CN111835210A

CN111835210A - Inverter device

Info

Publication number: CN111835210A
Application number: CN202010221764.9A
Authority: CN
Inventors: 斋藤恒之; 秋山和成
Original assignee: Nidec Elesys Corp
Current assignee: Nidec Elesys Corp
Priority date: 2019-03-29
Filing date: 2020-03-26
Publication date: 2020-10-27
Also published as: JP2020167857A

Abstract

Provided is an inverter device capable of securing a space above a DCDC converter that can be freely used. One embodiment of an inverter device according to the present invention includes: an inverter section; a DCDC converter; a case having a bottom portion, a side surface portion standing from the bottom portion, and an upper portion closing an upper opening of the side surface portion, the case housing the inverter portion and the DCDC converter; and a cooling flow path formed in a bottom of the case, and cooling the inverter unit and the DCDC converter, wherein the inverter unit and the DCDC converter are disposed in the bottom of the case, and a height of a portion of an upper portion of the case covering the DCDC converter is lower than a height of a portion of the upper portion of the case covering the inverter unit.

Description

Inverter device

Technical Field

The present invention relates to an inverter device.

Background

Patent document 1 discloses an example of an inverter device with a DCDC converter. In patent document 1, a power module and a DCDC converter are provided on a capacitor, and a control board is provided on the power module and the DCDC converter in a case of an inverter device. The power module is provided with a plurality of, is provided with the cooling water route between each other power module. The cooling water path is located between the capacitor and the control substrate.

Patent document 1: japanese laid-open patent publication No. 2007 and 174759

In the configuration of patent document 1, since the DCDC converter has a control board, there is no space above the DCDC converter that can be freely used.

Disclosure of Invention

In view of the above problems, an object of the present invention is to provide an inverter device capable of securing a free space above a DCDC converter.

One embodiment of an inverter device according to the present invention includes: an inverter section; a DCDC converter; a case having a bottom portion, a side surface portion standing from the bottom portion, and an upper portion closing an upper opening of the side surface portion, the case housing the inverter portion and the DCDC converter; and a cooling flow path formed in a bottom of the case, and cooling the inverter unit and the DCDC converter, wherein the inverter unit and the DCDC converter are disposed in the bottom of the case, and a height of a portion of an upper portion of the case covering the DCDC converter is lower than a height of a portion of the upper portion of the case covering the inverter unit.

According to the present invention, a free space can be secured above the DCDC converter.

Drawings

Fig. 1 is a front perspective view of an inverter device according to an embodiment of the present invention.

Fig. 2 is a perspective view of the inverter device as viewed from the upper right.

Fig. 3 is a perspective view of a left side surface of the inverter device as viewed from behind.

Fig. 4 is a perspective view of the inverter device as viewed from below.

Fig. 5 is a perspective view of a left side surface of the inverter device as viewed from above.

Fig. 6 is a perspective view showing a state where a top cover of the inverter device is removed.

Fig. 7 is a perspective view showing a state in which the inverter control substrate is detached from the state of fig. 6.

Fig. 8 is a perspective view showing a state where the capacitor unit is detached from the state of fig. 7.

Fig. 9 is a perspective view of the DCDC converter.

Fig. 10 is a perspective view showing a state where the DCDC control board is detached from the state of fig. 9.

Fig. 11 is a perspective view showing a state where the power supply substrate is detached from the state of fig. 9.

Fig. 12 is a perspective view showing a state where the shielding material is detached from the state of fig. 10.

Fig. 13 is a perspective view of the DCDC converter in the state of fig. 12 as viewed from below.

Fig. 14 is a perspective view of the booster reactor as viewed from below.

Fig. 15 is a perspective view of the first inverter circuit, the second inverter circuit, and the three-phase terminals.

Fig. 16 is a perspective view of the first inverter circuit, the second inverter circuit, and the three-phase terminals of fig. 15 as viewed from below.

Fig. 17 is a bottom view of the first inverter circuit, the second inverter circuit, and the three-phase terminals of fig. 16.

Fig. 18 is a perspective view of the state in which the three-phase terminal is removed from the state in fig. 16.

Fig. 19 is a perspective view of a state in which the joint housing is attached in the state of fig. 16.

Fig. 20 is a perspective view of the joint housing as viewed from below.

Fig. 21 is a perspective view of the joint housing as viewed from above.

Fig. 22 is a diagram showing a state in which the joint housing is detached from the state of fig. 4.

Fig. 23 is a perspective view showing a three-phase terminal, a current sensor, and a connector for a sensor.

Fig. 24A is a longitudinal sectional view illustrating a floating structure of the sensor connector.

Fig. 24B is a perspective view illustrating a floating structure of the connector for a sensor.

Fig. 25 is a perspective view of the three-phase terminal, the flat plate member, and the module bus bar of fig. 23 as viewed from below.

Fig. 26 is a perspective view of the top cover of the case.

Fig. 27 is a right side perspective view of the housing main body.

Fig. 28 is a left side perspective view of the housing main body.

Fig. 29 is a right side view of the housing main body.

Fig. 30 is a top view of the housing main body.

Fig. 31 is a perspective view of the housing main body viewed from above the rear surface.

Fig. 32 is a longitudinal section taken along line 32-32 of fig. 30.

Fig. 33 is a partial perspective view showing the first flow path and the second flow path provided to the housing main body.

Fig. 34 is a longitudinal section taken along 34-34 of fig. 30.

Fig. 35 is a bottom view of the housing main body.

Fig. 36 is a perspective view of the housing main body as viewed from below.

Fig. 37 is a flowchart illustrating an assembling method of the inverter device.

Fig. 38 is a diagram illustrating an assembling method of the inverter device.

Fig. 39 is a diagram illustrating an assembling method of the inverter device.

Fig. 40 is a diagram illustrating an assembling method of the inverter device.

Fig. 41 is a diagram illustrating an assembling method of the inverter device.

Fig. 42 is a diagram illustrating an assembling method of the inverter device.

Fig. 43 is a diagram illustrating an assembling method of the inverter device.

Fig. 44 is a diagram illustrating an assembling method of the inverter device.

Fig. 45 is a diagram illustrating an assembling method of the inverter device.

Fig. 46 is a diagram illustrating an assembling method of the inverter device.

Fig. 47 is a diagram illustrating an assembling method of the inverter device.

Fig. 48 is an exploded perspective view of the inverter device.

Fig. 49 is a circuit diagram of the inverter device.

