed position with high elastic modulus deforms, and the detection device is suitable for detecting larger acting force. Thereby allowing for higher sensitivity at both lower and higher pressures. The hollow structure arranged in the dielectric layer ensures that the dielectric layer can be further compressed, thereby increasing the deformation space of the dielectric layer and the contact area of the dielectric layer material, further providing higher mechanical resolution range and response sensitivity, and ensuring that the flexible pressure sensor can take the advantages of high sensitivity and wide range into consideration.
The flexible pressure sensor according to the embodiment of the present invention will be described in detail below:
as shown in fig. 1, in an exemplary embodiment, there are a first electrode 10, a first dielectric layer 20, a second dielectric layer 30, and a second electrode 40 in sequence from bottom to top. The elastic modulus of the first dielectric layer 20 is greater than that of the second dielectric layer 30, and the hollow structure is only located inside the first dielectric layer 20. The first dielectric layer 20 has a large elastic modulus and is suitable for sensing a large pressure, and the second dielectric layer 30 has a small elastic modulus and is suitable for sensing a small pressure. Therefore, the second dielectric layer 30 is arranged close to the stress surface, when the direction of the applied pressure is from the second dielectric layer 30 to the first dielectric layer 20, and when a small pressure is applied, the stress position of the second dielectric layer 30 is deformed, so that the pressure sensing under low pressure can be realized; when the pressure gradually increases, the stressed position of the first dielectric layer 20 also begins to deform, and pressure sensing under high pressure can be realized. Since the second dielectric layer 30 with a higher elastic modulus has a relatively better deformation capability and has a relatively ideal response sensitivity at a low pressure, the embodiment only sets the hollow structure in the first dielectric layer 20, that is, only sets the hollow structure in the dielectric layer with low elasticity, so as to improve the response sensitivity of the dielectric layer with low elasticity, thereby achieving the purpose of increasing the mechanical resolution range and simplifying the preparation process.
As shown in fig. 2, in another exemplary embodiment, the first electrode 10, the first dielectric layer 20, the second dielectric layer 30 and the second electrode 40 are arranged in sequence from bottom to top. The elastic modulus of the first dielectric layer 20 is greater than the elastic modulus of the second dielectric layer 30, and the hollow structure exists inside the first dielectric layer 20 and inside the second dielectric layer 30. In the present embodiment, the first dielectric layer 20 and the second dielectric layer 30 are both provided with hollow structures, so that the response sensitivity of the two film layers can be improved at the same time. Since the deformation capability of the second dielectric layer 30 is stronger than that of the first dielectric layer 20, the total volume of the hollow structures in the first dielectric layer 20 is larger than that of the hollow structures in the second dielectric layer 30, that is, the degree of improvement of the deformation of the first dielectric layer 20 is higher than that of the second dielectric layer 30, so that the response sensitivity of the low-elasticity dielectric layer can be further improved, and the mechanical resolution range can be enlarged.
In the embodiment of the present application, the material of the first dielectric layer 20 may be selected from PDMS (polydimethylsiloxane), PP (polypropylene), PE (polyethylene), etc., and the material of the second dielectric layer 30 may be selected from TPU (thermoplastic polyurethane elastomer rubber), PEDOT (polyethylene dioxythiophene), PC (polycarbonate), PVC (polycarbonate), PET (polyethylene terephthalate), PS (polystyrene), etc. The material of the first electrode 10 and the second electrode 40 may be silver, gold, platinum, copper, aluminum, or other metal materials. The thicknesses of the first dielectric layer 20 and the second dielectric layer may be set according to measurement requirements, and the present application is not particularly limited.
20-100nm, and the thickness of the first electrode layer 21 and the second electrode layer 22 is 20-100nm.
In order to improve the sensitivity of the cutout structure to pressure, in the embodiment shown in the figure, the cutout structure includes a plurality of cutout units 50. It should be noted that, in the embodiment of the present application, each of the cutout units 50 has an irregular shape, such as the shape shown in the drawing, and the irregular shape of the cutout units 50 can sense more pressure changes than a regular shape, and has higher sensitivity. The shape of the hollow units 50 may be other than that shown in the drawings, such as irregular hexahedron, octahedron, dodecahedron or the like, and the shapes of the hollow units may be the same or different. The maximum diameter of each hollow unit 50 may be between 1-1000 μm. In addition, the distribution of all the cutout units 50 may be uniform or non-uniform. In the present application, the hollow units 50 may be independent of each other without contact, or may contact each other to form a larger hollow area. Meanwhile, the hollow unit 50 may be disposed at an edge or a surface of the dielectric layer as shown in the figure, that is, communicated with the outside, or may be disposed only inside the dielectric layer, which is not communicated with the outside.
In the above embodiment, the first dielectric layer 20 and the second dielectric layer 30 are both made of insulating materials, and the sensor is a capacitive pressure sensor because only the film thickness changes when pressure is applied. In other embodiments, the first dielectric layer 20 or the second dielectric layer 30 may also have conductive particles distributed therein. In one embodiment, the conductive particles are uniformly distributed in the two dielectric layers, so that when pressure is applied, the conductive particles contact with each other to form a conductive path, and as the pressure is increased, the number of the contacted conductive particles is increased, the conductivity is increased, and thus the resistive pressure sensor is formed. In another embodiment, conductive particles are distributed in only one of the dielectric layers, such as the second dielectric layer 30, so that when the pressure is lower, only the thickness of the second dielectric layer 30 changes, and when the pressure is higher, the first dielectric layer 20 deforms, and the conductive particles therein gradually gather to contact and generate a conductive effect, so that the structure forms a capacitance-resistance type pressure sensor combining capacitance and resistance. Of course, the capacitance-resistance type pressure sensor can have other forms, for example, the first dielectric layer 20 can have a plurality of conductive particles distributed on the side thereof adjacent to the second dielectric layer 30. The material of the conductive particles may be a nano-metal material such as silver, gold, platinum, copper, aluminum, or the like. The addition amount can be set according to requirements.
It should be noted that, due to the limitation of the manufacturing method, the conductive particles are distributed in the dielectric layer without the hollow structure. The preparation method is explained below.
The embodiment of the present application further provides a method for manufacturing a flexible pressure sensor, and referring to fig. 3 to 8, the method for manufacturing includes:
step S100, providing a first substrate 60, forming a plurality of particles 70 on the first substrate 60, and forming a first hollow template, as shown in fig. 4;
step S200, forming a first dielectric layer 20 on the first hollow template, as shown in fig. 5, and forming a first electrode 10 on a side of the first dielectric layer 20 away from the hollow template, as shown in fig. 6;
step S300, stripping the first hollow template to obtain a first flexible layer, as shown in FIG. 7;
step S400, forming a second dielectric layer 30 on one side of the first dielectric layer 20, which is far away from the first electrode 10, wherein the elastic modulus of the first dielectric layer 20 is different from that of the second dielectric layer 30; a second electrode 40 is formed on the side of the second dielectric layer 30 facing away from the first dielectric layer 20.
One of the key points of the preparation of the pressure sensor lies in the preparation of the hollow-out structure, namely, the hollow-out structure is prepared through the hollow-out template, and the hollow-out template is removed after the hollow-out template forms the hollow-out structure. Therefore, the preparation of the hollow template in step S100 is the most important step in the process. In the embodiment of the present application, the substrate 60 of the stencil is made of an organic material, a metal material, or an inorganic non-metal material, and the particles 70 are made of a metal oxide material, such as silicon dioxide, aluminum oxide, titanium dioxide, or the like. When the first hollow template is manufactured in step S100, a plurality of particles 70 may be formed on the substrate 60 by a deposition method, a sputtering method or an evaporation method, and the plurality of particles 70 may be arranged in a single layer or multiple layers. The particles 70 and the substrate 60, which are prepared by the above-described process and material, are firmly bonded while being able to be directly torn off from the dielectric layer.
When the pressure sensor with the structure shown in fig. 1 is manufactured, the first hollow template can be manufactured in the above manner, then the first dielectric layer 20 and the first electrode 10 are sequentially formed on the first hollow template, the first hollow template is peeled off, particulate matter on the first hollow template can form a hollow structure on the first dielectric layer 20, the whole manufactured structure is used as a first flexible layer, and the size of the hollow unit 50 is the same as that of the particles 70. A second dielectric layer 30 and a second electrode 40 are then formed in the first flexible layer on the side of the first dielectric layer 20 directly facing away from the first electrode 10.
The dielectric layer can be formed by spin coating, evaporation, ink jet printing, etc., and in one method, for example, a dielectric layer solution is poured on the surface of the hollow template and then scraped by a doctor blade, and the dielectric layer is cured and molded by heating or ultraviolet curing. The electrode layer may be formed by spin coating, sputtering, or the like.
When the pressure sensor with the structure shown in fig. 2 is manufactured, the second flexible layer can be manufactured by the same method as the method for manufacturing the first flexible layer, and then the two layers are oppositely combined and fixed together. That is, the preparation method can be specifically carried out according to the following steps:
step S100, providing a first substrate 60, forming a plurality of particles 70 on the first substrate 60, and forming a first hollow template, as shown in fig. 4;
step S200, forming a first dielectric layer 20 on the first hollow template, as shown in fig. 5, and forming a first electrode 10 on a side of the first dielectric layer 20 away from the hollow template, as shown in fig. 6;
step S300, stripping the first hollow template to obtain a first flexible layer, as shown in FIG. 7;
step S410, providing a second substrate 60, forming a plurality of particles 70 on the second substrate 60, and forming a second hollow template;
step S420, forming a second dielectric layer 30 on the second hollow template, and forming a second electrode 40 on one side of the second dielectric layer 30 departing from the second hollow template;
step S430, stripping the second hollow template to obtain a second flexible layer with a hollow structure;
step S440, oppositely bonding the first flexible layer and the second flexible layer, so that the first dielectric layer 20 and the second dielectric layer 30 are both located between the first electrode 10 and the second electrode 40, as shown in fig. 8. There is also an adhesion layer between the first dielectric layer 20 and the second dielectric layer 30. Of course, in other embodiments, the two may be combined by other means such as electrostatic adsorption.
The formation methods of the dielectric layer and the electrode layer are the same as those of the previous embodiment, and are not described herein again.
The preparation method of the pressure sensor is simple and easy to implement, and the pressure sensor with an ideal shape can be prepared, so that the obtained pressure sensor has a wider sensing range and higher sensitivity.
The embodiment of the invention also provides an electronic device which comprises the flexible pressure sensor. Due to the fact that the flexible pressure sensor is arranged, the electronic device has corresponding technical effects.
The application of the present invention to the electronic device is not particularly limited, and the electronic device may be any product or component requiring the use of a flexible pressure sensor, such as a display device, a robot, a medical diagnostic apparatus, a wearable electronic apparatus, a human-computer interaction apparatus, and the like.
Although relative terms, such as "upper" and "lower," may be used in this specification to describe one element of an icon relative to another, these terms are used in this specification for convenience only, e.g., in accordance with the orientation of the examples described in the figures. It will be understood that if the illustrated device is turned upside down, elements described as "upper" will be those that are "lower". When a structure is "on" another structure, it may mean that the structure is integrally formed with the other structure, or that the structure is "directly" disposed on the other structure, or that the structure is "indirectly" disposed on the other structure via another structure.
The terms "a", "an", "the", "said" and "at least one" are used to indicate the presence of one or more elements/components/parts/etc.; the terms "comprising" and "having" are intended to be inclusive and mean that there may be additional elements/components/etc. other than the listed elements/components/etc.
Other embodiments of the invention will be apparent to those skilled in the art from consideration of the specification and practice of the invention disclosed herein. This application is intended to cover any variations, uses, or adaptations of the invention following, in general, the principles of the invention and including such departures from the present disclosure as come within known or customary practice within the art to which the invention pertains. It is intended that the specification and examples be considered as exemplary only, with a true scope and spirit of the invention being indicated by the following claims.
Claims (7)
1. A flexible pressure sensor, comprising:
a first electrode;
a second electrode disposed opposite to the first electrode;
a first dielectric layer disposed between the first electrode and the second electrode,
the second dielectric layer is arranged between the first electrode and the second electrode and positioned between the first dielectric layer and the second electrode, the elastic modulus of the first dielectric layer is different from that of the second dielectric layer, and the elastic modulus of the first dielectric layer is larger than that of the second dielectric layer;
the first dielectric layer and the second dielectric layer are at least one of internally provided with a hollow structure, the hollow structure is positioned in the first dielectric layer, or the hollow structures are respectively positioned in the first dielectric layer and the second dielectric layer, and the total volume of the hollow structures in the first dielectric layer is greater than that of the hollow structures in the second dielectric layer.
2. The flexible pressure sensor of claim 1, wherein the hollowed-out structure comprises a plurality of hollowed-out units, and the hollowed-out units are irregular in shape.
3. The flexible pressure sensor of claim 1, wherein at least one of the first dielectric layer and the second dielectric layer has conductive particles distributed therein.
4. A method of making a flexible pressure sensor according to claim 1, comprising:
providing a first substrate, and forming a plurality of particles on the first substrate to form a first hollow template;
forming a first dielectric layer on the first hollow template, and forming a first electrode on one side of the first dielectric layer, which is far away from the hollow template;
stripping the first hollowed-out template to obtain a first flexible layer;
forming a second dielectric layer on the side of the first dielectric layer facing away from the first electrode, wherein the first dielectric layer and the second dielectric layer have different elastic moduli; forming a second electrode on a side of the second dielectric layer facing away from the first dielectric layer;
forming the second dielectric layer and the second electrode comprises:
providing a second substrate, and forming a plurality of particles on the second substrate to form a second hollow template;
forming a second dielectric layer on the second hollow template;
forming a second electrode on one side of the second dielectric layer, which is far away from the second hollow template;
stripping the second hollowed-out template to obtain a second flexible layer with a hollowed-out structure;
and oppositely bonding the first flexible layer and the second flexible layer, so that the first dielectric layer and the second dielectric layer are positioned between the first electrode and the second electrode.
5. The method as claimed in claim 4, wherein the substrate is made of organic, metallic or inorganic non-metallic material, and the particles are made of metal oxide material.
6. The method of claim 5, wherein forming the first stencil or the second stencil comprises:
the particles are formed on the substrate by a deposition method, a sputtering method, or an evaporation method.
7. An electronic device, characterized in that it comprises a flexible pressure sensor according to any one of claims 1-3.
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