CN111816348A - Semi-conductive metal composite belt and cable - Google Patents
Semi-conductive metal composite belt and cable Download PDFInfo
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- CN111816348A CN111816348A CN202010699390.1A CN202010699390A CN111816348A CN 111816348 A CN111816348 A CN 111816348A CN 202010699390 A CN202010699390 A CN 202010699390A CN 111816348 A CN111816348 A CN 111816348A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
- H01B5/02—Single bars, rods, wires, or strips
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/18—Manufacture of films or sheets
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B7/00—Insulated conductors or cables characterised by their form
- H01B7/17—Protection against damage caused by external factors, e.g. sheaths or armouring
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B9/00—Power cables
- H01B9/02—Power cables with screens or conductive layers, e.g. for avoiding large potential gradients
- H01B9/021—Features relating to screening tape per se
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B9/00—Power cables
- H01B9/02—Power cables with screens or conductive layers, e.g. for avoiding large potential gradients
- H01B9/027—Power cables with screens or conductive layers, e.g. for avoiding large potential gradients composed of semi-conducting layers
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2323/00—Characterised by the use of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Derivatives of such polymers
- C08J2323/02—Characterised by the use of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Derivatives of such polymers not modified by chemical after treatment
- C08J2323/04—Homopolymers or copolymers of ethene
- C08J2323/06—Polyethene
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2423/00—Characterised by the use of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Derivatives of such polymers
- C08J2423/02—Characterised by the use of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Derivatives of such polymers not modified by chemical after treatment
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2423/00—Characterised by the use of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Derivatives of such polymers
- C08J2423/02—Characterised by the use of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Derivatives of such polymers not modified by chemical after treatment
- C08J2423/04—Homopolymers or copolymers of ethene
- C08J2423/08—Copolymers of ethene
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/001—Conductive additives
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/02—Elements
- C08K3/04—Carbon
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/02—Elements
- C08K3/04—Carbon
- C08K3/041—Carbon nanotubes
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/02—Elements
- C08K3/04—Carbon
- C08K3/042—Graphene or derivatives, e.g. graphene oxides
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/02—Elements
- C08K3/08—Metals
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- Manufacturing & Machinery (AREA)
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- Health & Medical Sciences (AREA)
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- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Insulated Conductors (AREA)
- Conductive Materials (AREA)
Abstract
The application discloses semi-conductive metal composite band includes: a metal base band; and the conductive film layer is positioned on one side or two sides of the metal base band and comprises polyethylene, a thermoplastic elastomer, a compatilizer, a conductive filler, a dispersant and an antioxidant. Therefore, the single side or double sides of the metal base band in the semiconductive metal composite band in the application are provided with the conductive film layers, the conductive film layers comprise polyethylene, thermoplastic elastomers, compatilizers, conductive fillers, dispersing agents and antioxidants, and the components of the conductive film layers are similar to those of the insulating shielding/outer shielding layer and the semiconductive sheath layer in the cable, so that the conductive film layers are more compact in contact with the insulating shielding/outer shielding layer and the semiconductive sheath layer, air gaps are eliminated, and meanwhile, the combination strength of the semiconductive metal composite band with the insulating shielding/outer shielding layer and the semiconductive sheath layer can be improved due to the existence of the conductive film layers. In addition, this application still provides a cable.
Description
Technical Field
The application relates to the technical field of wire and cable materials, in particular to a semi-conductive metal composite belt and a cable.
Background
The power cable comprises a cable conductor, a conductor shielding/inner shielding layer, an XLPE insulating layer, an insulating shielding/outer shielding layer, a metal belt shielding layer and a semi-conductive sheath layer from inside to outside.
At present, a metal belt shielding layer is a metal base belt, air gaps exist at the contact positions of the metal belt shielding layer, an insulating shielding/outer shielding layer and a semi-conductive sheath layer, no matter how perfect the processing technology of the metal belt shielding layer is, the metal belt shielding layer is subjected to bending deformation, cold and hot effects and the like in operation and construction, annular flat air gaps are generated among the metal belt shielding layer, the insulating shielding/outer shielding layer and the semi-conductive sheath layer, the metal belt shielding layer has a large deterioration effect on an electric field, partial discharge can be caused, the service life of a cable is shortened, the bonding strength of the metal belt shielding layer, the insulating shielding/outer shielding layer and the semi-conductive sheath layer is low due to the existence of the air gaps, and the bonding strength of the metal belt shielding layer can be further reduced after the metal belt shielding layer is influenced.
