CN111830401A

CN111830401A - Semiconductor test equipment

Info

Publication number: CN111830401A
Application number: CN202010962414.8A
Authority: CN
Inventors: 曹锐; 杜建; 裴敬; 邓标华
Original assignee: Wuhan Jinghong Electronic Technology Co ltd; Wuhan Jingce Electronic Group Co Ltd
Current assignee: Wuhan Jinghong Electronic Technology Co ltd; Wuhan Jingce Electronic Group Co Ltd; Wuhan Jingce Electronic Technology Co Ltd
Priority date: 2020-09-14
Filing date: 2020-09-14
Publication date: 2020-10-27
Anticipated expiration: 2040-09-14
Also published as: CN111830401B

Abstract

The application relates to a semiconductor test device, belongs to semiconductor test device technical field, includes: the test box comprises a main body and a plurality of test boxes, wherein the main body comprises at least one test box, at least one test cavity is arranged in the test box, the top of the test cavity is provided with an opening, an upper cover used for sealing the test cavity is arranged at the opening, and a test board horizontally arranged is arranged in the test cavity; an upper cover driving assembly connected with the upper cover and used for opening or closing the upper cover; and the feeding and discharging device is positioned above the main body and used for feeding or discharging the test board when the upper cover driving assembly opens the upper cover. This application need not plug when carrying out aging testing to semiconductor chip and surveys test panel, has improved the life who surveys test panel. And the upper cover driving assembly can automatically open and close the upper cover, and the feeding and discharging device can automatically feed and discharge materials, so that unmanned operation can be realized.

Description

Semiconductor test equipment

Technical Field

The application relates to the technical field of semiconductor test equipment, in particular to semiconductor test equipment.

Background

In order to achieve the yield of semiconductor chips, almost all semiconductor chips are subjected to burn-in test before shipment. The burn-in test is to provide necessary system signals for the semiconductor chip to be tested through a test board, simulate the working state of the semiconductor chip, accelerate the electrical fault of the semiconductor chip under the condition of high temperature or other conditions, acquire the fault rate of the semiconductor chip within a period of time, and enable the semiconductor chip to work under a given load state to enable the defects of the semiconductor chip to appear within a short time, thereby obtaining the approximate fault rate of the semiconductor chip in the life cycle and avoiding the faults occurring in the early stage of use.

In the related art, the aging test equipment mostly adopts a side door opening mode, a plurality of layers of test boards are arranged in the aging test equipment, and the test boards are arranged along the height direction of the aging test equipment. During each aging test, a side door needs to be manually opened to pull out a test board, a semiconductor chip to be tested is mounted on the test board, and then the test board and the semiconductor chip are inserted into aging test equipment together to close the side door for aging test; after the aging test is finished, the side door is manually opened to pull the test board and the semiconductor chips out of the aging test equipment, and the aging test of the semiconductor chips of the next batch is carried out so as to repeat the aging test.

However, the aging test device with the side door opening mode needs to be inserted and pulled out of the test board during each aging test, and because the aging test interface of the test board is plugged into the wall connector mounted on the aging test device by using a golden finger or a high-density connector, the aging test interface of the frequently plugged test board is easy to damage, which causes poor contact or damage, reduces the service life of the test board and affects the test result of the semiconductor chip. Meanwhile, before the aging test, a door needs to be opened manually, the semiconductor chip to be tested is installed on the test board, after the aging test is finished, the door needs to be closed manually, and the tested semiconductor chip is sorted to a set area. The aging test by manually opening and closing the door and feeding and discharging has low automation degree, labor intensity and efficiency, and can not realize unmanned test of the semiconductor chip.

Disclosure of Invention

The embodiment of the application provides a semiconductor test device, which aims to solve the problems of low automation degree, labor intensity and low efficiency of aging test by manually opening and closing a door and feeding and discharging in the related art and can not realize unmanned test of semiconductor chips.

An embodiment of the present application provides a semiconductor test apparatus, including:

the test box comprises a main body and a plurality of test boxes, wherein the main body comprises at least one test box, at least one test cavity is arranged in the test box, the top of the test cavity is provided with an opening, an upper cover used for sealing the test cavity is arranged at the opening, and a test board horizontally arranged is arranged in the test cavity;

an upper cover driving assembly connected with the upper cover and used for opening or closing the upper cover;

and the feeding and discharging device is positioned above the main body and used for feeding or discharging the test board when the upper cover driving assembly opens the upper cover.

In some embodiments: the main body comprises a test box, and a plurality of test cavities are arranged in the test box.

In some embodiments: the upper cover driving assembly includes:

a translation mechanism;

the lifting mechanism is movably assembled on the translation mechanism and used for lifting the upper cover to a set height;

and the translation mechanism is used for translating the upper cover to be above the other upper cover after the upper cover is lifted to a set height.

In some embodiments: the translation mechanism comprises two groups of linear modules and linear guide rails, and the two groups of linear modules and the linear guide rails are respectively fixed on two sides of the test box;

the lifting mechanism comprises a plurality of cylinders, the cylinders are respectively arranged on two groups of linear modules and linear guide rails, the linear guide rails are connected with the cylinders in a sliding mode through sliding blocks, and the linear modules are fixedly connected with the cylinders.

In some embodiments: an upper material bin and a lower material bin are respectively arranged at the end part of the main body, and a material lifting mechanism to be detected is arranged in the upper material bin;

the lower feed bin is internally provided with at least two measured material lifting mechanisms, and the measured material lifting mechanisms are usually three, one for storing qualified semiconductor chips, one for storing unqualified semiconductor chips and the other for standby.

In some embodiments: the material lifting mechanism to be tested comprises a lifting mechanism, a material tray bracket and a plurality of material trays, and the lifting mechanism is fixedly arranged in the upper storage bin;

the material tray support is connected with the lifting mechanism, and a plurality of material trays are stacked on the material tray support;

the structure of the measured material lifting mechanism is the same as that of the material lifting mechanism to be measured.

In some embodiments: the test box also comprises a case, the case is positioned at the end part of the test box, and a machine set for injecting a heat source or a cold source into the test box is arranged in the case;

and the case is provided with a button for controlling the operation of the unit and a touch screen for displaying the working state of the unit.

In some embodiments: the feeding and discharging device comprises a driving mechanism and a mechanical arm, wherein the driving mechanism is located on the side of the test box, and the driving mechanism drives the mechanical arm so that the mechanical arm can be used for feeding or discharging materials for the test board.

In some embodiments: the driving mechanism comprises an X-axis driving mechanism, a Y-axis driving mechanism and a Z-axis driving mechanism, the X-axis driving mechanism is located on the side portion of the test box, the Y-axis driving mechanism is connected with the X-axis driving mechanism, the Z-axis driving mechanism is connected with the Y-axis driving mechanism, and the manipulator is connected with the Z-axis driving mechanism.

In some embodiments: the Y-axis driving mechanism is provided with a plurality of Z-axis driving mechanisms, the mechanical arms are sucker assemblies connected to the Z-axis driving mechanisms, and the number of the mechanical arms is multiple.

In some embodiments: the main part includes two the test box, two all be equipped with two test chamber in the test box, two the test chamber of test box is the field font and arranges.

In some embodiments: the test box is also internally provided with a control cavity, the control cavity is positioned at the lower side of the test cavity, and the control cavity is separated from the test cavity by a heat insulation layer;

the control intracavity is equipped with test nuclear core plate, test nuclear core plate with survey between the board and be connected through the backplate electricity, the backplate run through in the insulating layer.

In some embodiments: the control chamber is located the below in test chamber, the test core plate is the horizontal direction setting and is in the control intracavity, the top of backplate pass through the connector with the middle part of surveying test panel is connected perpendicularly, the bottom of backplate pass through the connector with the test core plate is connected perpendicularly.

In some embodiments: the control chamber is located one side in test chamber, the test core plate is the horizontal direction setting and is in the control intracavity, the one end of backplate pass through the connector with survey test panel horizontal connection, the other end of backplate pass through the connector with test core plate horizontal connection.

The beneficial effect that technical scheme that this application provided brought includes:

the embodiment of the application provides semiconductor test equipment, and the aging test equipment is provided with a main body, wherein the main body comprises at least one test box, at least one test cavity is arranged in the test box, the top of the test cavity is provided with an opening, an upper cover used for sealing the test cavity is arranged at the opening of the test cavity, and a horizontally arranged test board is arranged in the test cavity; and the upper cover driving assembly is used for opening or closing the upper cover and exposing the test board when the upper cover is opened so as to feed or discharge the test board by the feeding and discharging device.

Therefore, when the semiconductor testing equipment tests the semiconductor chip, the upper cover driving assembly opens the upper cover, the loading and unloading device installs the semiconductor chip to be tested on the testing board, and then the upper cover driving assembly closes the upper cover for testing; after the test is finished, the upper cover driving assembly opens the upper cover, and the loading and unloading device takes the tested semiconductor chip down from the test board. Therefore, the test board does not need to be plugged and pulled when the semiconductor chip is tested, the damage caused by frequent plugging and pulling of the test interface of the test board in the semiconductor test process is avoided, the test precision of the semiconductor chip is improved, and the service life of the test board is prolonged.

Simultaneously this application upper cover drive assembly and last unloader, material lifting mechanism and test box are integrated as an organic whole to be set up, and the equipment volume is littleer, greatly saves occupation of land space. In addition, the test box and the test cavity quantity of this application can carry out reasonable collocation setting according to last unloading time and test time, but a plurality of test cavities continuous cycle test operation in the test box, and the last unloading time and the semiconductor test time make full use of each test cavity have improved beat and semiconductor test efficiency.

Drawings

In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings needed to be used in the description of the embodiments are briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present application, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without creative efforts.

FIG. 1 is a schematic diagram of a first perspective structure according to an embodiment of the present disclosure;

FIG. 2 is a schematic diagram of a second perspective structure according to an embodiment of the present disclosure;

FIG. 3 is a schematic structural diagram of an embodiment of the present application without a weathering test chamber;

FIG. 4 is a schematic structural diagram of a burn-in test box according to an embodiment of the present application;

FIG. 5 is a schematic structural diagram of an aging testing box and an upper cover driving assembly according to an embodiment of the present application;

FIG. 6 is a schematic structural diagram of an upper cover and an upper cover driving assembly according to an embodiment of the present disclosure;

fig. 7 is a schematic structural diagram of a material to be measured lifting mechanism according to an embodiment of the present application;

FIG. 8 is a schematic view of the internal structure of the test box according to the embodiment of the present application;

fig. 9 is a schematic structural diagram of a test board, a backplane, and a test core board according to an embodiment of the present application.

Reference numerals:

1. a main body; 11. a test box; 12. an upper cover; 13. a test board; 14. a chassis; 15. an L-shaped leg; 16. a protective cover; 17. an organ shield; 18. a touch screen; 19. a button;

2. a loading and unloading device; 21. an X-axis drive mechanism; 22. a Y-axis drive mechanism; 23. a Z-axis drive mechanism; 24. a manipulator; 25. a support;

3. an upper cover drive assembly; 31. a translation mechanism; 32. a lifting mechanism; 33. cushion blocks;

4. feeding a bin; 5. a material lifting mechanism to be detected; 6. discharging a bin; 7. a measured material lifting mechanism; 51. a lifting mechanism; 52. a material tray support; 53. a material tray;

110. a test chamber; 111. a control chamber; 112. a thermal insulation layer; 113. testing the core board; 114. a back plate.

Detailed Description

In order to make the objects, technical solutions and advantages of the embodiments of the present application clearer, the technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are some embodiments of the present application, but not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.

The embodiment of the application provides semiconductor test equipment, which can solve the problems of low automation degree, labor intensity and low efficiency of aging test by manually opening and closing a door and feeding and discharging in the related technology and can not realize unmanned test of semiconductor chips.

In the following embodiments of the present application, the application of the semiconductor burn-in test is taken as an example, and the technical solution of the present application is described in detail. However, the embodiments of the present application are not limited thereto, and any semiconductor test apparatus scheme using the inventive concept of the present application is within the scope of the present application.

Referring to fig. 1 to 6, an embodiment of the present application provides a semiconductor test apparatus, including:

the main body 1, this main body 1 includes at least one test box 11, is equipped with one test chamber 110 in test box 11 at least, and test chamber 110 open-top is equipped with upper cover 12 that is used for sealing test chamber 110 at the opening part of test chamber 110, and is equipped with the horizontal test board 13 that sets up in test chamber 110. The upper cover 12 and the test chamber 110 form a sealed chamber, and the test board 13 performs an aging test on the semiconductor chip in the sealed chamber.

And an upper cover driving assembly 3, wherein the upper cover driving assembly 3 is connected with the upper cover 12 and is used for opening or closing the upper cover 12.

And the loading and unloading device 2 is positioned above the main body 1, and loads or unloads the exposed test board 13 when the upper cover driving component 3 opens the upper cover 12.

Specifically, the loading/unloading device 2 includes a robot 24 and a driving mechanism for driving the robot 24 to move in a predetermined direction, and the robot 24 is located above the main body 1. When loading, the driving mechanism drives the manipulator 24, and the semiconductor chip to be tested, which is captured by the manipulator 24, is movably inserted onto the test board 13. During the blanking, the driving mechanism drives the manipulator 24 and moves the semiconductor chip tested on the test board 13 grasped by the manipulator 24 to a set position.

The upper cover driving assembly 3, the upper cover driving assembly 3 includes a lifting mechanism 32 and a translating mechanism 31, the lifting mechanism 32 is used for driving the upper cover 12 to move along the vertical direction, and the translating mechanism 31 is used for driving the upper cover 12 to move along the horizontal direction. When the upper cover 12 needs to be opened, the lifting mechanism 32 first drives the upper cover 12 to move upward in the vertical direction to the set position, and then the translation mechanism 31 drives the upper cover 12 to move in the horizontal direction to the set position. When the upper cover 12 needs to be closed, the translation mechanism 31 first drives the upper cover 12 to move to the original position in the horizontal direction, and then the lifting mechanism 32 drives the upper cover 12 to move downward to the original position in the vertical direction.

When the aging test equipment of the embodiment of the application performs the aging test on the semiconductor chip, after the upper cover driving component 3 opens the upper cover 12, the loading and unloading device 2 installs the semiconductor chip to be tested on the test board 13, and then the upper cover driving component 3 closes the upper cover 12 to perform the aging test; after the burn-in test is completed, the upper cover driving assembly 3 opens the upper cover 12, and the loading and unloading device 2 takes the tested semiconductor chip off the test board 13. Therefore, the test board 13 does not need to be inserted and pulled out when the burn-in test is performed on the semiconductor chip, and the service life of the test board 13 is prolonged. Meanwhile, the upper cover driving assembly 3 can automatically open and close the upper cover 12, and the feeding and discharging device 2 can automatically feed and discharge materials, so that the automation level of the aging test equipment is improved, and unmanned operation can be realized.

In some alternative embodiments, referring to fig. 4 and 5, the present application provides a semiconductor test apparatus, the main body 1 of the burn-in test apparatus includes a test box 11, two test chambers 110 are disposed in the test box 11, and two test chambers 110 are respectively provided with an upper cover 12; when one upper lid 12 is opened, the upper lids 12 of the two test chambers 110 at least partially overlap. Of course, one skilled in the art may also provide three test chambers 110, four test chambers 110, etc. in the test box 11, and provide the upper cover 12 on each of the three test chambers 110 or the four test chambers 110.

When the left test chamber 110 is in the temperature-rising burn-in test state, the test board 13 of the right test chamber 110 is automatically loaded and unloaded by the loading and unloading device 2. When the left test chamber 110 is finished, the upper lid driving assembly 3 may move the upper lid 12 vertically upward and then move right to the upper side of the right test chamber 110. The loading and unloading device 2 takes out the tested semiconductor chip in the left test chamber 110 and stores the semiconductor chip in the material tray 53 of the tested material lifting mechanism 7.

The two upper covers 12 can move horizontally and vertically on the test box 11, and the left test chamber 110 and the right test chamber 110 can be simultaneously heated for aging test. The test boards 13 in the left test chamber 110 and the right test chamber 110 are automatically loaded and unloaded by the loader/unloader 2.

Certainly, the left test chamber 110 and the right test chamber 110 can be subjected to temperature rise and aging tests respectively, and when the left test chamber 110 performs loading and unloading operations, the right test chamber 110 is in a closed state; when the right side test chamber 110 is used for loading and unloading, the left side test chamber 110 is in a closed state, and the two test chambers 110 can independently perform aging tests at the same time.

In some alternative embodiments, referring to fig. 5 and 6, the present application provides a semiconductor test apparatus, in which the upper lid driving assembly 3 includes: a translation mechanism 31; the lifting mechanism 32, the lifting mechanism 32 is movably assembled on the translation mechanism 31. The lifting mechanism 32 is used for lifting the upper cover to a set height; and, the translation mechanism 31 is used to translate the upper lid 12 over another upper lid 12 after the upper lid 12 is lifted to a set height.

Specifically, the translation mechanisms 31 of the burn-in test apparatus are located on both sides of the test box 11, and the moving direction of the translation mechanisms 31 is parallel to the length direction of the test box 11. The lifting mechanism 32 is fixedly connected between the translation mechanism 31 and the upper cover 12, and the translation mechanism 31 is used for driving the lifting mechanism 32 and the upper cover 12 to move in the horizontal direction.

The translation mechanism 31 of the embodiment includes two sets of linear modules and linear guide rails, which are respectively fixed on two sides of the test box 11; the two groups of linear modules and the linear guide rails respectively drive the two upper covers 12 to move along the horizontal direction. The specific structure of the translation mechanism 31 may be selected by those skilled in the art to implement the horizontal movement of the upper cover 12 by using an air cylinder, a hydraulic cylinder, an electric cylinder, a screw mechanism, a rack-and-pinion mechanism, or the like. The linear module and the linear guide rail are fixedly connected to two sides of the test box 11 through cushion blocks 33 respectively.

The lifting mechanism 32 comprises four cylinders, the four cylinders are respectively arranged on the two groups of linear modules and the linear guide rails, the linear guide rails are connected with the cylinders in a sliding mode through sliding blocks, and the linear modules are fixedly connected with the cylinders. Those skilled in the art can also select a hydraulic cylinder, an electric cylinder, a linear module, a screw mechanism or a rack and pinion mechanism to realize the lifting movement of the upper cover 12. The bottoms of the two cylinders are respectively connected with the two linear modules, and the other two cylinders are respectively connected with the two linear guide rails in a sliding mode through the sliding blocks.

Two sides of an upper cover 12 of the semiconductor aging test equipment are respectively provided with an L-shaped supporting leg 15, one end of the L-shaped supporting leg 15 is fixedly connected with the upper cover 12, and the other end of the L-shaped supporting leg 15 is fixedly connected with an air cylinder.

When the upper cover 12 is opened, the lifting mechanism 32 is firstly started to drive the upper cover 12 to move upwards, the upper cover 12 is separated from the test box 11, then the translation mechanism 31 is driven to drive the upper cover 12 to move towards the set direction, and the reverse step is adopted when the upper cover 12 is closed.

Protective covers 16 are respectively arranged on two sides of the test box 11, the translation mechanism 31 and the lifting mechanism 32 are both positioned in the protective covers 16, notches for movement of the L-shaped supporting legs 15 are formed in the protective covers 16, and organ protective covers 17 are arranged at the notches. Protective covers 16 are respectively arranged on two sides of the test box 11, and the protective covers 16 can close and protect the translation mechanism 31 and the lifting mechanism 32 to prevent external objects from damaging moving parts. The organ shield 17 is used to close the slot in the shield 16 and prevent foreign objects from entering the shield 16 and damaging the moving parts.

In some alternative embodiments: referring to fig. 1 to 3, an embodiment of the present application provides a semiconductor test apparatus, in which an upper bin 4 and a lower bin 6 are respectively disposed at two ends of a main body 1 of the burn-in test apparatus. Be equipped with material lifting mechanism 5 that awaits measuring in last feed bin 4, be equipped with the through-hole that stretches out material lifting mechanism 5 that awaits measuring at the top of last feed bin 4. The measured material lifting mechanisms 7 are arranged in the lower storage bin 6, at least two measured material lifting mechanisms 7 are arranged, and through holes extending out of the measured material lifting mechanisms 7 are formed in the top of the lower storage bin 6. The tested material lifting mechanisms 7 of the embodiment are provided with three groups, wherein the first group of tested material lifting mechanisms 7 are used for storing semiconductor chips which are qualified in testing, the second group of tested material lifting mechanisms 7 are used for storing semiconductor chips which are unqualified in testing, and the third group of tested material lifting mechanisms 7 are used for placing the empty material tray 53 for standby.

The semiconductor aging test equipment of the embodiment is provided with a material lifting mechanism 5 to be tested and a tested material lifting mechanism 7, wherein the material lifting mechanism 5 to be tested is used for storing semiconductor chips to be tested and is used for automatically feeding materials to the feeding and discharging device 2, and the feeding and discharging device 2 grabs the semiconductor chips on the material lifting mechanism 5 to be tested and installs the semiconductor chips on the test board 13. The tested material lifting mechanisms 7 are used for storing tested semiconductor chips taken down from the test board 13 by the feeding and discharging device 2, the tested material lifting mechanisms 7 are provided with three groups, the first group of tested material lifting mechanisms 7 are used for storing semiconductor chips which are qualified in testing, the second group of tested material lifting mechanisms 7 are used for storing semiconductor chips which are unqualified in testing, and the third group of tested material lifting mechanisms 7 are used for standby.

In some alternative embodiments: referring to fig. 1 and 7, the embodiment of the present application provides a semiconductor test apparatus, and a material lifting mechanism 5 to be tested of the burn-in test apparatus includes a lifting mechanism 51, a material tray support 52 and a material tray 53. Elevating system 51 fixed mounting is in last feed bin 4, and material tray support 52 is connected with elevating system 51, and material tray 53 is equipped with a plurality ofly, and a plurality of material trays 53 pile up on material tray support 52.

Elevating system 51 includes base and Z to sharp module, and Z is to the bottom and base fixed connection of sharp module, and Z is to sharp module drive material tray support 52 and material tray 53 elevating movement. The material tray 53 is used for storing semiconductor chips, after the semiconductor chips in the material tray 53 are grabbed by the loading and unloading device 2, the loading and unloading device 2 grabs and moves the material tray 53 to the tested material lifting mechanism 7, and the tested semiconductor chips can be stored in the material tray 53.

The measured material lifting mechanism 7 and the measured material lifting mechanism 5 have the same structure, and are not repeated herein.

In some alternative embodiments: referring to fig. 2 and 4, in the embodiment of the present application, a case 14 is respectively disposed at two ends of a test box 11 of the burn-in test apparatus, and a unit for injecting a heat source and a cold source into a test chamber 110 is disposed in the case 14. The cabinet 14 is provided with a button 19 for controlling the operation of the unit and a touch panel 18 for displaying the operating state of the unit.

In some alternative embodiments: referring to fig. 3, the embodiment of the present application provides a semiconductor testing apparatus, where the loading and unloading device 2 of the burn-in testing apparatus includes a driving mechanism and a manipulator 24, the driving mechanism is located beside the testing box 11, and the driving mechanism drives the manipulator 24, so that the manipulator 24 can load or unload the testing board 13.

Specifically, the driving mechanism includes an X-axis driving mechanism 21, a Y-axis driving mechanism 22, and a Z-axis driving mechanism 23, the X-axis driving mechanism 21 is located at a side portion of the main body 1, the Y-axis driving mechanism 22 is connected to the X-axis driving mechanism 21, the Z-axis driving mechanism 23 is connected to the Y-axis driving mechanism 22, and the robot 24 is connected to the Z-axis driving mechanism 23. Brackets 25 are respectively provided at both sides of the main body 1, the length and height of the brackets 25 are the same as those of the main body 1, and the brackets 25 are used to mount and support the X-axis driving mechanism 21, the Y-axis driving mechanism 22, and the Z-axis driving mechanism 23.

The X-axis driving mechanism 21 comprises an X-axis linear module and an X-axis linear guide rail, the X-axis linear module and the X-axis linear guide rail are respectively and fixedly arranged at the tops of the supports 25 on the two sides of the main body 1, and the X-axis linear module and the X-axis linear guide rail are parallel to each other on the supports 25 and are arranged at intervals.

The Y-axis driving mechanism 22 is connected to the X-axis driving mechanism 21, the Y-axis driving mechanism 22 is a Y-axis linear module, one end of the Y-axis linear module is connected with the X-axis linear module, and the other end of the Y-axis linear module is connected with the X-axis linear guide rail in a sliding mode through a sliding block. The X-axis drive mechanism 21 drives the Y-axis drive mechanism 22 to move linearly in the X-axis direction.

Z axle actuating mechanism 23 is connected on Y axle actuating mechanism 22, and manipulator 24 is connected on Z axle actuating mechanism 23, and Z axle actuating mechanism 23 is equipped with a plurality ofly, all is equipped with manipulator 24 on a plurality of Z axle actuating mechanism 23, can realize the unloading operation of going up simultaneously of a plurality of manipulators 24. The Z-axis driving mechanism 23 is a Z-axis linear module, and the Z-axis linear module is connected with the Y-axis linear module through a mounting plate. The Y-axis drive mechanism 22 drives the Z-axis drive mechanism 23 to move linearly in the Y-axis direction.

The robot 24 is preferably, but not limited to, a suction cup assembly including a suction cup mounting plate and a suction cup, the suction cup being fixedly attached to the bottom of the suction cup mounting plate, the suction cup mounting plate being connected to the Z-axis driving mechanism 23. The sucking disc mounting panel is the horizontal direction setting, and the sucking disc is equipped with a plurality ofly, and a plurality of sucking disc arrays are installed on the sucking disc mounting panel, and the semiconductor chip is grabbed through vacuum adsorption to the sucking disc.

The aging testing equipment of the embodiment of the application utilizes the X-axis driving mechanism 21, the Y-axis driving mechanism 22 and the Z-axis driving mechanism 23 to respectively drive the manipulator 24 to do linear motion along the X-axis direction, the Y-axis direction and the Z-axis direction, so that the manipulator 24 is driven and positioned, and the manipulator 24 is ensured to accurately grab a semiconductor chip and move the semiconductor chip to a set position. The X-axis driving mechanism 21, the Y-axis driving mechanism 22 and the Z-axis driving mechanism 23 of the embodiment all adopt linear modules as driving mechanisms, and the linear modules have the advantages of high monomer movement speed, high repeated positioning precision, light body weight, small occupied equipment space, long service life, low cost and the like. Of course, the specific structure of the X-axis driving mechanism 21, the Y-axis driving mechanism 22 and the Z-axis driving mechanism 23 may be selected by those skilled in the art to implement the movement and positioning of the manipulator 24 by using an air cylinder, a hydraulic cylinder, an electric cylinder, a screw rod mechanism or a rack and pinion mechanism.

In some alternative embodiments: referring to fig. 1 and 2, the embodiment of the present application provides a semiconductor test apparatus, the main body of which includes a plurality of test boxes 11, and the plurality of test boxes 11 are arranged in a rectangular array. In order to increase the operation range of the loading and unloading device 2, automatic loading and unloading operation is carried out on a plurality of main bodies 1, the X-axis driving mechanism 21 is positioned between two adjacent test boxes 11, and the length of the X-axis driving mechanism 21 is greater than the sum of the lengths of the plurality of test boxes 11 along the X-axis direction; the Y-axis driving mechanism 22 is connected to the top of the X-axis driving mechanism 21, and the length of the Y-axis driving mechanism 22 is greater than the sum of the widths of the plurality of test cases 11 in the Y-axis direction.

The main body 1 of the present embodiment is provided with two test cases 11, and the two test cases 11 are arranged in parallel in the width direction of the main body 1. Two test chambers 110 are arranged in each of the two test boxes 11, and the test chambers 110 of the two test boxes 11 are arranged in a matrix shape. When the aging test time is 60 minutes and the loading and unloading time is 15 minutes, the four test chambers 110 in the two test boxes 11 can continuously circulate the aging test operation, the loading and unloading time and the aging time of each test chamber 110 can be fully utilized, and the working cycle and the aging efficiency are improved.

In some alternative embodiments: referring to fig. 8, the embodiment of the present application provides a semiconductor test apparatus, a control chamber 111 is further disposed in a test box 11 of the burn-in test apparatus, the control chamber 111 is located beside a test chamber 110, and the control chamber 111 is separated from the test chamber 110 by a thermal insulation layer 112.

A test core board 113 is arranged in the control cavity 111, the test core board 113 is electrically connected with the test board 13 through a back board 114, and the back board 114 penetrates through the heat insulation layer 112.

The test board 13 and the test core board 113 are respectively placed in the test cavity 110 and the control cavity 111 to work, the temperatures of the test cavity 110 and the control cavity 111 are independent, and the test core board 113 sends test signals to the semiconductor chip at normal temperature, so that unnecessary temperature impact of high temperature or low temperature on the test core board 113 is reduced; the possibility of instability of the test core board 113 is reduced, the quality of test signals of the test core board 113 is guaranteed, and the integrity of the test signals is improved.

In some alternative embodiments: referring to fig. 8 and 9, the embodiment of the present application provides a semiconductor test apparatus, in which a control chamber 111 is located below a test chamber 110, and a test core board 113 is horizontally disposed in the control chamber 111. The top of the back plate 114 is vertically connected to the middle of the test board 13 through a connector, and the bottom of the back plate 114 is vertically connected to the test core board 113 through a connector.

The test board 13 and the back plate 114 are connected in a T-shaped vertical alignment manner, so that the length of a test signal path of a semiconductor chip to be tested on the farthest path on the test board 13 can be effectively shortened, and the quality of a test signal is ensured.

Those skilled in the art may also set the control cavity 111 at one side of the test cavity 110, the test core board 113 is horizontally disposed in the control cavity 111, one end of the backplane 114 is horizontally connected to the test board 13 through a connector, and the other end of the backplane 114 is horizontally connected to the test core board 113 through a connector.

Principle of operation

The embodiment of the application provides a semiconductor test device, because the aging test device of the application is provided with a main body 1, the main body 1 comprises at least one test box 11, at least one test cavity 110 is arranged in the test box 11, the top of the test cavity 110 is provided with an opening, an upper cover 12 for closing the test cavity 110 is arranged at the opening of the test cavity 110, and a horizontally arranged test board 13 is arranged in the test cavity 110; and the upper cover driving assembly 3 is used for opening or closing the upper cover 12 and exposing the test board 13 when the upper cover 12 is opened so that the loading and unloading device 2 can load or unload the test board 13.

When the aging test equipment performs aging test on the semiconductor chip, after the upper cover driving assembly 3 opens the upper cover 12, the loading and unloading device 2 installs the semiconductor chip to be tested on the test board 13, and then the upper cover driving assembly 3 closes the upper cover 12 for performing the aging test; after the burn-in test is completed, the upper cover driving assembly 3 opens the upper cover 12, and the loading and unloading device 2 takes the tested semiconductor chip off the test board 13. Therefore, the test board 13 does not need to be inserted and pulled out when the burn-in test is performed on the semiconductor chip, and the service life of the test board 13 is prolonged. Meanwhile, the upper cover driving assembly 3 can automatically open and close the upper cover 12, and the feeding and discharging device 2 can automatically feed and discharge materials, so that the automation level of the aging test equipment is improved, and unmanned operation can be realized.

In the description of the present application, it should be noted that the terms "upper", "lower", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, which are only for convenience in describing the present application and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed in a specific orientation, and operate, and thus, should not be construed as limiting the present application. Unless expressly stated or limited otherwise, the terms "mounted," "connected," and "connected" are intended to be inclusive and mean, for example, that they may be fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present application can be understood by those of ordinary skill in the art as appropriate.

It is noted that, in the present application, relational terms such as "first" and "second", and the like, are used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising an … …" does not exclude the presence of other identical elements in a process, method, article, or apparatus that comprises the element.

