CN111816557A - Solar cell cutting method, solar cell cutting equipment and photovoltaic module - Google Patents
Solar cell cutting method, solar cell cutting equipment and photovoltaic module Download PDFInfo
- Publication number
- CN111816557A CN111816557A CN202010699078.2A CN202010699078A CN111816557A CN 111816557 A CN111816557 A CN 111816557A CN 202010699078 A CN202010699078 A CN 202010699078A CN 111816557 A CN111816557 A CN 111816557A
- Authority
- CN
- China
- Prior art keywords
- cutting
- solar cell
- oxidizing gas
- laser
- cover body
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000005520 cutting process Methods 0.000 title claims abstract description 240
- 238000000034 method Methods 0.000 title claims abstract description 69
- 230000001590 oxidative effect Effects 0.000 claims abstract description 88
- 230000003647 oxidation Effects 0.000 claims abstract description 24
- 238000007254 oxidation reaction Methods 0.000 claims abstract description 24
- 239000007789 gas Substances 0.000 claims description 101
- 238000003698 laser cutting Methods 0.000 claims description 31
- 230000008569 process Effects 0.000 claims description 31
- 230000007246 mechanism Effects 0.000 claims description 18
- 238000012544 monitoring process Methods 0.000 claims description 18
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims description 13
- 239000001301 oxygen Substances 0.000 claims description 13
- 229910052760 oxygen Inorganic materials 0.000 claims description 13
- 238000002161 passivation Methods 0.000 abstract description 28
- 238000006243 chemical reaction Methods 0.000 abstract description 15
- 238000004519 manufacturing process Methods 0.000 description 16
- 230000006378 damage Effects 0.000 description 11
- 238000010438 heat treatment Methods 0.000 description 9
- 230000003685 thermal hair damage Effects 0.000 description 8
- 230000000694 effects Effects 0.000 description 6
- 238000002679 ablation Methods 0.000 description 5
- 238000005516 engineering process Methods 0.000 description 5
- MYMOFIZGZYHOMD-UHFFFAOYSA-N Dioxygen Chemical compound O=O MYMOFIZGZYHOMD-UHFFFAOYSA-N 0.000 description 4
- 229910001882 dioxygen Inorganic materials 0.000 description 4
- 238000012545 processing Methods 0.000 description 4
- 230000007547 defect Effects 0.000 description 3
- 238000010894 electron beam technology Methods 0.000 description 3
- 239000011521 glass Substances 0.000 description 3
- 238000010884 ion-beam technique Methods 0.000 description 3
- 238000000608 laser ablation Methods 0.000 description 3
- 229910052710 silicon Inorganic materials 0.000 description 3
- 239000010703 silicon Substances 0.000 description 3
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- 230000005855 radiation Effects 0.000 description 2
- 230000006798 recombination Effects 0.000 description 2
- 230000009467 reduction Effects 0.000 description 2
- 230000001360 synchronised effect Effects 0.000 description 2
- 230000009466 transformation Effects 0.000 description 2
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 1
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 1
- 229910052786 argon Inorganic materials 0.000 description 1
- 239000000969 carrier Substances 0.000 description 1
- 238000003776 cleavage reaction Methods 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 229910001873 dinitrogen Inorganic materials 0.000 description 1
- 238000005265 energy consumption Methods 0.000 description 1
- 230000003628 erosive effect Effects 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000003921 oil Substances 0.000 description 1
- 238000010248 power generation Methods 0.000 description 1
- 238000005215 recombination Methods 0.000 description 1
- 238000011084 recovery Methods 0.000 description 1
- 230000007017 scission Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
- H01L21/3043—Making grooves, e.g. cutting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67092—Apparatus for mechanical treatment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
- H01L31/1804—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof comprising only elements of Group IV of the Periodic System
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
- Y02E10/547—Monocrystalline silicon PV cells
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Abstract
The application provides a solar cell cutting method, a solar cell cutting device and a photovoltaic module, and relates to the technical field of solar cells. The cutting method of the solar cell piece comprises the following steps: placing the solar cell in cutting equipment, cutting the solar cell by using a cutting process, and introducing oxidizing gas into the cutting equipment while cutting; the cutting process enables the area to be cut of the solar cell to generate heat and be corroded, and thermal oxidation treatment of the cut section of the solar cell is achieved through the heat of the corroded area in an oxidizing atmosphere, so that the cut section is passivated in surface. The invention can synchronously complete the passivation at the edge of the slice and the slice, can improve the conversion efficiency of the battery, and further effectively relieves the efficiency loss caused by cutting the battery piece.
Description
Technical Field
The application relates to the technical field of solar cells, in particular to a solar cell cutting method, solar cell cutting equipment and a photovoltaic module.
Background
At present, the photovoltaic power generation technology is an important field of green energy development as a mainstream technology for utilizing solar energy resources, and is already on the market and commercialized. With the continuous progress of the technology, half-piece and laminated photovoltaic modules develop rapidly in recent years, the half-piece and laminated photovoltaic modules need to be cut when being manufactured, and the existing cutting modes comprise laser cutting and mechanical cutting, or a mode of firstly cutting by laser and then cutting and splitting by machinery, and the like.
The solar cell slice cutting is an important process in manufacturing of half-slice and laminated photovoltaic modules, and the existing solar cell slice cutting process is explained by taking the existing laser slice as an example. For example, in the process of cutting the cell slice by using laser, at least part of the cell slice is partially melted by high-energy laser, so that a cross section of the cell is seriously damaged by the laser, and the laser damage at the cross section becomes a recombination center of a photo-generated carrier, thereby affecting the photoelectric conversion efficiency of the cell. In addition, due to the high ablation temperature of the laser, ablation deposits can be formed on the cut surface of the cell, the cell is difficult to clean, a heat affected zone can be formed on the surface of the cell due to ablation, and a proper edge passivation treatment mode is not available after slicing at present, so that the efficiency and the power of the manufactured assembly are reduced to some extent, hidden crack hidden dangers exist, and a more complicated manufacturing process is brought to the production and the manufacturing of the cell.
