CN111836507A

CN111836507A - Controller device

Info

Publication number: CN111836507A
Application number: CN201910313244.8A
Authority: CN
Inventors: 林继谦; 江在民; 李国荣; 阎柏均
Original assignee: A Data Technology Co Ltd
Current assignee: A Data Technology Co Ltd
Priority date: 2019-04-18
Filing date: 2019-04-18
Publication date: 2020-10-27
Anticipated expiration: 2039-04-18
Also published as: CN111836507B

Abstract

The invention discloses a controller device, which comprises: the module comprises a heat dissipation module, a first control module, a second control module, a first conductive structure and a second conductive structure. The first control module is arranged on the heat dissipation module. The second control module is arranged on the heat dissipation module, and the first control module is positioned between the second control module and the heat dissipation module. The first conductive structure is disposed on the first control module and coupled to the first control module. The second conductive structure is disposed on the first control module and coupled to the first control module. Therefore, the invention achieves the effect of increasing the heat dissipation efficiency.

Description

Controller device

Technical Field

The present invention relates to a controller device, and more particularly, to a controller device applicable to an electric vehicle.

Background

Firstly, with global advices on energy saving and carbon reduction, the requirements of each country on the quality and performance of new energy vehicles are higher and higher, and the specification requirements of various parts are higher and higher in order to meet the requirements of different laws and regulations and different crowds. Therefore, it is becoming increasingly important how to make highly integrated and modular drivers to accommodate different specification requirements.

Next, in the driver of the electric vehicle in the prior art, the control circuit, the power transistor and the capacitor of the driver are generally disposed on the same printed circuit board, and there is no concept of modular design. Therefore, the design without modules is difficult to cope with different customer specifications, and if the power requirement of the design architecture is increased, the number of power transistors and capacitors is increased, and finally the area of the printed circuit board is increased. In addition, the power transistor and the capacitor in the prior art are stacked on the printed circuit board facing the same direction, but the design will cause the overall structure of the driver to be thickened, and the heat dissipation of the capacitor is not easy.

Therefore, how to improve the heat dissipation efficiency of the controller device of the electric vehicle by improving the structural design to overcome the above-mentioned drawbacks has become one of the important issues to be solved by the industry.

Disclosure of Invention

The present invention is directed to a controller device, which is provided to overcome the shortcomings of the prior art.

In order to solve the above technical problem, one of the technical solutions of the present invention is to provide a controller device, including: the module comprises a heat dissipation module, a first control module, a second control module, a first conductive structure and a second conductive structure. The first control module is arranged on the heat dissipation module, and the first control module abuts against the heat dissipation module. The second control module is arranged on the heat dissipation module, and the first control module and the second control module are stacked along a direction far away from the heat dissipation module. The first conductive structure is disposed on the first control module and coupled to the first control module, wherein the first conductive structure includes a first positioning plate disposed on the first control module and a first conductive pillar connected to the first positioning plate. The second conductive structure is disposed on the first control module and coupled to the first control module, wherein the second conductive structure includes a second positioning plate disposed on the first control module and a second conductive pillar connected to the second positioning plate.

Still further, the controller device further includes: the first conductive structure further comprises a first locking hole arranged on the first positioning plate, the second conductive structure further comprises a second locking hole arranged on the second positioning plate, and the first control module comprises a first opening corresponding to the first locking hole and a second opening corresponding to the second locking hole; the first locking piece is embedded with the heat dissipation module through the first opening and the first locking hole in sequence to fix the first conductive structure and the first control module on the heat dissipation module, and the second locking piece is embedded with the heat dissipation module through the second opening and the second locking hole in sequence to fix the second conductive structure and the first control module on the heat dissipation module.

Further, the first positioning plate includes a first end portion and a second end portion corresponding to the first end portion, and the second positioning plate includes a third end portion and a fourth end portion corresponding to the third end portion; the distance from the first conductive pillar to the first terminal portion is different from the distance from the first conductive pillar to the second terminal portion, and the distance from the second conductive pillar to the third terminal portion is different from the distance from the second conductive pillar to the fourth terminal portion.

Furthermore, the first control module comprises a circuit board, a chip and a capacitor, the circuit board comprises a first surface facing away from the heat dissipation module and a second surface facing the heat dissipation module, the chip is arranged on the first surface, and the capacitor is arranged on the second surface.

Furthermore, the heat dissipation module comprises a heat dissipation structure and an accommodating space which is positioned on the heat dissipation structure and is concavely arranged relative to the heat dissipation structure, one part of the second surface of the circuit board is abutted against the heat dissipation structure, and the capacitor arranged on the second surface is positioned in the accommodating space.

Furthermore, the heat dissipation module further includes a liquid channel disposed in the heat dissipation structure, a first opening disposed on the heat dissipation structure and connected to the liquid channel, and a second opening disposed on the heat dissipation structure and connected to the liquid channel, wherein the liquid channel can form a first projection region relative to a vertical projection of the heat dissipation structure, the circuit board can form a second projection region relative to a vertical projection of the heat dissipation structure, and the first projection region and the second projection region are at least partially overlapped.