The above description is merely exemplary of the present application and is presented to enable those skilled in the art to understand and practice the present application. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the generic principles defined herein may be applied to other embodiments without departing from the spirit or scope of the application. Thus, the present application is not intended to be limited to the embodiments shown herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. A semiconductor test apparatus, comprising:

the test device comprises a main body (1) and a test system, wherein the main body comprises at least one test box (11), at least one test cavity (110) is arranged in the test box (11), the top of the test cavity (110) is provided with an opening, an upper cover (12) used for sealing the test cavity (110) is arranged at the opening, and a test board (13) horizontally arranged is arranged in the test cavity (110);

an upper cover driving assembly (3) connected with the upper cover (12) and used for opening or closing the upper cover (12);

and the feeding and discharging device (2) is positioned above the main body (1) and is used for feeding or discharging the test board (13) when the upper cover driving component (3) opens the upper cover (12).

2. A semiconductor test apparatus as recited in claim 1, wherein:

the main body (1) comprises a test box (11), and a plurality of test cavities (110) are arranged in the test box (11).

3. A semiconductor test apparatus according to claim 2, wherein the upper cover driving unit (3) comprises:

a translation mechanism (31);

a lifting mechanism (32) movably assembled on the translation mechanism (31), wherein the lifting mechanism (32) is used for lifting the upper cover (12) to a set height; and the number of the first and second electrodes,

the translation mechanism (31) is used for translating the upper cover (12) to be above another upper cover (12) after the upper cover (12) is lifted to a set height.

4. A semiconductor test apparatus as claimed in claim 3, characterized in that:

the translation mechanism (31) comprises two groups of linear modules and linear guide rails, and the two groups of linear modules and the linear guide rails are respectively fixed on two sides of the test box (11);

the lifting mechanism (32) comprises a plurality of cylinders which are respectively arranged on two groups of linear modules and linear guide rails, the linear guide rails are connected with the cylinders in a sliding mode through sliders, and the linear modules are fixedly connected with the cylinders.

5. A semiconductor test apparatus as recited in claim 1, wherein:

an upper material bin (4) and a lower material bin (6) are respectively arranged at the end part of the main body (1), and a material lifting mechanism (5) to be detected is arranged in the upper material bin (4);

the material lifting mechanism (7) is arranged in the discharging bin (6), and at least two material lifting mechanisms (7) are arranged.

6. A semiconductor test apparatus as claimed in claim 5, characterized in that:

the material lifting mechanism (5) to be detected comprises a lifting mechanism (51), a material tray support (52) and a plurality of material trays (53), and the lifting mechanism (51) is fixedly arranged in the upper storage bin (4);

the material tray support (52) is connected with a lifting mechanism (51), and a plurality of material trays (53) are stacked on the material tray support (52);

the measured material lifting mechanism (7) and the material lifting mechanism (5) to be measured have the same structure.

7. A semiconductor test apparatus as claimed in claim 1 or 2, characterized in that:

the test box (11) further comprises a case (14), the case (14) is positioned at the end part of the test box (11), and a machine set for injecting a heat source or a cold source into the test box (11) is arranged in the case (14);

and a button (19) for controlling the operation of the unit and a touch screen (18) for displaying the working state of the unit are arranged on the case (14).

8. A semiconductor test apparatus as recited in claim 1, wherein:

unloader (2) include actuating mechanism and manipulator (24), actuating mechanism is located the side of test box (11), actuating mechanism drive manipulator (24) to make manipulator (24) carry out material loading or unloading for surveying test panel (13).

9. A semiconductor test apparatus as recited in claim 8, wherein:

actuating mechanism includes X axle actuating mechanism (21), Y axle actuating mechanism (22) and Z axle actuating mechanism (23), X axle actuating mechanism (21) are located the lateral part of test box (11), Y axle actuating mechanism (22) with X axle actuating mechanism (21) are connected, Z axle actuating mechanism (23) with Y axle actuating mechanism (22) are connected, manipulator (24) with Z axle actuating mechanism (23) are connected.

10. A semiconductor test apparatus as recited in claim 9, wherein:

the Y-axis driving mechanism (22) is provided with a plurality of Z-axis driving mechanisms (23), the mechanical arm (24) is a sucker component connected to the Z-axis driving mechanisms (23), and the number of the mechanical arm (24) is multiple.

11. A semiconductor test apparatus as recited in claim 1, wherein:

the main body (1) comprises two test boxes (11), wherein two test cavities (110) are arranged in each test box (11), and the test cavities (110) of the two test boxes (11) are arranged in a shape like a Chinese character 'tian'.

12. A semiconductor test apparatus as recited in claim 1, wherein:

a control cavity (111) is further arranged in the test box (11), the control cavity (111) is located on the lower side of the test cavity (110), and the control cavity (111) is separated from the test cavity (110) through a heat insulation layer (112);

the testing device is characterized in that a testing core board (113) is arranged in the control cavity (111), the testing core board (113) is electrically connected with the testing board (13) through a back board (114), and the back board (114) penetrates through the heat insulation layer (112).