Therefore, how to solve the above technical problems should be a great concern to those skilled in the art.
Disclosure of Invention
The application aims to provide the semiconductive metal composite belt and the cable, so that air gaps between the semiconductive metal composite belt and an insulating shielding/outer shielding layer and between the semiconductive metal composite belt and the semiconductive sheath layer are eliminated, and the bonding strength between the semiconductive metal composite belt and the insulating shielding/outer shielding layer and between the semiconductive sheath layer and the semiconductive shielding layer is improved.
In order to solve the above technical problem, the present application provides a semiconductive metal composite tape, comprising:
a metal base band;
and the conductive film layer is positioned on one side or two sides of the metal base band and comprises polyethylene, a thermoplastic elastomer, a compatilizer, a conductive filler, a dispersant and an antioxidant.
Optionally, the value ranges of the various components in the conductive film layer by weight are respectively as follows:
40-100 parts of polyethylene, 3-60 parts of thermoplastic elastomer, 3-12 parts of compatilizer, 5-60 parts of conductive filler, 0.1-10 parts of dispersant and 0.1-5 parts of antioxidant.
Optionally, the polyethylene is any one of or any combination of low density polyethylene, linear low density polyethylene, metallocene polyethylene.
Optionally, the compatibilizer is any one or a combination of a maleic anhydride graft and a glycidyl methacrylate graft.
Optionally, the conductive filler is any one or any combination of conductive carbon black, graphene, carbon nanotubes and metal micro powder.
Optionally, the dispersing agent is any one or any combination of stearic acid, silicone master batch, fluoropolymer processing aid, polyethylene wax, ethylene-vinyl acetate copolymer wax and ethylene bis stearamide.
Optionally, the thermoplastic elastomer is any one or any combination of an ethylene-vinyl acetate copolymer, ethylene-butyl acrylate, ethylene ethyl acrylate, an ethylene acrylic acid copolymer, an ethylene methyl acrylate copolymer, and a polyolefin elastomer.
The present application further provides a cable comprising any of the semiconductive metal composite tapes described above.
The application provides a semiconductive metal composite belt, includes: a metal base band; and the conductive film layer is positioned on one side or two sides of the metal base band and comprises polyethylene, a thermoplastic elastomer, a compatilizer, a conductive filler, a dispersant and an antioxidant. Therefore, the semiconductive electric metal composite belt in the application is provided with the conductive film layers on one side or two sides of the metal base belt, the conductive film layers comprise polyethylene, thermoplastic elastomers, compatilizers, conductive fillers, dispersing agents and antioxidants, and the components of the conductive film layers are similar to those of the insulating shielding/outer shielding layer and the semiconductive sheath layer in the cable, so that the conductive film layers are more compact in contact with the insulating shielding/outer shielding layer and the semiconductive sheath layer, air gaps are eliminated, and meanwhile, the bonding strength of the semiconductive electric metal composite belt with the insulating shielding/outer shielding layer and the semiconductive sheath layer can be improved due to the existence of the conductive film layers.
In addition, this application still provides a cable.
Drawings
For a clearer explanation of the embodiments or technical solutions of the prior art of the present application, the drawings needed for the description of the embodiments or prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present application, and for those skilled in the art, other drawings can be obtained according to these drawings without creative efforts.
Fig. 1 is a schematic structural diagram of a semiconductive metal composite tape according to an embodiment of the present disclosure;
fig. 2 is a schematic structural diagram of a cable according to an embodiment of the present application.
Detailed Description
In order that those skilled in the art will better understand the disclosure, the following detailed description will be given with reference to the accompanying drawings. It is to be understood that the embodiments described are only a few embodiments of the present application and not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.
In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present invention, but the present invention may be practiced in other ways than those specifically described and will be readily apparent to those of ordinary skill in the art without departing from the spirit of the present invention, and therefore the present invention is not limited to the specific embodiments disclosed below.