Therefore, how to effectively reduce the efficiency loss caused by thermal damage in the solar cell slicing process is a problem to be solved urgently at present.
Disclosure of Invention
The application aims to provide a solar cell cutting method, a solar cell cutting device and a photovoltaic module, which can synchronously complete passivation and slicing at the edge of a slice, can improve the conversion efficiency of a cell, and further effectively relieve the efficiency loss caused by cutting the cell.
In order to achieve the purpose, the technical scheme adopted by the application is as follows:
according to one aspect of the present application, there is provided a method for cutting a solar cell sheet, comprising the steps of:
placing the solar cell in cutting equipment, cutting the solar cell by using a cutting process, and introducing oxidizing gas into the cutting equipment while cutting;
the cutting process enables the area to be cut of the solar cell to generate heat and be corroded, and thermal oxidation treatment of the cut section of the solar cell is achieved through the heat of the corroded area in an oxidizing atmosphere, so that the cut section is passivated in surface.
In one possible implementation, the oxidizing gas includes oxygen or a mixed gas containing oxygen.
In one possible implementation, the flow rate of the oxidizing gas is not greater than 100 slm;
and/or the pressure within the cutting apparatus is from 1kPa to 120kPa, inclusive.
In one possible implementation, the cutting process comprises a laser cutting process, which satisfies at least one of the following operating conditions:
the laser wavelength is 1064 nm;
a frequency of 100kHz-500kHz, inclusive;
the power is 1W-50W, including the end points;
the cutting speed is 1000mm/s-10000mm/s including end points;
the number of cuts was 1-20, inclusive.
The cutting process may be a laser cutting process, but is not limited thereto, and for example, any one or a combination of at least two of a mechanical cutting, a combination of a mechanical cutting and a laser cutting, a cutting method such as an ion beam, a high-energy particle beam, and an electron beam bombardment may be used.
In one possible implementation, the cutting device is provided with an oxidizing gas inlet and an oxidizing gas outlet, and the cutting process is performed using energy of a cutting source;
the flow path of the oxidizing gas within the cutting apparatus is the same as or parallel to the path of the cutting source.
According to another aspect of the present application, there is provided a cutting apparatus for cutting a solar cell sheet, including:
the bearing table is used for bearing the solar cell;
the cutting device is used for generating a cutting source and cutting the solar cell piece by utilizing the energy of the cutting source so that the area to be cut of the solar cell piece generates heat and is corroded;
and the cover body is covered on the outer side of the bearing table and is suitable for allowing oxidizing gas to enter the cover body, and thermal oxidation treatment of the cut section of the solar cell piece is realized by means of heat of the eroded part under an oxidizing atmosphere, so that the surface of the cut section is passivated.
In a possible implementation manner, one side of the cover body is provided with an oxidizing gas inlet, and the other side of the cover body is provided with an oxidizing gas outlet, and the flowing path of the oxidizing gas in the cover body is the same as or parallel to the path of the cutting source.
In one possible implementation manner, a temperature monitoring mechanism is arranged in the cover body;
and/or a pressure monitoring mechanism is arranged in the cover body.
In one possible implementation, the cover body is provided with a switch structure, and the switch structure is suitable for allowing the solar cell to enter the cover body or move out of the cover body.
In one possible implementation, the cutting device comprises a laser device, and the cutting source comprises a laser beam.
According to another aspect of the present application, there is provided a photovoltaic module comprising at least one set of cell strings, wherein the cell strings comprise a cell obtained by the solar cell cutting method as described above, or a cell obtained by using the solar cell cutting device as described above.
Compared with the prior art, the technical scheme provided by the application can achieve the following beneficial effects:
the application provides a solar wafer's cutting method, when utilizing the cutting technology to cut the solar wafer, let in oxidizing gas in to cutting equipment, thereby, utilize this cutting technology can make the region of waiting to cut of solar wafer produce certain heat, have certain high temperature, by the ablation, form the cutting section, and this cutting is gone on under the oxidizing atmosphere, can realize the thermal oxidation treatment to the cutting section with the help of the (heat) high temperature of being ablated department, make the cutting section form the surface passivation, can avoid the serious phenomenon of edge carrier recombination in section department, reduce the efficiency loss that section department brought by the heat damage.
According to the cutting method, the surface of the cut section can be passivated by utilizing the high temperature of cutting through thermal oxidation, the passivation at the edge of the cut section and the cut section are completed synchronously, the production efficiency can be improved, the production cost is reduced, the efficiency loss caused by thermal damage at the cut section can be reduced, and the conversion efficiency of the solar cell is improved.
The cutting device for cutting the solar cell piece provided by the application is based on the same inventive concept as the cutting method of the solar cell piece, so that the cutting device at least has all the characteristics and advantages of the cutting method of the solar cell piece, and further description is omitted.
It is to be understood that both the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the application.
Drawings
In order to more clearly illustrate the detailed description of the present application or the technical solutions in the prior art, the drawings needed to be used in the detailed description of the present application or the prior art description will be briefly introduced below, and it is obvious that the drawings in the following description are some embodiments of the present application, and other drawings can be obtained by those skilled in the art without creative efforts.
Fig. 1 is a schematic structural diagram of a cutting apparatus for cutting a solar cell sheet according to an exemplary embodiment of the present disclosure;
fig. 2 is a schematic structural diagram of another cutting apparatus for cutting a solar cell piece according to an exemplary embodiment of the present application.
