CN111816443A - High-temperature ceramic plate type array capacitor and preparation method thereof - Google Patents
High-temperature ceramic plate type array capacitor and preparation method thereof Download PDFInfo
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/005—Electrodes
- H01G4/012—Form of non-self-supporting electrodes
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B41/00—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone
- C04B41/009—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone characterised by the material treated
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B41/00—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone
- C04B41/45—Coating or impregnating, e.g. injection in masonry, partial coating of green or fired ceramics, organic coating compositions for adhering together two concrete elements
- C04B41/52—Multiple coating or impregnating multiple coating or impregnating with the same composition or with compositions only differing in the concentration of the constituents, is classified as single coating or impregnation
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B41/00—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone
- C04B41/80—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone of only ceramics
- C04B41/81—Coating or impregnation
- C04B41/89—Coating or impregnation for obtaining at least two superposed coatings having different compositions
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/018—Dielectrics
- H01G4/06—Solid dielectrics
- H01G4/08—Inorganic dielectrics
- H01G4/12—Ceramic dielectrics
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/224—Housing; Encapsulation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/228—Terminals
- H01G4/232—Terminals electrically connecting two or more layers of a stacked or rolled capacitor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/30—Stacked capacitors
Abstract
The invention discloses a high-temperature ceramic plate type array capacitor and a preparation method thereof, wherein the capacitor main body comprises: ceramic dielectric, internal electrode and terminal electrode, the capacitor main part is the multilayer platelike structure who has a plurality of signal holes, internal electrode includes: the ceramic dielectric ceramic capacitor comprises a plurality of common grounding electrodes and a plurality of signal electrodes, wherein the common grounding electrodes and the signal electrodes are alternately arranged in the lamination direction of the ceramic dielectric, and the projection parts of the common grounding electrodes and the signal electrodes on the lamination plane are overlapped; each common grounding electrode extends inwards from the outer edge of the ceramic medium and keeps a space with the signal hole; each signal pole extends outwardly from a signal aperture and is spaced from the outer edge of the capacitor adjacent the signal pole of the signal aperture. The invention solves the problems that in the prior art, a discrete ceramic tube type capacitor filter has weak mechanical impact resistance, is easy to damage and is easy to cause the reliability reduction of the whole filter.
Description
Technical Field
The embodiment of the invention relates to the technical field of capacitors, in particular to a high-temperature ceramic plate type array capacitor and a preparation method thereof.
Background
With the development of electronic equipment with high frequency, high speed, high sensitivity, high reliability, multiple functions, miniaturization and informatization, the development of electrical connectors with miniaturization, high density, high frequency and multiple functions is also in progress, and the demand of various devices for resisting electromagnetic interference is rapidly increased. There are two main ways to resist electromagnetic interference: and (4) shielding and filtering. Conventional filter connectors mostly employ tube capacitor filtering. The tubular capacitor is characterized by large size, low capacitance, poor mechanical strength and low reliability. Because the tubular capacitor is of a single-layer ceramic structure, the thickness of the ceramic tube is generally 0.2 mm-0.4 mm, the mechanical strength and the capacitance of the ceramic tube become a pair of contradictions due to the thickness of the ceramic tube, and the mechanical strength of the ceramic tube is sacrificed when large capacity is obtained. The anti-electromagnetic interference filter is mainly used for filtering high-frequency interference signals, the capacitance of the required filter is relatively large, and the structural characteristics of the tubular capacitor filter restrict the capacity design of the tubular capacitor filter.
The filter connector is also required to be applied to a control system of equipment working in a high-temperature environment, and the core component of the filter connector is required to be resistant to the high-temperature environment and can stably work in the environment for a long time. However, the conventional discrete ceramic tube capacitor filter has weak mechanical shock resistance and is easy to damage, so that the reliability of the whole filter is reduced, and the high-temperature ceramic plate array capacitor is successfully developed and applied.
Disclosure of Invention
Therefore, the invention provides a high-temperature ceramic plate type array capacitor and a preparation method thereof, and aims to solve the problems that in the prior art, a discrete ceramic tube type capacitor filter is weak in mechanical impact resistance, easy to damage and easy to cause reliability reduction of the whole filter.
In order to achieve the above purpose, the invention provides the following technical scheme:
according to a first aspect of the invention, there is disclosed a high temperature ceramic plate array capacitor, the capacitor body comprising: ceramic dielectric, internal electrode and terminal electrode, the capacitor main part is the multilayer platelike structure who has a plurality of signal holes, internal electrode includes: the ceramic dielectric ceramic capacitor comprises a plurality of common grounding electrodes and a plurality of signal electrodes, wherein the common grounding electrodes and the signal electrodes are alternately arranged in the lamination direction of the ceramic dielectric, and the projection parts of the common grounding electrodes and the signal electrodes on the lamination plane are overlapped; each common grounding electrode extends inwards from the outer edge of the ceramic medium and keeps a space with the signal hole; each signal pole extends outwardly from a signal aperture and is spaced from the outer edge of the capacitor adjacent the signal pole of the signal aperture.