Furthermore, the first control module further comprises a first conductive element disposed on the circuit board, a second conductive element disposed on the circuit board, and a third conductive element disposed on the circuit board.

Furthermore, the first control module comprises a first circuit board, a second circuit board, a chip and a capacitor, the first circuit board comprises a first substrate, the second circuit board comprises a second substrate, the chip is arranged on the first substrate, and the capacitor is arranged on the second substrate.

Furthermore, the first substrate and the second substrate are made of different materials, and the thermal conductivity of the first substrate is greater than that of the second substrate.

Furthermore, the first substrate is coupled to the second substrate, the first substrate is disposed on the heat dissipation module, the second substrate is disposed on the first substrate, and a vertical projection of the first substrate with respect to the heat dissipation module at least partially overlaps a vertical projection of the second substrate with respect to the heat dissipation module.

Further, the second control module includes a third circuit board, the third circuit board includes a first through hole corresponding to the first conductive pillar of the first conductive structure and a second through hole corresponding to the second conductive pillar of the second conductive structure, the first conductive pillar passes through the first through hole, and the second conductive pillar passes through the second through hole.

Still further, the controller device further includes: the current sensing module is arranged on the second control module; the first control module further comprises a first conductive element arranged on the circuit board, a second conductive element arranged on the circuit board and a third conductive element arranged on the circuit board; the third circuit board of the second control module further includes a third through hole corresponding to the first conductive element, a fourth through hole corresponding to the second conductive element, and a fifth through hole corresponding to the third conductive element; the current sensing module at least corresponds to one of the first conductive element, the second conductive element and the third conductive element.

Still further, the controller device further includes: and the shell structure is arranged on the heat dissipation module.

One of the advantages of the present invention is that the controller device provided by the present invention can increase the heat dissipation efficiency by the technical scheme that the first control module is disposed on the heat dissipation module, the second control module is disposed on the heat dissipation module, and the first control module and the second control module are stacked along a direction away from the heat dissipation module.

For a better understanding of the features and technical content of the present invention, reference should be made to the following detailed description of the invention and accompanying drawings, which are provided for purposes of illustration and description only and are not intended to limit the invention.

Drawings

Fig. 1 is a schematic perspective view of a controller device according to an embodiment of the invention.

Fig. 2 is another perspective assembly diagram of the controller device according to the embodiment of the invention.

Fig. 3 is an exploded perspective view of a controller device according to an embodiment of the invention.

Fig. 4 is another exploded perspective view of the controller device according to the embodiment of the invention.

Fig. 5 is a schematic perspective view of a heat dissipation module, a first control module, a first conductive structure, and a second conductive structure of a controller device according to an embodiment of the invention.

Fig. 6 is an exploded perspective view of the heat dissipation module, the first control module, the first conductive structure, and the second conductive structure of the controller device according to the embodiment of the invention.

Fig. 7 is another exploded perspective view of the heat dissipation module, the first control module, the first conductive structure and the second conductive structure of the controller device according to the embodiment of the invention.

Fig. 8 is a further exploded perspective view of the heat dissipation module, the first control module, the first conductive structure and the second conductive structure of the controller device according to the embodiment of the invention.

Fig. 9 is an exploded perspective view of a heat dissipation module, a first control module, a second control module, a first conductive structure, a second conductive structure, and a current sensing module of a controller device according to an embodiment of the invention.

Fig. 10 is a perspective assembly view of the heat dissipation module, the first control module, the second control module, the first conductive structure, the second conductive structure, and the current sensing module of the controller device according to the embodiment of the invention.

Fig. 11 is an exploded perspective view of a current sensing module of the controller device according to the embodiment of the invention.

Fig. 12 is another exploded view of a current sensing module of a controller device according to an embodiment of the invention.

Fig. 13 is an exploded perspective view of a heat dissipation module of the controller device according to the embodiment of the invention.

Fig. 14 is another exploded perspective view of the heat dissipation module of the controller device according to the embodiment of the invention.

Fig. 15 is a perspective view of another embodiment of a heat dissipation module of a controller device according to an embodiment of the invention.

Detailed Description

The following is a description of the embodiments of the "controller device" disclosed in the present invention with reference to specific embodiments, and those skilled in the art can understand the advantages and effects of the present invention from the disclosure of the present specification. The invention is capable of other and different embodiments and its several details are capable of modification and various other changes, which can be made in various details within the specification and without departing from the spirit and scope of the invention. The drawings of the present invention are for illustrative purposes only and are not intended to be drawn to scale. The following embodiments will further explain the related art of the present invention in detail, but the disclosure is not intended to limit the scope of the present invention.

It will be understood that, although the terms first, second, third, etc. may be used herein to describe various elements, these elements should not be limited by these terms. These terms are used primarily to distinguish one element from another. In addition, the term "or" as used herein should be taken to include any one or combination of more of the associated listed items as the case may be.

Examples

First, referring to fig. 1 to 4, fig. 1 and 2 are respectively perspective assembly schematic views of a controller device according to an embodiment of the present invention, and fig. 3 and 4 are respectively perspective exploded schematic views of the controller device according to the embodiment of the present invention. The embodiment of the invention provides a controller device U, which includes a heat dissipation module 1, a first control module 2, a second control module 3, a first conductive structure 4 and a second conductive structure 5. The first control module 2 may be disposed on the heat dissipation module 1, and the first control module 2 may abut against the heat dissipation module 1. In addition, the second control module 3 may be disposed on the heat dissipation module 1, and the first control module 2 and the second control module 3 may be sequentially stacked along a direction (Y direction) away from the heat dissipation module 1. For example, the second control module 3 may be elevated by the copper pillar C, so that the first control module 2 is located between the heat dissipation module 1 and the second control module 3, but the present invention is not limited to the manner in which the second control module 3 is disposed above the first control module 2.

In view of the above, the first conductive structure 4 may be disposed on the first control module 2 and coupled to the first control module 2, and the second conductive structure 5 may be disposed on the first control module 2 and coupled to the first control module 2. In addition, the first control module 2 may include a circuit board 21, a chip 22, a capacitor 23, a first conductive element 24, a second conductive element 25, and a third conductive element 26. The first conductive structure 4, the second conductive structure 5, the chip 22, the capacitor 23, the first conductive element 24, the second conductive element 25, and the third conductive element 26 may be disposed on the circuit board 21 and coupled to the circuit board 21. For example, the controller device U provided in the embodiment of the present invention can be preferably applied to a driver of an electric vehicle, but the present invention is not limited thereto. In addition, the first conductive element 24, the second conductive element 25 and the third conductive element 26 of the controller device U can be respectively connected to the motor, and the first conductive structure 4 and the second conductive structure 5 can be respectively used as a positive pole and a negative pole of the direct current, but the invention is not limited thereto. It should be noted that although the first control module 2 includes the chip 22 and the capacitor 23 as an example, in other embodiments, the first control module 2 may include other electronic components. It should be noted that the coupling in the present disclosure can be directly or indirectly connected, or directly or indirectly connected, and the present disclosure is not limited thereto.

For example, the controller device U may further include a current sensing module 6, the current sensing module 6 may be disposed on the second control module 3, and the current sensing module 6 may be configured to sense a value of current flowing through the first conductive structure 4, the second conductive structure 5, the first conductive element 24, the second conductive element 25 and/or the third conductive element 26. However, it should be noted that the present invention is not limited by the arrangement of the current sensing modules 6, and the form and number of the current sensing modules 6 are also not limited. For example, the controller device U may further include a housing structure 7, and the housing structure 7 may be disposed on the heat dissipation module 1 and cover the first control module 2, the second control module 3, the first conductive structure 4, the second conductive structure 5, and the current sensing module 6. Further, the housing structure 7 may include a housing body 71, a first hole 72 disposed on the housing body 71 and corresponding to the first conductive structure 4, a second hole 73 disposed on the housing body 71 and corresponding to the second conductive structure 5, a third hole 74 disposed on the housing body 71 and corresponding to the first conductive element 24, a fourth hole 75 disposed on the housing body 71 and corresponding to the second conductive element 25, and a fifth hole 76 disposed on the housing body 71 and corresponding to the third conductive element 26. More specifically, the first conductive structure 4, the second conductive structure 5, the first conductive element 24, the second conductive element 25 and the third conductive element 26 can be exposed outside the housing body 71 through the first hole 72, the second hole 73, the third hole 74, the fourth hole 75 and the fifth hole 76, respectively, for other elements to be inserted.

Next, referring to fig. 3 and 4, and also referring to fig. 5 to 8, fig. 5 is a three-dimensional assembly diagram of a heat dissipation module, a first control module, a first conductive structure and a second conductive structure of a controller device according to an embodiment of the present invention, fig. 6 to 8 are three-dimensional exploded diagrams of the heat dissipation module, the first control module, the first conductive structure and the second conductive structure of the controller device according to the embodiment of the present invention, respectively, and the following further illustrates the configuration of the heat dissipation module 1, the first control module 2, the first conductive structure 4 and the second conductive structure 5. In detail, the first conductive structure 4 may include a first positioning plate 41 disposed on the first control module 2 and a first conductive pillar 42 connected to the first positioning plate 41, and a length direction (X direction) of the first positioning plate 41 and a length direction (Y direction) of the first conductive pillar 42 are perpendicular to each other. The second conductive structure 5 includes a second positioning plate 51 disposed on the first control module 2 and a second conductive pillar 52 connected to the second positioning plate 51, wherein a length direction (X direction) of the second positioning plate 51 and a length direction (Y direction) of the second conductive pillar 52 are perpendicular to each other. Thereby, the first conductive structure 4 and the second conductive structure 5 can form a structure similar to an inverted T shape.

As mentioned above, the first conductive pillar 42 may be disposed between the center (not numbered) of the first positioning plate 41 and a first end portion 411 of the first positioning plate 41, that is, the distance from the first conductive pillar 42 to the first end portion 411 of the first positioning plate 41 is different from the distance from the first conductive pillar 42 to a second end portion 412 of the first positioning plate 41. In addition, the second conductive pillar 52 may be disposed between a center (not numbered) of the second positioning plate 51 and a third end portion 511 of the second positioning plate 51, that is, a distance from the second conductive pillar 52 to the third end portion 511 of the second positioning plate 51 is different from a distance from the second conductive pillar 52 to a fourth end portion 512 of the second positioning plate 51. It should be noted that the position of the center of the first positioning plate 41 refers to the middle position between the first end portion 411 and the second end portion 633 of the first positioning plate 41, and the position of the center of the second positioning plate 51 refers to the middle position between the third end portion 511 and the fourth end portion 512 of the second positioning plate 51. For example, the length of the first positioning plate 41 may be greater than the length of the first conductive pillar 42, and the length of the second positioning plate 51 may be greater than the length of the second conductive pillar 52, but the invention is not limited thereto.

For example, the first positioning plate 41 and the second positioning plate 51 may be shaped as long strips, the length of the first positioning plate 41 may be greater than that of the first conductive pillar 42, and the length of the second positioning plate 51 may be greater than that of the second conductive pillar 52, but the invention is not limited thereto. Further, when the first conductive structure 4 and the second conductive structure 5 are disposed on the first control module 2, the first positioning plate 41 and the second positioning plate 51 may be parallel to each other and disposed side by side, and the first conductive posts 42 and the second conductive posts 52 may be staggered with each other. Therefore, since the first conductive posts 42 are disposed asymmetrically with respect to the first positioning board 41, and the second conductive posts 52 are disposed asymmetrically with respect to the second positioning board 51, the present invention can utilize the positions of the first conductive structures 4 and the second conductive structures 5 disposed on the first control module 2, so that the shapes and structures of the first conductive structures 4 and the second conductive structures 5 can be completely the same when the first conductive structures 4 and the second conductive structures 5 are fabricated.

Next, referring to fig. 5 to 8, preferably, in the present invention, the controller device U may further include a first locking element S1 and a second locking element S2, that is, the first conductive structure 4 and the second conductive structure 5 may be disposed on the first control module 2 and the heat dissipation module 1 by using the first locking element S1 and the second locking element S2 respectively and electrically connected to the first control module 2. Further, the first conductive structure 4 may further include a first locking hole 43 disposed on the first positioning plate 41, the second conductive structure 5 may further include a second locking hole 53 disposed on the second positioning plate 51, and the first control module 2 may include a first opening 212A corresponding to the first locking hole 43 and a second opening 212B corresponding to the second locking hole 53. The first locking member S1 can be sequentially engaged with the heat dissipation module 1 through the first opening 212A and the first locking hole 43, so as to fix the first conductive structure 4 and the first control module 2 on the heat dissipation module 1. The second locking member S2 can be sequentially inserted into the heat dissipation module 1 through the second opening 212B and the second locking hole 53, so as to fix the second conductive structure 5 and the first control module 2 on the heat dissipation module 1. In addition, in a preferred embodiment, the controller device U may include a plurality of first locking elements S1 and a plurality of second locking elements S2, such that the plurality of first locking elements S1 and the plurality of second locking elements S2 are respectively locked on the plurality of first locking holes 43, the plurality of second locking holes 53, the plurality of first openings 212A and the plurality of second openings 212B, so as to fix the first conductive structures 4, the second conductive structures 5 and the first control module 2 on the heat dissipation module 1. It should be noted that the controller device U may further include one or more insulating pads R, where the insulating pads R may correspond to the first locking member S1 and/or the second locking member S2, respectively, the insulating pads R are disposed between the first locking member S1 and the first conductive structure 4, and the insulating pads R are disposed between the second locking member S2 and the second conductive structure 5, but the invention is not limited thereto.

In view of the above, the heat dissipation module 1 of the present invention may include a heat dissipation structure 11, and the circuit board 21 may be disposed on a supporting surface 110 of the heat dissipation structure 11 and abut against the supporting surface 110 of the heat dissipation structure 11. In addition, the circuit board 21 may include a first surface 2101 facing away from the heat dissipation module 1 and a second surface 2102 facing the heat dissipation module 1, the chip 22 may be disposed on the first surface 2101, and the capacitor 23 may be disposed on the second surface 2102. In other words, the height direction (positive Y direction) of the chip 22 disposed on the circuit board 21 and the height direction (negative Y direction) of the capacitor 23 disposed on the circuit board 21 are opposite to each other. That is, the height direction (positive Y direction) of the chip 22 is a direction away from the heat dissipation module 1, and the height direction (negative Y direction) of the capacitor 23 is a direction toward the heat dissipation module 1. Further, since the height direction (negative Y direction) of the capacitor 23 is toward the direction close to the heat dissipation module 1, the heat dissipation module 1 may preferably further include an accommodating space 12 located on the heat dissipation structure 11 and recessed relative to the heat dissipation structure 11. Therefore, a portion of the second surface 2102 of the circuit board 21 may abut on the heat dissipation structure 11, and the capacitor 23 disposed on the second surface 2102 may be located in the accommodating space 12. Thereby, the capacitor 23 may be formed in an inverted arrangement with respect to the chip 22 to reduce the volume of the controller device U. It should be noted that a portion of the second surface 2102 of the circuit board 21 may directly abut against the heat dissipation structure 11, or a thermal conductive adhesive may be disposed between the second surface 2102 of the circuit board 21 and the heat dissipation structure 11, so that a portion of the second surface 2102 of the circuit board 21 may indirectly abut against the heat dissipation structure 11.

In light of the above, the controller device U may further include a heat conducting material T, the heat conducting material T may be disposed in the accommodating space 12, and the capacitor 23 disposed on the circuit board 21 may be disposed in the accommodating space 12 and embedded in the heat conducting material T. Therefore, the heat generated by the capacitor 23 can be conducted to the heat dissipation structure 11 by the heat conduction material T, and the heat dissipation efficiency of the capacitor 23 is further increased. In addition, the capacitor 23 is embedded in the heat conductive material T, so that a shock absorbing effect can be achieved. For example, the heat conductive material T may be a heat conductive adhesive, but the invention is not limited thereto.

Next, referring to fig. 5 to 8, preferably, in the present invention, the circuit board 21 may be composed of a first circuit board 21A and a second circuit board 21B, that is, the first control module 2 may include a first circuit board 21A, a second circuit board 21B, a chip 22 and a capacitor 23. The first circuit board 21A may include a first substrate 211A, the second circuit board 21B includes a second substrate 211B, the first substrate 211A may be coupled to the second substrate 211B, and the first conductive structures 4 and the second conductive structures 5 may be coupled to the first substrate 211A and the second substrate 211B. For example, according to the present invention, one or more conductive pads P may be disposed on the first substrate 211A and the second substrate 211B, respectively, so as to couple the first substrate 211A and the second substrate 211B to each other by using the conductive pads P. Further, the first substrate 211A may be disposed on the heat dissipation module 1, the second substrate 211B may be disposed on the first substrate 211A, and a vertical projection of the first substrate 211A with respect to the heat dissipation module 1 and a vertical projection of the second substrate with respect to the heat dissipation module 1 at least partially overlap. In other words, the first substrate 211A and the second substrate 211B are at least partially overlapped. In addition, the conductive pads P of the first substrate 211A and the second substrate 211B may be disposed at positions where the first substrate 211A and the second substrate 211B overlap, so that the first substrate 211A and the second substrate 211B are coupled to each other by overlapping.

In summary, the first substrate 211A of the first circuit board 21A may include a first surface 2101A facing away from the heat dissipation module 1 and a second surface 2102A facing toward the heat dissipation module 1, and the second substrate 211B of the second circuit board 21B may include a first surface 2101B facing away from the heat dissipation module 1 and a second surface 2102B facing toward the accommodating space 12 of the heat dissipation module 1. The chip 22 may be disposed on the first surface 2101A of the first substrate 211A, and the capacitor 23 may be disposed on the second surface 2102B of the second substrate 211B. Accordingly, the height direction (positive Y direction) of the chip 22 is a direction away from the heat dissipation module 1, and the height direction (negative Y direction) of the capacitor 23 is a direction toward the heat dissipation module 1.

In view of the above, the second surface 2102A of the first substrate 211A can be disposed on a supporting surface 110 of the heat dissipation structure 11 and abut against the supporting surface 110 of the heat dissipation structure 11, so that heat generated by the chip 22 can be directly transmitted to the heat dissipation structure 11 through the first substrate 211A, thereby increasing the heat dissipation efficiency of the chip 22. In addition, the conductive pads P disposed on the first substrate 211A may be disposed on the first surface 2101A of the first substrate 211A.

In view of the above, further, the conductive pad P disposed on the second substrate 211B may be disposed on the second surface 2102B of the second substrate 211B, and the second surface 2102B of the second substrate 211B may abut against the first surface 2101A of the first substrate 211A, so that the conductive pad P disposed on the first surface 2101A of the first substrate 211A and the conductive pad P disposed on the second substrate 211B abut against each other to be coupled to each other.

In view of the above, the conductive pads P may be further disposed on the first surface 2101B of the second substrate 211B, such that the first conductive structures 4 and the second conductive structures 5 are coupled to the conductive pads P disposed on the first surface 2101B of the second substrate 211B against the conductive pads P disposed on the first surface 2101B of the second substrate 211B. Thereby, the first conductive structure 4 and the second conductive structure 5 can be coupled to the first circuit board 21A and the second circuit board 21B.

In view of the above, the first conductive element 24, the second conductive element 25 and the third conductive element 26 may be disposed on the first surface 2101A of the first substrate 211A and coupled to the first substrate 211A. In addition, the first conductive element 24, the second conductive element 25 and the third conductive element 26 may also be disposed on the first substrate 211A and the heat dissipation module 1 respectively by using the locking member S and electrically connected to the first substrate 211A.

In view of the above, it is preferable that the first substrate 211A and the second substrate 211B are made of different materials, and more preferably, the thermal conductivity of the first substrate 211A is greater than that of the second substrate 211B. For example, the first substrate 211A may be an aluminum substrate, the second substrate 211B may be an FR4 substrate, the chip 22 may be a Power transistor (such as, but not limited to, a MOS field effect Power transistor (MOS transistor)) to control electrical signals transmitted to the motor through the first conductive element 24, the second conductive element 25, and the third conductive element 26, and the capacitor 23 may be used for voltage stabilization of the Power supply and provision of the transient current, but the invention is not limited thereto. Therefore, the heat generated by the power transistor is conducted to the heat dissipation structure 11 through the first substrate 211A (aluminum substrate), so as to greatly improve the heat dissipation efficiency of the chip 22. The heat generated by the capacitor 23 can be conducted to the heat dissipation structure 11 by conduction through the heat conductive material T. For example, the heat dissipation structure 11 may also be a metal with good thermal conductivity, such as but not limited to aluminum.

Next, referring to fig. 5, and also referring to fig. 9 and fig. 10, fig. 9 is a three-dimensional exploded schematic view of a heat dissipation module, a first control module, a second control module, a first conductive structure, a second conductive structure, and a current sensing module of a controller device according to an embodiment of the present invention, and fig. 10 is a three-dimensional assembled schematic view of the heat dissipation module, the first control module, the second control module, the first conductive structure, the second conductive structure, and the current sensing module of the controller device according to the embodiment of the present invention. The second control module 3 can be disposed on the heat dissipation module 1, and the second control module 3 can be elevated by the copper pillar C, so that the first control module 2 is located between the heat dissipation module 1 and the second control module 3. For example, the second control module 3 may include a third circuit board 31 and an electronic component 32 disposed on the third circuit board 31, and the electronic component 32 may be a chip, a capacitor, a microprocessor or a signal connection port, which is not limited in the present invention.

As shown in fig. 9 and 10, the third circuit board 31 may further include a first through hole 311 corresponding to the first conductive pillar 42 of the first conductive structure 4, a second through hole 312 corresponding to the second conductive pillar 52 of the second conductive structure 5, a third through hole 313 corresponding to the first conductive element 24, a fourth through hole 314 corresponding to the second conductive element 25, and a fifth through hole 315 corresponding to the third conductive element 26. The first conductive pillar 42 can pass through the first through hole 311, and the second conductive pillar 52 can pass through the second through hole 312. In addition, the first conductive element 24 may pass through the third through hole 313, the second conductive element 25 may pass through the fourth through hole 314, and the third conductive element 26 may pass through the fifth through hole 315. Therefore, the first conductive pillar 42 of the first conductive structure 4, the second conductive pillar 52 of the second conductive structure 5, the first conductive element 24, the second conductive element 25, and the third conductive element 26 can be disposed in a protruding manner with respect to the third circuit board 31.

As mentioned above, the current sensing module 6 may be disposed on the third circuit board 31 of the second control module 3 and coupled to the third circuit board 31. In addition, the current sensing module 6 may correspond to at least one of the first conductive element 24, the second conductive element 25 and the third conductive element 26, and at least one of the first conductive element 24, the second conductive element 25 and the third conductive element 26 may pass through the current sensing module 6 to sense a current value through the current sensing module 6. Preferably, a plurality of current sensing modules 6 may be provided to sense the values of current passing through the first conductive element 24, the second conductive element 25 and the third conductive element 26, respectively. Further, the current sensing module 6 may also correspond to at least one of the first conductive pillar 42 and the second conductive pillar 52, and preferably, a plurality of current sensing modules 6 may be provided to respectively sense the current value passing through the first conductive pillar 42 and the second conductive pillar 52. Further, the first conductive element 24, the second conductive element 25, the third conductive element 26, the first conductive pillar 42 and/or the second conductive pillar 52 may respectively pass through the current sensing module 6, and the first conductive element 24, the second conductive element 25, the third conductive element 26, the first conductive pillar 42 and/or the second conductive pillar 52 are disposed in a protruding manner with respect to the current sensing module 6.

Next, referring to fig. 11 and 12, fig. 11 and 12 are respectively schematic exploded perspective views of a current sensing module of a controller device according to an embodiment of the invention. The current sensing module 6 may include a carrier 61, a current sensing element 62 disposed on the carrier 61 and coupled to the carrier 61, and a current sensing ring 63 disposed on the carrier 61 and corresponding to the current sensing element 62. For example, the Current sensing module 6 may be a Hall Current Sensor (Hall Current Sensor), the carrier 61 may be a Printed Circuit Board (PCB), and the Current sensing ring 63 may be a C-shaped magnetic ring, but the invention is not limited thereto. Further, the current sensing ring 63 may include a ring-shaped body 631, a first end connected to the ring-shaped body 631, and a second end 633 connected to the ring-shaped body 631, wherein an air gap 634 may be disposed between the first end 632 and the second end 633, and the ring-shaped body 631 may surround a sensing space 635. It should be noted that the current sensing ring 63 may be formed by powder metallurgy or by a wound silicon steel sheet, but the invention is not limited thereto.

As mentioned above, the first conductive element 24, the second conductive element 25, the third conductive element 26, the first conductive pillar 42 and/or the second conductive pillar 52 may be respectively located in the sensing space 635 of the current sensing module 6 to sense the current value thereof. In addition, the current sensing module 6 may also be disposed on the third circuit board 31 of the second control module 3 using the copper pillar C.

Referring to fig. 13 and 14, fig. 13 and 14 are respectively schematic perspective exploded views of a heat dissipation module of a controller device according to an embodiment of the present invention. In the present invention, the heat dissipation module 1 may further include a liquid flow channel 13 disposed in the heat dissipation structure 11, a first opening 14 disposed on the heat dissipation structure 11 and connected to the liquid flow channel 13, and a second opening 15 disposed on the heat dissipation structure 11 and connected to the liquid flow channel 13. In other words, the heat dissipation module 1 provided by the present invention can be a water-cooled heat dissipation module 1, so as to increase the overall heat dissipation efficiency of the controller device U. Preferably, a vertical projection of the liquid channel 13 relative to the carrying surface 110 of the heat dissipation structure 11 can form a first projection area, a vertical projection of the circuit board 21 relative to the carrying surface 110 of the heat dissipation structure 11 can form a second projection area, and the first projection area and the second projection area at least partially overlap. Further, the second projection area is preferably a vertical projection of the first substrate 211A of the circuit board 21 with respect to the carrying surface 110 of the heat dissipation structure 11, and the first projection area and the second projection area at least partially overlap. In other words, the liquid flow channel 13 is preferably disposed below the first substrate 211A to improve the heat dissipation efficiency of the first circuit board 21A. In addition, the heat dissipating structure 11 may include a heat dissipating body 111 and a cover 112 connected to the heat dissipating body 111, and the liquid flow channel 13 is disposed between the heat dissipating body 111 and the cover 112. In other words, the heat dissipating structure 11 may be composed of a heat dissipating body 111 and a cover 112, and the cover 112 may be used to close the liquid flow channel 13.

Next, referring to fig. 15, fig. 15 is a schematic perspective view of a heat dissipation module of a controller device according to another embodiment of the present invention. As can be seen from a comparison between fig. 15 and fig. 2, the liquid flow channel 13 may not be provided in the embodiment of fig. 15, and the heat dissipation structure 11 includes a plurality of heat dissipation fins disposed on the heat dissipation body 111. In other words, the heat dissipation module 1 shown in fig. 15 may be an air-cooled heat dissipation module 1.

Advantageous effects of the embodiments

One of the advantages of the present invention is that the controller device U provided by the present invention can increase the heat dissipation efficiency by the technical scheme that the first control module 2 is disposed on the heat dissipation module 1, the second control module 3 is disposed on the heat dissipation module 1, and the first control module 2 and the second control module 3 are stacked along a direction away from the heat dissipation module 1.

More specifically, the controller device U of the present invention can fix the first conductive structure 4 and the first control module 2 on the heat dissipation module 1 by "the first locking member S1 is sequentially embedded with the heat dissipation module 1 through the first opening 212A and the first locking hole 43, and the second locking member S2 is sequentially embedded with the heat dissipation module 1 through the second opening 212B and the second locking hole 53, so as to fix the second conductive structure 5 and the first control module 2 on the heat dissipation module 1", thereby improving the assembly efficiency in the manufacturing process.

In particular, according to the controller device U provided by the present invention, the chip 22 is disposed on the first surface 2101 of the circuit board 21, the capacitor 23 is disposed on the second surface 2102 of the circuit board 21, and the capacitor 23 is disposed in the accommodating space 12, so that the capacitor 23 is inverted compared to the chip, and the overall height of the controller device U can be reduced.

More specifically, the controller device U provided by the present invention can increase the heat dissipation efficiency of the controller device U by the technical solutions that "the first control module 2 includes a first circuit board 21A, a second circuit board 21B, a chip 22 and a capacitor 23, the first circuit board 21A includes a first substrate 211A, the second circuit board 21B includes a second substrate 211B, the chip 22 is disposed on the first substrate 211A, the capacitor 23 is disposed on the second substrate 211B", and "the first substrate 211A and the second substrate 211B are made of different materials, and the thermal conductivity of the first substrate 211A is greater than that of the second substrate 211B".