Reference numerals:
1-a bearing platform;
2-solar cell slice;
3-a cutting device;
4-a cover body;
401-an oxidizing gas inlet;
402-an oxidizing gas outlet;
5-a temperature monitoring mechanism;
6-pressure monitoring mechanism.
Detailed Description
In order to make the objects, technical solutions and advantages of the present application more apparent, the present application is described in further detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the present application and are not intended to limit the present application.
It should be understood that the term "and/or" as used herein is merely one type of association that describes an associated object, meaning that three relationships may exist, e.g., a and/or B may mean: a exists alone, A and B exist simultaneously, and B exists alone.
It should be understood that the terms "upper," "lower," "inner," "outer," and the like in the description of the embodiments of the present application are used for descriptive purposes only and not for purposes of limitation. Further, it will be understood that when an element is referred to as being "on" or "under" another element, it can be directly on or under the other element or be indirectly on or under the other element via an intermediate element. As used in the examples of this application and the appended claims, the singular forms "a", "an", and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise.
All the technical features mentioned herein, as well as preferred features, may be combined with each other to form new solutions, if not mentioned specifically. Unless defined or indicated otherwise, technical and scientific terms used herein have the same meaning as is familiar to those skilled in the art.
In the present invention, unless otherwise stated, the numerical range "a-b" represents a shorthand representation of any combination of real numbers between a and b, including a and b, where a and b are both real numbers. For example, a numerical range of "1 to 20" means that all real numbers between "1 to 20" have been listed herein, and "1 to 20" is only a shorthand representation of the combination of these numbers. The "ranges" disclosed herein may have one or more lower limits and one or more upper limits, respectively, in the form of lower limits and upper limits.
As the technical background, the conventional solar cell cutting method has the defects that the surface after laser ablation has thermal damage, and the conventional method has no proper edge passivation treatment mode after slicing, so that edge carriers at the slicing position are seriously compounded, and the efficiency of the sliced cell is lost. It should be understood that the embodiment of the present invention mainly uses laser cutting as an example to describe the cutting process of the existing solar cell in detail, and then, other related or similar cutting processes also have the same or similar problems.
Therefore, in order to overcome the defects of the prior art, the technical scheme of the embodiment of the invention provides a cutting method, a cutting device and a photovoltaic module of a solar cell, so that the high temperature of cutting is utilized for thermal oxidation, the surface passivation of a solar cell slicing part, namely a cutting section, is realized while the cutting treatment is carried out, and the conversion efficiency of the solar cell is improved.
In view of this, an embodiment of the present application provides a method for cutting a solar cell, including the following steps:
placing the solar cell in cutting equipment, cutting the solar cell by using a cutting process, and introducing oxidizing gas into the cutting equipment while cutting;
the cutting process enables the area to be cut of the solar cell to generate heat and be corroded, and thermal oxidation treatment of the cut section of the solar cell is achieved through the heat of the corroded area in an oxidizing atmosphere, so that the cut section is passivated in surface.
According to the cutting method of the solar cell piece, oxidizing gas is introduced in the cutting process, and thermal oxidation treatment of the cut section of the solar cell piece is realized by means of heat (high temperature) of a melted part, so that the cut section is passivated on the surface, and the conversion efficiency of the cell is improved. Particularly, the method can synchronously complete the passivation and slicing at the edge of the slice, can be realized by only carrying out a small amount of transformation on the existing equipment, can avoid equipment investment and energy consumption of the subsequent additional passivation treatment process, can improve the production efficiency, reduce the production cost, reduce the efficiency loss caused by heat damage at the slice position, and improve the conversion efficiency of the solar cell.
In particular, in the cutting method, the specific implementation manner of the cutting process can be various types. Illustratively, the cutting process may be performed using a controlled cutting process. The controlled cutting process provides the required energy within a portion of the area to be cut of the solar cell sheet to be cut. The controlled cutting process may be an existing cutting process, for example, the controlled cutting process has been described in U.S. patent No. 6,013,563, entitled "controlled cutting process," to which specific reference is made and which will not be described in detail herein.
In a specific embodiment, the cutting process may be performed by using a heat treatment process. In particular, the heat treatment process provides a certain amount of heat (thermal gradient) at the area to be cut of the solar cell sheet to be cut, and for example, the heating can be accomplished by various techniques, such as conduction, convection, radiation, and any combination thereof. Wherein the conduction may be through a heating plate or other contact device or the like or by conduction with a fluid and/or gas; the radiation may include heat lamps, flash lamps, laser lamps, fast-heating device lamps, and the like.
It should be understood that the cutting process may be performed by using a heat treatment process, the heat treatment process may generate a certain amount of heat or a high temperature, and the specific manner of generating heat may be various, and the embodiment of the present invention is not limited to the specific operation manner of the heat treatment process as long as the heat treatment process can enable the to-be-cut region of the to-be-cut solar cell to have a certain amount of heat or be melted to form the cut section, and the purpose of the present invention is not limited.
In particular, in some embodiments, the cutting process may be a laser cutting process, i.e., the cutting process may be performed using a laser to provide energy for cutting. With a laser, selected areas to be cut can be formed to allow the laser to penetrate a portion of the substrate and to allow energy to be absorbed at a portion of the cut area. The specific type of the laser may be various types, for example, the laser may be pulsed and/or flash and/or specific to a space region, or the laser may be ultraviolet light, visible light, infrared light, etc., and the specific type of the laser is not limited by the embodiment of the present invention.
