CN111830747B - Patch type backlight module and backlight device - Google Patents
Patch type backlight module and backlight device Download PDFInfo
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- CN111830747B CN111830747B CN202010605676.9A CN202010605676A CN111830747B CN 111830747 B CN111830747 B CN 111830747B CN 202010605676 A CN202010605676 A CN 202010605676A CN 111830747 B CN111830747 B CN 111830747B
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- patch
- circuit board
- welding
- backlight module
- guide plate
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
- G02F1/1336—Illuminating devices
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
- G02F1/1336—Illuminating devices
- G02F1/133602—Direct backlight
- G02F1/133605—Direct backlight including specially adapted reflectors
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
- G02F1/1336—Illuminating devices
- G02F1/133602—Direct backlight
- G02F1/133608—Direct backlight including particular frames or supporting means
Abstract
The invention provides a patch type backlight module, which comprises a patch circuit board, a light guide plate, a diffusion film, a light emitting device and a reflecting frame, wherein the light guide plate is arranged on the surface of the patch circuit board; the patch circuit board is provided with a plurality of groups of welding parts, any one of the welding parts comprises a plurality of welding grooves arranged on the side wall of the patch circuit board, and each welding groove comprises an electric connection layer which is arranged on the inner wall of the corresponding welding groove in a covering manner; the patch circuit board is connected and fixed with the reflecting frame; the reflecting frame is provided with a surrounding wall, and the light guide plate is arranged on the inner side of the surrounding wall; the light-emitting device is arranged on the top surface of the patch circuit board in a bonding way, and is arranged on the inner side of the surrounding wall, and the light-emitting direction of the light-emitting device faces the light-guiding plate; the diffusion film is disposed over the reflective frame. The invention provides a patch type backlight module, which is convenient for manual welding and automatic patch use of a machine by adopting a patch circuit board, and has good use convenience. In addition, the invention also provides a backlight device.
Description
Technical Field
The invention relates to the field of display and backlight, in particular to a patch type backlight module and a backlight device.
Background
In recent years, with the rapid development of the home appliance market, small-size backlight products are gradually purchased in batches by the home appliance market, customers have higher and higher requirements on the display effect of the products, and meanwhile, the automatic requirements on the production and assembly of the products are provided.
The existing small-size backlight source is usually designed into an original plug-in structure, and when the backlight source is used, the backlight source is required to be inserted into a preset welding hole in a control board designed by a customer in a manual operation mode, and then the other corresponding surface of the control board is welded. If a manual welding mode is adopted, the backlight source is easy to fall off or tilt in the process of reversing the control panel; if the wave crest furnace welding mode is adopted, the backlight source is easy to generate bad phenomena such as tilting and the like due to the buoyancy generated by the tin liquid to the backlight source when passing through the tin furnace, and the backlight source needs to be overhauled in the modes such as secondary processing and the like in the later period, so that the processing convenience is poor.
Disclosure of Invention
In order to overcome the defects of the conventional backlight module, the invention provides a patch type backlight module and a backlight device, wherein the backlight module is of a patch type structure and is convenient to assemble and use.
Correspondingly, the patch type backlight module provided by the invention comprises a patch circuit board, a light guide plate, a diffusion film, a light emitting device and a reflecting frame;
the patch circuit board is provided with a plurality of groups of welding parts, any one group of welding parts in the plurality of groups of welding parts comprises a plurality of welding grooves arranged on the side wall of the patch circuit board, and each welding groove comprises an electric connection layer which is arranged on the inner wall of the corresponding welding groove in a covering manner;
the patch circuit board is connected and fixed with the reflecting frame;
the reflecting frame is provided with a surrounding wall, and the light guide plate is arranged on the inner side of the surrounding wall;
the light emitting device is arranged on the top surface of the patch circuit board in a bonding way, the light emitting device is arranged on the inner side of the surrounding wall, and the light emitting direction of the light emitting device faces the light guide plate;
the diffusion film is disposed above the reflection frame.
In an alternative embodiment, the light guide plate is closely disposed on the top surface of the patch circuit board, and the light guide plate is located in the outline surrounding area of the patch circuit board.
In an alternative embodiment, the surface of the patch circuit board is provided with a circuit board reflection layer on a setting area corresponding to the light guide plate.
In an alternative embodiment, the light emitting device is a side light emitting device, and a light emitting side of the light emitting device faces the light guide plate.
In an alternative embodiment, the reflective frame further includes a bottom plate closing the lower end opening of the surrounding wall, and the light guide plate is disposed on the bottom plate.