Description of the reference symbols

10: an inverter device; 12: a top cover; 14: a housing main body; 16: a signal connector; 18: a box body; 20: a DC input section; 22: a pipe member; 22 a: a first branch; 22 b: a second branch circuit; 23 a: a first pipeline; 23 b: a second pipeline; 24: the bottom of the box body; 26: a three-phase terminal; 30: a joint housing; 40: a DCDC converter; 42: a boost reactor; 50: a capacitor section; 60: a first inverter circuit; 70: a second inverter circuit.

Detailed Description

Hereinafter, a cooling structure of an inverter device according to an embodiment of the present invention will be described with reference to the drawings. The scope of the present invention is not limited to the embodiments described below, and can be arbitrarily changed within the scope of the technical idea of the present invention. In the following drawings, in order to facilitate understanding of the respective structures, scales, numbers, and the like of the respective structures may be different from scales, numbers, and the like of the actual structures.

In the drawings, an XYZ coordinate system is appropriately shown as a three-dimensional rectangular coordinate system. In the XYZ coordinate system, the Z-axis direction is a vertical direction and is a height direction of the inverter device in fig. 1 and 2. The X-axis direction is a direction perpendicular to the Z-axis direction. The X-axis direction is a width direction (left-right direction) of the inverter device in fig. 1 and 2. The Y-axis direction is a direction perpendicular to both the X-axis direction and the Z-axis direction.

In the following description, the height direction (Z-axis direction) of the inverter device is referred to as the vertical direction. The positive side (+ Z side) in the Z-axis direction with respect to a certain object is sometimes referred to as "upper side", and the negative side (-Z side) in the Z-axis direction with respect to a certain object is sometimes referred to as "lower side". The front-back direction, the front side, and the rear side are names used for explanation only, and do not limit the actual positional relationship and direction. In the present embodiment, a case where the-Z side is viewed from above in the Z-axis direction (+ Z side) is referred to as a case of a plan view.

Fig. 1 is a front perspective view showing an external appearance of an inverter device 10 of the present embodiment. The inverter device 10 is disposed in two motors (a motor for power generation and a motor for driving) in an engine room of an automobile, for example. The inverter device 10 includes a first inverter circuit 60 (fig. 8) and a second inverter circuit 70 (fig. 8), and for example, the first inverter circuit 60 is connected to a driving motor, and the second inverter circuit 70 is connected to a power generation motor.

As shown in fig. 1, the inverter device 10 has a top cover 12 and a case main body 14 when viewed from the outside. A signal connector (signal connector)16 is mounted on the right side surface 14a of the housing main body 14. The top cover 12 is provided on the case main body 14, and the case 18 of the inverter device 10 is constituted by the top cover 12 and the case main body 14. The top cover 12 is fixed to the housing main body 14 by bolts 20. A DC input section 19 is mounted on a front portion (front surface) 18a of the case 18. The DC input unit 19 receives a direct current from a battery (not shown) of an automobile, for example. The DC input portion 19 is fixed to the front portion 18a of the case 18 by a bolt 21. The DC input 19 may also be referred to as a DC connector.

In fig. 1, the Z direction is the height direction of the case 18, the X direction is the width direction of the case 18, and the Y direction is the length direction of the case 18.

Fig. 2 is a perspective view of the inverter device 10 viewed from the upper right. Fig. 3 is a perspective view of the left side surface of the inverter device 10 viewed from behind. Reference numeral 12a of fig. 2 denotes an upper surface portion of the top cover 12. As shown in fig. 2 and 3, a pipe member 22 is attached to the rear portion of the case 18 (the rear surface 14c of the housing main body 14). The pipe member 22 is a member for introducing cooling water (e.g., LLC) into the tank 18. LLC is short for Long Life Coolant. The pipe member 22 branches into two

branch paths

22a and 22b near the back surface 14c of the housing main body 14. Reference symbol a denotes a portion (branch point) where the pipe member 22 branches. A branch passage 22a through which cooling water for cooling the first inverter circuit 60 flows, which will be described later, is sometimes referred to as a first branch passage, and a branch passage 22b through which cooling water for cooling the second inverter circuit 70 flows, is sometimes referred to as a second branch passage. The cooling water is an example of the coolant, and a coolant other than the cooling water (e.g., cooling oil) may be used.

Part or all of the pipe member 22 may be made of metal or resin. When the pipe member 22 is made of metal, for example, a part of the first branch passage 22a may be a rubber pipe. Specifically, the vicinity of the branch point a of the first branch passage 22 may be formed by a metal pipe, the portion extending parallel to the back surface 14c of the housing main body 14 may be formed by a rubber pipe, and the vicinity of the downstream end of the first branch passage 22 (the vicinity of the first flow path opening 18 b) may be formed by a metal pipe. By using a rubber pipe, manufacturing errors in the distance between the first channel opening 18b and the second channel opening 18c can be absorbed.

The first inverter circuit 60 is an inverter circuit for controlling a driving motor, for example, and the second inverter circuit 70 is an inverter circuit for controlling a power generating motor, for example.

As shown in fig. 3, the three-

phase terminals

26 and 28 extend downward from the bottom 24 of the case 18. The left side surface 14b of the housing main body 14 is provided with a ventilation filter 37. Since the bottom 24 of the case 18 is also the bottom of the case main body 14, the reference numeral 24 denotes the bottom of the case 18 and also the bottom of the case main body.

Fig. 4 is a perspective view of the inverter device 10 as viewed from below. The three-

phase terminals

26, 28 protruding from the bottom portion 24 of the case 18 are spaced apart from each other at a predetermined interval in the width direction of the inverter device 10. The base 24 mounts a connector housing 30. The joint housing 30 is a housing that contacts a motor (not shown) located below the inverter device 10, and may be referred to as a motor joint housing. The joint housing 30 is, for example, an integrally molded product. The joint housing 30 is manufactured separately from the housing main body 14 (i.e., the box body 18), and is attached to the housing main body 14. The three-

phase terminals

26 and 28 protruding downward from the joint housing 30 can be directly connected to the motor located below the inverter device 10. Thus, cables for connecting the three-

phase terminals

26, 28 to the motor are not required. The shape of the joint housing 30 can be determined in accordance with the shape of the housing main body 14 and the like. The shape of the joint housing 30 will be described later with reference to fig. 20 and 21. An opening 25 is provided at a position where the joint housing 30 is attached to the bottom 24 of the case 18.

Fig. 5 is a perspective view of the left side surface of the inverter device 10 as viewed from above.