It should be noted that the cutting process may be a laser cutting process, but is not limited thereto, and for example, in other embodiments, the cutting process may also be implemented by a mechanical cutting process, or may be implemented by an acoustic process, or may be implemented by a combination of laser cutting and mechanical cutting, or may be implemented by electron beam bombardment, or may be implemented by an ion beam, or may be implemented by a high-energy particle beam, and the like. For convenience of description, the embodiments of the present application mainly use a laser cutting process as an example, and the cutting process and the cutting method of the solar cell are specifically described. However, those skilled in the art will understand that the principles of the present invention may be implemented in any suitable cutting process and are not limited to laser cutting processes. Moreover, descriptions of well-known functions, constructions, or specific operations may be omitted for clarity and conciseness.
On one hand, the solar cell is cut by adopting a laser cutting method, and the solar cell has the following advantages: the cutting ability is strong; the cutting precision is high, the cutting seam is narrow, the quality is good, the heat affected zone is small, and the cutting end surface is flat and smooth; the cutting speed is high, and the processing efficiency is high; the cutting tool is a non-contact type cutting tool, does not have mechanical processing force, does not deform, does not have the pollution problems of processing scraps, oil stain, noise and the like, and is green and environment-friendly. On the other hand, the existing laser cutting battery piece still has some defects, which are mainly shown in the following steps: when the laser is used for cutting, the crystal phase of the battery piece is damaged to a certain extent, the battery piece is damaged and craze to a certain extent, and the efficiency loss after slicing is large. Therefore, there is a need for improving the existing laser cutting process to reduce the cutting damage of the battery piece and prevent the power loss.
In order to reduce the damage to the cutting section of the cell, the invention introduces oxidizing gas into the cutting equipment while cutting, namely the oxidizing gas is used for passivating the cutting position during the cutting process of the solar cell, thereby reducing the cutting damage of the cut cell and reducing the efficiency loss caused by thermal damage at the laser cutting position. Specifically, in some embodiments, the oxidizing gas comprises oxygen or a mixed gas comprising oxygen. Oxidizing gas is used for directly carrying out thermal oxidation passivation on the section to generate at least one passivation layer, so that the exposed silicon on the cut section can be protected, the cutting damage of the cell piece is reduced, the power loss is prevented, and the conversion efficiency of the solar cell is improved.
The oxidizing gas may be composed of one gas or a plurality of gases, for example, oxygen gas, which is a single gas, or a mixed gas of oxygen gas and other gases, such as a mixed gas of oxygen gas and a small amount of nitrogen gas, a mixed gas of oxygen gas and a small amount of hydrogen gas, and a mixed gas of oxygen and a small amount of argon gas. Preferably, the oxidizing gas is single-gas oxygen, i.e. the used oxidizing gas is preferably common oxygen, which facilitates thermal oxidation treatment to passivate the surface at the cutting edge, and the gas source is safe and stable, has low cost, and can effectively improve the passivating effect.
It should be noted that, in the case of satisfying the required thermal oxidation treatment to passivate the surface at the cutting edge, there is no limitation on the specific type and content of the other gases in the above mixed gas, for example, when the oxidizing gas is a mixed gas of oxygen and other gases, the oxygen and other gases may be mixed in any proportion without affecting the performance of the cut cell, and the specific proportion or content thereof is not particularly limited and can be adjusted by those skilled in the art according to the actual situation.
Therefore, when the battery is cut, the oxidizing gas is introduced into the cutting equipment, so that the efficiency loss of the cutting method during cutting of the battery piece is reduced, the efficiency of the cut small battery pieces is improved, and the overall power of the assembly is further improved.
Specifically, in some embodiments, the flow rate of the oxidizing gas is not greater than 100slm, further may be 0.1 to 100slm, further may be 10 to 80 slm; typical but non-limiting examples may be 0.1slm, 1slm, 10slm, 20slm, 30slm, 40slm, 50slm, 60slm, 80slm, 90slm, 100slm, etc. By adjusting the flow of the appropriate oxidizing gas, the passivation effect is improved, the cutting efficiency is ensured, the resource waste is reduced, the cost is reduced, and the efficiency loss caused by thermal damage at the laser slice position is effectively reduced.
In some embodiments, the pressure within the cutting apparatus is from 1kPa to 120kPa, further may be from 2kPa to 100kPa, further may be from 5kPa to 60 kPa; typical but non-limiting examples are 1kPa, 2kPa, 5kPa, 10kPa, 20kPa, 40kPa, 50kPa, 60kPa, 80kPa, 100kPa, 110kPa, 120kPa, etc. The thermal oxidation treatment needs to be carried out under a certain pressure, and the thermal oxidation treatment is carried out within the proper pressure range, so that the passivation effect can be improved, the cutting efficiency is ensured, and the efficiency loss caused by thermal damage at the laser slice position is effectively reduced.
According to the cutting method provided by the embodiment of the invention, the cutting process is utilized for carrying out slicing treatment, the cutting process can be a laser cutting process, oxidizing gas such as oxygen is introduced in the laser slicing process, and thermal oxidation treatment is carried out on the cutting section by utilizing the high temperature of the laser ablation part. Specifically, in some embodiments, the laser cutting process satisfies at least one of the following operating conditions:
the laser wavelength is 1064 nm;
the frequency is 100kHz-500kHz, further can be 150-450kHz, further can be 200-400kHz, and typical but not limiting, for example can be 100kHz, 150kHz, 200kHz, 300kHz, 400kHz, 450kHz, 500kHz, etc.;
the power is 1W-50W, further can be 2-40W, further can be 10-30W, and typical but not limiting, for example, can be 1W, 2W, 5W, 8W, 10W, 15W, 20W, 30W, 35W, 40W, 50W, etc.;
the cutting speed is 1000mm/s-10000mm/s, further 2000-;
the number of times of cleavage is 1 to 20, further 2 to 18, further 3 to 15, and typical but not limiting examples thereof include 1, 2, 4, 5, 6, 8, 10, 12, 15, 18, 20, and the like.