In an optional embodiment, the number of the soldered parts of any one of the patch circuit boards is more than four; each group of welding parts comprises at least three welding grooves arranged in an array, wherein in all the welding parts, at least two welding parts are electrically connected with the welding parts, and the other welding parts are connected with the welding parts;
or the number of the welding parts of any patch circuit board is two, each group of the welding parts comprises a welding groove, and all the welding parts are electrically connected with the welding parts.
In an alternative embodiment, each set of solder joints further includes a bottom pad;
in one set of the welding parts, the bottom bonding pad is arranged on the edge position of the bottom surface of the patch circuit board corresponding to the plurality of welding grooves, and the bottom bonding pad is electrically connected with the electric connection layer in each welding groove in the same set of welding parts.
In an alternative embodiment, the total area of all the bottom pads is S1, and the area of the bottom surface of the patch circuit board is S2, where,
in an alternative embodiment, in the same set of the soldered portions, the bottom pad has a distance interval [1mm,3mm ] between a side surface close to the plurality of soldered grooves and a side surface of the bottom pad distant from the plurality of soldered grooves.
In an optional embodiment, the reflection frame further includes a fixing pin, the fixing pin is disposed at the bottom of the reflection frame, and the fixing pin is disposed on the patch circuit board based on a hot pressing process.
In an alternative embodiment, the patch circuit board is provided with a fixing hole, and the fixing hole is axially divided into a first fixing section and a second fixing section;
the first fixed section faces one side of the light emitting device, and the diameter of the second fixed section is larger than that of the first fixed section;
the fixing feet are arranged in the fixing holes in a matched mode based on a hot pressing process, and the fixing feet are not beyond the plane where the opening of the fixing holes on one side of the second fixing section is located.
In an alternative embodiment, the reflection frame further includes supporting feet, and the supporting feet are disposed at the lower portion of the reflection frame.
Correspondingly, the invention also provides a backlight device, which comprises a main control board and the patch type backlight module; the patch type backlight module is arranged on one surface of the main control board.
The invention provides a patch type backlight module and a backlight device, which adopt a patch circuit board, so that the backlight module can be externally used and installed based on a patch mode, is convenient for manual welding and automatic patch use of a machine, and has good use convenience; the implementation mode of processing the reflecting layer around the light guide plate is replaced by an independent reflecting frame entity structure, so that the processing difficulty of the backlight module can be reduced; the reflecting frame also has the function of limiting the light guide plate, so that the assembly process can be reduced, and the processing time of the backlight module can be shortened; the supporting legs and the bottom plate are arranged on the reflecting frame, so that the arrangement height of the light guide plate can be changed, on one hand, all possible defects caused by direct contact between the light guide plate and the patch type circuit board can be avoided, and on the other hand, the patch type circuit board can be provided with electronic components on the premise of not changing the size, and the applicability of the patch type backlight module is improved; meanwhile, the cooperation structure between the two new light emitting devices and the light guide plate is creatively provided by combining the actual processing conditions, so that the patch type backlight module has good processing convenience.
Drawings
In order to more clearly illustrate the embodiments of the invention or the technical solutions in the prior art, the drawings that are required in the embodiments or the description of the prior art will be briefly described, it being obvious that the drawings in the following description are only some embodiments of the invention, and that other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.
Fig. 1 is an exploded view of a patch type backlight module according to an embodiment of the invention;
fig. 2 is a schematic cross-sectional view of a patch type backlight module according to an embodiment of the invention;
fig. 3 is a schematic diagram of a usage structure of a patch type backlight module according to an embodiment of the invention;
fig. 4 is a schematic top view of a patch type backlight module according to an embodiment of the invention
Fig. 5 is a schematic cross-sectional view of a patch type backlight module according to a second embodiment of the present invention;
fig. 6 is a schematic diagram of a patch type backlight module according to a second embodiment of the invention.
Detailed Description
The following description of the embodiments of the present invention will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present invention, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
Embodiment one:
fig. 1 shows an exploded schematic view of a patch type backlight module according to an embodiment of the present invention, fig. 2 shows a cross-sectional schematic view of a patch type backlight module according to an embodiment of the present invention, and fig. 3 shows a schematic view of a patch type backlight module according to an embodiment of the present invention.
Basically, the patch type backlight module provided by the embodiment of the invention comprises a patch circuit board 1, a light guide plate 3, a diffusion film 5, a light emitting device 2 and a reflecting frame 4.
Specifically, the side wall of the patch circuit board 1 is provided with a plurality of groups of welding parts 101, any group of welding parts 101 comprises a plurality of welding grooves 110 arranged on the side wall of the patch circuit board 1 in an array manner, the welding grooves 110 comprise electric connection layers which are arranged on the inner wall of the welding grooves in a covering manner, and the electric connection layers can be made of conductive metals such as copper, gold and the like; specifically, the welding groove 110 has various shapes, and in the embodiment of the present invention, the welding groove 110 has a semicircular hole structure, that is, the cross-section of the welding groove 110 is semicircular.
Specifically, when the welding groove 110 has a semicircular hole structure, the aperture of the semicircular hole ranges from 0.6mm to 1mm, and preferably, the aperture of the semicircular hole ranges from 0.8mm. When the aperture of the semicircular hole is larger, the depth of the semicircular hole is too deep, the area of the routable area of the patch circuit board is reduced, and relatively larger patch circuit board size is needed, so that the size of the patch type backlight module is increased; when the aperture of the semicircular hole is smaller, the formation of an electric connection layer is not facilitated, and the reliability is reduced.
Further, considering that the chip circuit board may have a connection fixing function while having an electrical connection function, in practical implementation, the types of the solder portions may be divided into two types, i.e., an electrical connection solder portion and a connection solder portion. When in use, the electric connection welding part has the function of connection and fixation and can also play the role of electric connection; the connecting welding part only has the function of connecting and fixing. In specific implementation, the corresponding type of welding part can be arranged according to the requirement.
Specifically, the patch circuit board 1 and the reflection frame 4 are connected and fixed with each other. In specific implementation, the reflecting frame 4 is fixed on the patch circuit board 1 or the patch circuit board 1 is fixed on the reflecting frame 4 according to the size relation of the patch circuit board 1 and the reflecting frame 4.
Specifically, the reflection frame 4 has a surrounding wall 402, and the light guide plate 3 is disposed inside the surrounding wall 402. In practice, the reflective frame 4 is generally made of white material, and the inner wall surface of the surrounding wall 402 is smooth and can be used for reflecting light. Further, a reflective coating or a reflective film may be disposed on the inner wall of the surrounding wall 402, for reflecting the light guided out from the side of the light guide plate 3.
In the embodiment of the invention, the light guide plate 3 is closely arranged on the top surface of the patch circuit board 1, and the light guide plate 3 is positioned in the outline surrounding area of the patch circuit board 1. Accordingly, the surrounding wall 402 of the reflection frame 4 needs to be disposed outside the light guide plate, and in this embodiment of the present invention, the reflection frame 4 is fixed on the patch circuit board 1.
Specifically, the reflection frame 4 further includes a fixing pin 401, the fixing pin 401 is disposed at the bottom of the reflection frame 4, and the fixing pin 401 is disposed on the chip circuit board 1 based on a hot pressing process.
Specifically, the patch circuit board 1 is provided with a fixing hole, and the fixing hole is axially divided into a first fixing section 411 and a second fixing section 412; the first fixing section 411 faces to the side of the light emitting device 2 (light guide plate 3), and the second fixing section 412 has a diameter larger than that of the first fixing section 411; the fixing pins 401 are disposed in the fixing holes in a matching manner based on a hot pressing process, and the fixing pins 401 do not exceed the plane of the opening of the fixing holes on one side of the second fixing section 412.
In the embodiment of the invention, the fixing holes are arranged in a sectional variable-diameter mode, so that part of materials of the fixing pins in the hot pressing process can be melted into the second fixing section, the boss is prevented from being formed on the mounting surface of the patch type backlight module, and the patch type backlight module can be ensured to be used for mounting.
Basically, the light emitting device 2 is arranged on the top surface of the patch circuit board 1 in a bonding manner, and the light emitting device 2 is arranged inside the surrounding wall 402, and the light emitting direction of the light emitting device 2 faces the light guide plate 3; the diffusion film 5 is disposed above the reflection frame 4.
In the embodiment of the present invention, the light emitting device 2 is a side light emitting device. In addition, in the embodiment, in combination with the structure shown in fig. 2 of the drawings, the diffusion film 5 is a light-transmitting region at a position corresponding to the light guide plate 3, and the diffusion film 5 is a light-impermeable region at a position corresponding to the reflection frame 4 and the light emitting device 2.
In specific implementation, referring to the structure shown in fig. 3 of the drawings, the patch type backlight module of the embodiment of the present invention needs to be mounted on the main control board 6 of the user, and the main control board 6 is provided with a structure such as a pad 601 at a position corresponding to the soldering portion 101 of the patch circuit board 1. When the patch type backlight module is used, after an operator installs the patch circuit board 1 at a corresponding position on the main control board 6, the operator can weld the welding part 101 at the same side with the corresponding welding pad 601 on the main control board 6, and the welding flux can realize connection with the welding pad 601 and an electric connection layer in the welding groove 110.
Further, for the patch type backlight module structure of the embodiment of the invention, in the implementation, the corresponding structure can be limited in size, so that the assembly stability of the patch type backlight module structure is improved.
Fig. 4 is a schematic top view of a patch type backlight module according to an embodiment of the present invention, and it should be noted that fig. 4 and fig. 1 to 3 are not the same physical structure, and fig. 4 is only used to illustrate corresponding dimensional relationships.
Optionally, the number of the soldering parts 101 of any one of the patch circuit boards is more than four; each set of said welds 101 comprises at least three weld grooves 110 arranged in an array; of all the solder parts 101, at least two solder parts 101 are electrically connected solder parts, and the other solder parts are connected solder parts.
Further, in order to enhance the bonding strength between the bonding portion 101 and the bonding pad 601, specifically, each set of bonding portions 101 further includes a bottom bonding pad 111; in one set of the soldering parts 101, the bottom pads 111 are disposed at edge positions of the bottom surface of the chip circuit board corresponding to the soldering grooves 110, and the bottom pads 111 are electrically connected to the electrical connection layer in each soldering groove 110 in the same set of soldering parts.
Optionally, in order to ensure connection stability between the patch type backlight module and the main control board 6, in a specific implementation, the total area of all the bottom pads is set to S1, the area of the bottom surface of the patch circuit board is set to S2, where,under the limiting condition, the connection stability between the patch type backlight module and the main control board 6 is better, andthe bottom pads do not occupy too much area of the patch circuit board.
Optionally, in the same set of the soldered portions, the distance between the side surface of the bottom pad 111 close to the plurality of soldered grooves and the side surface of the bottom pad far from the plurality of soldered grooves (i.e., the width of the bottom pad 111 in the embodiment of the invention) is [1mm,3mm ], so as to meet the connection requirement.
Further, the pitch between the weld grooves (dead space as shown) is preferably set to 0.3mm to 0.5mm. The position between two adjacent welding grooves is not provided with an electric connection layer, namely the position can not play a role of tin coating connection and is a useless space, which is limited by the processing technology. If the interval between two adjacent welding grooves is too large, the useless space length is increased, so that waste is caused, and the design is not facilitated; if the interval between two adjacent welding grooves is too small, the dead space becomes narrow, and the tip burrs are easily formed, resulting in breakage of the plate edges.
In addition, when the chip circuit board is electrically connected with the main control board based on the solder, the higher the climbing height of the solder is, the larger the welding strength is; however, since the solder is in a water flow shape during the complete melting of the reflow oven, the maximum ramp height is not expected to exceed 0.4mm, so the distance between the outer ends of the corresponding connection pads of the main control board and the edge of the bonding pad of the chip circuit board is preferably 0.6 mm-1 mm for accommodating the solder. If the accommodation length is too short, the solder may be extruded to form a bulge or overflow, and if the accommodation length is too long, the increase of the solder climbing height is not facilitated, and meanwhile, the occupied area of the bonding pad is too large, so that the wiring space on the main control board is wasted.
Embodiment two:
fig. 5 shows a schematic cross-sectional structure of a patch type backlight module according to an embodiment of the invention, and fig. 6 shows a schematic use structure of a patch type backlight module according to an embodiment of the invention.
The difference between the embodiment and the first embodiment of the present invention is mainly the change of the size relationship between the patch circuit board and the reflection frame. In the embodiment of the invention, the patch circuit board 1 is only used for supporting and electrically connecting the light emitting device 2, and the sizes of the reflecting frame and the light guide plate are larger than those of the patch circuit board 1.
In specific implementation, referring to the first embodiment, the patch circuit board 1 is fixed by matching with the fixing pins 401 of the reflection frame based on the fixing holes; the reflection frame further comprises a bottom plate 405, the bottom plate 405 closes the lower end opening of the surrounding wall 402, and the light guide plate 3 is disposed on the bottom plate 405.
