CN111832380A

CN111832380A - Sensor module, electronic equipment and assembling method

Info

Publication number: CN111832380A
Application number: CN201911053111.8A
Authority: CN
Inventors: 刘清文; 李亚培
Original assignee: Vkansee Beijing Technology Co ltd
Current assignee: Vkansee Beijing Technology Co ltd
Priority date: 2019-04-15
Filing date: 2019-10-31
Publication date: 2020-10-27
Also published as: CN211604129U

Abstract

The application discloses a sensor module, an electronic device and an assembling method of the sensor module. The sensor module comprises a base material structure, a fixing frame, a photoelectric conversion component and a light path structure component; the substrate structure comprises at least one lead arranged in a substrate, one end of the lead is connected with the photoelectric conversion element, the other end of the lead is used for being connected with the printed circuit board, and one end connected with the photoelectric conversion element and the other end connected with the printed circuit board are arranged on the surface of the same side of the substrate; the fixing frame is arranged on one side of the base material where two ends of the lead are positioned; the photoelectric conversion component is arranged in the fixed frame; the light path structure component is arranged on the photoelectric conversion component; the fixed frame is filled with protective glue, and the base material structure, the photoelectric conversion component and the light path structure component are packaged into a whole by the fixed frame and the protective glue. Adopt this sensor module, reduced the whole height of subassembly to protect parts such as photoelectric conversion components and parts and metal wire wherein better.

Description

Sensor module, electronic equipment and assembling method

This application claims priority to a chinese patent application filed by the chinese bureau of china on 15/04 in 2019 and having application number 201910300583.2, the entire contents of which are incorporated herein by reference.

Technical Field

The application relates to the technical field of sensor modules, in particular to a sensor module, electronic equipment and an assembling method of the sensor module.

Background

At present, electronic devices, such as mobile phones and tablet computers, are often equipped with a sensor module, such as a fingerprint module, for capturing and recognizing biometric images of a user, such as a fingerprint.

Referring to fig. 1, fig. 1 is a schematic structural diagram of a general fingerprint module and its associated components. The fingerprint module 91 for collecting a fingerprint image of a user includes a substrate 911, a fingerprint sensor 912, an infrared filter 913, and a molding compound 914. Fingerprint sensor 912 sets up on substrate 911, and infrared filter 913 sets up on fingerprint sensor 912, and mould material 914 encapsulates the three into a whole, namely obtains fingerprint module 91. The lower surface of the mold 914 is connected to the printed circuit board 93 through the bonding pad 92, so that the electrical signal of the fingerprint sensor 912 can be transmitted to the printed circuit board 93 through the conducting wire penetrating from the upper surface of the substrate 911 to the lower surface of the substrate 911, and the printed circuit board 93 can process the electrical signals to identify the fingerprint image.

The whole of the mounted sensor module and the printed circuit board can be called an assembly, and the thickness of the assembly is large. If the thin-type electronic device is applied to an electronic device with a high requirement on thickness, such as an ultra-thin mobile phone, the thickness of the assembly can hinder the implementation of the thin-type electronic device. Therefore, the thickness of the existing assembly is large, which results in a large overall thickness or partial thickness of the electronic device employing the assembly.

To solve this problem, the inventors of the present application have previously developed a new sensor module having a smaller thickness of an assembly of the sensor module and a printed circuit board. However, there is still room for improvement in the packaging of the sensor module.

Disclosure of Invention

The application is providing a sensor module, when sensor module and printed circuit board install together, can reduce the thickness of built-up member, and then lays the basis for ultra-thin type electronic equipment's realization to improve this sensor module's encapsulation mode on this basis, thereby protect the photoelectric conversion components and parts in the sensor module better, and rather than metal wires such as wire and connecting wire that are relevant.

In a first aspect, the application provides a sensor module, which comprises a base material structure, a fixed frame, a photoelectric conversion component and a light path structure component; wherein the content of the first and second substances,

the substrate structure comprises at least one lead arranged in a substrate, one end of the lead is connected with the photoelectric conversion element, the other end of the lead is used for being connected with the printed circuit board, and the end connected with the photoelectric conversion element and the other end connected with the printed circuit board are arranged on the surface of the same side of the substrate;

the fixing frame is arranged on one side of the base material where two ends of the conducting wire are located;

the photoelectric conversion element is arranged in the fixed frame;

the light path structural component is arranged on the photoelectric conversion component;

the fixed frame is filled with protective glue, and the base material structure, the photoelectric conversion component and the light path structure component are packaged into a whole by the fixed frame and the protective glue.

With reference to the first aspect, in a first possible implementation manner of the first aspect, the protective glue is a silica gel.

With reference to the first aspect and the foregoing possible implementation manners, in a second possible implementation manner of the first aspect, the protective glue is made of a transparent material; and/or the fixing frame is made of plastic.

With reference to the first aspect and the possible implementations described above, in a third possible implementation of the first aspect, at least two wires are disposed in the base material; wherein the content of the first and second substances,

at least one wire is a first wire, and one end of the first wire is connected with the first side of the photoelectric conversion component;

the second side of the photoelectric conversion component is opposite to the first side, at least one wire is a second wire, and one end of the second wire is connected with the second side.

With reference to the first aspect and the foregoing possible implementations, in a fourth possible implementation of the first aspect, at least one of the second conductive lines is disposed above the first conductive line in the substrate.

With reference to the first aspect and the foregoing possible implementation manners, in a fifth possible implementation manner of the first aspect, in the substrate, a connection line between one end and the other end of at least one first conducting wire is parallel to a connection line between one end and the other end of a second conducting wire.

With reference to the first aspect and the foregoing possible implementation manners, in a sixth possible implementation manner of the first aspect, in the substrate, connecting lines of one end and the other end of each of the first conductive lines are parallel to each other; and/or the presence of a gas in the gas,

and connecting lines of one end and the other end of each second lead are parallel to each other.