Within the laser frequency, power, cutting speed and cutting frequency ranges, thermal oxidation treatment can be effectively guaranteed while cutting treatment is carried out, the surface passivation effect at the cutting edge is improved, efficiency loss caused by thermal damage at the laser slice position is effectively reduced, production efficiency can be improved, and production cost can be reduced.
In the laser cutting process, the width and the depth of the laser cutting are adjustable, the width and the depth of the laser cutting can be adjusted by adjusting specific operating parameters of the laser cutting process, and the specific width, the specific depth and the like can be selected and designed according to actual requirements, which is not limited in the embodiment of the invention.
In the laser cutting process, the laser beam may be a pulse laser beam or a continuous thermal laser beam. For example, it may be an infrared pulse laser beam, or it may be an infrared continuous heat laser beam.
In order to cut the battery piece in a pre-designed direction, the cutting source needs to move in a predetermined direction, and the moving direction of the introduced oxidizing gas needs to be adapted to the path of the cutting source. In particular, in some embodiments, the cutting apparatus is provided with an oxidizing gas inlet and an oxidizing gas outlet, and the cutting process is performed using energy of a cutting source; the flow path of the oxidizing gas within the cutting apparatus is the same as or parallel to the path of the cutting source. The cutting process can be a laser cutting process, the cutting source can be laser (laser beam), when oxidizing gas is introduced into the cutting equipment or an oxidizing gas inlet and an oxidizing gas outlet are designed, the flowing path of the oxidizing gas in the cutting equipment is required to be the same as or parallel to the path of the laser, so that the high temperature of a laser erosion part can be effectively utilized, the oxidizing gas is utilized to directly carry out thermal oxidation treatment on the cutting section under certain pressure to form a passivation layer generated by surface passivation, further, exposed silicon at the cutting section is protected, the cutting damage of a cell piece is reduced, the power loss is prevented, and the conversion efficiency of the solar cell is improved. In addition, the mode of designing the oxidizing gas inlet and the oxidizing gas outlet is beneficial to reducing the cost, and the structure is simple and easy to process and manufacture.
In the above cutting method, the specific structure, shape, type, etc. of the whole battery piece are not limited, and correspondingly, the specific structure, shape, or type of the cut battery piece is also not limited, and the specific shape structure, etc. may be selected and set according to the actual situation, for example, the whole battery piece or the cut battery piece may be rectangular, square, or other shapes structure, etc., and will not be described in detail herein.
Compared with the existing cutting method, the solar cell slice cutting method provided by the embodiment of the invention does not need to perform additional treatment such as subsequent passivation treatment operation and the like after cutting, but introduces oxidizing gas during cutting, realizes thermal oxidation treatment at the solar cell slice position by virtue of high temperature at the ablation position, forms surface passivation, further completes passivation at the slice edge together with laser slicing, avoids thermal damage caused by traditional laser cutting, improves the slice yield to a certain extent, and improves the conversion efficiency of the solar cell.
Referring to fig. 1 and fig. 2, an embodiment of the present application further provides a cutting apparatus for cutting a solar cell, including:
the carrying table 1 is used for carrying the solar cell 2;
the cutting device 3 is used for generating a cutting source, and cutting the solar cell slice 2 by using the energy of the cutting source, so that the solar cell slice 2 to be cut generates heat and is corroded;
and the cover body 4 is covered on the outer side of the bearing table 1, the cover body 4 is suitable for allowing oxidizing gas to enter the cover body 4, and thermal oxidation treatment of the cut section of the solar cell piece 2 is realized by means of heat of the eroded part under an oxidizing atmosphere, so that the surface passivation is formed on the cut section.
The cutting device for cutting the solar cell is based on the same inventive concept as the cutting method of the solar cell, and thus has at least the same characteristics and advantages as the cutting method of the solar cell.
Namely, the working principle of the cutting equipment is that oxidizing gas is introduced in the cutting treatment process, and thermal oxidation treatment of the cut section of the solar cell piece 2 is realized by means of heat (high temperature) of the melted part, so that the cut section is passivated on the surface, and the conversion efficiency of the cell is improved. Especially, utilize this equipment to enable the passivation and the synchronous completion of section edge, this cutting equipment only needs to carry out a small amount of transformation to current equipment and can realize, can avoid the equipment input and the energy resource consumption of follow-up extra passivation treatment process, can improve production efficiency, reduction in production cost can also reduce the efficiency loss that section department was brought by the heat damage, promotes solar cell conversion efficiency.
In particular, in some embodiments, the cutting device 3 comprises a laser device and the cutting source comprises a laser beam. It should be understood that, as mentioned above, the cutting device 3 may be a laser device, but is not limited to, for example, a mechanical cutting device, an ion beam device, an electron beam bombardment device, etc., and specific reference may be made to the description of the foregoing solar cell cutting method, which is not described herein again.
In some embodiments, the laser device comprises a laser capable of generating a laser beam. The embodiment of the present invention is not limited to the specific structure or type of the laser, and may be, for example, a semiconductor laser, a liquid laser, a gas laser, or the like.
In addition, the laser apparatus may further include a mechanism for adjusting an angle and an irradiation position of the laser beam generated by the laser.
The laser device can be arranged on the outer side of the cover body 4, the bearing table 1 and the solar cell piece 2 arranged on the bearing table 1 can be arranged on the inner side of the cover body 4, and a laser beam generated by the laser device penetrates through the cover body 4 to be focused on the position, to be split, of the solar cell piece 2 to be cut so as to cut the solar cell piece. Alternatively, the laser device may be disposed inside the cover 4, and the laser beam generated by the laser device is directly focused on the to-be-split position of the solar cell 2 to perform the cutting process on the to-be-cut cell.