As described in the background section, the metal tape shielding layer in the prior art is a metal base tape, an air gap exists at a contact position of the metal tape shielding layer and the insulation shielding/outer shielding layer and the semi-conductive sheath layer, which has a great effect on electric field deterioration, resulting in a reduction in the service life of the cable, and the bonding strength of the metal tape shielding layer and the insulation shielding/outer shielding layer and the semi-conductive sheath layer is low.
In view of the above, the present application provides a semiconductive metal composite tape, please refer to fig. 1, where fig. 1 is a schematic structural diagram of a semiconductive metal composite tape provided in an embodiment of the present application, and the semiconductive metal composite tape includes:
a metal base band 1;
and the conductive film layer 2 is positioned on one side or two sides of the metal base band 1, and the conductive film layer 2 comprises polyethylene, a thermoplastic elastomer, a compatilizer, a conductive filler, a dispersant and an antioxidant.
The metal base tape 1 in the present application includes, but is not limited to, any of a stainless steel base tape, a chrome-plated steel base tape, an aluminum base tape, and a copper base tape.
The conductive film layer 2 is a film layer having a certain conductive property because it contains a conductive filler.
The conductive film layer 2 is located on a single side or double sides of the metal base band 1, that is, the conductive film layer 2 is provided on one or both of the upper surface and the lower surface of the metal base band 1. When the semiconductive metal composite belt is provided with the single-sided conductive film layer 2, the conductive film layer 2 is in contact with the semiconductive sheath layer of the cable; when the semiconductive metal composite belt is provided with the double-sided conductive film layer 2, the front side and the back side do not need to be distinguished in the using process of the semiconductive metal composite belt, and the use is convenient.
Preferably, the value ranges of the various components in the conductive film layer 2 by weight are respectively as follows:
40-100 parts of polyethylene, 3-60 parts of thermoplastic elastomer, 3-12 parts of compatilizer, 5-60 parts of conductive filler, 0.1-10 parts of dispersant and 0.1-5 parts of antioxidant.
Further, the conductive film layer 2 may be formed by mixing various component materials uniformly and then directly coating the mixture on the metal base tape 1, or may be formed by mixing various component materials uniformly and then forming the conductive film layer 2, and then thermally attaching or adhering the conductive film layer 2 on the metal base tape 1.
The polyethylene is not particularly limited in this application, and may be provided by itself. For example, the Polyethylene is any one of Low Density Polyethylene (LDPE), Linear Low Density Polyethylene (LLDPE), metallocene Polyethylene (mPE), or any combination thereof.
It is to be noted that the compatibilizing agent is not particularly limited in the present application as the case may be. For example, the compatibilizer is any one or a combination of a maleic anhydride graft and a glycidyl methacrylate graft.
Further, maleic anhydride grafts herein include, but are not limited to, maleic anhydride grafted polyethylene (maleic anhydride grafted PE), maleic anhydride grafted ethylene vinyl acetate copolymer (maleic anhydride grafted EVA), maleic anhydride grafted ethylene butyl acrylate copolymer (maleic anhydride grafted EBA), maleic anhydride grafted ethylene octene copolymer (maleic anhydride grafted POE), maleic anhydride grafted ethylene ethyl acrylate (maleic anhydride grafted EEA). Glycidyl methacrylate grafts in this application include, but are not limited to, glycidyl methacrylate grafted polyethylene (glycidyl methacrylate grafted PE), glycidyl methacrylate grafted ethylene-vinyl acetate copolymer (glycidyl methacrylate grafted EVA), glycidyl methacrylate grafted ethylene butyl acrylate copolymer (glycidyl methacrylate grafted EBA), glycidyl methacrylate grafted ethylene octene copolymer (glycidyl methacrylate grafted POE), glycidyl methacrylate grafted ethylene ethyl acrylate (glycidyl methacrylate grafted EEA).
The conductive filler in the present application includes, but is not limited to, any one or any combination of conductive carbon black, graphene, carbon nanotubes, and metal fine powder.
It is to be noted that the dispersant is not particularly limited in the present application and may be used as appropriate. For example, the dispersant may be any one or any combination of a lubricating dispersant such as stearic acid, silicone base particles, a fluoropolymer processing additive (PPA), polyethylene wax, ethylene-vinyl acetate copolymer wax, Ethylene Bis Stearamide (EBS), and the like.