Optionally, the reflection frame further includes supporting feet 406, and the supporting feet 406 are disposed at a lower portion of the reflection frame. The supporting legs 406 can keep a certain gap between the bottom plate 405 of the reflection frame and the main control board 6 when the patch type backlight module is in use, and are used for avoiding parts on the main control board 6. Meanwhile, the patch circuit board is oppositely arranged on one side of the reflecting frame, and the supporting legs 406 are arranged, so that the fixing stability of the patch type backlight module can be increased.
Correspondingly, when the patch type backlight module is mounted on the main control board, the welding part on the patch type circuit board 1 is correspondingly connected to the bonding pad of the main control board, specifically, in order to ensure the connection stability of the patch type backlight module and the main control board 6, the reflecting frame is provided with a connecting pin 420 with a buckle structure on one side far away from the patch type circuit board 1, and the connecting pin 420 can be inserted into a hole site corresponding to the main control board so as to ensure the connection stability of the patch type backlight module and the main control board.
Specifically, when the sizes of the adjacent two sides of the patch circuit board exceed 3.5mm, the welding part structure of the first embodiment may be set on any one side of the patch circuit board, and in a specific implementation, if the size of one side of the patch circuit board is smaller than 3.5mm, the welding part may be set on the adjacent side of the patch circuit board, and specifically, the following implementation may be adopted: referring to the structure shown in fig. 6, the number of the soldering parts of any one of the chip circuit boards 1 is two, and each of the soldering parts includes one soldering groove 110; all the welding parts are electrically connected with the welding parts.
In summary, the present invention provides a patch type backlight module and a backlight device, which adopt a patch circuit board, so that the backlight module can be externally used and installed based on a patch mode, thereby being convenient for manual welding and machine automation patch use and having good use convenience; the implementation mode of processing the reflecting layer around the light guide plate is replaced by an independent reflecting frame entity structure, so that the processing difficulty of the backlight module can be reduced; the reflecting frame also has the function of limiting the light guide plate, so that the assembly process can be reduced, and the processing time of the backlight module can be shortened; the supporting legs and the bottom plate are arranged on the reflecting frame, so that the arrangement height of the light guide plate can be changed, on one hand, all possible defects caused by direct contact between the light guide plate and the patch type circuit board can be avoided, and on the other hand, the patch type circuit board can be provided with electronic components on the premise of not changing the size, and the applicability of the patch type backlight module is improved; meanwhile, the cooperation structure between the two new light emitting devices and the light guide plate is creatively provided by combining the actual processing conditions, so that the patch type backlight module has good processing convenience.
The patch type backlight module and the backlight device provided by the embodiment of the invention are described in detail, and specific examples are applied to illustrate the principle and the implementation of the invention, and the description of the above embodiments is only used for helping to understand the method and the core idea of the invention; meanwhile, as those skilled in the art will have variations in the specific embodiments and application scope in accordance with the ideas of the present invention, the present description should not be construed as limiting the present invention in view of the above.
Claims (10)
1. The surface mount backlight module is characterized by comprising a surface mount circuit board, a light guide plate, a diffusion film, a light emitting device and a reflecting frame;
the patch circuit board is provided with a plurality of groups of welding parts, any one group of welding parts in the plurality of groups of welding parts comprises a plurality of welding grooves arranged on the side wall of the patch circuit board, and each welding groove comprises an electric connection layer which is arranged on the inner wall of the corresponding welding groove in a covering manner;
the patch circuit board is connected and fixed with the reflecting frame;
the reflecting frame is provided with a surrounding wall, and the light guide plate is arranged on the inner side of the surrounding wall;
the light emitting device is arranged on the top surface of the patch circuit board in a bonding way, the light emitting device is arranged on the inner side of the surrounding wall, and the light emitting direction of the light emitting device faces the light guide plate;
the diffusion film is arranged above the reflecting frame;
the light emitting device is a side light emitting device, and the light emitting side surface of the light emitting device faces the light guide plate;
the reflecting frame further comprises fixing feet, the fixing feet are arranged at the bottom of the reflecting frame, and the fixing feet are arranged on the patch circuit board based on a hot pressing process;
the patch circuit board is provided with a fixing hole which is axially divided into a first fixing section and a second fixing section;
the first fixed section faces one side of the light emitting device, and the diameter of the second fixed section is larger than that of the first fixed section;
the fixing feet are arranged in the fixing holes in a matched mode based on a hot pressing process, and the fixing feet are not beyond the plane where the opening of the fixing holes on one side of the second fixing section is located.
2. The patch type backlight module of claim 1, wherein the light guide plate is disposed on the top surface of the patch circuit board in a close-fitting manner, and the light guide plate is located in a surrounding area of the patch circuit board.
3. A patch type backlight module according to claim 2, wherein the surface of the patch circuit board is provided with a circuit board reflection layer on a disposition area corresponding to the light guide plate.
4. The patch type backlight module of claim 1, wherein the reflection frame further comprises a bottom plate closing the lower end opening of the surrounding wall, and the light guide plate is disposed on the bottom plate.
5. A patch type backlight module according to any one of claims 1 to 4, wherein the number of the soldered portions of any one of the patch circuit boards is four or more; each group of welding parts comprises at least three welding grooves arranged in an array, wherein in all the welding parts, at least two welding parts are electrically connected with the welding parts, and the other welding parts are connected with the welding parts;
or the number of the welding parts of any patch circuit board is two, each group of the welding parts comprises a welding groove, and all the welding parts are electrically connected with the welding parts.
6. A patch backlight module according to claim 5, wherein each set of the solder portions further comprises a bottom pad;
in one set of the welding parts, the bottom bonding pad is arranged on the edge position of the bottom surface of the patch circuit board corresponding to the plurality of welding grooves, and the bottom bonding pad is electrically connected with the electric connection layer in each welding groove in the same set of welding parts.
7. The patch type backlight module of claim 6, wherein the total area of all the bottom pads is S1, the area of the bottom surface of the patch circuit board is S2, wherein,
8. a patch type backlight module as claimed in claim 6, wherein in the same set of the soldering parts, the distance interval between the side surface of the bottom pad adjacent to the plurality of soldering grooves and the side surface of the bottom pad distant from the plurality of soldering grooves is [1mm,3mm ].
9. A patch type backlight module as claimed in claim 4, wherein the reflection frame further comprises supporting legs disposed at a lower portion of the reflection frame.
10. A backlight device, comprising a main control board and the patch type backlight module set according to any one of claims 1 to 9;
the patch type backlight module is arranged on one surface of the main control board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010605676.9A CN111830747B (en) | 2020-06-29 | 2020-06-29 | Patch type backlight module and backlight device |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010605676.9A CN111830747B (en) | 2020-06-29 | 2020-06-29 | Patch type backlight module and backlight device |
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| CN111830747A CN111830747A (en) | 2020-10-27 |
| CN111830747B true CN111830747B (en) | 2023-08-15 |
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| CN116471742A (en) * | 2021-09-23 | 2023-07-21 | 荣耀终端有限公司 | Circuit board assembly, electronic equipment and frame plate manufacturing method |
Citations (5)
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| CN201234405Y (en) * | 2008-07-04 | 2009-05-06 | 比亚迪股份有限公司 | Printed circuit board |
| TW201109795A (en) * | 2009-09-11 | 2011-03-16 | Chi Mei Optoelectronics Corp | Backlight module and liquid crystal display |
| CN202109357U (en) * | 2011-06-10 | 2012-01-11 | 安徽森力汽车电子有限公司 | LCD (liquid crystal display) backlight device for automobile audio |
| CN202748571U (en) * | 2012-06-29 | 2013-02-20 | 深圳市同兴达科技有限公司 | Liquid crystal display module for positioning and welding via-hole |
| CN105516407A (en) * | 2015-12-21 | 2016-04-20 | 惠州Tcl移动通信有限公司 | Mobile terminal and circuit board assembly thereof |
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- 2020-06-29 CN CN202010605676.9A patent/CN111830747B/en active Active
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| CN201234405Y (en) * | 2008-07-04 | 2009-05-06 | 比亚迪股份有限公司 | Printed circuit board |
| TW201109795A (en) * | 2009-09-11 | 2011-03-16 | Chi Mei Optoelectronics Corp | Backlight module and liquid crystal display |
| CN202109357U (en) * | 2011-06-10 | 2012-01-11 | 安徽森力汽车电子有限公司 | LCD (liquid crystal display) backlight device for automobile audio |
| CN202748571U (en) * | 2012-06-29 | 2013-02-20 | 深圳市同兴达科技有限公司 | Liquid crystal display module for positioning and welding via-hole |
| CN105516407A (en) * | 2015-12-21 | 2016-04-20 | 惠州Tcl移动通信有限公司 | Mobile terminal and circuit board assembly thereof |
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| CN111830747A (en) | 2020-10-27 |
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