In some embodiments, the cover 4 may be a cover made of glass, and further may be a cover 4 made of transparent glass resistant to high temperatures. In this way, when the laser device is disposed outside the cover 4, the laser beam can be conveniently focused on the position to be split of the solar cell 2 through the glass cover 4 to perform the cutting process.
Specifically, in some embodiments, the housing 4 is provided with an oxidizing gas inlet 401 at one side and an oxidizing gas outlet 402 at the other side, and the flowing path of the oxidizing gas in the housing 4 is the same as or parallel to the path of the cutting source. Wherein the cutting source may be a laser beam; the oxidizing gas inlet 401 and the oxidizing gas outlet 402 may be provided in one or more.
Illustratively, the housing 4 may be formed by being surrounded by a plurality of sidewalls, including a left sidewall, a right sidewall, a front sidewall, a rear sidewall, an upper sidewall, and the like. The left side wall and the right side wall may be disposed oppositely, the front side wall and the right side wall may be disposed oppositely, the oxidizing gas inlet 401 may be disposed on the left side wall of the cover 4, the oxidizing gas outlet 402 may be disposed on the right side wall of the cover 4, or the oxidizing gas inlet 401 may be disposed on the front side wall of the cover 4, the oxidizing gas outlet 402 may be disposed on the rear side wall of the cover 4, and the specific arrangement manner of the oxidizing gas inlet and outlet may be various according to the moving path of the laser beam, and will not be described in detail herein.
Thus, through the design of the oxidizing gas inlet 401 and the oxidizing gas outlet 402, the flowing path of the oxidizing gas in the cover body 4 is the same as or parallel to the path of the laser beam, the high temperature at the laser ablation part can be effectively utilized, the thermal oxidation treatment is directly carried out on the cutting section by the oxidizing gas under a certain pressure, a passivation layer generated by surface passivation is formed, and further, the exposed silicon at the cutting section is protected, the cutting damage of a cell piece is reduced, the loss of power is prevented, the conversion efficiency of the solar cell is improved, and the solar cell has the advantages of simple structure, low cost and easiness in processing and manufacturing.
In some embodiments, the cutting apparatus further comprises an oxidizing gas source (not shown) for providing an oxidizing gas, which may be connected to the oxidizing gas inlet 401, by which an oxidizing gas, such as oxygen, is introduced into the enclosure 4 through the oxidizing gas inlet 401.
The cutting facility further includes an oxidizing gas recovery device (not shown) for recovering the oxidizing gas, which is connectable to the oxidizing gas outlet 402, and by which the oxidizing gas flowing out of the housing 4 can be recovered and recovered for disposal or reuse.
Specifically, as shown in fig. 2, in some embodiments, at least one temperature monitoring mechanism 5 is disposed within the enclosure 4; the temperature monitoring mechanism 5 can be used for detecting the ambient temperature inside the cover 4 and the temperature at the laser cutting position. Exemplarily, a temperature monitoring mechanism 5 can be arranged at any position in the cover body 4 to detect the ambient temperature in the cover body 4, and a temperature monitoring mechanism 5 can be arranged at a laser cutting position close to the solar cell 2 to detect the temperature at the laser cutting position, so that the temperature in the cutting process can be monitored conveniently, the smooth proceeding of thermal oxidation treatment can be ensured, and the surface passivation effect at the cutting edge can be improved.
The specific structure or type of the temperature monitoring mechanism 5 is not limited in the embodiment of the present invention, as long as the temperature of the environment inside the cover body or the temperature of the laser cutting part can be conveniently detected, and for example, an infrared temperature measuring mechanism can be adopted.
In some embodiments, as shown in fig. 2, a pressure monitoring mechanism 6 is disposed within the enclosure 4. The pressure monitoring means 5 is preferably provided on one side or both sides parallel to the laser path, and for example, may be provided at a position near the oxidizing gas inlet 401, or may be provided at a position near the oxidizing gas outlet 402, or may be provided at a position near the oxidizing gas inlet 401 and the oxidizing gas outlet 402, respectively, with pressure monitoring means 6. The pressure of the cover body can be controlled by adjusting the gas inlet and outlet amount of the oxidizing gas. Through the setting of pressure monitoring mechanism 6, conveniently monitor the internal pressure of cover, guarantee going on smoothly of thermal oxidation treatment, improve the surface passivation effect of cutting edge department.
The specific structure or type of the pressure monitoring mechanism 6 in the embodiment of the present invention is not limited, as long as the pressure inside the cover body can be conveniently detected, and for example, a pressure sensor may be used.
Specifically, in some embodiments, the cover 4 is provided with a switch structure (not shown) adapted to allow the solar cell sheet 2 to enter into the cover 4 or move out of the cover 4. The switch structure may be a switch door that can allow the solar cell 2 to enter and exit, and further may be a switch door that can be automatically opened and closed. Thus, the operation is convenient, and the cutting efficiency is improved.
As can be seen from the above, the cutting apparatus for cutting a solar cell provided in the embodiment of the present invention is a little improved over the existing cutting apparatus, and the cutting apparatus is provided with the additional cover body 4, the cover body 4 is covered outside the carrying table 4 capable of accommodating and carrying the solar cell 2, the cover body 4 is provided with a switch structure, such as a switch door, capable of automatically opening and closing and allowing the solar cell 2 to enter and exit the cover body 4, the cover body 4 is provided with a temperature monitoring mechanism 5 capable of detecting the temperature inside the cover body 4 and the temperature at the laser cutting position, and two sides parallel to the laser path direction are respectively provided with a single pair or multiple pairs of air inlet and outlet channels and a pressure monitoring mechanism 6. From this, can make the passivation and the synchronous completion of laser cutting piece in section edge, can avoid the equipment input and the energy resource consumption of follow-up extra passivation treatment process, can improve production efficiency, reduction in production cost can also reduce the efficiency loss that section department brought by the heat damage, promotes solar cell conversion efficiency.