The thermoplastic elastomer in the present application is any one or any combination of thermoplastic elastomers such as ethylene-vinyl acetate copolymer, ethylene-butyl acrylate, ethylene ethyl acrylate, ethylene acrylic acid copolymer, ethylene methyl acrylate copolymer, polyolefin elastomer, and the like.
The single face or two-sided of the metal baseband 1 of the semi-conductive metal composite belt in the application is conductive film layer 2, conductive film layer 2 includes polyethylene, thermoplastic elastomer, compatilizer, conductive filler, dispersant, antioxidant, the component of conductive film layer 2 is similar with the component of insulating shield/outer shielding layer, semi-conductive restrictive coating in the cable, thereby make conductive film layer 2 inseparabler when contacting with insulating shield/outer shielding layer, semi-conductive restrictive coating, eliminate the air gap, promote the bonding strength of semi-conductive metal composite belt and insulating shield/outer shielding layer, semi-conductive restrictive coating simultaneously.
The present application also provides a cable comprising the semiconductive metal composite tape described in any of the above embodiments.
Referring to fig. 2, the cable sequentially includes a copper conductor 3, a conductor shield/inner shield layer 4, a cross-linked polyethylene (XLPE) insulation layer 5, an insulation shield/outer shield layer 6, a semiconductive metal composite tape 7, and a semiconductive sheath layer 8 from inside to outside. The semi-conductive metal composite belt 7 is positioned between the insulating shielding/outer shielding layer 6 and the semi-conductive sheath layer 8, and can play a role in transferring charges and blocking water, and meanwhile, the conductive film layer in the semi-conductive metal composite belt 7 is similar to the insulating shielding/outer shielding layer 6 and the semi-conductive sheath layer 8 in material components. Therefore, the insulation shielding/outer shielding layer 6, the semiconductive metal composite belt 7 and the semiconductive sheath layer 8 can be well combined.
The semi-conductive metal composite belt can be used in an armor layer or a shielding layer in a cable, improves the whole conductivity and shielding performance of the cable, can also be used for a cable outer protective layer to play a role of a moisture barrier layer, and has an armor effect on a cable core. In addition, the cable can be wound and lapped with a conductive film layer.
The type of the cable is not particularly limited in this application, and may be, for example, an electric cable, an optical-electrical composite cable, or the like. When the cable is the superhigh pressure cable, semi-conductive restrictive coating 8 is made by the great material of insulation resistance, when can not the multiple spot ground connection in succession, semi-conductive restrictive coating 8 forms dangerous voltage on the position far away from the place, may endanger the safe operation of superhigh pressure cable, so the superhigh pressure cable need adopt the outer jacket that has certain conducting power to pass through the outer jacket with the electric charge of induction on the semi-conductive jacket 8 and discharge to contacts such as earth, simultaneously, the outer jacket on the semi-conductive restrictive coating 8 can also be used to cable sheathing detection.
The embodiments are described in a progressive manner, each embodiment focuses on differences from other embodiments, and the same or similar parts among the embodiments are referred to each other. The device disclosed by the embodiment corresponds to the method disclosed by the embodiment, so that the description is simple, and the relevant points can be referred to the method part for description.
The semiconductive metal composite tape and cable provided by the present application are described in detail above. The principles and embodiments of the present application are explained herein using specific examples, which are provided only to help understand the method and the core idea of the present application. It should be noted that, for those skilled in the art, it is possible to make several improvements and modifications to the present application without departing from the principle of the present application, and such improvements and modifications also fall within the scope of the claims of the present application.
Claims (8)
1. A semiconductive metal composite tape, comprising:
a metal base band;
and the conductive film layer is positioned on one side or two sides of the metal base band and comprises polyethylene, a thermoplastic elastomer, a compatilizer, a conductive filler, a dispersant and an antioxidant.
2. The semiconductive metal composite tape according to claim 1, wherein the conductive film layer comprises the following components in parts by weight:
40-100 parts of polyethylene, 3-60 parts of thermoplastic elastomer, 3-12 parts of compatilizer, 5-60 parts of conductive filler, 0.1-10 parts of dispersant and 0.1-5 parts of antioxidant.
3. The semiconducting metal composite tape of claim 1, wherein the polyethylene is any one of or any combination of low density polyethylene, linear low density polyethylene, metallocene polyethylene.
4. The semiconducting metal composite tape of claim 1, wherein the compatibilizer is any one or combination of a maleic anhydride-based graft, a glycidyl methacrylate-based graft.
5. The semiconducting metal composite tape of claim 1, wherein the conductive filler is any one or any combination of conductive carbon black, graphene, carbon nanotubes, metal micropowder.
6. The semiconductive metal composite tape according to claim 1, wherein the dispersing agent is any one or any combination of stearic acid, silicone master batch, fluoropolymer processing aid, polyethylene wax, ethylene-vinyl acetate copolymer wax, ethylene bis stearamide.
7. The semiconducting metal composite tape of any of claims 1 to 6, wherein the thermoplastic elastomer is any one of ethylene vinyl acetate, ethylene butyl acrylate, ethylene ethyl acrylate, ethylene acrylic acid, ethylene methyl acrylate, polyolefin elastomer, or any combination thereof.
8. A cable comprising the semiconducting metal composite tape according to any one of claims 1 to 7.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010699390.1A CN111816348A (en) | 2020-07-20 | 2020-07-20 | Semi-conductive metal composite belt and cable |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010699390.1A CN111816348A (en) | 2020-07-20 | 2020-07-20 | Semi-conductive metal composite belt and cable |
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| Publication Number | Publication Date |
|---|---|
| CN111816348A true CN111816348A (en) | 2020-10-23 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202010699390.1A Pending CN111816348A (en) | 2020-07-20 | 2020-07-20 | Semi-conductive metal composite belt and cable |
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Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4469538A (en) * | 1981-02-10 | 1984-09-04 | Anaconda-Ericsson, Inc. | Process for continuous production of a multilayer electric cable and materials therefor |
| CN103589044A (en) * | 2013-11-15 | 2014-02-19 | 东莞市德诚塑化科技有限公司 | Plastic composition for cable and wire shielding layer and preparation method of plastic composition |
| CN105061879A (en) * | 2015-08-19 | 2015-11-18 | 成都鑫成鹏线缆材料有限公司 | Ethylene-vinyl acetate copolymer based thermoplastic semiconductive shielding material for conductor and preparation method of thermoplastic semiconductive shielding material |
| CN205487487U (en) * | 2016-03-31 | 2016-08-17 | 温州安能科技有限公司 | Aluminium base compound area of nanometer film |
| CN108997631A (en) * | 2017-06-06 | 2018-12-14 | 高邮市金国电缆材料厂有限公司 | Cable semiconductive polyethylene shielding material |
| CN209365522U (en) * | 2018-08-16 | 2019-09-10 | 江苏科麦特科技发展有限公司 | A kind of antistatic aluminium-plastic tape |
-
2020
- 2020-07-20 CN CN202010699390.1A patent/CN111816348A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4469538A (en) * | 1981-02-10 | 1984-09-04 | Anaconda-Ericsson, Inc. | Process for continuous production of a multilayer electric cable and materials therefor |
| CN103589044A (en) * | 2013-11-15 | 2014-02-19 | 东莞市德诚塑化科技有限公司 | Plastic composition for cable and wire shielding layer and preparation method of plastic composition |
| CN105061879A (en) * | 2015-08-19 | 2015-11-18 | 成都鑫成鹏线缆材料有限公司 | Ethylene-vinyl acetate copolymer based thermoplastic semiconductive shielding material for conductor and preparation method of thermoplastic semiconductive shielding material |
| CN205487487U (en) * | 2016-03-31 | 2016-08-17 | 温州安能科技有限公司 | Aluminium base compound area of nanometer film |
| CN108997631A (en) * | 2017-06-06 | 2018-12-14 | 高邮市金国电缆材料厂有限公司 | Cable semiconductive polyethylene shielding material |
| CN209365522U (en) * | 2018-08-16 | 2019-09-10 | 江苏科麦特科技发展有限公司 | A kind of antistatic aluminium-plastic tape |
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Application publication date: 20201023 |
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