With reference to the first aspect and the foregoing possible implementation manners, in a seventh possible implementation manner of the first aspect, in the substrate, a connection line between one end and the other end of each of the first conductive lines and a connection line between one end and the other end of each of the second conductive lines are parallel to each other.

With reference to the first aspect and the foregoing possible implementation manners, in an eighth possible implementation manner of the first aspect, when the sensor module is mounted on a printed circuit board, the printed circuit board and the photoelectric conversion component are located on the same side of the substrate, and are connected to the other end of the wire.

With reference to the first aspect and the foregoing possible implementation manners, in a ninth possible implementation manner of the first aspect, the printed circuit board is a flexible printed circuit board.

With reference to the first aspect and the possible implementations described above, in a tenth possible implementation of the first aspect, the printed circuit board is connected to the other end of the wire through a pad; the sum of the heights of the bonding pad and the printed circuit board is less than or equal to the sum of the heights of the photoelectric conversion component and the optical path structural component.

With reference to the first aspect and the foregoing possible implementation manners, in an eleventh possible implementation manner of the first aspect, the sensor module is applied to an electronic device having a display screen, a small hole layer is disposed in the display screen, at least one small hole for small hole imaging is disposed in the small hole layer, and the sensor module is disposed below the at least one small hole.

With reference to the first aspect and the foregoing possible implementation manners, in a twelfth possible implementation manner of the first aspect, an air layer is spaced between the aperture layer and the optical path structure component of the sensor module.

With reference to the first aspect and the foregoing possible implementation manners, in a thirteenth possible implementation manner of the first aspect, a circle of glue is coated on the upper surface of the fixing frame, and the small hole layer is disposed on the glue, so that an air layer is formed between the small hole layer and the optical path structure component.

With reference to the first aspect and the foregoing possible implementation manners, in a thirteenth possible implementation manner of the first aspect, the optical path structure component includes an infrared-resistant coating, and the infrared-resistant coating covers the photoelectric conversion component.

In a second aspect, the application provides a sensor module, which includes a photoelectric conversion component and an optical path structural component; wherein the content of the first and second substances,

the back surface of the photoelectric conversion component is provided with at least one electric contact point, the at least one electric contact point is used for being connected with a printed circuit board, and the at least one electric contact point is connected with a circuit in the photoelectric conversion component, so that an electric signal output by the photoelectric conversion component is transmitted to the printed circuit board through the at least one electric contact point;

the light path structure component is arranged on the photoelectric conversion component.

With reference to the second aspect, in a first possible implementation manner of the second aspect, the back surface of the photoelectric conversion component is provided with at least one line outlet, the line outlet is connected to a line inside the photoelectric conversion component, and the line outlet is connected to the electrical contact point through a conducting line located on the back surface of the photoelectric conversion component.

With reference to the second aspect and the foregoing possible implementation manners, in a second possible implementation manner of the second aspect, the at least one line outlet includes at least one first line outlet and at least one second line outlet, and the at least one first line outlet and the at least one second line outlet are located on two sides of the electrical contact point; the electrical contacts include a first contact and a second contact; the conducting lines comprise a first conducting line and a second conducting line;

the first line outlet is connected to the first contact point via the first conducting line, and the second line outlet is connected to the second contact point via the second conducting line.

With reference to the second aspect and the foregoing possible implementation manners, in a third possible implementation manner of the second aspect, the optical path structure component includes an infrared-resistant coating, and the infrared-resistant coating covers the photoelectric conversion element.

In a third aspect, the present application provides an electronic device including the sensor module of any one of the first aspect or the second aspect.

In a fourth aspect, the present application provides a method for assembling a sensor module, where the sensor module is any one of the sensor modules of the first aspect; the method comprises the following steps:

fixing the fixing frame and the photoelectric conversion component on the base material structure respectively, and fixing the light path structure component on the photoelectric conversion component; the photoelectric conversion component is connected with one end of a lead in the substrate structure;

and the fixing frame is filled with protective glue, so that the base material structure, the photoelectric conversion component and the light path structure component are packaged into a whole by the fixing frame and the protective glue.

With reference to the fourth aspect, in a first possible implementation manner of the fourth aspect, the method further includes:

and connecting a printed circuit board with the other end of the lead in the base material, wherein the printed circuit board and the other end of the lead are positioned on the same side of the base material.

In a fifth aspect, the present application provides a method for assembling a sensor module, wherein the sensor module is any one of the sensor modules of the second aspect; the method comprises the following steps:

and connecting at least one electric contact point on the back surface of the photoelectric conversion component of the sensor module with the printed circuit board.

With reference to the fifth aspect, in a first possible implementation manner of the fifth aspect, the method further includes:

and covering an anti-infrared coating on the front surface of the photoelectric conversion component.

In the sensor module, the conducting wire in the substrate structure no longer penetrates through the upper surface and the lower surface of the substrate, and two ends of the conducting wire are not respectively positioned on the upper surface and the lower surface of the substrate but positioned on the same side surface of the substrate. Therefore, the photoelectric conversion components connected with the two ends of the lead and the printed circuit board can be arranged on the same side of the substrate, and the overall height of the assembly obtained through assembly is reduced. The sensor module in the embodiment is applied to the electronic equipment, so that the ultra-thin electronic equipment can be realized. Simultaneously, this application improves the packaging mode of this sensor module, adopts fixed frame and protection to glue and encapsulates, has many-sided beneficial effect. First, fixed frame and protection glue can fix the relative position of photoelectric conversion components and parts, light path structure subassembly and substrate, the whole application of being convenient for. And secondly, the fixing frame and the protective glue can isolate parts such as photoelectric conversion components from the outside, so that the sensor module is protected, and the parts such as the photoelectric conversion components are prevented from being polluted and damaged by substances in the environment, and the normal work of the sensor module is influenced. Thirdly, the protective glue can also help the sensor module to dissipate heat during working. Fourthly, because the protective adhesive is soft, the protective adhesive is in a jelly shape after being cured, has certain elasticity, can play a role in buffering, can better protect photoelectric conversion components and parts such as metal wires in the sensor module, and avoids the components from being damaged under the action of external force.

Drawings

In order to more clearly explain the technical solution of the present application, the drawings in the embodiments will be briefly described below.

FIG. 1 is a schematic diagram of a fingerprint module and its associated components in the prior art;

FIG. 2 is a side view of one embodiment of a sensor module and printed circuit board of the present application;

fig. 3a is a schematic perspective view of one embodiment of a sensor module according to the present application;

fig. 3b is a schematic perspective view of the sensor module shown in fig. 3a after the fixing frame and the protective adhesive are removed;

FIG. 4 is a perspective view of one of the embodiments of the substrate structure of the present application;

fig. 5a is a schematic perspective view of a second embodiment of a sensor module according to the present application;

FIG. 5b is a schematic perspective view of the sensor module shown in FIG. 5a after the fixing frame and the protective adhesive are removed;

FIG. 6 is a perspective view of a second embodiment of a substrate structure of the present application;

FIG. 7 is a perspective view of a third embodiment of a substrate structure according to the present application;

FIG. 8 is a side view of one of the embodiments of the electronic device of the present application;

FIG. 9 is a side view of a third embodiment of a sensor module of the present application after assembly with a printed circuit board;

fig. 10a is a schematic perspective view of a third embodiment of a sensor module according to the present application;

fig. 10b is a schematic perspective view of the sensor module shown in fig. 10a after the fixing frame and the protective adhesive are removed;

FIG. 11 is a side view of a fourth embodiment of the sensor module of the present application after assembly with a printed circuit board;

FIG. 12 is a perspective view of a fourth embodiment of a sensor module of the present application after assembly with a printed circuit board;

fig. 13 is a perspective view of one embodiment of a photoelectric conversion device of the sensor module according to the present application;

fig. 14 is a side view of a second embodiment of the electronic device of the present application.

Description of reference numerals:

FIG. 1: a fingerprint module 91; a substrate 911; a fingerprint sensor 912; an infrared filter 913; a mold material 914; a pad 92; a printed circuit board 93.

Fig. 2 to 14: a substrate 1; a wire 2; a first conductive line 21; one end 211 of the first conductive line; the other end 212 of the first wire; a second conductive line 22; one end 221 of the second wire; the other end 222 of the second wire; a photoelectric conversion element 3; a first side 31; a second side 32; a back surface 33; a front face 34; electrical contact points 35; the first contact points 351; a second contact point 352; a first port 361; a second port 362; a conducting line 37; a first conductive line 371; a second conductive line 372; an internal wiring 38; an optical path structure component 4; an infrared ray resistant coating 41; a fixed frame 51; a protective adhesive 52; a pad 6; a printed circuit board 7; a connecting line 81;

adhesive layers

82, 83; a display screen 100; a small pore layer 101; an aperture 1011; a light-transmitting portion 1021; a capacitor 11; a stress balance member 12.

Detailed Description

The following provides a detailed description of the embodiments of the present application.

Referring to fig. 2 to 7, a sensor module is provided in a first embodiment of the present application. The sensor module comprises a base material structure, a fixing frame 51, a photoelectric conversion component 3 and a light path structure component 4. The substrate structure comprises at least one lead 2 arranged in a substrate 1, one end of the lead 2 is connected with the photoelectric conversion component 3, the other end of the lead 2 is used for being connected with a printed circuit board 7, and one end connected with the photoelectric conversion component 3 and the other end connected with the printed circuit board 7 are arranged on the same side surface of the substrate 1. The fixing frame 51 is provided on the side of the base material 1, which is also the side where both ends of the lead 2 are located. The photoelectric conversion component 3 is provided in the fixing frame 51. The light path structure component 4 is disposed on the photoelectric conversion component 3. The fixing frame 51 is filled with a protective adhesive 52, and the base material structure, the photoelectric conversion component 3 and the optical path structure component 4 are integrally packaged by the fixing frame 51 and the protective adhesive 52.

In the above-described substrate structure, the lead 2 may be provided inside the substrate 1, and only both ends of the lead exposed on the surface of the substrate 1 may be provided on the upper surface or the lower surface of the substrate 1 as a whole. The wire 2 provided in the substrate 1 in the present application may include any of the above-described implementations. It should be noted that the wires 2 disposed in the substrate 1 may be arranged in a straight line or may be disposed in a bent manner, and this is not limited herein.

In the above substrate structure, the wires 2 no longer penetrate through the upper and lower surfaces of the substrate 1, and the two ends of the wires 2 are no longer respectively located on the upper and lower surfaces of the substrate 1, but located on the same side surface of the substrate 1. When the substrate structure is used, the photoelectric conversion element 3 and the printed circuit board 7 can be arranged on the same side of the substrate 1, one end of the lead 2 is connected with the photoelectric conversion element 3, and the other end of the lead 2 is used for being connected with the printed circuit board 7. Alternatively, one end of the lead 2 may be connected to the photoelectric conversion element 3 through a connection line 81. Thus, the electrical signals output from the photoelectric conversion device 3 can be transmitted to the printed circuit board 7 through the wires 2, so that the printed circuit board 7 can process the electrical signals.

The photoelectric conversion device 3 is a device that converts an optical signal into an electrical signal. In the present application, an Image sensor such as a CMOS (Complementary Metal-Oxide-Semiconductor), cis (CMOS Image sensor), or CCD (Charge-coupled Device) may be used.

The light path structure component 4 is a component through which light can pass, and may be, for example, an infrared filter, an infrared glass, or the like. The optical path structure components may be used to provide image distance for pinhole imaging, and/or to control field angle by refractive index changes, etc.

The fixing frame 51 may be a rigid fixing frame, and for example, a plastic fixing frame may be used.