Embodiments of the present invention also provide a photovoltaic module, which includes at least one group of cell strings, where the cell strings include a cell obtained by the above-described solar cell cutting method, or a cell obtained by using the above-described solar cell cutting device.
In some embodiments, the photovoltaic module may be a half-sheet photovoltaic module or a shingled photovoltaic module.
The photovoltaic module comprises the battery piece obtained by the cutting method or the cutting equipment, the reliability is good, and the safety and the conversion efficiency of the photovoltaic module are improved.
The above description is only a preferred embodiment of the present application and is not intended to limit the present application, and various modifications and changes may be made by those skilled in the art. Any modification, equivalent replacement, improvement and the like made within the spirit and principle of the present application shall be included in the protection scope of the present application.
It is noted that a portion of this patent application contains material which is subject to copyright protection. The copyright owner reserves the copyright rights whatsoever, except for making copies of the patent files or recorded patent document contents of the patent office.
Claims (10)
1. A method for cutting a solar cell is characterized by comprising the following steps:
placing the solar cell in cutting equipment, cutting the solar cell by using a cutting process, and introducing oxidizing gas into the cutting equipment while cutting;
the cutting process enables the area to be cut of the solar cell to generate heat and be corroded, and thermal oxidation treatment of the cut section of the solar cell is achieved through the heat of the corroded area in an oxidizing atmosphere, so that the cut section is passivated in surface.
2. The method for cutting a solar cell sheet according to claim 1, wherein the oxidizing gas comprises oxygen or a mixed gas containing oxygen.
3. The method for cutting a solar cell sheet according to claim 1, wherein the flow rate of the oxidizing gas is not more than 100 slm;
and/or the pressure in the cutting apparatus is from 1kPa to 120 kPa.
4. The method for cutting the solar cell piece according to any one of claims 1 to 3, wherein the cutting process comprises a laser cutting process, and the laser cutting process at least meets one of the following operating conditions:
the laser wavelength is 1064 nm;
the frequency is 100kHz-500 kHz;
the power is 1W-50W;
the cutting speed is 1000mm/s-10000 mm/s;
the cutting times are 1-20 times.
5. The method for cutting a solar cell sheet according to any one of claims 1 to 3, wherein the cutting apparatus is provided with an oxidizing gas inlet and an oxidizing gas outlet, and the cutting process is performed using energy of a cutting source;
the flow path of the oxidizing gas within the cutting apparatus is the same as or parallel to the path of the cutting source.
6. A cutting apparatus for cutting a solar cell sheet, comprising:
the bearing table is used for bearing the solar cell;
the cutting device is used for generating a cutting source and cutting the solar cell piece by utilizing the energy of the cutting source so that the area to be cut of the solar cell piece generates heat and is corroded;
and the cover body is covered on the outer side of the bearing table and is suitable for allowing oxidizing gas to enter the cover body, and thermal oxidation treatment of the cut section of the solar cell piece is realized by means of heat of the eroded part under an oxidizing atmosphere, so that the surface of the cut section is passivated.
7. The cutting apparatus for cutting solar cell pieces according to claim 6, wherein the cover body is provided with an oxidizing gas inlet on one side and an oxidizing gas outlet on the other side, and the flowing path of the oxidizing gas in the cover body is the same as or parallel to the path of the cutting source.
8. The cutting device for cutting the solar cell piece according to claim 6, wherein a temperature monitoring mechanism is arranged in the cover body;
and/or a pressure monitoring mechanism is arranged in the cover body.
9. The cutting apparatus for cutting solar cell pieces according to any one of claims 6 to 8, wherein the cover body is provided with a switch structure adapted to allow the solar cell pieces to enter into or move out of the cover body.
