CN111854623B - Rapid detection method and detection system for micro deformation of object - Google Patents
Rapid detection method and detection system for micro deformation of object Download PDFInfo
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- CN111854623B CN111854623B CN202010746133.9A CN202010746133A CN111854623B CN 111854623 B CN111854623 B CN 111854623B CN 202010746133 A CN202010746133 A CN 202010746133A CN 111854623 B CN111854623 B CN 111854623B
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- 238000001514 detection method Methods 0.000 title claims abstract description 20
- 239000013598 vector Substances 0.000 claims abstract description 28
- 239000004065 semiconductor Substances 0.000 claims abstract description 20
- 238000005259 measurement Methods 0.000 claims abstract description 19
- 238000000034 method Methods 0.000 claims abstract description 18
- 239000011248 coating agent Substances 0.000 claims abstract description 4
- 238000000576 coating method Methods 0.000 claims abstract description 4
- 239000011159 matrix material Substances 0.000 claims abstract description 4
- 230000003287 optical effect Effects 0.000 claims abstract description 4
- 239000000126 substance Substances 0.000 claims description 3
- 238000006073 displacement reaction Methods 0.000 abstract description 4
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000009776 industrial production Methods 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
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- 238000012544 monitoring process Methods 0.000 description 1
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B11/00—Measuring arrangements characterised by the use of optical techniques
- G01B11/16—Measuring arrangements characterised by the use of optical techniques for measuring the deformation in a solid, e.g. optical strain gauge
- G01B11/167—Measuring arrangements characterised by the use of optical techniques for measuring the deformation in a solid, e.g. optical strain gauge by projecting a pattern on the object
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/17—Systems in which incident light is modified in accordance with the properties of the material investigated
- G01N21/25—Colour; Spectral properties, i.e. comparison of effect of material on the light at two or more different wavelengths or wavelength bands
- G01N21/27—Colour; Spectral properties, i.e. comparison of effect of material on the light at two or more different wavelengths or wavelength bands using photo-electric detection ; circuits for computing concentration
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
- G06T7/00—Image analysis
- G06T7/80—Analysis of captured images to determine intrinsic or extrinsic camera parameters, i.e. camera calibration
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Abstract
The invention discloses a method for rapidly detecting micro deformation of an object, which comprises the following steps: forming a semiconductor matrix by N semiconductor lasers; coating black and white grids with uniform size on the surface of the monitored object, and taking grid intersection points as observation points; illuminating the laser array to enable the light spot to be projected at the central position of the observation point; when the monitored object does not work, randomly lighting the laser array, collecting n times of measurement results of reflected light signals of n observation points, and recording the measurement results as calibration vectors; after the monitored object works, the laser array is lightened in the lightening mode in the step S4, and n times of measurement results of optical signals reflected by n observation points are collected and recorded as detection vectors; and calculating the two norms of the difference between the calibration vector and the detection vector, comparing the two norms with a set threshold value, and judging whether the measured object deforms. The method can accurately and efficiently judge the slight displacement of the object, simultaneously cannot damage and influence the measured object, and has high detection efficiency and precision.
Description
Technical Field
The invention belongs to the technical field of deformation detection, and particularly relates to a method and a system for rapidly detecting micro deformation of an object.
Background
In the industrial production process and the like, a plurality of parts are usually assembled on equipment such as a machining bed and the like, and in some special environments, due to rapid temperature change, some parts can generate tiny deformation, or the like of a punching machine tool and the like generate tiny deformation due to the action of external force, so that accident potential is caused, and corresponding real-time monitoring is needed.
Disclosure of Invention
The technical problem to be solved by the present invention is to provide a method and a system for rapidly detecting micro deformation of an object, aiming at the defects of the prior art.
In order to achieve the technical purpose, the technical scheme adopted by the invention is as follows:
a method for rapidly detecting micro deformation of an object, wherein: the method comprises the following steps:
step S1: forming a semiconductor matrix by N semiconductor lasers;
step S2: coating black and white grids with uniform size on the smooth surface of a measured object, wherein the black and white grids are distributed in a crossed manner, and the grid crossing points are used as observation points;
step S3: lightening semiconductor lasers in the laser array, projecting light spots of each laser onto an observation point, and calibrating to enable the light spots to be projected at the center position of the observation point;
step S4: when the measured object is not displaced, randomly lightening the semiconductor lasers in the laser array, and detecting n times of measurement results of reflected light signals of n observation points by using a photoelectric detector, and recording the measurement results as calibration vectors;
step S4: after the object to be measured works, detecting n times of measurement results of optical signals reflected by n observation points by a photoelectric detector in a lighting mode in step S4, and recording the measurement results as detection vectors;
step S5: and calculating the two norms of the difference between the calibration vector and the detection vector, comparing the two norms with a set threshold value, and judging whether the measured object deforms.
In order to optimize the technical scheme, the specific measures adopted further comprise:
further, each observation point corresponds to one semiconductor laser in step S2.
Further, the calibration vector Y is:
Y(I1,I2,…In)
wherein, cniIs a random coefficient having a value of 0 or 1, the index n representing the nth measurement, InRepresenting the intensity value of the nth measurement, i representing the ith observation point, PiRepresenting the brightness of the ith observation point when the laser is irradiated.
Further, a vector Y is detectedtComprises the following steps:
wherein the content of the first and second substances,the light intensity value measured for the nth time after the measured object works is represented,representing the brightness of the ith observation point irradiated by the laser after the measured object works.
Further, the two-norm of the difference between the calibration vector and the detection vector is | | | Y-Yt||2And when the value of the two norms is smaller than the set threshold value, the measured object is judged not to deform.
The utility model provides a quick detecting system of equipment displacement, includes laser array, light detector, controller, the controller respectively with laser array, light detector electric connection, scribble intercrossing's black and white net on the smooth surface of testee, light detector is located the route that black and white net reverberation thought, what each semiconductor laser of laser array jetted out falls on the crosspoint that corresponds black and white net, the controller control laser array lights and light detector gathers the light signal of reflection.
The invention has the beneficial effects that:
the method and the system for rapidly detecting the micro deformation of the object can accurately and efficiently judge the micro deformation of the object, cannot damage and influence the object to be detected, and have high detection efficiency and high detection precision.
Drawings
FIG. 1 is a schematic flow diagram of the present invention;
FIG. 2 is a schematic structural view of the present invention;
FIG. 3 is a schematic view of laser irradiation without displacement of the object to be measured according to the present invention;
fig. 4 is a schematic view of laser irradiation when the object to be measured of the present invention is displaced.
The reference signs are: the device comprises a laser array 1, a light detector 2, a controller 3 and a measured object 4.
Detailed Description
Embodiments of the present invention are described in further detail below with reference to the accompanying drawings.
As shown in fig. 1, a method for rapidly detecting micro deformation of an object, wherein: the method comprises the following steps:
step S1: forming a semiconductor matrix by N semiconductor lasers;
step S2: coating black and white grids with uniform size on the smooth surface of a measured object, wherein the black and white grids are distributed in a crossed manner, and the grid crossing points are used as observation points;
each observation point corresponds to one semiconductor laser, and reflected light can be observed at each observation point.
Step S3: lightening semiconductor lasers in the laser array, projecting light spots of each laser onto an observation point, and calibrating to enable the light spots to be projected at the central position of the observation point;
ensuring that the spots occupy the same size of area of the adjacent black and white grid at the viewpoint.
Step S4: when the measured object is not displaced, randomly lightening the semiconductor lasers in the laser array, and detecting n times of measurement results of reflected light signals of n observation points by using a photoelectric detector, and recording the measurement results as calibration vectors;
the calibration vector Y is:
Y(I1,I2,…In)
wherein, cniIs a random coefficient having a value of 0 or 1, the index j representing the j-th measurement, InRepresenting the intensity value of the nth measurement, i representing the ith observation point, PiRepresenting the brightness of the ith observation point when the laser is irradiated.
At this time, the calculated light intensity value is reflected by the light spot of the observation point, and the area of the light spot is a circle formed by four equal-area sectors of the adjacent black-white grids.
Step S4: after the object to be measured works, detecting n times of measurement results of optical signals reflected by n observation points by a photoelectric detector in a lighting mode in step S4, and recording the measurement results as detection vectors;
detecting vector YtComprises the following steps:
wherein the content of the first and second substances,the light intensity value measured for the nth time after the measured object works is represented,representing the brightness of the ith observation point irradiated by the laser after the measured object works.
At the moment, if the measured object deforms, the position of the light spot at the observation point inevitably changes, and the calculated light intensity value changes; if the measured object is not deformed, the calculated light intensity value is unchanged.
Step S5: and calculating the two norms of the difference between the calibration vector and the detection vector, comparing the two norms with a set threshold value, and judging whether the measured object deforms.
Wherein, the two norms of the difference between the calibration vector and the detection vector are | | | Y-Yt||2And when the value of the two norms is smaller than the set threshold value, the measured object is judged not to deform.
The utility model provides a quick detecting system of equipment displacement, includes laser array, light detector, controller, the controller respectively with laser array, light detector electric connection, scribble intercrossing's black and white net on the smooth surface of testee, light detector is located black and white net reflected light's route, what each semiconductor laser of laser array jetted out falls on the crosspoint that corresponds black and white net, the controller control laser array lights and light detector gathers the reflected light signal.
The above is only a preferred embodiment of the present invention, and the protection scope of the present invention is not limited to the above-mentioned embodiments, and all technical solutions belonging to the idea of the present invention belong to the protection scope of the present invention. It should be noted that modifications and embellishments within the scope of the invention may be made by those skilled in the art without departing from the principle of the invention.
Claims (5)
1. A method for rapidly detecting micro deformation of an object is characterized by comprising the following steps:
step S1: forming a semiconductor matrix by N semiconductor lasers;
step S2: coating black and white grids with uniform size on the smooth surface of a measured object, wherein the black and white grids are distributed in a crossed manner, and the grid crossing points are used as observation points;
step S3: lightening semiconductor lasers in the laser array, projecting light spots of each laser onto an observation point, and calibrating to enable the light spots to be projected at the center position of the observation point;
step S4: when the measured object does not work, randomly lightening the semiconductor lasers in the laser array, and detecting n times of measurement results of reflected light signals of n observation points by using a photoelectric detector, and recording the measurement results as calibration vectors;
step S5: after the object to be measured works, the semiconductor lasers in the laser array are lightened in the lightening mode in the step S4, and the n times of measurement results of optical signals reflected by n observation points are detected by using photoelectric detectors and recorded as detection vectors;
step S6: and calculating the two norms of the difference between the calibration vector and the detection vector, comparing the two norms with a set threshold value, and judging whether the measured object deforms.
2. The method for rapidly detecting the micro-deformation of the object according to claim 1, wherein the method comprises the following steps: in step S2, each observation point corresponds to one semiconductor laser.
3. The method for rapidly detecting the micro-deformation of the object according to claim 2, wherein the method comprises the following steps: the calibration vector Y is:
wherein, cniIs a random coefficient having a value of 0 or 1, the index n representing the nth measurement, InIndicates the nth measurementLight intensity value of quantity, i represents the ith observation point, PiRepresenting the brightness of the ith observation point when the laser is irradiated.
4. The method for rapidly detecting the micro-deformation of the object according to claim 3, wherein the method comprises the following steps: the detection vector YtComprises the following steps:
5. The method for rapidly detecting the micro-deformation of the object according to claim 4, wherein the method comprises the following steps: the two norms of the difference between the calibration vector and the detection vector are | | Y-Yt||2And when the value of the two norms is smaller than the set threshold value, the measured object is judged not to deform.
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Application publication date: 20201030 Assignee: Jiangsu Nangong Testing Co.,Ltd. Assignor: NANJING INSTITUTE OF TECHNOLOGY Contract record no.: X2024980001802 Denomination of invention: A Fast Detection Method and Detection System for Small Deformation of Objects Granted publication date: 20220211 License type: Common License Record date: 20240202 |
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