Furthermore, the surface of the outer edge of the capacitor body is covered with a terminal electrode which is a public grounding electrode leading-out terminal, and the edge and the wall of the signal hole are covered with terminal electrodes which are leading-out terminals of the signal electrode.
According to a second aspect of the invention, a method for preparing a high-temperature ceramic plate array capacitor is disclosed, the method comprises the following steps:
s1, preparing a green body through wet printing;
s2, machining the green body by a machining method to enable the green body to be the same as the plate-type array capacitor in shape and to be in a certain proportion to the size of the green body;
s3, carrying out binder removal and sintering on the green body to prepare a ceramic medium;
and S4, preparing a common grounding electrode leading-out end, a signal electrode leading-out end and a surface coating layer on the ceramic dielectric to finish the preparation of the high-temperature ceramic plate type array capacitor.
Further, the method for preparing the green body by wet printing in the step S1 is as follows: preparing ceramic dielectric slurry, wherein the ceramic dielectric slurry is prepared by mixing ceramic powder and an organic binder, the content of the binder in the slurry is 5-20%, and the addition amount of a solvent in the binder is generally 30%;
the preparation of the ceramic dielectric slurry adopts general pulping equipment, so that the material input reaches the scale of 5-40 kg each time, the stability of the slurry performance and the mutual dispersion of the components are ensured, the particle size of slurry particles is less than or equal to 7 mu m, and the shrinkage rate of slurry printed green bodies after firing is stabilized at 15-17%.
Further, in the step S2, the ceramic dielectric paste and the internal electrode paste are printed layer by layer on the printing support plate, the green body is processed into a green body with through holes according to the required pattern size by using a machining method, and then the green body and the support plate are peeled off to form the green body to be fired.
Further, in the step S3, in order to avoid internal delamination, bubbles, cracking, etc. at the green body binder removal stage below 400 ℃, the sintering curve should be set according to the following requirements: setting the temperature rise speed to be 15-20 ℃/h and the heat preservation time to be 4-10 h;
the sintering temperature is 1050-1200 ℃, the heating rate is 10-100 ℃/h, the heat preservation time is 2-3 h, and the sintering is carried out in an oxidizing atmosphere.
Further, in the step S4, the sintered ceramic dielectric is coated with the palladium-silver terminal electrode slurry on the inner wall of the signal hole and the outer edge surface of the ceramic dielectric by a manual coating method, and then sintered to form the common ground electrode and the lead-out terminal electrode of the signal electrode; the sintering temperature is 850 ℃, and in order to prevent the terminal electrode of the capacitor from being oxidized when the capacitor works at the high temperature of 200 ℃, a layer of gold needs to be electroplated on the palladium-silver terminal electrode so as to ensure that the capacitor can normally work at the high temperature.
Further, in the step S4, the method for coating the surface includes: printing the medium glaze slurry on the upper and lower surfaces of a ceramic medium, and then sintering at 850 ℃ to form a medium glaze covering layer; and then the three-proofing paint is printed on the medium glaze layer.
The embodiment of the invention has the following advantages:
the invention discloses a high-temperature ceramic plate type array capacitor and a preparation method thereof, which are characterized in that wet printing is used for preparing a green body, the green body is processed into the green body with a signal hole according to the drawing size through a machining method, then glue is discharged and sintered, coating and printing are provided, and the preparation of a leading-out terminal electrode and a surface coating layer is completed, so that the mechanical impact resistance of a core part of a filter connector is improved, and the reliability of the filter connector is improved.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below. It should be apparent that the drawings in the following description are merely exemplary, and that other embodiments can be derived from the drawings provided by those of ordinary skill in the art without inventive effort.
The structures, ratios, sizes, and the like shown in the present specification are only used for matching with the contents disclosed in the specification, so as to be understood and read by those skilled in the art, and are not used to limit the conditions that the present invention can be implemented, so that the present invention has no technical significance, and any structural modifications, changes in the ratio relationship, or adjustments of the sizes, without affecting the effects and the achievable by the present invention, should still fall within the range that the technical contents disclosed in the present invention can cover.
Fig. 1 is a front view of a high-temperature ceramic plate array capacitor according to an embodiment of the present invention;
FIG. 2 is a side view of a high temperature ceramic plate array capacitor according to an embodiment of the present invention;
FIG. 3 is a cross-sectional view of a high temperature ceramic plate array capacitor according to an embodiment of the present invention;
in the figure: 1-ceramic medium, 2-public earth electrode leading-out terminal and 3-signal electrode leading-out terminal.