Fig. 6 is a perspective view showing a state where the top cover 12 of the inverter device 10 is removed. The housing 18 houses the DCDC converter 40, the power supply board 43, the capacitor unit 50, the inverter circuit control board 51, the first inverter circuit 60, and the second inverter circuit 70. The first inverter circuit 60 and the second inverter circuit 70 are located below the capacitor section 50, and thus are not shown in fig. 6.

The DCDC converter 40 has a DCDC control board 41 and a boost reactor 42. The boost reactor 42 is located below the DCDC control substrate 41. A power supply substrate 43 is provided below the DCDC control substrate 41 and beside the boost reactor 42. The DCDC converter 40 boosts a direct current (power supplied from the battery) input (supplied) from the DC input unit 19 to the inverter device 10. That is, the voltage supplied from the DC input unit (power supply input unit) 19 to the inverter device 10 is boosted by the DCDC converter 40, and then supplied to the inverter unit (the capacitor unit 50, the first inverter circuit 60, and the second inverter circuit 70). When a current flows from the DCDC converter 40 to the battery, the DCDC converter 40 performs a step-down process. As shown in fig. 6, the DC input section 19 is attached to the front surface 14d of the casing main body 14.

The DCDC control board 41 controls the operation of the DCDC converter 40. The DCDC control board 41 detects the input/output voltage/current as an input signal, and performs control of, for example, an interleave method. The DCDC control board 41 generates a signal for driving (half-bridge) the MOSFET mounted on (mounted on) the power supply board 43. The power supply board 43 is mounted with a power device (MOSFET) or a smoothing capacitor, and the power supply board 43 performs a switching operation for performing power conversion and a smoothing process after the switching operation in accordance with a power device drive signal (PWM signal) from the DCDC control board 41.

The capacitor unit 50 is formed of, for example, an electrolytic capacitor. The capacitor unit 50 is located below the inverter circuit control substrate 51. The capacitor portion 50 is sometimes referred to as a film capacitor. The inverter circuit control board 51 may also be referred to as an inverter control board.

Fig. 7 is a perspective view showing a state in which the inverter control substrate 51 is detached from the state of fig. 6. Fig. 8 is a perspective view showing a state where the capacitor unit 50 is detached from the state of fig. 7. Fig. 8 shows a first inverter circuit 60 and a second inverter circuit 70. The first inverter circuit 60 and the second inverter circuit 70 are arranged in the width direction (X direction) of the case 18. The discharge resistor 35 is provided on the housing main body left side surface 14b in the vicinity of the second inverter circuit 70.

Fig. 9 is a perspective view of the DCDC converter 40. Fig. 10 is a perspective view showing a state where the DCDC control substrate 41 is detached from the state of fig. 9. Fig. 11 is a perspective view showing a state where the power supply substrate 43 is detached from the state of fig. 9. Fig. 12 is a perspective view showing a state where the shielding material 44 is detached from the state of fig. 10. Fig. 13 is a perspective view of the DCDC converter 40 in the state of fig. 12 as viewed from another direction. Fig. 14 is a perspective view of the booster reactor 42 as viewed from below.

As shown in fig. 9, the DCDC converter 40 includes a DCDC control board 41, a boost reactor 42, and a power supply board 43. A first shielding material 44 is provided between the DCDC control substrate 41 and the boost reactor 42. Although a predetermined number of semiconductor elements 43a (fig. 6) are provided on the upper and lower surfaces of the power supply substrate 43, the semiconductor elements are not shown in fig. 9.

The DCDC control board 41 controls the boost reactor 42 and the power supply board 43.

The booster reactor 42 includes, for example, a solenoid core (not shown), a lead wire 42a wound around the solenoid core, and a reactor case 42b accommodating the solenoid core and the lead wire 42 a. The lead wire 42a is, for example, a lead wire with an insulating coating, and is wound around the electromagnetic core in a coil shape. In addition, in fig. 9 and 10, a part of the case 42b of the voltage boosting reactor 42 is omitted so that the lead wire 42a of the voltage boosting reactor 42 can be seen.

The power supply substrate 43 has a plurality of semiconductor elements 43a (fig. 6) that accumulate/discharge magnetic energy of the booster reactor 42 by being turned on/off.

The first shielding material 44 prevents noise generated by the boost reactor 42 from reaching the DCDC control substrate 41. That is, the first sealing material 44 is a member that protects the booster reactor 42 from noise. The first shield material 44 is a flat plate-like member slightly larger than the DCDC control board 41 in a plan view (i.e., when viewed from above in the Z direction).

As shown in fig. 14, a plurality of fins 45 extend downward from the bottom surface of the reactor case 42 b. As described later, the heat sink 45 is disposed in contact with the cooling water. The DCDC converter 40 is cooled by cooling water through the cooling fins 45. The heat sink 45 may also be referred to as a heat dissipation portion. The fins 45 are in direct contact with the refrigerant.

Fig. 15 is a perspective view of first inverter circuit 60, second inverter circuit 70, and three-

phase terminals

26, 28. As shown in fig. 15, the first inverter circuit 60 has a substantially rectangular parallelepiped shape. The second inverter circuit 70 has the same shape as the first inverter circuit 60.

As shown in fig. 15, the first inverter circuit 60 has an inverter power supply substrate 61 and an IGBT 63. The inverter power supply substrate 61 has a structure in which IGBTs 63 are stacked. The second inverter circuit 70 has an inverter power supply substrate 71 and an IGBT 73. The inverter power supply substrate 71 has a structure in which IGBTs 73 are stacked. IGBT is short for Insulated Gate bipolar transistor.

The three-phase terminal 26 includes a U-phase terminal 26a, a V-phase terminal 26b, and a W-phase terminal 26 c. The three-phase terminal 28 includes a U-phase terminal 28a, a V-phase terminal 28b, and a W-phase terminal 28 c.

Fig. 16 is a perspective view of first inverter circuit 60, second inverter circuit 70, and three-

phase terminals

26 and 28 of fig. 15 as viewed from below. The case 18 is provided with a mounting portion (not shown) to which the three-

phase terminals

26 and 28 are mounted. First inverter circuit 60 and second inverter circuit 70 are located on substantially the same plane, and three-

phase terminals

26 and 28 are located at a predetermined distance downward from first inverter circuit 60 and second inverter circuit 70. The bottom portion 24 of the case 18 is located between the three-

phase terminals

26 and 28 and the first inverter circuit 60 and the second inverter circuit 70, and therefore the three-

phase terminals

26 and 28 are located at a predetermined distance downward from the first inverter circuit 60 and the second inverter circuit 70 in fig. 16.

Fig. 17 is a bottom view of the first inverter circuit 60, the second inverter circuit 70, the three-

phase terminals

26, 28, the

connectors

92, 96, and the

flat plate members

93, 97 in the state of fig. 16.

Fig. 18 is a perspective view of the state in which the three-

phase terminals

26 and 28 are removed from the state in fig. 16. As shown in fig. 16 to 18, a plurality of heat sinks 62 extend from the lower surface of the first inverter circuit 60. Also, a plurality of heat radiation fins 72 protrude from the lower surface of the second inverter circuit 70. The heat sinks 62 and 72 may also be referred to as heat dissipation portions. An O-ring 64 is attached to the lower surface of the first inverter circuit 60 so as to surround the heat sink 62. An O-ring 74 is attached to the lower surface of the second inverter circuit 70 so as to surround the heat sink 72. The

fins

62 and 72 are in direct contact with the refrigerant. Therefore, it can be said that the first inverter circuit 60 and the second inverter circuit 70 are in direct contact with the refrigerant.

Fig. 19 is a perspective view of a state in which the joint housing 30 is attached in the state of fig. 16.

Fig. 20 is a perspective view of the joint housing 30 as viewed from below. Fig. 21 is a perspective view of the joint housing 30 as viewed from above. When the joint housing 30 is removed from the state of fig. 4, fig. 22 is obtained.

As shown in fig. 20, the joint housing 30 includes a base portion 38 fixed to the bottom portion 24 of the box body 18, and a protruding portion 39 protruding downward from the base portion 38 toward the box body 18. The base 38 is a plate-like member having a predetermined thickness. The outer periphery of the joint housing 30 (the outer periphery of the protruding portion 39) is provided with a groove portion 33. The groove 33 is provided with a liquid packing (not shown). The liquid gasket is a sealing member for preventing water and dust.

As shown in fig. 21, the inner surface of the joint housing 30 (the surface fixed to the bottom portion 24 of the case 18) is provided with a first recess 31a, a second recess 31b, a third recess 31c, and a fourth recess 31d as four recesses. The depth of each recess is smaller (shallower) than the thickness of the base 38. The first recess 31a is a recess for screw retraction, the second recess 31b is a recess for bus bar retraction, the third recess 31c is a recess for screw retraction, and the fourth recess 31d is a recess for screw retraction. The joint housing 30 is provided with two opening

portions

36a, 36 b. The opening 36a is an opening through which the three-phase terminal 26 passes, and the opening 36b is an opening through which the three-phase terminal 28 passes. The two opening

portions

36a and 36b are integrally formed when molding the joint housing 30. That is, the two opening

portions

36a and 36b are integrally molded at the same time with the joint housing 30. It can be said that the opening portion 25 of the bottom portion 24 of the box body 18 has two opening

portions

25a and 25b at positions corresponding to the two opening

portions

36a and 36b of the joint housing 30. When attached to the bottom portion 24 of the case 18, the joint housing 30 covers the opening 25 of the bottom portion 24 of the case 18.

Fig. 23 shows the three-phase terminals 28(28a, 28b, 28c), the box-shaped current sensor 94 having three holes 94a through which the three-phase terminals 28 pass, the sensor connector 96, the flat plate member 97 having a predetermined thickness, and the bus bar 98 provided on the flat plate member 97. The flat plate member 97 is a substantially rectangular plate-like member in a plan view. The plate member 97 has a protrusion 95. Reference numeral 97a denotes a short side of the substantially rectangular shape of the plate member 97, and reference numeral 97b denotes a long side. The current sensor 94 is a sensor that detects the current of the motor.

The bus bar 98 is an L-shaped bus bar. The L-shaped long side portion of the bus bar 98 extends in the flat plate member 97 along the long side 97b of the flat plate member 97 in most parts, and the L-shaped short side portion (bent portion) protrudes from the short side 97a of the flat plate member 97 to the outside of the flat plate member 97. Further, the short side portion of the L-shape extends in the perpendicular direction with respect to the surface 97c of the flat plate member 97. The current sensor 94 has a flange portion 94a parallel to a surface 97c of the flat plate member 97.

The current sensor 94 and the sensor connector 96 are provided on a flat plate member 97. The flange 94a of the current sensor 94 is fixed to the projection 95 of the plate member 97 by a screw (not shown). The three-phase terminal 26 and the configuration around it (current sensor 91, sensor connector 92, and flat plate member 93) are the same as those shown in fig. 23, and therefore, the description thereof is omitted.

The sensor connector 96 is a connector to which a sensor (for example, a thermistor) of a motor (not shown) located below the inverter device 10 is connected. A thermistor is an example of a temperature sensor. That is, the motor as the external device has a temperature sensor for detecting a predetermined physical quantity (temperature), and the inverter circuit has a connector 96 for receiving a signal from the temperature sensor. The sensor connector 96 may be fixed to the flat plate member 97, or may have a structure (floating structure) that can float with respect to the flat plate member 97. As shown in fig. 24A, in the case of the floating structure, the sensor connector 96 has two widened portions 96a at the lower portion, and the flat plate member 97 has two inverted L-shaped portions 99 which engage with the widened portions 96a from above. Fig. 24A is a longitudinal section. The widened portion 96a projects outward in the horizontal direction from the lower portion of the sensor connector 96. The inverted L-shaped portion 99 is composed of a vertical portion 99a and a horizontal portion 99 b. The horizontal portion 99b extends from the vertical portion 99a to the inside in the horizontal direction. When the sensor connector 96 has a floating structure, the sensor connector 96 can move relative to the inverter circuit within a predetermined range.

As can be seen from fig. 24A, the engagement between the widened portion 96a of the sensor connector 96 and the inverted L-shaped portion 99 is a gap fit, and the sensor connector 96 can move by a predetermined amount with respect to the flat plate member 97. More specifically, the sensor connector 96 is movable by a predetermined amount in the left-right direction (arrow a direction) and the up-down direction (arrow B direction) of the paper surface of fig. 24A, and is also movable by a predetermined amount in the direction perpendicular to the paper surface of fig. 24A (arrow C direction of fig. 24B). The inverted L-shaped portion 99 holds the sensor connector 96 with a predetermined degree of freedom, and can be referred to as a holding member. The holding portion of the sensor connector 96 is formed by the two inverted L-shaped portions 99.

Fig. 24B is a perspective view of fig. 24A. When the sensor connector 96 is assembled to the inverted L-shaped portion 99, the sensor connector 96 is moved in the direction of the arrow C, and the sensor connector 96 is inserted into the space 90 between the two inverted L-shaped portions 99. After the sensor connector 96 is inserted, screws or the like (not shown) for closing the space 90 in the arrow C direction are provided at both ends of the inverted L-shaped portion 99 in the arrow C direction. In fig. 24A and 24B, the gap between the inverted L-shaped portion 99 and the widened portion 96a of the sensor connector 96 is shown exaggerated compared to the actual case for easy understanding.

In a state where the sensor connector 96 is assembled to the inverted L-shaped portion 99, the sensor connector 96 can move by a predetermined amount (relative movement with respect to the flat plate member 97) in the directions of the arrows A, B and C in the space 90 defined by the two inverted L-shaped portions 99. The inverted-L portion 99 is a member provided in (fixed to) the inverter circuit, and can be said to be a holding portion that holds the sensor connector 96. The sensor connector 96 is fitted to the inverted L-shaped portion 99 with a gap therebetween.

When the sensor connector 96 has a floating structure, the operation of attaching the inverter device 10 to the motor is facilitated. More specifically, since the position of the sensor connector 96 can be moved by a predetermined amount with respect to the position of the sensor (thermistor) of the motor, the floating structure absorbs an error in the position of the sensor connector 96. By absorbing this error, the operation of attaching the inverter device 10 to the motor is facilitated.

Fig. 25 is a perspective view of fig. 23 as viewed from below. As is apparent from fig. 23 and 25, the three-phase terminal 28 is an L-shaped terminal. One side of the L-shape penetrates the current sensor 94 and extends in the vertical direction with respect to the flat plate member 97. The other side of the L is bent under the current sensor 94 and extends in the current sensor 94. The three-phase terminal 28, the flat plate member 97, and the bus bar 98 of fig. 25 can be manufactured by integral molding.

Fig. 26 is a perspective view of the top cover 12 of the case 18. As shown in fig. 26, the top cover 12 has a substantially flat upper surface portion 12a and an outer peripheral portion 12b extending downward from the upper surface portion 12 a.

Fig. 27 is a perspective view of the housing main body 14 as viewed from above the right side surface 14 a. Fig. 28 is a perspective view of the housing main body 14 as viewed from above the left side surface 14 b.

As shown in fig. 27 or 28, the housing main body 14 has a back surface 14c connecting a rear end portion of the right side surface 14a and a rear end portion of the left side surface 14b, and has a front surface 14d connecting a front end portion of the right side surface 14a and a front end portion of the left side surface 14 b. The height of the back surface 14c is greater than the height of the front surface 14 d.

Fig. 29 is a right side view of the housing main body 14. In the present embodiment, the right side surface 14a, the left side surface 14b, the rear surface 14c, and the front surface 14d of the housing main body 14 may be collectively referred to as a side surface portion (or a peripheral portion) 15 of the housing main body 14. An upper opening 15a is formed above the side surface 15. The case body 14 has a side surface portion 15 rising from a bottom portion 24, and an upper opening 15a of the side surface portion 15 is closed (blocked) by a top cover 12 which is an upper portion of the case 18.

Fig. 30 is a plan view of the housing main body 14. Fig. 31 is a perspective view of the case main body 14 as viewed from above the rear surface 14 c.

As shown in fig. 30 or 31, the pipe member 22 for supplying the cooling water to the inverter device 10 branches into a first branch passage 22a and a second branch passage 22b at a position near the back surface 14c of the housing main body 14. The first branch passage 22a through which the cooling water for cooling the first inverter circuit 60 flows is connected to a first flow passage opening 18b provided at the lower left of the back surface 14c of the case main body 14. The second branch passage 22b through which the cooling water for cooling the second inverter circuit 70 flows is connected to a second flow passage opening portion 18c provided at a lower right portion of the back surface 14c of the case main body 14.

As shown in fig. 27 and 28, a shallow bathtub-like first raised portion 80 is provided in a region where the first inverter circuit 60 is disposed, and a shallow bathtub-like second raised portion 82 is provided in a region where the second inverter circuit 70 is disposed, in the housing main body 14. In the present embodiment, the first raised portion 80 and the second raised portion 82 form a step in the bottom portion 24 of the case 18. Two

inverter circuits

60 and 70 are mounted on the higher bottom portion (first raised portion 80 and second raised portion 82).

Inside the case main body 14, a first pipe passage 23a is provided, and the first pipe passage 23a extends from a first flow passage opening 18b (fig. 31) formed in the back surface 14c of the case main body 14 to the first bulging portion 80. Further, a second pipe passage 23b is provided inside the case main body 14, and the second pipe passage 23b extends from the second flow passage opening 18c of the back surface 14c of the case main body 14 to the second bulging portion 82.

The first swelling portion 80 has a first cooling water inlet portion 80a at a portion connected to the first pipe 23 a. First cooling water inlet 80a has a circular opening. The second swelling portion 82 has a second cooling water inlet portion 82a at a portion connected to the second pipe line 23 b. Second cooling water inlet 82a has a circular opening.

The bathtub-like first raised part 80 is a substantially rectangular parallelepiped raised part having a predetermined height from the upper surface 24a of the bottom part 24 of the casing 18, and has a first recessed part 81 on the upper surface. The first recess 81 has a predetermined depth. The first recess 81 has a first inlet recess 81a, a planar portion 81b, and a first outlet recess 81 c. The first inlet recess 81a is a portion connected to the first cooling water inlet 80 a. The first inlet recess 81a is provided at a position lower than the flat surface 81b of the first recess 81.

The cooling water flowing in from the first pipe 23a enters the first inlet recess 81a from the first cooling water inlet 80a, and then accumulates in the flat portion 81b of the first recess 81. Since the flat portion 81b is wider than the first cooling water inlet 80a (or the first pipe 23a) in plan view, the flow velocity of the cooling water is reduced, and the cooling water can flow or stay at a low velocity in the flat portion 81 b. The planar portion 81b has substantially the same shape as the first inverter circuit 60 in a plan view. In the present embodiment, the width (dimension in the X direction) and the length (dimension in the Y direction) of the planar portion 81b are smaller than the width and the length of the first inverter circuit 60 by predetermined amounts in a plan view. Since the first raised part 80 and the second raised part 82 are also part of the bottom part 24 of the case 18, the bottom part 24 of the case 18 can be said to have a first bottom part defined by the first raised part 80 and the second raised part 82, and a second bottom part (a second bottom part defined by the upper surface 24 a) formed at a position lower than the first bottom part.

The heat radiation fins 62 of the first inverter circuit 60 are located in the first recess 81. The heat radiation fins 62 of the first inverter circuit 60 are cooled by the cooling water, whereby the first inverter circuit 60 is cooled. The depth of the first recess 81 is slightly larger than the height of the heat radiating fin 62.

The downstream end of the first recess 81 is provided with a first outlet recess 81 c. The first outlet recess 81c is a cylindrical opening (cylindrical hole) extending downward. The lower end of the first outlet recess 81c is connected to a first flow path 84 (fig. 32) provided in the bottom portion 24 of the casing 18 by drilling.

Fig. 32 is a longitudinal sectional view taken along line 32-32 of fig. 30 through the housing body 14. The sectional view of fig. 32 is a longitudinal sectional view seen in a plane cutting the first outlet recess 81 c. Fig. 33 is a partial perspective view showing the first flow path 84 and the second flow path 85 provided to the housing main body 14.

As shown in fig. 32, the lower end of the first cylindrical outlet recess 81c is connected to the upstream end 84a of the first flow path 84. The first flow path 84 extends to the front surface 14d of the housing main body 14. An outlet (downstream end) 84b of the first flow path 84 is provided to the front surface 14d of the housing main body. The first flow path 84 is an elongated hole formed substantially at the center of the thickness (height) of the bottom portion 24 of the case 18.

As shown in fig. 28 and 33, the bathtub-like second raised portion 82 is a substantially rectangular parallelepiped raised portion having a predetermined height, and has a second recessed portion 83 on the upper surface. The second recess 83 has a predetermined depth. The second recess 83 has a second inlet recess 83a, a flat portion 83b, and a second outlet recess 83 c. Second inlet recess 83a is a portion connected to second cooling water inlet 82 a. The second inlet recess 83a is provided at a position lower than the flat surface portion 83b of the second recess 83.

The cooling water flowing in from the second pipe 23b enters the second inlet recess 83a from the second cooling water inlet portion 82a, and then, the flat portion 83b of the second recess 83 is accumulated. Since the flat surface portion 83b is wider than the second cooling water inlet portion 82a (or the second pipe 23b) in plan view, the flow velocity of the cooling water is reduced, and the cooling water can flow or stay at a low velocity in the flat surface portion 83 b. The flat surface portion 83b has substantially the same shape as the second inverter circuit 70 in a plan view. In the present embodiment, the width and length of the flat surface portion 83b are smaller than the width and length of the second inverter circuit 70 by predetermined amounts in a plan view.

The heat radiation fins 72 of the second inverter circuit 70 are located in the second recess 83. The heat radiation fins 72 of the second inverter circuit 70 are cooled by the cooling water, whereby the second inverter circuit 70 is cooled. The depth of the second recess 83 is slightly larger than the height of the heat sink 72.

The downstream end of the second recess 83 is provided with a second outlet recess 83 c. The second outlet recess 83c is a cylindrical opening extending downward. The lower end of the second outlet recess 83c is connected to a second flow path 85 provided in the bottom portion 24 of the casing 18 by drilling.

Fig. 34 is a longitudinal section taken along line 34-34 of fig. 30 through the housing body 14. The sectional view of fig. 34 is a longitudinal sectional view seen in a plane cutting the second outlet recess 83 c. As shown in fig. 34, the lower end of the second cylindrical outlet recess 83c is connected to the upstream end 85a of the second flow path 85. The second flow path 85 extends to the front surface 14d of the housing main body 14. An outlet (downstream end) 85b of the first flow path 85 is provided to the front surface 14d of the housing main body.

As shown in fig. 33 and 34, the outer wall of the second flow path 85 has a portion 85c rising from the bottom 24 of the casing 18.

The third recess 86 is provided in the bottom 24 of the case 18 in a region where the reactor is disposed. The third recess 86 has an L-shape in plan view. The third recessed portion 86 has a predetermined depth from the upper surface 24a of the bottom portion 24 of the case 18 downward. The portion 85c rising from the third recess 86 is a portion where the second flow path 85 passes through the third recess 86.

The second flow path 85 passes through the third recess 86, passes through the bottom 24 of the casing 18, and extends to the outlet 85b of the front surface 14d of the casing main body 14. The reactor 42 of the DCDC converter 40 is cooled by the cooling water flowing through the second flow path 85. The DCDC converter 40 generates a smaller amount of heat than the second inverter circuit 70. In the present embodiment, after the second inverter circuit 70 having a large heat generation amount is cooled, the DCDC converter 40 having a small heat generation amount is cooled. That is, in the case 18, the heat generating components (the second inverter circuit 70 and the DCDC converter 40) are arranged from the upstream side to the downstream side of the cooling flow path in the order of decreasing heat generation amount. The heat generation amounts of the respective components can be calculated/obtained in advance using the values at the design stage.

The path through which the cooling water passes from the first flow path opening 18b provided in the rear surface 14c of the housing main body 14 to the first flow path outlet 84b provided in the front surface 14d of the housing main body 14 may be collectively referred to as a first refrigerant flow path. In the present embodiment, the first refrigerant flow path is provided in the bottom portion 24 of the tank 18. The first refrigerant flow path is constituted by the first tube path 23a, the first recessed portion 81, and the first flow path 84. The first refrigerant flow path is a flow path extending below the first inverter circuit 60.

The path through which the cooling water passes from the second flow path opening 18c provided in the rear surface 14c of the housing main body 14 to the second flow path outlet 85b provided in the front surface 14d of the housing main body 14 may be collectively referred to as a second refrigerant flow path. In the present embodiment, the second refrigerant flow path is provided in the bottom portion 24 of the tank 18. The second refrigerant flow path is constituted by the second tube path 23b, the second recessed portion 83, and the second flow path 85. The second refrigerant flow path is a flow path extending below the second inverter circuit 70. The first refrigerant flow path and the second refrigerant flow path extend substantially in parallel.

Fig. 35 is a bottom view of the housing main body 14. The L-shaped portion 24b is a through hole. Fig. 36 is a perspective view of the housing main body 14 as viewed from below (in a state where the joint housing 30 is attached). The portion of the joint housing 30 joined to the housing main body 14 is an annular portion (an annular portion including six bolt holes 24 d) shown by reference numeral 24c of fig. 35.

< method for assembling inverter device >

A method of assembling the inverter device 10 will be described with reference to fig. 22, 27, 31, and 37 to 47. Fig. 37 is a flowchart for explaining the assembling method. S is short for Step.

First, the case main body 14 shown in fig. 27 is prepared. Then, as shown in fig. 31, the tube member 22 is attached to the back surface 14c of the housing main body 14. The pipe member 22 is attached by press fitting, for example (S1).

After S1, as shown in fig. 38, discharge resistor 35 is attached to bottom portion 24 of case main body 14 in the vicinity of second recessed portion 83. More specifically, the discharge resistor 35 is attached to the bottom portion 24 so as to be in contact with the inner surface of the left side surface 14 b. Further, the DC input section 19 is mounted on the front surface 14d of the casing main body 14 (S2). The mounting of S2 is performed by bolt-based fastening.

After S2, as shown in fig. 39, the voltage boosting reactor 42, the power supply substrate 43, and the bus bar 46 are mounted on the case main body 14 (S3). The mounting of S3 is performed by bolt-based fastening.

After S3, as shown in fig. 40, the first inverter circuit 60 and the second inverter circuit 70 are mounted on the case main body 14 (S4). Since the first inverter circuit 60 and the second inverter circuit 70 are constituted by the

IGBTs

63 and 73, IGBT terminals, and the like, they are represented as the mounting of IGBT components in the flowchart. The mounting of S4 is performed by bolt-based fastening. In S4, O-ring 64 is attached to the lower surface of first inverter circuit 60, and O-ring 74 is attached to the lower surface of second inverter circuit 70.

The length of the first inverter circuit 60 in the Y axis direction is longer than the length of the first bump 80 in the Y axis direction in a plan view. Thus, when the first inverter circuit 60 is mounted to the bottom portion 24 of the case main body 14, a front portion of the first inverter circuit 60 (a portion facing the front surface 14d of the case main body 14) protrudes from the first raised portion 80.

The length of the second inverter circuit 70 in the Y axis direction is greater than the length of the second bump 82 in the Y axis direction. Thus, in the case where the second inverter circuit 70 is mounted to the bottom portion 24 of the case main body 14, a front side portion of the second inverter circuit 70 (a portion facing the front surface 14d of the case main body 14) protrudes from the second bulging portion 82.

After S4, as shown in fig. 41, the control substrate 41 of the DCDC converter 40 and the DC bus bar 47 are mounted on the case main body 14 (S5). The mounting of S5 is performed by bolt-based fastening. The DC bus bar 47 connects the DC input portion 19 and the power supply substrate 43.

After S5, as shown in fig. 42, the capacitor part (film capacitor) 50 and the bus bar 48 are mounted (S6). The bus bar 48 connects the power supply substrate 43 and the capacitor unit 50. The mounting of S6 is performed by bolt-based fastening.

The first inverter circuit 60, the second inverter circuit 70, and the capacitor unit 50 disposed thereon may be collectively referred to as an inverter unit.

After S6, as shown in fig. 43, the inverter control board 51 is mounted on the capacitor unit 50 (S7). The mounting of S7 is performed by bolt-based fastening.

After S7, as shown in fig. 44, the signal connector 16 is mounted on the right side face 14a of the housing main body 14 (S8). The mounting of S8 is performed by bolt-based fastening. Thereafter, a necessary wire harness (not shown) is inserted into the case main body 14 (S9). Thereafter, the liquid sealing material is applied along the upper edge 15b of the peripheral portion 15 of the case main body 14 (S10).

After S10, as shown in fig. 45, the top cover 12 is mounted at the housing main body 14 (S11). The mounting of S11 is performed by fastening with the bolt 20. The liquid seal applied at S10 is used to seal between the case main body 14 and the top cover 12 for water and dust resistance.

After S11, as shown in fig. 22, the case 18 is reversed, the motor three-phase terminals 26 and the plate member 93 provided with the sensor connectors 92 are attached to the first inverter circuit 60, and the motor three-phase terminals 28 and the plate member 97 provided with the sensor connectors 96 are attached to the second inverter circuit 70 (S12). The mounting of S12 is performed by bolt-based fastening. After S12, the

terminal portions

66 and 76 of the first inverter circuit 60 and the second inverter circuit 70 are joined to the motor three-phase terminals by welding (S13). After S13, the motor current sensor 94 is mounted by a bolt (S14). After S14, the liquid sealing material is applied to the annular portion 24c (fig. 35) of the bottom portion 24 of the case main body 14 (S15). The liquid seal applied at S15 is used to seal between the housing main body 14 and the joint housing 30 for water and dust resistance.

After S15, as shown in fig. 46, the joint case 30 is mounted on the case main body 14 by bolts (S16).

After S16, as shown in fig. 47, the breather filter 37 is inserted into the left side face 14b of the housing main body 14 (S17). The breather filter 37 is a member for passing air between the inside and outside of the case 18, and has a filtering function for preventing foreign matter from entering the inside of the case 18.

The inverter device 10 is assembled in steps S1 to S17.

Fig. 48 is an exploded perspective view of the inverter device 10. Fig. 49 is a circuit diagram of the inverter device 10.

< effects of the embodiment >

According to the present embodiment, since the upper portion of the case 18 covering the DCDC converter 40 is lower than the upper portion of the case 18 covering the inverter portion, a free space can be secured above the DCDC converter 40.

According to the present embodiment, since the bottom portion 24 of the case 18 is provided with the openings 25(25a, 25b) through which the three-

phase terminals

26 and 28 of the first inverter circuit 60 and the second inverter circuit 70 and the like pass, when the inverter device 10 is provided in an external device (for example, a motor), the terminal group of the inverter circuit can be directly connected to the external device. Thus, the power cable used in patent document 1 is not required, and a space for the power cable is also not required. Therefore, space saving can be achieved.

According to the present embodiment, the first refrigerant flow path and the second refrigerant flow path are branched, and the first inverter circuit 60 is cooled by the first refrigerant flow path and the second inverter circuit 70 is cooled by the second refrigerant flow path. That is, the first inverter circuit 60 and the second inverter circuit 70 can be cooled simultaneously/in parallel. Therefore, the two

inverter circuits

60 and 70 can be cooled equally, and the cooling efficiency of the two

inverter circuits

60 and 70 can be improved. As described above, according to the present embodiment, the cooling efficiency of the inverter device 10 can be improved.

Further, since the first refrigerant flow path and the second refrigerant flow path are provided in the bottom portion 24 of the case 18, an increase in the size of the cooling structure of the inverter device 10 can be suppressed. That is, since the cooling flow path does not need to be provided as a separate member from the case, the case can be downsized.

As can be seen in fig. 2 and 6, the top cover 12 is inclined relative to the bottom 24 of the housing body 14. Further, since the upper part of the case covering the DCDC converter 40 is lower than the upper part of the case covering the inverter units (the first inverter circuit 60 and the second inverter circuit 70), a free space can be secured above the DCDC converter 40. The top cover 12 is inclined downward from above the inverter unit toward above the DCDC converter 40.

The inverter unit includes inverter power source substrates 61 and 71, a capacitor unit 50, and an inverter control substrate 51, and the capacitor unit 50 is provided on the power source substrates 61 and 71. The inverter control board 51 is provided on the capacitor unit 50. With such a laminated structure, the assembly of the inverter unit is facilitated. Furthermore, the inverter section can be made compact.

In the inverter device 10 of the present embodiment, the following configuration can be adopted.

The first refrigerant flow path and the second refrigerant flow path are two flow paths in the tank 18, but may be combined into one flow path before or after extending out of the tank.

The first inverter circuit 60 is connected to the driving motor, and the second inverter circuit 70 is connected to the power generating motor, but the first inverter circuit 60 may be connected to the power generating motor, and the second inverter circuit 70 may be connected to the driving motor.

The position of the power supply substrate 43 of the DCDC converter 40 may be a position cooled by the first flow path 84.

The mounting of each component is not limited to bolt fastening.

The device connected to the inverter device 10 of the present embodiment is not particularly limited, and may be mounted on a device or a driving device other than a motor. That is, the three-

phase terminals

26 and 28 of the inverter device 10 may be connected to a driving device or the like other than the motor. The case 18 has a two-piece structure that can be divided into the top cover 12 and the housing main body 14, and may have another structure (for example, a three-piece structure).

The inverter device 10 of the above embodiment includes the DCDC converter 40, but the inverter device 10 may not include the DCDC converter 40. In this case, the capacitor unit 50 is disposed at a position where the DCDC converter 40 is disposed. Then, the capacitor unit 50 is cooled by the cooling water flowing through the second coolant flow field. The inverter control board 51 is provided on the inverter

power source boards

61 and 71. The voltage supplied from the DC input section 19 to the inverter device 10 is supplied to the capacitor section 50, and then supplied to the first inverter circuit 60 and the second inverter circuit 70.

In the above embodiment, the first refrigerant flow path is constituted by the first tube passage 23a, the first recessed portion 81, and the first flow path 84, but the tube member 22 (the first tube passage 23a) outside the casing 18 may be included in the first refrigerant flow path. The second refrigerant flow path is constituted by the second tube passage 23b, the second recessed portion 83, and the second flow path 85, but the tube member 22 (the first tube passage 23b) outside the casing 18 may be included in the second refrigerant flow path.

Further, the respective structures described above can be appropriately combined within a range not inconsistent with each other.

Claims

1. An inverter device, comprising:

an inverter section;

a DCDC converter;

a case having a bottom portion, a side surface portion standing from the bottom portion, and an upper portion closing an upper opening of the side surface portion, the case housing the inverter portion and the DCDC converter; and

a cooling flow path formed in a bottom portion of the case and cooling the inverter unit and the DCDC converter,

it is characterized in that the preparation method is characterized in that,

the inverter unit and the DCDC converter are disposed at a bottom of the case,

the height of a portion of the upper portion of the case covering the DCDC converter is lower than the height of a portion of the upper portion of the case covering the inverter.

2. The inverter device according to claim 1,

the inverter unit includes a power supply board, a capacitor, and an inverter control board,

the capacitor is disposed on the power substrate,

the inverter control substrate is disposed on the capacitor.

3. The inverter device according to claim 1 or 2,

the upper part of the tank is inclined with respect to the bottom,

the inclination is an inclination that decreases from above the inverter unit to above the DCDC converter.

4. The inverter device according to any one of claims 1 to 3,

the side surface of the box body is provided with a power input part,

the voltage supplied from the power input section to the inverter device is supplied to the inverter section after being boosted by the DCDC converter.

5. The inverter device according to any one of claims 1 to 4,

the DCDC converter includes a DC reactor and a converter control unit,

the inverter device further includes a shielding material provided between the DC reactor and the converter control unit.

6. The inverter device according to any one of claims 1 to 5,

the inverter section has a first inverter section and a second inverter section,

the cooling flow path is branched into a first flow path and a second flow path before cooling the inverter unit,

the first flow path cools the first inverter section,

the second flow path cools the second inverter unit.

7. The inverter device according to claim 6,

the first flow path cools the DCDC converter after cooling the first inverter unit,

the second flow path cools the DCDC converter after cooling the second inverter unit.

8. The inverter device according to any one of claims 1 to 7,

the bottom of the case has a first bottom and a second bottom formed at a lower position than the first bottom,

the inverter unit is mounted on the first bottom portion,

the DCDC converter is mounted on the second base.

9. The inverter device according to any one of claims 1 to 8,

the first inverter unit is an inverter unit for controlling a driving motor,

the second inverter unit is an inverter unit that controls a motor for power generation.

10. An inverter device, comprising:

an inverter circuit including a power supply board and an inverter control board;

a capacitor;

a case that houses the inverter circuit and the capacitor; and

a cooling flow path formed in a bottom portion of the case and cooling the inverter circuit and the capacitor,

it is characterized in that the preparation method is characterized in that,

the case has a bottom, a side surface portion rising from the bottom, and an upper portion closing an upper opening of the side surface portion,

the inverter circuit and the capacitor are disposed at the bottom of the case,

the height of a portion of the upper portion of the case that covers the capacitor is lower than the height of a portion that covers the inverter circuit.

11. The inverter device according to claim 10,

the inverter control substrate is disposed on the power substrate.

12. The inverter device according to claim 10 or 11,

the upper part of the tank is inclined with respect to the bottom,

the inclination is an inclination that decreases from above the inverter circuit toward above the capacitor.

13. The inverter device according to any one of claims 10 to 12,

the inverter circuit has a first inverter circuit and a second inverter circuit,

the cooling flow path is branched into a first flow path and a second flow path before cooling the first inverter circuit and the second inverter circuit,

the first flow path cools the first inverter circuit,

the second flow path cools the second inverter circuit.

14. The inverter device according to claim 13,

the first flow path cools the capacitor after cooling the first inverter circuit,

the second flow path cools the capacitor after cooling the second inverter circuit.

15. The inverter device according to any one of claims 10 to 14,

the inverter circuit is mounted on the first bottom portion,

the capacitor is mounted on the second bottom.

16. The inverter device according to any one of claims 10 to 15,

the first inverter circuit is an inverter circuit for controlling a driving motor,

the second inverter circuit is an inverter circuit that controls a motor for power generation.

17. The inverter device according to any one of claims 1 to 16,

and a connector part connected with the motor is arranged at the bottom of the box body.