Furthermore, the heat dissipation module 1, the first control module 2, the second control module 3, the current sensing module 6, the first conductive structure 4 and/or the second conductive structure 5 of the present invention are modular in design, and can be directly replaced according to different specification requirements.

The disclosure is only a preferred embodiment of the invention, and is not intended to limit the scope of the claims, so that all technical equivalents and modifications using the contents of the specification and drawings are included in the scope of the claims.

Claims

1. A controller device, characterized in that the controller device comprises:

a heat dissipation module;

the first control module is arranged on the heat dissipation module;

the second control module is arranged on the heat dissipation module, and the first control module and the second control module are stacked along a direction far away from the heat dissipation module;

a first conductive structure disposed on and coupled to the first control module, wherein the first conductive structure includes a first positioning plate disposed on the first control module and a first conductive pillar connected to the first positioning plate; and

a second conductive structure disposed on and coupled to the first control module, wherein the second conductive structure includes a second positioning plate disposed on the first control module and a second conductive pillar connected to the second positioning plate.

2. The controller device according to claim 1, wherein the controller device further comprises: the first conductive structure further comprises a first locking hole arranged on the first positioning plate, the second conductive structure further comprises a second locking hole arranged on the second positioning plate, and the first control module comprises a first opening corresponding to the first locking hole and a second opening corresponding to the second locking hole; the first locking piece is embedded with the heat dissipation module through the first opening and the first locking hole in sequence to fix the first conductive structure and the first control module on the heat dissipation module, and the second locking piece is embedded with the heat dissipation module through the second opening and the second locking hole in sequence to fix the second conductive structure and the first control module on the heat dissipation module.

3. The controller device of claim 1, wherein the first positioning plate includes a first end portion and a second end portion corresponding to the first end portion, and the second positioning plate includes a third end portion and a fourth end portion corresponding to the third end portion; the distance from the first conductive pillar to the first terminal portion is different from the distance from the first conductive pillar to the second terminal portion, and the distance from the second conductive pillar to the third terminal portion is different from the distance from the second conductive pillar to the fourth terminal portion.

4. The controller device of claim 1, wherein the first control module comprises a circuit board, a chip, and a capacitor, the circuit board comprising a first surface facing away from the heat dissipation module and a second surface facing toward the heat dissipation module, the chip being disposed on the first surface, the capacitor being disposed on the second surface.

5. The controller device according to claim 4, wherein the heat dissipation module comprises a heat dissipation structure and an accommodating space located on the heat dissipation structure and recessed with respect to the heat dissipation structure, a portion of the second surface of the circuit board abuts against the heat dissipation structure, and the capacitor located on the second surface is located in the accommodating space.

6. The controller device of claim 5, wherein the heat dissipation module further comprises a liquid flow channel disposed in the heat dissipation structure, a first opening disposed on the heat dissipation structure and connected to the liquid flow channel, and a second opening disposed on the heat dissipation structure and connected to the liquid flow channel, wherein a vertical projection of the liquid flow channel with respect to the heat dissipation structure can form a first projection region, and a vertical projection of the circuit board with respect to the heat dissipation structure can form a second projection region, and the first projection region and the second projection region at least partially overlap.

7. The controller device of claim 4, wherein the first control module further comprises a first conductive element disposed on the circuit board, a second conductive element disposed on the circuit board, and a third conductive element disposed on the circuit board.

8. The controller device of claim 1, wherein the first control module comprises a first circuit board, a second circuit board, a chip, and a capacitor, the first circuit board comprising a first substrate, the second circuit board comprising a second substrate, the chip disposed on the first substrate, the capacitor disposed on the second substrate.

9. The controller device of claim 8, wherein the first substrate is made of a different material than the second substrate, and wherein the first substrate has a thermal conductivity greater than the second substrate.

10. The controller device of claim 8, wherein the first substrate is coupled to the second substrate, the first substrate is disposed on the heat dissipation module, the second substrate is disposed on the first substrate, and a vertical projection of the first substrate with respect to the heat dissipation module at least partially overlaps a vertical projection of the second substrate with respect to the heat dissipation module.

11. The controller device according to claim 1, wherein the second control module comprises a third circuit board, the third circuit board comprising a first through hole corresponding to the first conductive pillar of the first conductive structure and a second through hole corresponding to the second conductive pillar of the second conductive structure, the first conductive pillar passing through the first through hole and the second conductive pillar passing through the second through hole.

12. The controller device according to claim 11, wherein the controller device further comprises: the current sensing module is arranged on the second control module; the first control module further comprises a first conductive element arranged on the circuit board, a second conductive element arranged on the circuit board and a third conductive element arranged on the circuit board; the third circuit board of the second control module further includes a third through hole corresponding to the first conductive element, a fourth through hole corresponding to the second conductive element, and a fifth through hole corresponding to the third conductive element; the current sensing module at least corresponds to one of the first conductive element, the second conductive element and the third conductive element.

13. The controller device according to claim 1, wherein the controller device further comprises: and the shell structure is arranged on the heat dissipation module.