Detailed Description
The present invention is described in terms of particular embodiments, other advantages and features of the invention will become apparent to those skilled in the art from the following disclosure, and it is to be understood that the described embodiments are merely exemplary of the invention and that it is not intended to limit the invention to the particular embodiments disclosed. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Examples
Referring to fig. 1 to 3, the present embodiment discloses a high temperature ceramic plate array capacitor, the capacitor body including: ceramic dielectric 1, internal electrode and terminal electrode, the capacitor main part is the multilayer platelike structure who has a plurality of signal holes, the internal electrode includes: the ceramic dielectric ceramic capacitor comprises a plurality of common grounding electrodes and a plurality of signal electrodes, wherein the common grounding electrodes and the signal electrodes are alternately arranged in the lamination direction of the ceramic dielectric, and the projection parts of the common grounding electrodes and the signal electrodes on the lamination plane are overlapped; each common grounding electrode extends inwards from the outer edge of the ceramic medium 1 and keeps a space with the signal hole; each signal pole extends outwards from the signal hole, and is spaced from the outer edge of the capacitor and the signal poles of the adjacent signal holes, and a certain distance is kept between the adjacent signal holes.
The surface of the outer edge of the capacitor main body is covered with a terminal electrode which is a public grounding electrode leading-out terminal 2, and the hole edge and the hole wall of the signal hole are covered with terminal electrodes which are leading-out terminals 3 of the signal electrode.
Example 2
The embodiment discloses a preparation method of a high-temperature ceramic plate type array capacitor, which comprises the following steps:
s1, preparing a green body through wet printing;
s2, machining the green body by a machining method to enable the green body to be the same as the plate-type array capacitor in shape and to be in a certain proportion to the size of the green body;
s3, carrying out binder removal and sintering on the green body to prepare a ceramic medium 1;
s4, preparing a common grounding electrode leading-out end 2, a signal electrode leading-out end 3 and a surface coating layer on the ceramic dielectric 1, and completing the preparation of the high-temperature ceramic plate type array capacitor.
The method for preparing the green body by wet printing in the step S1 comprises the following steps: preparing ceramic dielectric slurry, wherein the ceramic dielectric slurry is prepared by mixing ceramic powder and an organic adhesive, and the organic adhesive is uniform viscous liquid obtained by dissolving an organic polymer in an organic solvent; the organic polymer is usually polyvinyl butyral, and the organic solvent is usually toluene, acetone, ethanol, terpineol, etc. The content of the adhesive in the slurry is 5-20%, and the addition amount of the solvent in the adhesive is generally 30%;
the preparation of the ceramic dielectric slurry adopts general pulping equipment, so that the material input reaches the scale of 5-40 kg each time, the stability of the slurry performance and the mutual dispersion of the components are ensured, the particle size of slurry particles is less than or equal to 7 mu m, and the shrinkage rate of slurry printed green bodies after firing is stabilized at 15-17%.
Printing ceramic dielectric slurry and internal electrode slurry on a printing support plate layer by layer, processing a green body into a green body with through holes according to the required pattern size by adopting a machining forming method, and then peeling the green body from the support plate to form the green body to be fired.
The drying temperature (150-160 ℃) of printing is increased during printing, and the ceramic dielectric film layer and the inner electrode slurry film layer are fully dried and dried thoroughly, so that the ceramic dielectric film layer and the inner electrode slurry film layer are well combined, and layering is avoided. In order to avoid the phenomena of internal delamination, air bubbles, cracking and the like in the green body binder removal stage below 400 ℃, the sintering curve is set according to the following requirements: setting the temperature rise speed to be 15-20 ℃/h and the heat preservation time to be 4-10 h;
the sintering temperature is 1050-1200 ℃, the heating rate is 10-100 ℃/h, the heat preservation time is 2-3 h, and the sintering is carried out in an oxidizing atmosphere.
Coating palladium-silver terminal electrode slurry on the inner wall of the signal hole and the surface of the outer edge of the ceramic medium 1 by adopting a manual coating mode for the sintered ceramic medium 1, and then sintering to form a common grounding electrode and a leading-out terminal electrode of the signal electrode; the sintering temperature is 850 ℃, and in order to prevent the terminal electrode of the capacitor from being oxidized when the capacitor works at the high temperature of 200 ℃, a layer of gold needs to be electroplated on the palladium-silver terminal electrode so as to ensure that the capacitor can normally work at the high temperature.
The method for coating the surface comprises the following steps: firstly, printing the medium glaze slurry on the upper surface and the lower surface of a ceramic medium 1, and then sintering at 850 ℃ to form a medium glaze covering layer; and printing the three-proofing paint on the medium glaze layer to finish the manufacture of the high-temperature ceramic plate type array capacitor.
According to the preparation method of the high-temperature ceramic plate type array capacitor disclosed by the embodiment, wet printing is used for preparing the green body, the green body is machined into the green body with the signal hole according to the drawing size through a machining method, then glue discharging and sintering are carried out on the green body, coating and printing are carried out, the preparation of the leading-out terminal electrode and the surface coating layer is completed, the mechanical impact resistance of the core component of the filter connector is improved, and the reliability of the filter connector is improved.
Although the invention has been described in detail above with reference to a general description and specific examples, it will be apparent to one skilled in the art that modifications or improvements may be made thereto based on the invention. Accordingly, such modifications and improvements are intended to be within the scope of the invention as claimed.
Claims (8)
1. A high temperature ceramic plate array capacitor, wherein the capacitor body comprises: ceramic dielectric, internal electrode and terminal electrode, the capacitor main part is the multilayer platelike structure who has a plurality of signal holes, internal electrode includes: the ceramic dielectric ceramic capacitor comprises a plurality of common grounding electrodes and a plurality of signal electrodes, wherein the common grounding electrodes and the signal electrodes are alternately arranged in the lamination direction of the ceramic dielectric, and the projection parts of the common grounding electrodes and the signal electrodes on the lamination plane are overlapped; each common grounding electrode extends inwards from the outer edge of the ceramic medium and keeps a space with the signal hole; each signal pole extends outwardly from a signal aperture and is spaced from the outer edge of the capacitor adjacent the signal pole of the signal aperture.
2. The high-temperature ceramic plate array capacitor as claimed in claim 1, wherein the outer peripheral surface of the capacitor body is covered with terminal electrodes, the terminal electrodes are common ground electrode terminals, and the edges and walls of the signal holes are covered with terminal electrodes, which are terminals for signal electrodes.
3. A preparation method of a high-temperature ceramic plate type array capacitor is characterized by comprising the following steps:
s1, preparing a green body through wet printing;
s2, machining the green body by a machining method to enable the green body to be the same as the plate-type array capacitor in shape and to be in a certain proportion to the size of the green body;
s3, carrying out binder removal and sintering on the green body to prepare a ceramic medium;
and S4, preparing a common grounding electrode leading-out end, a signal electrode leading-out end and a surface coating layer on the ceramic dielectric to finish the preparation of the high-temperature ceramic plate type array capacitor.
4. The method of claim 3, wherein the wet printing step of S1 is performed by: preparing ceramic dielectric slurry, wherein the ceramic dielectric slurry is prepared by mixing ceramic powder and an organic binder, the content of the binder in the slurry is 5-20%, and the addition amount of a solvent in the binder is 30%;
the preparation of the ceramic dielectric slurry adopts general pulping equipment, so that the material input reaches the scale of 5-40 kg each time, the stability of the slurry performance and the mutual dispersion of the components are ensured, the particle size of slurry particles is less than or equal to 7 mu m, and the shrinkage rate of slurry printed green bodies after firing is stabilized at 15-17%.
5. The method of claim 3, wherein the step S2 is to print the ceramic dielectric paste and the internal electrode paste on the printing substrate layer by layer, process the green body into a green body with through holes according to the required pattern size by using a machining method, and peel the green body from the substrate to form the green body to be fired.
6. The method according to claim 3, wherein in the step S3, the sintering curve is set according to the following requirements for avoiding internal delamination, blistering and cracking during the green body binder removal stage below 400 ℃: setting the temperature rise speed to be 15-20 ℃/h and the heat preservation time to be 4-10 h;
the sintering temperature is 1050-1200 ℃, the heating rate is 10-100 ℃/h, the heat preservation time is 2-3 h, and the sintering is carried out in an oxidizing atmosphere.
7. The method according to claim 3, wherein in step S4, the sintered ceramic dielectric is coated by hand with Pd/Ag terminal electrode slurry on the inner wall of the signal hole and the outer edge surface of the ceramic dielectric, and then sintered to form the common ground electrode and the lead-out terminal electrode of the signal electrode; the sintering temperature is 850 ℃, and in order to prevent the terminal electrode of the capacitor from being oxidized when the capacitor works at the high temperature of 200 ℃, a layer of gold needs to be electroplated on the palladium-silver terminal electrode so as to ensure that the capacitor can normally work at the high temperature.
8. The method of manufacturing a high temperature ceramic plate array capacitor as claimed in claim 3, wherein in the step of S4, the method of coating the surface layer is: printing the medium glaze slurry on the upper and lower surfaces of a ceramic medium, and then sintering at 850 ℃ to form a medium glaze covering layer; and then the three-proofing paint is printed on the medium glaze layer.
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2020
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Application publication date: 20201023 |