10. A photovoltaic module comprising at least one string of cells, wherein the string of cells comprises a cell obtained by the method for cutting a solar cell according to any one of claims 1 to 5 or a cell obtained by the apparatus for cutting a solar cell according to any one of claims 6 to 9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010699078.2A CN111816557A (en) | 2020-07-20 | 2020-07-20 | Solar cell cutting method, solar cell cutting equipment and photovoltaic module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010699078.2A CN111816557A (en) | 2020-07-20 | 2020-07-20 | Solar cell cutting method, solar cell cutting equipment and photovoltaic module |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN111816557A true CN111816557A (en) | 2020-10-23 |
Family
ID=72866164
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202010699078.2A Pending CN111816557A (en) | 2020-07-20 | 2020-07-20 | Solar cell cutting method, solar cell cutting equipment and photovoltaic module |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN111816557A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113013290A (en) * | 2021-02-20 | 2021-06-22 | 泰州隆基乐叶光伏科技有限公司 | Passivation method of sliced battery, sliced battery after passivation and battery assembly |
| CN113257951A (en) * | 2021-03-30 | 2021-08-13 | 苏州联诺太阳能科技有限公司 | Preparation method of sliced battery and laser equipment |
| CN113829528A (en) * | 2021-09-24 | 2021-12-24 | 湖北美格新能源科技有限公司 | Cutting method of functional semiconductor device |
| CN114765232A (en) * | 2020-12-30 | 2022-07-19 | 苏州阿特斯阳光电力科技有限公司 | Battery piece and preparation method thereof, photovoltaic module with battery piece and preparation method |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH09192870A (en) * | 1996-01-10 | 1997-07-29 | Sumitomo Heavy Ind Ltd | Laser beam machining head, device, and method |
| CN1561277A (en) * | 2001-03-22 | 2005-01-05 | 埃克赛尔技术有限公司 | A laser machining system and method |
| CN104353933A (en) * | 2014-10-22 | 2015-02-18 | 信阳师范学院 | Laser scribing device for photovoltaic cells |
| CN204195066U (en) * | 2014-10-22 | 2015-03-11 | 信阳师范学院 | A kind of laser scriber of photovoltaic cell |
| CN110071178A (en) * | 2019-04-12 | 2019-07-30 | 泰州隆基乐叶光伏科技有限公司 | A kind of preparation method being sliced battery and slice battery and photovoltaic module |
| CN110137271A (en) * | 2019-04-25 | 2019-08-16 | 泰州隆基乐叶光伏科技有限公司 | The passivating method and device and slice battery and photovoltaic module of slice battery |
| CN111081819A (en) * | 2019-12-31 | 2020-04-28 | 通威太阳能（合肥）有限公司 | Damage-preventing cutting method and device for solar cell |
-
2020
- 2020-07-20 CN CN202010699078.2A patent/CN111816557A/en active Pending
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH09192870A (en) * | 1996-01-10 | 1997-07-29 | Sumitomo Heavy Ind Ltd | Laser beam machining head, device, and method |
| CN1561277A (en) * | 2001-03-22 | 2005-01-05 | 埃克赛尔技术有限公司 | A laser machining system and method |
| CN104353933A (en) * | 2014-10-22 | 2015-02-18 | 信阳师范学院 | Laser scribing device for photovoltaic cells |
| CN204195066U (en) * | 2014-10-22 | 2015-03-11 | 信阳师范学院 | A kind of laser scriber of photovoltaic cell |
| CN110071178A (en) * | 2019-04-12 | 2019-07-30 | 泰州隆基乐叶光伏科技有限公司 | A kind of preparation method being sliced battery and slice battery and photovoltaic module |
| CN110137271A (en) * | 2019-04-25 | 2019-08-16 | 泰州隆基乐叶光伏科技有限公司 | The passivating method and device and slice battery and photovoltaic module of slice battery |
| CN111081819A (en) * | 2019-12-31 | 2020-04-28 | 通威太阳能（合肥）有限公司 | Damage-preventing cutting method and device for solar cell |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114765232A (en) * | 2020-12-30 | 2022-07-19 | 苏州阿特斯阳光电力科技有限公司 | Battery piece and preparation method thereof, photovoltaic module with battery piece and preparation method |
| CN113013290A (en) * | 2021-02-20 | 2021-06-22 | 泰州隆基乐叶光伏科技有限公司 | Passivation method of sliced battery, sliced battery after passivation and battery assembly |
| CN113257951A (en) * | 2021-03-30 | 2021-08-13 | 苏州联诺太阳能科技有限公司 | Preparation method of sliced battery and laser equipment |
| CN113257951B (en) * | 2021-03-30 | 2022-09-20 | 苏州联诺太阳能科技有限公司 | Preparation method of sliced battery and laser equipment |
| CN113829528A (en) * | 2021-09-24 | 2021-12-24 | 湖北美格新能源科技有限公司 | Cutting method of functional semiconductor device |
| CN113829528B (en) * | 2021-09-24 | 2024-01-26 | 湖北美格新能源科技有限公司 | Cutting method of functional semiconductor device |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN111816557A (en) | Solar cell cutting method, solar cell cutting equipment and photovoltaic module | |
| EP2507182B1 (en) | Methods for laser scribing and separating glass substrates | |
| JP2022035906A (en) | Method for cutting/passivating silicon-based semiconductor device, and silicon-based semiconductor device | |
| US20110127244A1 (en) | Methods for laser scribing and separating glass substrates | |
| Bartlome et al. | Laser applications in thin-film photovoltaics | |
| Tangwarodomnukun et al. | A comparison of dry and underwater laser micromachining of silicon substrates | |
| CN106475680A (en) | A kind of method that OCA optical cement in interlayer is disassembled using laser | |
| CN104264130B (en) | Preparation method and preparation device of graphene | |
| CN102709163B (en) | A kind of crystalline silicon etching technique based on laser interference induced reaction | |
| WO2008084206A1 (en) | A process for laser cutting a non-metallic material | |
| CN111081819B (en) | Damage-preventing cutting method and device for solar cell | |
| JP2008060205A (en) | Solar cell and method for manufacturing the same | |
| KR101532721B1 (en) | Spatially selective laser annealing applications in high-efficiency solar cells | |
| CN217315884U (en) | High-energy laser material increasing and decreasing composite manufacturing device | |
| CN113649701B (en) | Laser edge cleaning method and device for solar cell | |
| Okoshi et al. | Laser ablation of polymers using 395 nm and 790 nm femtosecond lasers | |
| Lin et al. | Precision machining of single crystal diamond cutting tool via picosecond laser irradiation | |
| Saetang et al. | Laser scribing of fluorine-doped tin oxide coated on glass substrate in air and water | |
| JP2011035262A (en) | Processing method and processing apparatus for manufacture of crystal-based solar cell | |
| CN208674581U (en) | A kind of multichannel picosecond laser | |
| CN106363307A (en) | Novel machining method for NdFeB | |
| CN113774494B (en) | Stripping method and stripping device for semi-insulating silicon carbide single crystal wafer | |
| US20120318776A1 (en) | Method and apparatus for machining a workpiece | |
| CN104353933A (en) | Laser scribing device for photovoltaic cells | |
| CN103586587A (en) | Laser cutting method of silicon wafers |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination |