CN1118354C - 镶嵌式抛光垫及其制造方法 - Google Patents

镶嵌式抛光垫及其制造方法 Download PDF

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Publication number
CN1118354C
CN1118354C CN98804962A CN98804962A CN1118354C CN 1118354 C CN1118354 C CN 1118354C CN 98804962 A CN98804962 A CN 98804962A CN 98804962 A CN98804962 A CN 98804962A CN 1118354 C CN1118354 C CN 1118354C
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CN
China
Prior art keywords
polishing
pad
adjacent
inserts
panel
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN98804962A
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English (en)
Chinese (zh)
Other versions
CN1255080A (zh
Inventor
约翰·V·H·罗伯茨
李·迈尔伯纳·库克
戴维·B·詹姆斯
海因茨·F·雷恩哈德特
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
DuPont Electronic Materials Holding Inc
Original Assignee
Rodel Holdings Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Rodel Holdings Inc filed Critical Rodel Holdings Inc
Publication of CN1255080A publication Critical patent/CN1255080A/zh
Application granted granted Critical
Publication of CN1118354C publication Critical patent/CN1118354C/zh
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D11/00—Constructional features of flexible abrasive materials; Special features in the manufacture of such materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/26—Lapping pads for working plane surfaces characterised by the shape of the lapping pad surface, e.g. grooved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B41/00—Component parts such as frames, beds, carriages, headstocks
    • B24B41/04—Headstocks; Working-spindles; Features relating thereto
    • B24B41/047—Grinding heads for working on plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D7/00—Bonded abrasive wheels, or wheels with inserted abrasive blocks, designed for acting otherwise than only by their periphery, e.g. by the front face; Bushings or mountings therefor
    • B24D7/06—Bonded abrasive wheels, or wheels with inserted abrasive blocks, designed for acting otherwise than only by their periphery, e.g. by the front face; Bushings or mountings therefor with inserted abrasive blocks, e.g. segmental
    • B24D7/066—Grinding blocks; their mountings or supports

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
CN98804962A 1997-05-09 1998-05-08 镶嵌式抛光垫及其制造方法 Expired - Fee Related CN1118354C (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US4610497P 1997-05-09 1997-05-09
US60/046,104 1997-05-09

Publications (2)

Publication Number Publication Date
CN1255080A CN1255080A (zh) 2000-05-31
CN1118354C true CN1118354C (zh) 2003-08-20

Family

ID=21941643

Family Applications (1)

Application Number Title Priority Date Filing Date
CN98804962A Expired - Fee Related CN1118354C (zh) 1997-05-09 1998-05-08 镶嵌式抛光垫及其制造方法

Country Status (6)

Country Link
US (1) US6019666A (cg-RX-API-DMAC7.html)
EP (1) EP1007283A4 (cg-RX-API-DMAC7.html)
JP (1) JP4151799B2 (cg-RX-API-DMAC7.html)
KR (1) KR100485846B1 (cg-RX-API-DMAC7.html)
CN (1) CN1118354C (cg-RX-API-DMAC7.html)
WO (1) WO1998050201A1 (cg-RX-API-DMAC7.html)

Cited By (2)

* Cited by examiner, † Cited by third party
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CN100436060C (zh) * 2004-06-04 2008-11-26 智胜科技股份有限公司 研磨垫及其制造方法
US8182318B2 (en) 2006-11-06 2012-05-22 Jtekt Corporation Obliquely grooved grinding wheel and method for manufacturing the same

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US6390890B1 (en) 1999-02-06 2002-05-21 Charles J Molnar Finishing semiconductor wafers with a fixed abrasive finishing element
US6641463B1 (en) 1999-02-06 2003-11-04 Beaver Creek Concepts Inc Finishing components and elements
US6319108B1 (en) 1999-07-09 2001-11-20 3M Innovative Properties Company Metal bond abrasive article comprising porous ceramic abrasive composites and method of using same to abrade a workpiece
DE19939258A1 (de) * 1999-08-19 2001-03-08 Wacker Siltronic Halbleitermat Werkzeug und Verfahren zum abrasiven Bearbeiten einer im wesentlichen ebenen Fläche
KR100598090B1 (ko) * 1999-08-25 2006-07-07 삼성전자주식회사 폴리싱 면의 균일성을 얻기 위한 화학적 기계적 폴리싱 시스템
US7059948B2 (en) * 2000-12-22 2006-06-13 Applied Materials Articles for polishing semiconductor substrates
US6848970B2 (en) * 2002-09-16 2005-02-01 Applied Materials, Inc. Process control in electrochemically assisted planarization
US6390891B1 (en) * 2000-04-26 2002-05-21 Speedfam-Ipec Corporation Method and apparatus for improved stability chemical mechanical polishing
US6561891B2 (en) 2000-05-23 2003-05-13 Rodel Holdings, Inc. Eliminating air pockets under a polished pad
DE60110226T2 (de) 2000-06-30 2006-03-09 Rohm and Haas Electronic Materials CMP Holdings, Inc., Wilmington Unterlage für polierscheibe
US6612917B2 (en) 2001-02-07 2003-09-02 3M Innovative Properties Company Abrasive article suitable for modifying a semiconductor wafer
US6632129B2 (en) 2001-02-15 2003-10-14 3M Innovative Properties Company Fixed abrasive article for use in modifying a semiconductor wafer
US6673220B2 (en) * 2001-05-21 2004-01-06 Sharp Laboratories Of America, Inc. System and method for fabricating silicon targets
US7070480B2 (en) * 2001-10-11 2006-07-04 Applied Materials, Inc. Method and apparatus for polishing substrates
US20030194959A1 (en) * 2002-04-15 2003-10-16 Cabot Microelectronics Corporation Sintered polishing pad with regions of contrasting density
US7141155B2 (en) * 2003-02-18 2006-11-28 Parker-Hannifin Corporation Polishing article for electro-chemical mechanical polishing
JP2005019669A (ja) * 2003-06-26 2005-01-20 Matsushita Electric Ind Co Ltd 研磨パッド、研磨装置、及びウェハの研磨方法
US7086932B2 (en) * 2004-05-11 2006-08-08 Freudenberg Nonwovens Polishing pad
JP2005294412A (ja) * 2004-03-31 2005-10-20 Toyo Tire & Rubber Co Ltd 研磨パッド
TWI254354B (en) * 2004-06-29 2006-05-01 Iv Technologies Co Ltd An inlaid polishing pad and a method of producing the same
US6958002B1 (en) * 2004-07-19 2005-10-25 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Polishing pad with flow modifying groove network
US7252582B2 (en) * 2004-08-25 2007-08-07 Jh Rhodes Company, Inc. Optimized grooving structure for a CMP polishing pad
CN100513082C (zh) * 2004-10-06 2009-07-15 拉杰夫·巴贾 用于改善的化学机械抛光的方法和设备
US20080318505A1 (en) * 2004-11-29 2008-12-25 Rajeev Bajaj Chemical mechanical planarization pad and method of use thereof
US20090061744A1 (en) * 2007-08-28 2009-03-05 Rajeev Bajaj Polishing pad and method of use
US20070224925A1 (en) * 2006-03-21 2007-09-27 Rajeev Bajaj Chemical Mechanical Polishing Pad
US7815778B2 (en) * 2005-11-23 2010-10-19 Semiquest Inc. Electro-chemical mechanical planarization pad with uniform polish performance
US7846008B2 (en) * 2004-11-29 2010-12-07 Semiquest Inc. Method and apparatus for improved chemical mechanical planarization and CMP pad
WO2006057713A2 (en) * 2004-11-29 2006-06-01 Rajeev Bajaj Electro-method and apparatus for improved chemical mechanical planarization pad with uniform polish performance
US7530880B2 (en) * 2004-11-29 2009-05-12 Semiquest Inc. Method and apparatus for improved chemical mechanical planarization pad with pressure control and process monitor
US7762871B2 (en) * 2005-03-07 2010-07-27 Rajeev Bajaj Pad conditioner design and method of use
US8398463B2 (en) 2005-03-07 2013-03-19 Rajeev Bajaj Pad conditioner and method
US7179159B2 (en) * 2005-05-02 2007-02-20 Applied Materials, Inc. Materials for chemical mechanical polishing
KR100711010B1 (ko) * 2005-06-14 2007-04-25 한국화학연구원 지르코늄 산화물 박막 제조 방법
JP4712539B2 (ja) * 2005-11-24 2011-06-29 ニッタ・ハース株式会社 研磨パッド
US20070128991A1 (en) * 2005-12-07 2007-06-07 Yoon Il-Young Fixed abrasive polishing pad, method of preparing the same, and chemical mechanical polishing apparatus including the same
JP4999560B2 (ja) * 2007-06-07 2012-08-15 豊田バンモップス株式会社 研削盤における砥石軸装置
US9180570B2 (en) 2008-03-14 2015-11-10 Nexplanar Corporation Grooved CMP pad
TWI449597B (zh) * 2008-07-09 2014-08-21 Iv Technologies Co Ltd 研磨墊及其製造方法
KR20100096459A (ko) * 2009-02-24 2010-09-02 삼성전자주식회사 화학적 기계적 연마장치
TWI535527B (zh) * 2009-07-20 2016-06-01 智勝科技股份有限公司 研磨方法、研磨墊與研磨系統
US20120302148A1 (en) 2011-05-23 2012-11-29 Rajeev Bajaj Polishing pad with homogeneous body having discrete protrusions thereon
EP2732916A1 (en) * 2011-07-15 2014-05-21 Toray Industries, Inc. Polishing pad
US9067297B2 (en) 2011-11-29 2015-06-30 Nexplanar Corporation Polishing pad with foundation layer and polishing surface layer
US9067298B2 (en) 2011-11-29 2015-06-30 Nexplanar Corporation Polishing pad with grooved foundation layer and polishing surface layer
JP5923353B2 (ja) * 2012-03-21 2016-05-24 富士紡ホールディングス株式会社 研磨パッド用シート及びその製造方法、研磨パッド及びその製造方法、並びに研磨方法
US9597769B2 (en) 2012-06-04 2017-03-21 Nexplanar Corporation Polishing pad with polishing surface layer having an aperture or opening above a transparent foundation layer
US10226853B2 (en) 2013-01-18 2019-03-12 Applied Materials, Inc. Methods and apparatus for conditioning of chemical mechanical polishing pads
TWI599447B (zh) 2013-10-18 2017-09-21 卡博特微電子公司 具有偏移同心溝槽圖樣之邊緣排除區的ｃｍｐ拋光墊
CN103551961A (zh) * 2013-11-04 2014-02-05 无锡雨田精密工具有限公司 一种机夹切削打磨刀具
US11685013B2 (en) * 2018-01-24 2023-06-27 Taiwan Semiconductor Manufacturing Company, Ltd. Polishing pad for chemical mechanical planarization
EP3616840B1 (en) * 2018-09-03 2024-10-30 3M Innovative Properties Company Abrasive article
TWI850338B (zh) * 2019-02-28 2024-08-01 美商應用材料股份有限公司 拋光墊、化學機械拋光系統、及控制拋光墊的背襯層的剛度的方法
CN110802508B (zh) * 2019-11-12 2021-08-24 西安奕斯伟硅片技术有限公司 抛光垫及化学机械抛光设备

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4571893A (en) * 1983-03-23 1986-02-25 Gerd Braasch Rotary grinding tool
US4751797A (en) * 1986-09-26 1988-06-21 Hi-Control Limited Abrasive sheet and method of preparation
US5076024A (en) * 1990-08-24 1991-12-31 Intelmatec Corporation Disk polisher assembly
US5212910A (en) * 1991-07-09 1993-05-25 Intel Corporation Composite polishing pad for semiconductor process

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JPS60242975A (ja) * 1984-05-14 1985-12-02 Kanebo Ltd 平面研磨装置
US4927432A (en) * 1986-03-25 1990-05-22 Rodel, Inc. Pad material for grinding, lapping and polishing
FR2639278B1 (fr) * 1988-11-22 1991-01-11 Lam Plan Sa Plateau de polissage
US5209760A (en) * 1990-05-21 1993-05-11 Wiand Ronald C Injection molded abrasive pad
US5243790A (en) * 1992-06-25 1993-09-14 Abrasifs Vega, Inc. Abrasive member
MY114512A (en) * 1992-08-19 2002-11-30 Rodel Inc Polymeric substrate with polymeric microelements
DE4240476A1 (de) * 1992-12-02 1994-06-16 Winter & Sohn Ernst Schleifscheibe zum spangebenden Bearbeiten von Werkstückflächen
US5489233A (en) * 1994-04-08 1996-02-06 Rodel, Inc. Polishing pads and methods for their use
US5672095A (en) * 1995-09-29 1997-09-30 Intel Corporation Elimination of pad conditioning in a chemical mechanical polishing process
JP3042593B2 (ja) * 1995-10-25 2000-05-15 日本電気株式会社 研磨パッド

Patent Citations (4)

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Publication number Priority date Publication date Assignee Title
US4571893A (en) * 1983-03-23 1986-02-25 Gerd Braasch Rotary grinding tool
US4751797A (en) * 1986-09-26 1988-06-21 Hi-Control Limited Abrasive sheet and method of preparation
US5076024A (en) * 1990-08-24 1991-12-31 Intelmatec Corporation Disk polisher assembly
US5212910A (en) * 1991-07-09 1993-05-25 Intel Corporation Composite polishing pad for semiconductor process

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN100436060C (zh) * 2004-06-04 2008-11-26 智胜科技股份有限公司 研磨垫及其制造方法
US8182318B2 (en) 2006-11-06 2012-05-22 Jtekt Corporation Obliquely grooved grinding wheel and method for manufacturing the same
CN101528419B (zh) * 2006-11-06 2012-10-31 株式会社捷太格特 带倾斜槽的砂轮及其制造方法

Also Published As

Publication number Publication date
EP1007283A1 (en) 2000-06-14
US6019666A (en) 2000-02-01
KR20010012359A (ko) 2001-02-15
EP1007283A4 (en) 2002-05-08
JP2002504864A (ja) 2002-02-12
JP4151799B2 (ja) 2008-09-17
WO1998050201A1 (en) 1998-11-12
CN1255080A (zh) 2000-05-31
KR100485846B1 (ko) 2005-04-28

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CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20030820

Termination date: 20170508

CF01 Termination of patent right due to non-payment of annual fee