The protective adhesive 52 is a soft protective adhesive, and the protective adhesive has a packaging capability, a certain elasticity, and a certain buffering capability against external force. The protective gel is jelly-like in a state after curing. The protective glue used in the present application may be an existing protective glue, such as a silicone gel. Optionally, the protective adhesive may be made of a transparent material.

The photoelectric conversion component 3 and the optical path structure assembly 4 are both in the fixing frame 51. By filling the fixing frame 51 with the soft protective paste 52, the base material structure, the photoelectric conversion element 3, and the optical path structure assembly 4 can be packaged as a single body. At this time, the top surface of the road structure member 4 may be flush with the top surface of the fixed frame 51 or lower than the top surface of the fixed frame 51, so that the height of the entire sensor module is not additionally increased.

Adopt fixed frame and protection to glue to encapsulate in the sensor module of this application, have many-sided beneficial effect. First, fixed frame and protection glue can fix the relative position of photoelectric conversion components and parts 3, light path structure subassembly 4 and substrate 1, the whole application of being convenient for. And secondly, the fixing frame and the protective glue can isolate parts such as photoelectric conversion components from the outside, so that the sensor module is protected, and the parts such as the photoelectric conversion components are prevented from being polluted and damaged by substances in the environment, and the normal work of the sensor module is influenced. Thirdly, the protective glue can also help the sensor module to dissipate heat during working. Fourthly, as the protective glue is soft, is in a jelly shape after being cured, has certain elasticity and can play a role in buffering, photoelectric conversion components, metal wires and other parts in the sensor module can be better protected, and the parts are prevented from being damaged under the action of external force.

The height of the light path structure component 4 is h1, the height of the photoelectric conversion component 3 is h2, the height of the base material 1 is h3, and the height of the printed circuit board 7 is h 4. According to the original assembly method, the height of the assembly after the four assemblies are assembled together is (h1+ h2+ h3+ h4), and the height of the assembly after the four assemblies are assembled together is { h3+ max [ (h1+ h2), h4] }, so that the overall height of the assembly is reduced. The assembly is applied to the electronic device, so that the realization of an ultra-thin electronic device is possible.

In actual assembly, an adhesive layer 82 may be present between the photoelectric conversion element 3 and the substrate 1. Similarly, an adhesive layer 83 may also be present between the photoelectric conversion element 3 and the optical path structure member 4. The adhesive layer 82 may be formed using a conventional adhesive or the like, and may be formed using, for example, a water gel, a Die Attach Film (DAF), or the like. No matter the substrate structure in the prior art or the substrate structure in this embodiment is adopted, the heights of the bonding layer 82 and the bonding layer 83 are not changed after the assembly is completed, and therefore the existence of the bonding layer 82 and the bonding layer 83 does not affect the realization of the beneficial effects of the present application. Based on this, the height of the entire adhesive layer 82 and the photoelectric conversion element 3 may be regarded as h2, and the height of the entire adhesive layer 83 and the optical path structure member 4 may be regarded as h1, as shown in fig. 2.

It should be noted that, in actual assembly, the printed circuit board 7 and the other end of the lead 2 may be connected via a PAD 6 (PAD). The pads 6 may be implemented using conventional technology, for example, a land grid array package pad (LGAPAD) or the like may be used. Alternatively, as shown in the schematic diagram of fig. 2, the height of the land 6 is represented by h5, and the sum of the heights of the land 6 and the printed circuit board 7 (h4+ h5) is less than or equal to the sum of the heights of the photoelectric conversion component 3 and the optical path structure member 4 (h1+ h 2). In this case, the height of the assembly in the present embodiment is reduced (h4+ h5) as compared with the existing assembly. When (h4+ h5) > (h1+ h2), the overall height of the assembly is (h3+ h4+ h5), which is reduced compared to the conventional assembly (h1+ h 2).

In one example, the height h3 of the base material 1 is 150 μm, the height h2 of the photoelectric conversion element 3 is 170 μm, the height h1 of the optical path structure member 4 is 130 μm, the height h4 of the printed circuit board 7 is 250 μm, and the height h5 of the land 6 is 30-50 μm. If the substrate and the corresponding assembly method in the prior art are adopted, the height of the assembly after the sensor module and the printed circuit board are assembled is 730 μm and 750 μm. If the substrate structure and the corresponding assembly method in the present application are adopted, the height of the assembly is 450 μm, which is reduced by 280-300 μm. The height h2 of the photoelectric conversion component 3 includes the adhesive layer 82 between the substrate 1 and the photoelectric conversion component 3, and the height of the optical path structural member 4 includes the adhesive layer 83 between the optical path structural member 4 and the photoelectric conversion component 3.

In another example, the height h3 of the base material 1 is 50 μm, the height h2 of the photoelectric conversion element 3 is 80 μm, the height h1 of the optical path structure member 4 is 30 μm, the height h4 of the printed circuit board 7 is 28 μm, and the height h5 of the land 6 is 10 μm. If the prior art substrate and corresponding assembly method are used, the height of the assembly as a whole after the sensor module and the printed circuit board are assembled is 198 μm. If the substrate structure and corresponding assembly method of the present application is used, the overall height of the assembly is 160 μm, which is a reduction of 38 μm.

Referring to fig. 3a, fig. 3b and fig. 4, at least two wires 2 may be optionally disposed in the substrate 1. At least one of the conductive wires 2 is a first conductive wire 21, and one end 211 of the first conductive wire is connected to the first side 31 of the photoelectric conversion device 3. The second side 32 of the photoelectric conversion element 3 is disposed opposite to the first side 31. At least one of the wires 2 is a second wire 22, one end 221 of which is connected to the second side 32.

When being provided with many wires 2 in the substrate 1, through setting up the one end (211 and 221) of many wires 2 in the both sides of photoelectric conversion components and parts 3 to make arranging of many wires 2 more reasonable, be convenient for the production and the follow-up assembly of substrate structure.

Alternatively, referring to fig. 3b and fig. 4, when the wires 2 are disposed inside the substrate 1, at least one second wire 22 is disposed above the first wire 21 in the substrate 1, so as to make the arrangement of the wires 2 more reasonable.

It should be noted that, when the wires 2 are disposed inside the substrate 1, in order to make both ends of the first wire 21 and both ends of the second wire 22 on the same surface of the substrate 1, there may be a local curved line section near the surface of the substrate 1 where the first wire 21 and the second wire 22 are close to each other. The second conductive line 22 is disposed above the first conductive line 21 in this embodiment, which mainly means that the horizontal segment of the second conductive line 22 is disposed above the horizontal segment of the first conductive line 21.

It should also be noted that the first feature "on," "above," and "above" the second feature in this application includes the first feature being directly above and obliquely above the second feature, or merely indicating that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature includes the first feature being directly under and obliquely below the second feature, or simply means that the first feature is at a lower level than the second feature.

Alternatively, referring to fig. 4, when the wires 2 are disposed inside the substrate 1 and only two ends of the wires are exposed on the surface of the substrate 1, a connection line L1 between one end 211 of at least one first wire and the other end 212 of the first wire is parallel to or overlaps with a connection line L2 between one end 221 of at least one second wire and the other end 222 of the second wire. When at least one L1 and at least one L2 overlap, it indicates that at least one second conductive line 22 is directly above the first conductive line 21.

It should be understood that in fig. 3a to 7, in order to avoid the situation that the plurality of first wires 21 and the plurality of second wires 22 are all drawn in the figures to cause excessively messy structures, only one first wire 21 and one second wire 22 are schematically drawn. In practice, a first wire exists between one end 211 of each pair of first wires and the other end 212 of the first wires; a second wire is present between one end 221 of each pair of second wires and the other end 222 of the second wire.

Alternatively, referring to fig. 7, when the wires 2 are entirely disposed on the surface of the substrate 1, a connection line L1 between one end 211 of at least one first wire and the other end 212 of the first wire is parallel to a connection line L2 between one end 221 of at least one second wire and the other end 222 of the second wire.

Referring to fig. 3b, fig. 4 and fig. 7, optionally, when a plurality of first conductive lines 21 are disposed in the substrate 1, a connecting line L1 between one end 211 of each first conductive line and the other end 212 of each first conductive line is parallel to each other. In this case, the heights of the plurality of first wires 21 in the substrate 1 may be the same or different, and the present application does not limit this.

Alternatively, when a plurality of second conductive lines 22 are provided in the substrate 1, the connecting line L2 of one end 221 of each second conductive line and the other end 222 of the second conductive line is parallel to each other. In this case, the heights of the plurality of second wires 22 in the substrate 1 may be the same or different, and the present application does not limit this.

The above-described conductor arrangements may also be combined with each other. In different application scenes, different lead arrangement modes can be set for the substrate structure so as to facilitate the production and subsequent assembly of the substrate structure.

Alternatively, referring to fig. 5a to 7, when the substrate 1 is provided with a plurality of first conductive lines 21 and a plurality of second conductive lines 22, each L1 and each L2 may also be parallel to each other, that is, all L1 and all L2 are parallel to each other. At this time, since the first wires 21 and the second wires 22 are staggered in the horizontal position in the substrate 1, the heights of the first wires 21 and the second wires 22 in the substrate 1 may be the same or different, and the arrangement of the wires may be specifically set according to different practical application scenarios or the convenience requirement of substrate structure processing.

Alternatively, when a plurality of first conductive lines 21 and a plurality of second conductive lines 22 are provided in the substrate 1, the first conductive lines 21 and the second conductive lines 22 may be staggered in a horizontal position, as shown in fig. 5a to 7.

Furthermore, the first lines 21 and the second lines 22 may also be arranged in sections, i.e. all first lines 21 are arranged in one horizontal section and all second lines 22 are arranged in another horizontal section.

Alternatively, the printed circuit board 7 may be a rigid printed circuit board or a flexible printed circuit board (FPC). The flexible printed circuit board is flexible and thin, so that the sum of the heights of the printed circuit board and the soldering pad is kept at the height of and below the photoelectric conversion component and the optical path structure component.

Optionally, referring to fig. 8, the sensor module may be applied to an electronic device having a display screen 100, the display screen 100 is provided with a small hole layer 101, the small hole layer 101 is provided with at least one small hole 1011 for small hole imaging, and the sensor module is disposed below the at least one small hole 1011. Thus, light rays above the display screen 100 pass through the small holes 1011 and pass through the optical path structure component 4, and form image spots on the photoelectric conversion component 3 according to the principle of small hole imaging. The photoelectric conversion component 3 outputs the image spots in the form of electric signals so as to process the electric signals subsequently to form an image, thereby completing the image acquisition process. The sensor module is applied to electronic equipment and can be used for collecting biological characteristic images such as fingerprints, palm prints and human faces.

Optionally, a light-transmitting portion 1021 is correspondingly disposed above the small hole 1011 in the small hole layer 101, so that light can pass through other structures above the small hole layer 101, such as a liquid crystal layer, an optical film, etc., and then pass through the small hole 1011 to reach the sensor module. The light-transmitting portion 1021 and the small hole 1011 may have the same or different sizes, and the present application does not limit the same.

The aperture layer 101 and the optical path structure component 4 may be closely attached to each other, or may be separated by a thin air layer, which is not limited in the present application. When the sensor module and the display screen with the above structure are installed, a circle of glue (not shown in the figure) can be coated on the upper surface of the fixing frame 51, and air is left in the glue circle. The small hole layer is provided on the glue, so that an air layer is formed between the small hole layer 101 and the optical path structural member 4, thereby spacing the small hole layer 101 from the optical path structural member 4. When an air layer is arranged between the small hole layer 101 and the optical path structure component 4, due to the change of the refractive index, part of stray light in the light passing through the small hole 1011 can disappear, and the influence of the stray light on image acquisition is avoided.

Alternatively, in the sensor module, other common components may be disposed on the substrate 1. For example, referring to fig. 8, a capacitor 11 is further disposed on the substrate 1. For another example, a stress balance member 12 is further provided on the base material 1, and the material of the stress balance member 12 may be the same as or similar to that of the photoelectric conversion element 3. The sensor module may be cut or cooled during the process of processing and mounting, at this time, the interconnected photoelectric conversion device 3 and the substrate 1 are easily deformed to generate stress, and the stress balancing member 12 may balance the stress between the photoelectric conversion device 3 and the substrate 1. These two components are packaged together with the base material structure, the photoelectric conversion component 3, and the optical path structure assembly 4 by the fixing frame 51 and the protective adhesive 52.

As described above, the light path structure member 4 is a member through which light can pass. Referring to fig. 9 to 10b, optionally, the optical path structure element 4 may include an infrared-resistant coating (IR cut coating)41, and the infrared-resistant coating 41 may cover the photoelectric conversion element 3 by evaporation or the like, that is, cover the surface of the front surface 34 of the photoelectric conversion element 3.

The infrared-resistant coating 41 may be formed by using an existing infrared-resistant material and by using processes such as vapor deposition and spray coating, and the material and the forming process of the infrared-resistant coating are not limited in the present application.

The thickness of the infrared ray resistant coating 41 itself is small, typically, a few tenths of micrometers to two micrometers, and the infrared ray resistant coating 41 can be attached to the photoelectric conversion element 3 without being fixed by an adhesive layer. Therefore, the thickness of the optical path structure component can be reduced by adopting the scheme of the anti-infrared coating. Suitably, the height of the fixing frame 51 and the protective glue 52 can be reduced accordingly, so that they are flush with the infrared-resistant coating 41 or slightly lower than the infrared-resistant coating 41. In this way, the thickness of the sensor module and thus the entire assembly can be further reduced.

In one example, the height h3 of the base material 1 is 50 μm, the height h2 of the photoelectric conversion element 3 is 80 μm, the height h6 of the infrared ray resistant coating 41 is 1 μm, the height h5 of the printed circuit board 7 is 28 μm, and the height h5 of the land 6 is 10 μm. Thus, the height of the assembly after assembly was 131 μm overall, which was further reduced by about 30 μm compared to the 160 μm example described above.

It should be noted that the optical path structure component may only include the infrared-resistant coating, and may also include other possible components. When the optical path structure component only includes the anti-infrared coating, it is not sufficient to provide an image distance for pinhole imaging because the thickness of the anti-infrared coating itself is small. To this end, in one implementation, the image distance for pinhole imaging may be provided by a sensor module or other possible component or assembly in the electronic device.

Referring to fig. 8, in a second embodiment of the present application, an electronic device is provided, which includes any one of the sensor modules in the first embodiment. Optionally, the electronic device may further include a display screen 100, wherein a small hole layer 101 is disposed in the display screen 100, one or more small holes 1011 for small hole imaging are disposed in the small hole layer 101, and the sensor module is disposed below the one or more small holes 1011. Thus, light can pass through the aperture 1011 to reach the sensor module and be converted into an electrical signal by the sensor module.

The electronic device may further include a printed circuit board 7, the printed circuit board 7 being connected to the other ends of the wires (e.g., the other end 212 of the first wire and the other end 222 of the second wire) in the substrate 1, and the printed circuit board 7 being on the same side of the substrate 1 as the other ends of the wires (e.g., the other end 212 of the first wire and the other end 222 of the second wire). That is, the printed circuit board 7 is on the same side of the substrate 1 as the photoelectric conversion element 3 and the optical path structure component 4.

Since the electronic device includes any one of the sensor modules, the electronic device has the beneficial effects of the sensor module, and the description thereof is omitted.

In a third embodiment of the present application, a method of assembling a sensor module is provided. The sensor module here is any one of the sensor modules in the first embodiment described above. The installation method comprises the following steps:

s100: fixing the fixing frame and the photoelectric conversion component on the base material structure respectively, and fixing the light path structure component on the photoelectric conversion component; the photoelectric conversion component is connected with one end of a lead in the substrate structure;

s200: and the fixing frame is filled with protective glue, so that the base material structure, the photoelectric conversion component and the light path structure component are packaged into a whole by the fixing frame and the protective glue.

The sensor module and the printed circuit board can refer to the related description in the first embodiment, and are not described herein again.

By adopting the assembly method of the sensor module, the base material 1, the fixing frame 51, the photoelectric conversion component 3 and the optical path structural component 4 of the sensor module can be firstly installed and fixed, and then the fixing frame 51 is filled with the protective adhesive 52, so that the components are assembled into a whole, and the industrial installation and use are conveniently realized.

Further, the method may further comprise the steps of:

s300: and connecting a printed circuit board with the other end of the lead in the base material, wherein the printed circuit board and the other end of the lead are positioned on the same side of the base material.

By the method, the sensor module and the printed circuit board can be conveniently installed together, and industrial installation is convenient to realize. The mounted sensor module and the printed circuit board can be regarded as a whole, i.e. an assembly. When the assembly is applied to electronic equipment, the assembly is integrally installed in the electronic equipment, and the installation process is very convenient. Compared with the prior art, the overall height of the assembled part after being installed is greatly reduced, so that a foundation is laid for realizing the ultrathin electronic equipment.

In order to further reduce the overall thickness of the assembly, please refer to fig. 11 to 13, another sensor module is provided in a fourth embodiment of the present application. The sensor module comprises a photoelectric conversion component 3 and a light path structure component; wherein the back surface 33 of the photoelectric conversion component 3 is provided with at least one electrical contact point 35. These electrical contacts 35 are connected to the wiring 38 inside the photoelectric conversion element 3. When the sensor module is assembled with the printed circuit board 7, the printed circuit board 7 is connected with the photoelectric conversion element 3 through the electric contact points 35, so that the electric signals output by the photoelectric conversion element 3 can be transmitted to the printed circuit board 7 through the electric contact points 35, and the printed circuit board 7 can process the electric signals. The light path structure component is arranged on the photoelectric conversion component 3.

The above optical path structure components can refer to the related description in the first embodiment, and are not described herein again. Alternatively, the optical path structure component may include an infrared-ray-resistant coating 41, and the infrared-ray-resistant coating 41 covers the photoelectric conversion component 3, that is, the surface of the front surface 34 of the photoelectric conversion component 3, thereby reducing the thickness of the sensor module and the entire assembly.

As described in the first embodiment, the photoelectric conversion device 3 is a device that converts an optical signal into an electrical signal, and an image sensor such as a CMOS, CIS, or CCD may be used in the present application.

For the general photoelectric conversion component 3, for the convenience of wiring, a connection line is generally led out from the front surface 34 or the side surface of the photoelectric conversion component 3, so as to connect with other components in the sensor module, as shown in fig. 3b and 10 b. In the present embodiment, in order to reduce the overall thickness of the assembly, the base material structure is omitted, and the fixing frame and the protective adhesive for integrally packaging the photoelectric conversion device 3 and the optical path structural component are omitted. Meanwhile, by improving the structure of the photoelectric conversion component 3, that is, by providing the electrical contact points 35 on the back surface 33 of the photoelectric conversion component 3 and connecting the electrical contact points with the circuit 38 inside the photoelectric conversion component 3, the photoelectric conversion component 3 can be directly connected with the printed circuit board 7 without being indirectly connected through a wire inside the substrate structure. Since the base material structure and the adhesive layer are omitted, the overall thickness of the sensor module in this embodiment is smaller than that in the related art.

In actual assembly, the electrical contact points 35 may be electrically connected to the printed circuit board 7 through bonding pads, or the photoelectric conversion device 3 may be electrically connected to the printed circuit board 7 through an adhesive layer, so that the electrical contact points 35 of the photoelectric conversion device 3 are electrically connected to the printed circuit board 7.

Referring to fig. 11, the thickness of the ir-resistant coating 41 is h 6. When the optical path structure component includes only the infrared-resistant coating 41, the thickness of the optical path structure component is h 6. The height of the photoelectric conversion component 3 is h2, the height of the printed circuit board 7 is h4, and the height of the land 6 is h 5. The height of the assembly after assembly is (h6+ h2+ h4+ h5) and the thickness is smaller compared to the prior art assembly. The assembly is applied to the electronic device, so that the realization of an ultra-thin electronic device is possible. In addition, since the thickness of the base material structure is generally larger than the thickness of the printed circuit board 7 and the pad 6, the overall thickness of the sensor module in this embodiment is also smaller than that in the first embodiment.

In one example, the height h6 of the infrared ray cut-off 41 is 1 μm, the height h2 of the photoelectric conversion element 3 is 80 μm, the height h4 of the printed circuit board 7 is 28 μm, and the height h5 of the land 6 is 10 μm. The overall height of the assembled assembly, after assembly, is 119 μm, which is a reduction of about 80 μm compared to 198 μm in the prior art, and a further reduction of 12 μm compared to the 131 μm example described above.

Referring to fig. 13, optionally, the back surface 33 of the photoelectric conversion component 3 is provided with at least one line outlet, the line outlet is connected with a line 38 inside the photoelectric conversion component 3, and the line outlet is connected with the electric contact point 35 through a conducting line 37 located on the back surface 33 of the photoelectric conversion component 3. The conductive line 37 on the rear surface 33 of the photoelectric conversion component 3 may be a circuit or the like provided on the front surface of the rear surface 33, and the thickness thereof is generally negligible.

The line outlet described above has a function of connecting the line 38 inside the photoelectric conversion element 3 and the external conducting line 37. In practical implementation, holes of different forms such as via holes, through holes, or blind holes may be formed on the back surface 33 of the photoelectric conversion device 3. These holes may serve as passages for the wiring 38 inside the photoelectric conversion element 3 to pass through the holes and be connected to the external via wiring 37, or for the internal wiring 38 and the external via wiring 37 to be connected inside the holes.

All the lines 38 inside the photoelectric conversion component 3 are directly connected to the electrical contact points 35, and the design requirement for the lines 38 inside the photoelectric conversion component 3 is high. Through the external conducting circuit 37 on the back 33 of the photoelectric conversion component 3, part of circuits which need to be designed inside the photoelectric conversion component 3 originally can be moved to the outside of the photoelectric conversion component 3, and the circuit design is more convenient.

Optionally, referring to fig. 13, in one implementation, the line outlet may include at least one first line outlet 361 and at least one second line outlet 362. The first line outlet 361 and the second line outlet 362 are located at both sides of the electrical contact point 35. The electrical contacts 35 include a first contact point 351 and a second contact point 352. The conductive line 37 includes a first conductive line 371 and a second conductive line 372. The first line outlet 361 is connected to the first contact point 351 through a first conduction line 371, and the second line outlet 362 is connected to the second contact point 352 through a second conduction line 372.

Through setting up the circuit export, switching on circuit and electrical contact, for arranging of 3 internal lines of photoelectric conversion components and parts provides convenience, simultaneously, also be convenient for photoelectric conversion components and parts 3's design, industrial production and follow-up assembly.

Referring to fig. 14, in a fifth embodiment of the present application, an electronic device is provided, which includes any one of the sensor modules in the fourth embodiment. Optionally, the electronic device may further include a display screen 100, wherein a small hole layer 101 is disposed in the display screen 100, one or more small holes 1011 for small hole imaging are disposed in the small hole layer 101, and the sensor module is disposed below the one or more small holes 1011. Thus, light can pass through the aperture 1011 to reach the sensor module and be converted into an electrical signal by the sensor module. Optionally, the electronic device may further include a printed circuit board 7, and the printed circuit board 7 is connected to the electrical contact points 35 of the photoelectric conversion element 3.

Since the electronic device includes any one of the sensor modules in the fourth embodiment, the electronic device has the beneficial effects of the sensor module, which are not described herein again.

In a sixth embodiment of the present application, a method of assembling a sensor module is provided. The sensor module here is any one of the sensor modules in the fourth embodiment described above. The installation method comprises the following steps:

s400: and connecting at least one electric contact point on the back surface of the photoelectric conversion component of the sensor module with the printed circuit board.

Further, the method may further comprise the steps of:

s500: and covering an anti-infrared coating on the front surface of the photoelectric conversion component.

The sensor module, the printed circuit board, and the like can refer to the description related to the fourth embodiment, and are not described herein again.

The term "plurality" in this specification means two or more unless otherwise specified. In the embodiments of the present application, the words "first", "second", and the like are used to distinguish the same items or similar items having substantially the same functions and actions. Those skilled in the art will appreciate that the terms "first," "second," etc. do not denote any order or quantity, nor do the terms "first," "second," etc. denote any order or importance.

It should be understood that in the description of the present application, the terms "upper", "lower", "front", "rear", "left", "right", "top", "bottom", "inner", "outer", and the like indicate orientations or positional relationships based on those shown in the drawings, and are only for convenience of description, and do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed in a particular orientation, and be operated, and thus, should not be construed as limiting the present application.

It should be understood that, in the various embodiments of the present application, the execution sequence of each step should be determined by its function and inherent logic, and the size of the sequence number of each step does not mean the execution sequence, and does not limit the implementation process of the embodiments. For example, the step of S400 in the aforementioned sixth embodiment may be executed before the step of S500, or may be executed after the step, which is not limited in this application.

It should be understood that like parts are referred to each other in this specification for the same or similar parts between the various embodiments. In particular, as for the embodiments of the electronic device and the assembly method, since they are substantially similar to the embodiments of the sensor module, the description is relatively simple, and in relation to this, reference may be made to the description of the embodiments of the method. The above-described embodiments of the present invention should not be construed as limiting the scope of the present invention.

Claims

1. A sensor module is characterized by comprising a base material structure, a fixing frame, a photoelectric conversion component and a light path structure component; wherein the content of the first and second substances,

the photoelectric conversion element is arranged in the fixed frame;

2. The sensor module of claim 1, wherein the protective gel is a silicone gel.

3. The sensor module of claim 1, wherein the protective adhesive is transparent; and/or the fixing frame is made of plastic.

4. The sensor module according to claim 1, wherein at least two wires are provided in the substrate; at least one wire is a first wire, and one end of the first wire is connected with the first side of the photoelectric conversion component; the second side of the photoelectric conversion component is opposite to the first side, at least one wire is a second wire, and one end of the second wire is connected with the second side.

5. The sensor module according to claim 4, wherein at least one of the second conductive lines is disposed above the first conductive line in the substrate; alternatively, the first and second electrodes may be,

in the substrate, a connecting line of one end and the other end of at least one first conducting wire is parallel to a connecting line of one end and the other end of a second conducting wire; alternatively, the first and second electrodes may be,

in the substrate, connecting lines of one end and the other end of each first lead are parallel to each other; alternatively, the first and second electrodes may be,

connecting lines of one end and the other end of each second wire are parallel to each other; alternatively, the first and second electrodes may be,

in the substrate, a line connecting one end and the other end of each first conducting wire and a line connecting one end and the other end of each second conducting wire are parallel to each other.

6. The sensor module according to claim 1, wherein the printed circuit board is located on the same side of the substrate as the photoelectric conversion element and is connected to the other end of the lead when the sensor module is mounted on the printed circuit board.

7. The sensor module of claim 6, wherein the printed circuit board is a flexible printed circuit board.

8. The sensor module of claim 6, wherein the printed circuit board is connected to the other end of the wire by a pad; the sum of the heights of the bonding pad and the printed circuit board is less than or equal to the sum of the heights of the photoelectric conversion component and the optical path structural component.

9. The sensor module according to any one of claims 1-8, wherein the sensor module is applied to an electronic device having a display screen, wherein a small hole layer is disposed in the display screen, at least one small hole for small hole imaging is disposed in the small hole layer, and the sensor module is disposed below the at least one small hole.

10. A sensor module according to claim 9, wherein the aperture layer is spaced from the optical path structure components of the sensor module by an air layer.

11. The sensor module of claim 10, wherein the upper surface of the fixing frame is coated with a ring of glue, and the orifice layer is disposed on the glue to form an air layer between the orifice layer and the optical path structure member.

12. The sensor module of claim 1, wherein the optical circuit structure component comprises an infrared-resistant coating, and the infrared-resistant coating covers the photoelectric conversion element.

13. A sensor module is characterized by comprising a photoelectric conversion component and a light path structure component; wherein the content of the first and second substances,

14. The sensor module according to claim 13, wherein the back surface of the photoelectric conversion component is provided with at least one line outlet, the line outlet is connected with a line inside the photoelectric conversion component, and the line outlet is connected with the electrical contact point through a conducting line on the back surface of the photoelectric conversion component.

15. The sensor module of claim 14, wherein the at least one line outlet includes at least one first line outlet and at least one second line outlet, the at least one first line outlet and the at least one second line outlet being located on opposite sides of the electrical contact; the electrical contacts include a first contact and a second contact; the conducting lines comprise a first conducting line and a second conducting line;

16. The sensor module of any one of claims 13-15, wherein the optical circuit structure component includes an anti-infrared coating, and the anti-infrared coating covers the photoelectric conversion element.

17. An electronic device comprising a sensor module according to any one of claims 1-16.

18. A method of assembling a sensor module, wherein the sensor module is a sensor module according to any one of claims 1 to 12; the method comprises the following steps:

19. The method of claim 18, further comprising:

20. A method of assembling a sensor module, wherein the sensor module is a sensor module according to any one of claims 13 to 16; the method comprises the following steps:

21. The method of claim 20, further comprising: