CN111812032B - Stress measuring instrument for wide-spectrum optical material and element - Google Patents

Stress measuring instrument for wide-spectrum optical material and element Download PDF

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CN111812032B
CN111812032B CN202010787844.0A CN202010787844A CN111812032B CN 111812032 B CN111812032 B CN 111812032B CN 202010787844 A CN202010787844 A CN 202010787844A CN 111812032 B CN111812032 B CN 111812032B
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optical
stress
elastic
optical material
modulator
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CN111812032A (en
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李克武
王志斌
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North University of China
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North University of China
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    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/01Arrangements or apparatus for facilitating the optical investigation
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/17Systems in which incident light is modified in accordance with the properties of the material investigated
    • G01N21/21Polarisation-affecting properties
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/17Systems in which incident light is modified in accordance with the properties of the material investigated
    • G01N21/25Colour; Spectral properties, i.e. comparison of effect of material on the light at two or more different wavelengths or wavelength bands
    • G01N21/31Investigating relative effect of material at wavelengths characteristic of specific elements or molecules, e.g. atomic absorption spectrometry
    • G01N21/35Investigating relative effect of material at wavelengths characteristic of specific elements or molecules, e.g. atomic absorption spectrometry using infrared light
    • G01N21/3563Investigating relative effect of material at wavelengths characteristic of specific elements or molecules, e.g. atomic absorption spectrometry using infrared light for analysing solids; Preparation of samples therefor

Abstract

The invention belongs to the technical field of stress measurement of optical materials and elements, and particularly relates to a stress measuring instrument for a wide-spectrum optical material and an element, wherein two measuring channels respectively work in a resonant state through two elastic light modulators with different frequencies to generate modulated light signals of fundamental frequency, difference frequency and the like, the stress birefringence phase delay quantity of the optical material to be measured and the element 5 is loaded into the modulated light signals, and the phase delay quantity and the fast axis azimuth can be solved simultaneously through extracting the fundamental frequency signals and the difference frequency signals of the two elastic light modulators. The invention adopts the elasto-optical modulation technology to solve the problems of mechanical adjustment, low detection precision, low repeatability and the like of the traditional stress measurement method, and provides advanced equipment for measurement and evaluation of structural stress, thermal stress, mechanical stress and the like of optical materials. The invention is used for measuring the stress of the optical material and the element.

Description

Stress measuring instrument for wide-spectrum optical material and element
Technical Field
The invention belongs to the technical field of stress measurement of optical materials and elements, and particularly relates to a stress measuring instrument for a wide-spectrum optical material and an element.
Background
The optical elements such as a window, an optical filter, a lens, a prism and the like in the photoelectric system are manufactured by using optical materials such as BK7 glass, fused quartz, sapphire, zinc selenide, germanium and the like, and the light transmission range covers the wave bands such as visible light, near infrared, short wave infrared, medium wave infrared, long wave infrared and the like. Stress is one of important indexes for evaluating the quality of an optical system, and the reasons for generating stress by an optical material and an optical element mainly comprise 3 aspects of structural stress, thermal stress and mechanical stress. Optical material growth defects or structural stresses due to physical-chemical changes; in the annealing and cooling manufacturing process, uneven plastic deformation and uneven volume change caused by temperature change can generate thermal stress; cutting grinding and load clamping during component machining can create mechanical stresses. The damage to the optical system and the optical instrument caused by the stress of the optical materials and the elements is mainly represented as follows: (1) When the stress is large, in the optical processing processes such as cutting, grinding and the like, the optical system is easy to cause the explosion of materials and elements under the high-strength aerodynamic load; (2) The birefringence induced by the stress in the optical material and element causes the imaging beam at one point to no longer converge at one point, resulting in astigmatism in the imaging system; (3) The stress distribution of the optical material and the element is uneven, so that the refractive index uniformity of the optical material is poor, the wave surface of the light wave passing through the optical material and the element is deformed, and the imaging distortion of the imaging system is caused.
The most significant optical effect is birefringence when stresses are present in the optical material or the optical element. Polarized light is incident and decomposed into ordinary light and extraordinary light with different propagation speeds, which are perpendicular to each other in the vibration direction, along the two principal stress directions, and an optical path difference is generated after exiting, and this stress optical path difference is generally referred to as a retardation. By measuring technical parameters such as retardation (optical path difference) and fast axis azimuth angle caused by stress birefringence, the stress distribution of the optical material and the optical element can be further and comprehensively mastered by data inversion. Scientific researchers at home and abroad conduct intensive research on optical materials and element stress analysis technology, and commercialized mature instrument products are obtained. At present, the developed optical material stress measuring technology and instrument mainly comprise two typical representative products, namely a polarized light interferometer and a polarized light stress meter by a Senarmont compensation method: (1) polarization interferometry stress: the detection light source sequentially passes through the polarizer, the sample and the analyzer to interfere, the stress magnitude and distribution are obtained by observing the polarized light interference color sequence, the measurement accuracy is low, and the detection light source is 10 2 The nm magnitude is suitable for qualitative or semi-quantitative measurement of stress distribution; (2) Senarmont Compensation polarization stress Analyzer: in order to further improve the resolution and sensitivity of stress measurement, the Senarmont compensation method is applied to stress detection analysis, a detection light source sequentially passes through a polarizer, a sample, a 1/4 wave plate and an analyzer, and the polarization angle is observed through a rotating wave plate or the analyzer so as to realize stress measurement. The polarization stress meter has the advantages that the structure of the meter is simple, but the mechanical rotation of the wave plate is required, the measuring speed is limited, and in addition, the wave plate is only suitable for a certain specific wavelength, so that the measuring technology can not meet the stress measuring application of high-precision wide-spectrum optical materials and optical elements.
Disclosure of Invention
Aiming at the technical problems of lower measurement precision of the polarization interference stress meter and lower measurement speed of the polarization stress meter by the Senarmont compensation method, the invention provides the stress measuring instrument of the wide-spectrum optical material and the element, which have high modulation efficiency, high modulation purity, high modulation frequency and good working stability.
In order to solve the technical problems, the invention adopts the following technical scheme:
the stress measuring instrument comprises a first detection light source, a first polarizer, a first elastic light modulator, a two-dimensional sample scanning table, an optical material to be measured, an element, a second elastic light modulator, a first analyzer, a visible light detector, a second detection light source, a second polarizer, a third elastic light modulator, a fourth elastic light modulator, a second analyzer, an infrared photoelectric detector, a first LC resonance circuit, a second LC resonance circuit, a scanning sample table stepping motor control circuit, a third LC resonance circuit, a fourth LC resonance circuit, a system control and data processing module, a first preamplifier, a second preamplifier, a modulation optical signal analog-to-digital conversion module and a control computer, wherein the first polarizer, the first elastic light modulator, the optical material to be measured, the element, the second elastic light modulator, the first analyzer and the visible light detector are sequentially arranged in the light path direction of the first detection light source to form a visible light measuring channel, the visible light detector is connected with the first preamplifier through a wire, the second detection light source is sequentially provided with the second polarizer, the second polarizer is sequentially arranged in the light path direction of the second detection light source, the second photodetector is connected with the second photodetector, the second photodetector is sequentially arranged in the light modulator, the second preamplifier, the second photodetector is sequentially connected with the second photodetector light modulator and the second photodetector is sequentially arranged in the light modulator, the first photodetector is connected with the first photodetector and the optical signal amplifier, the optical amplifier and the optical amplifier, the optical amplifier is sequentially connected with the optical amplifier, the optical amplifier and the optical detector is connected with the optical amplifier, the fourth elastic light modulator is respectively connected with a third LC resonance circuit and a fourth LC resonance circuit, the optical material to be detected and the element are arranged on the two-dimensional sample scanning table, the two-dimensional sample scanning table is connected with a scanning sample table stepping motor control circuit, the first LC resonance circuit, the second LC resonance circuit, the scanning sample table stepping motor control circuit, the third LC resonance circuit and the fourth LC resonance circuit are all connected to a system control and data processing module, and the system control and data processing module is connected with a control computer.
The system control and data processing module comprises a digital phase lock and a signal generator, wherein the digital phase lock is connected with the signal generator, the digital phase lock is respectively connected with the modulated optical signal analog-to-digital conversion module and the control computer, and the signal generator is respectively connected with the first LC resonance circuit, the second LC resonance circuit, the scanning sample stage stepping motor control circuit, the third LC resonance circuit and the fourth LC resonance circuit.
The visible light detector adopts a silicon photoelectric detector, the spectral response range of the visible light detector is 200-1100nm, the infrared photoelectric detector adopts an indium-arsenic-antimony photoelectric detector, and the spectral response range of the infrared photoelectric detector is 1.0-5.8 mu m.
The first polarizer, the first analyzer, the second polarizer and the second analyzer are all Rochon prisms made of magnesium fluoride crystals, the extinction ratios of the first polarizer, the first analyzer, the second polarizer and the second analyzer are 10000:1, and the light transmission ranges of the first polarizer, the first analyzer, the second polarizer and the second analyzer are all 0.2-6 mu m.
The first, second, third and fourth light-emitting modulators are all magnesium fluoride octagonal symmetrical structure light-emitting modulators, the light-passing ranges of the first, second, third and fourth light-emitting modulators are all 0.18-8 μm, the modulation frequencies of the first and third light-emitting modulators are all 40-50kHz, and the modulation frequencies of the second and fourth light-emitting modulators are all 60-80kHz.
The digital phase lock is obtained by a modulation optical signal analog-digital conversion moduleFundamental frequency difference frequency signal omega of first elastic optical modulator and second elastic optical modulator 21 Fundamental frequency signal omega of first elastic optical modulator 1 And a fundamental frequency signal omega of a second elasto-optical modulator 2 And the amplitude of the low-frequency signal is equal, and the digital phase-locking analysis is used for solving the stress birefringence phase delay and the fast axis azimuth of the optical material and the element to be tested.
The system control and data processing module obtains optical path difference, double refraction size, stress distribution and strain distribution parameters of the optical material to be tested and the element by inversion of the wavelength lambda of the detection light source, the thickness d of the optical material to be tested and the element and the stress optical coefficient C of the optical material to be tested and the element;
the method for solving the optical path difference comprises the following steps:the delta is an optical path difference, the lambda is a detection light source, and the X is a stress birefringence phase delay amount;
the solving method of the birefringence is as follows:the delta n is the double refraction, and the d is the thickness of the optical material and the element to be measured;
the solving method of the stress distribution comprises the following steps:the delta sigma is stress distribution, the sigma 1 Sum sigma 2 The principal stresses are respectively the principal stresses of the optical material to be measured and the element plane in two directions perpendicular to each other, and C is the stress optical coefficient of the optical material to be measured and the element plane;
the solving method of the strain distribution comprises the following steps:and epsilon is strain distribution, and E is Young's modulus of the optical material and the element to be tested.
The system control and data processing module drives and controls the two-dimensional sample scanning table to realize two-dimensional scanning measurement through the stepping motor control circuit of the scanning sample table, the system control and data processing module obtains stress distribution measurement through the two-dimensional scanning measurement, and the system control and data processing module constructs two-dimensional graphs, three-dimensional graphs and parameter tables from the coordinate position data and the stress distribution measurement data to be visually displayed and stored.
Compared with the prior art, the invention has the beneficial effects that:
1. the invention applies the elasto-optical modulation technology to the stress measurement of the optical material, two elasto-optical modulators with different frequencies work in a resonant state simultaneously to generate modulated optical signals of fundamental frequency, difference frequency and the like, the stress birefringence phase delay quantity of the optical material is loaded into the modulated optical signals, and the solution of the phase delay quantity and the fast axis azimuth angle can be realized simultaneously by extracting the fundamental frequency signals and the difference frequency signals of the two elasto-optical modulators, so that the invention has higher measurement speed compared with the stress measurement of the traditional polarized interference and rotating wave plates.
2. The two elastic light modulators for generating the modulated light signals are both magnesium fluoride symmetrical structure elastic light modulators, the residual stress birefringence of the elastic light modulators is small, the elastic light modulators adopt closed-loop control to eliminate the influence of heat dissipation on the working stability, in addition, the whole measuring process has no mechanical adjusting part, the high frequency of the elastic light modulators ensures the high signal-to-noise ratio of signal processing, and finally, the stress measuring technology is ensured to have higher stress measuring precision and measuring repeatability.
3. The invention adopts magnesium fluoride symmetrical structure elastometer, selects magnesium fluoride as elastometer crystal material, has light transmission range of 0.18-8 μm, can ensure the passing of detection light with wider spectrum range, and provides key element for realizing stress measurement of wide spectrum optical material such as glass, fused quartz, sapphire, zinc selenide, germanium and the like, which corresponds to light transmission range and covers visible light, near infrared, short wave infrared, medium wave infrared, long wave infrared and the like.
4. According to the invention, each measuring channel adopts a two-dimensional scanning sample stage to bear optical materials and elements to be measured, the sample stage adopts a stepping motor to realize progressive scanning measurement, a grating ruler displacement sensor feedback system controls scanning accuracy, position information of each point is correspondingly stored with stress parameters, then the stress data of the sample is visually displayed through two-dimensional/three-dimensional images by image processing, a good man-machine interaction relationship is provided, and functions of local area stress data observation, data derivation and the like are provided.
Drawings
Fig. 1 is a schematic structural view of the present invention.
Wherein: 1 is a first detection light source, 2 is a first polarizer, 3 is a first elastic light modulator, 4 is a two-dimensional sample scanning table, 5 is an optical material and element to be detected, 6 is a second elastic light modulator, 7 is a first analyzer, 8 is a visible light detector, 9 is a second detection light source, 10 is a second polarizer, 11 is a third elastic light modulator, 12 is a fourth elastic light modulator, 13 is a second analyzer, 14 is an infrared light photodetector, 15 is a first LC resonance circuit, 16 is a second LC resonance circuit, 17 is a scanning sample table stepping motor control circuit, 18 is a third LC resonance circuit, 19 is a fourth LC resonance circuit, 20 is a system control and data processing module, 21 is a first pre-amplifier, 22 is a second pre-amplifier, 23 is a modulated light signal analog-to-digital conversion module, 24 is a control computer, 201 is a digital phase lock, and 202 is a signal generator.
Detailed Description
The following description of the embodiments of the present invention will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present invention, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
The stress measuring instrument for the wide-spectrum optical material and the element comprises a first detection light source 1, a first polarizer 2, a first elastic light modulator 3, a two-dimensional sample scanning table 4, an optical material and element to be measured 5, a second elastic light modulator 6, a first polarization analyzer 7, a visible light detector 8, a second detection light source 9, a second polarizer 10, a third elastic light modulator 11, a fourth elastic light modulator 12, a second polarization analyzer 13, an infrared photoelectric detector 14, a first LC resonance circuit 15, a second LC resonance circuit 16, a scanning sample table stepping motor control circuit 17, a third LC resonance circuit 18, a fourth LC resonance circuit 19, a system control and data processing module 20, a first pre-amplifier 21, a second pre-amplifier 22, a modulated light signal analog-digital conversion module 723 and a control computer 24, wherein the first polarization analyzer 2, the first elastic light modulator 3, the optical material and element to be measured 5, the second elastic light modulator 6, the first polarization analyzer 7 and the visible light detector 8 are sequentially arranged in the light path direction of the first detection light source 1 to form a visible light measuring channel. The visible light detector 8 is connected with a first pre-amplifier 21 through a wire, and a second polarizer 10, a third elastic light modulator 11, an optical material to be tested and the element 5, a fourth elastic light modulator 12, a second analyzer 13 and an infrared photoelectric detector 14 are sequentially arranged in the light path direction of the second detection light source 9 to form an infrared light measurement channel. The infrared photoelectric detector 14 is connected with a second pre-amplifier 22 through a wire, the first pre-amplifier 21 and the second pre-amplifier 22 are both connected with a modulation optical signal analog-to-digital conversion module 23, the modulation optical signal analog-to-digital conversion module 23 is connected with a system control and data processing module 20, the first elastic light modulator 3 and the second elastic light modulator 6 are respectively connected with a first LC resonance circuit 15 and a second LC resonance circuit 16, the third elastic light modulator 11 and the fourth elastic light modulator 12 are respectively connected with a third LC resonance circuit 18 and a fourth LC resonance circuit 19, the optical material to be detected and the element 5 are arranged on the two-dimensional sample scanning table 4, the two-dimensional sample scanning table 4 is connected with a scanning sample table stepping motor control circuit 17, the first LC resonance circuit 15, the second LC resonance circuit 16 and the scanning sample table stepping motor control circuit 17, the third LC resonance circuit 18 and the fourth LC resonance circuit 19 are both connected with the system control and data processing module 20, and the system control and data processing module 20 is connected with a control computer 24. The stress measuring instrument is realized based on two different-frequency elasto-modulators, the difference frequency modulation technology of the two elasto-modulators is utilized and the advantages of the digital phase locking technology are combined, a first detection light source 1 sequentially passes through a first polarizer 2, a first elasto-modulator 3, an optical material to be measured, an element 5 and a second elasto-modulator 6, finally, the optical material to be measured exits through a first analyzer 7 and is detected by a visible light detector 8, a second detection light source 9 sequentially passes through a second polarizer 10, a third elasto-modulator 11, the optical material to be measured, the element 5 and a fourth elasto-modulator 12, finally, the optical material to be measured passes through a second analyzer 13 and is detected by an infrared photoelectric detector 14, the two measurement channels respectively and simultaneously work in a resonance state to generate modulation light signals such as fundamental frequency and difference frequency, the stress birefringence phase delay of the optical material to be measured and the element 5 is loaded into the modulation light signals, and the solution of the phase delay and the azimuth angle of a fast axis can be simultaneously realized through the extraction of the fundamental frequency signals and the difference frequency signals of the two elasto-modulators.
Further, the system control and data processing module 20 includes a digital phase lock 201 and a signal generator 202, the digital phase lock 201 is connected with the signal generator 202, the digital phase lock 201 is respectively connected with a modulated optical signal analog-to-digital conversion module 23 and a control computer 24, and the signal generator 202 is respectively connected with the first LC resonant circuit 15, the second LC resonant circuit 16, the scanning sample stage stepping motor control circuit 17, the third LC resonant circuit 18 and the fourth LC resonant circuit 19. The digital phase lock 201 obtains the fundamental frequency difference frequency signal omega of two elasto-modulators of two measuring channels through the signal generator 202 respectively 21 And the amplitude of low-frequency signals such as fundamental frequency signals of the two elastic optical modulators, and the stress birefringence phase delay and the fast axis azimuth angle of the optical material to be measured and the element 5 are analyzed and solved.
Further, it is preferable that the visible light detector 8 is a silicon photodetector, the spectral response range of the visible light detector 8 is 200-1100nm, the infrared light photodetector 14 is an indium-arsenic-antimony photodetector, and the spectral response range of the infrared light photodetector 14 is 1.0-5.8 μm.
Further, preferably, the first polarizer 2, the first polarizer 7, the second polarizer 10 and the second polarizer 13 are all rochon prisms made of magnesium fluoride crystals, the extinction ratio of the first polarizer 2, the first polarizer 7, the second polarizer 10 and the second polarizer 13 is 10000:1, and the light transmission ranges of the first polarizer 2, the first polarizer 7, the second polarizer 10 and the second analyzer 13 are all 0.2-6 μm.
Further, preferably, the first elastic light modulator 3, the second elastic light modulator 6, the third elastic light modulator 11 and the fourth elastic light modulator 12 are all magnesium fluoride octagonal symmetrical structure elastic light modulators, the light passing ranges of the first elastic light modulator 3, the second elastic light modulator 6, the third elastic light modulator 11 and the fourth elastic light modulator 12 are all 0.18-8 μm, the modulation frequencies of the first elastic light modulator 3 and the third elastic light modulator 11 are all 40-50kHz, the modulation frequencies of the second elastic light modulator 6 and the fourth elastic light modulator 12 are all 60-80kHz, and two difference frequency modulations with different modulation frequencies are formed.
Further, the digital phase lock 201 obtains the fundamental frequency difference frequency signal ω of the first elastic optical modulator 3 and the second elastic optical modulator 6 through the modulation optical signal analog-to-digital conversion module 23 21 Fundamental frequency signal omega of first elasto-modulator 3 1 And the fundamental frequency signal omega of the second elasto-optical modulator 6 2 The amplitude of the low-frequency signal is equal, and the digital phase lock 201 analyzes and solves the stress birefringence phase delay and the fast axis azimuth of the optical material to be tested and the element 5.
Further, the system control and data processing module 20 obtains optical path difference, birefringence size, stress distribution and strain distribution parameters of the optical material to be tested and the element by inversion of the detected light source wavelength lambda, the thickness d of the optical material to be tested and the element and the stress optical coefficient C of the optical material to be tested and the element;
further, the method for solving the optical path difference is as follows:the delta is an optical path difference, the lambda is a detection light source, and the X is a stress birefringence phase delay amount;
further, the method for solving the birefringence is as follows:the delta n is the double refraction, and the d is the thickness of the optical material and the element to be measured;
further, the method for solving the stress distribution is as follows:the delta sigma is stress distribution, the sigma 1 Sum sigma 2 The principal stresses are respectively the principal stresses of the optical material to be measured and the element plane in two directions perpendicular to each other, and C is the stress optical coefficient of the optical material to be measured and the element plane;
further, the solving method of the strain distribution is as follows:and epsilon is strain distribution, and E is Young's modulus of the optical material and the element to be tested.
Further, the system control and data processing module 20 drives and controls the two-dimensional sample scanning table 4 to realize two-dimensional scanning measurement through the scanning sample table stepping motor control circuit 17, the system control and data processing module 20 obtains stress distribution measurement through the two-dimensional scanning measurement, and the system control and data processing module 20 constructs two-dimensional graphs, three-dimensional graphs and parameter tables from the coordinate position data and the stress distribution measurement data to be visually displayed and stored.
The working flow of the invention is as follows: the first detection light source 1 in the visible light measurement channel sequentially passes through the first polarizer 2, the first elastic light modulator 3, the optical material to be measured and the element 5, the second elastic light modulator 6, finally, the first detection light source is emitted through the first analyzer 7 and detected by the visible light detector 8, the second detection light source 9 in the infrared light measurement channel sequentially passes through the second polarizer 10, the third elastic light modulator 11, the optical material to be measured and the element 5, the fourth elastic light modulator 12, finally, the second detection light source passes through the second analyzer 13 and is detected by the infrared light detector 14, the two measurement channels respectively generate modulation light signals of fundamental frequency, difference frequency and the like in a resonance state through the two elastic light modulators with different frequencies, stress birefringence phase delay amounts of the optical material to be measured and the element 5 are loaded into the modulation light signals, the phase delay amounts and the fast axis solution can be simultaneously realized through the extraction of the system control and data processing module 20, the system control and data processing module 20 drives and controls the two-dimensional sample scanning platform 4 through the scanning platform stepping motor control circuit 17, the two-dimensional scanning platform 4 realizes the two-dimensional scanning and the control and the two-dimensional scanning and the stress and the processing system and the two-dimensional data processing platform to obtain the two-dimensional data and the three-dimensional graphic data.
Examples
In order to meet the requirements of wide-spectrum optical materials and element stress measurement application, the photoelectric performance of a detection light source and a detector is comprehensively considered. The measuring device is provided with two measuring channels. 1-8 components in the device form a visible light measuring channel, a first detection light source 1 can be a semiconductor, solid laser or monochromator light source, a visible light detector 8 is a silicon photoelectric detector, and the spectral response range is 200-1100nm; the 9-14 components in the device form an infrared light measuring channel, the second detection light source 9 can be an infrared semiconductor, solid laser or monochromator light source, the infrared light photodetector 14 is an indium-arsenic-antimony photodetector, and the spectral response range is 1.0-5.8 mu m. The first polarizer 2 and the second polarizer 10 of the two measuring channels in the device, the first analyzer 7 and the second analyzer 13 are respectively Rochon prisms made of magnesium fluoride crystals, the extinction ratio is 10000:1, and the light transmission range is 0.2-6 mu m. The first elastic light modulator 3, the second elastic light modulator 6, the third elastic light modulator 11 and the fourth elastic light modulator 12 of the two measuring channels in the device are all magnesium fluoride octagonal symmetrical structure elastic light modulators, residual stress of the elastic light modulators is controlled to be in a minimum range, the light transmission range of the elastic light modulators is 0.18-8 mu m, modulation frequencies of the first elastic light modulator 3 and the third elastic light modulator 11 are selected to be 40-50kHz, modulation frequencies of the second elastic light modulator 6 and the fourth elastic light modulator 12 are selected to be 60-80kHz, and two difference frequency modulations with different modulation frequencies are formed. The measurement principle and method of the two measurement channels are as follows:
the light transmission axis direction of the polarizer, the modulation fast axis azimuth angle of the elasto-optical modulator and the light transmission axis direction of the analyzer are sequentially set to have a phase difference of 45 degrees. The optical signal is described by Stokes vectors, and the polarization transmission characteristics of the elasto-modulator and the sample through the polarizer are described by a Muller matrix. The detection light signal reaches the detector through the whole detection system and is described as Stokes vector and Muller matrix
S out =M P2 M PEM2 M sample M PEM1 M P1 S in (1)
Wherein S is out ,S in Sotkes vectors, M, representing outgoing light and incoming light, respectively P1 And M P2 Muller matrix, M, representing polarizer and analyzer, respectively PEM1 And M PEM2 The Muller matrices respectively representing the first and second elastomehc modulators 3 and 6 can be expressed as their Muller matrices according to the arrangement of the transmission axis direction of the polarizer and the azimuth angle of the fast axis of the elastomehc modulator
Wherein delta 1 And delta 2 Is the phase modulation of the first and second elastomehc modulator 3, 6, which can be further described as delta 1 =δ 10 sinω 1 t and delta 2 =δ 20 sinω 2 t, wherein omega 1 And omega 2 Respectively represent the frequencies of two elasto-optical modulators, delta 10 And delta 20 Representing the phase modulation amplitudes of the two elastomehc modulators, respectively. When stress exists in the optical material, birefringence is generated, and the detected light generates optical path difference/retardation delta=cd (sigma 12 ) C is stress optical coefficient, d is optical material thickness, sigma 1 Sum sigma 2 Is the principal stress with two directions perpendicular to each other. The retardation corresponds to a phase retardation of x=2pi Δ/λ, and therefore, the polarization transmission characteristics of stress birefringence of an optical material can be described as a Muller matrix
In the above equation, ρ is expressed as the fast axis azimuth of stress birefringence. Bringing a Muller matrix corresponding to stress birefringence of a polarizer and an elastic light modulator and a Muller matrix corresponding to stress birefringence of a sample to be detected into the step (1), and taking the first component of Stokes vector which is the light intensity capable of being detected by the detector into consideration, so that the intensity of a detection light signal detected by the detector is
Wherein I is 0 The total intensity of the detection laser is represented by K, which represents the transmittance constant of the entire detection optical system.
Sin delta in formula (4) i =sin(δ i0 sinω i t) and cos delta i =cos(δ i0 sinω i the function of t) can be developed using a Bessel function of the first type:andis a positive integer J 0 、J 2k-1 、J 2k Representing the 0 th order, the 2k-1 st order and the 2k th order Bessel series respectively, i=1 and 2 representing the first elastic optical modulator 3 and the second elastic optical modulator 6 respectively, and (4) taking the lower order Bessel series to be rewritable as
From the analysis of formulas (4) and (5), sin (4ρ) sin, which is related to the stress of the optical material, was found 2 (X/2) is contained in 2ω 1 、2ω 2 、2ω 1 +2ω 2 And 2ω 2 -2ω 1 In the frequency signal cosX is contained in ω 12 And omega 21 In the frequency signal, cos (2ρ) sinX is contained in ω 2 、2ω 12 And 2ω 12 In the frequency signal, sin (2ρ) sinX is contained in ω 1 、2ω 21 And 2ω 21 In the frequency signal. Selecting fundamental frequency difference frequency signal omega of two elasto-optical modulators 21 The fundamental frequency signal omega of the first elasto-modulator 3 1 And the fundamental frequency signal omega of the second elasto-optical modulator 6 2 Amplitude of low frequency signal And->And (5) carrying out data processing analysis to solve the stress birefringence retardation and the fast axis azimuth of the optical material to be measured and the element 5. The phase-locked technology is adopted to obtain the signal amplitude extracted with high precision, but the traditional analog phase-locked amplifier can only obtain single frequency signal amplitude at the same time, but cannot obtain a plurality of frequency signal amplitudes at the same time. The FPGA is used for controlling the AD converter to work while providing the driving source signal of the elastometer, and converting the detection light signal output by the detector into a digital signal sequence to be input into the FPGA, wherein the digital signal sequence after AD conversion
The two elasto-optical modulators have frequencies f respectively 1 =ω 1 /2 pi and f 2 =ω 2 Sampling rate of AD is set to f s Let f s =N 1 ×f 1 =N 2 ×f 2 ,N 1 ,N 2 >3, sampling the input signal in the whole period of the two elastic optical modulators, and obtaining the total sampling number of M=N due to the different working frequencies of the two elastic optical modulators 1 ×q 1 =N 2 ×q 2 The number of digital signal sequences is m=0, 1, …, M-1. According to the digital signal sequence characteristics of the elasto-modulated signals described in the step (6), combining with the hardware resources of the FPGA, applying the digital phase locking technology to the modulated signal processing and realizing theAnd (3) multi-channel digital phase locking data processing, extracting a plurality of frequency signal components, and completing the solution of stress birefringence delay and fast axis azimuth angle. The FPGA controls the sampling rate of the AD and converts the modulated optical signals detected by the photoelectric detector into digital signal sequences. Meanwhile, the digital signal sequences are input into the FPGA, and are subjected to cross-correlation operation with a plurality of frequency multiplication reference signal sequences stored in the ROM of the FPGA, and extraction of different frequency item amplitudes is completed.
For the digital signal sequence I of formula (6) (m) Sine reference sequence S of frequency multiplication term of first elastic optical modulator 3 in FPGA 11(m) =Bsin(2πm/N 1 ) Multiplying and accumulating the same phase component of phase lock A phase difference between the frequency-multiplied signal and the reference signal for the first elasto-modulator 3; will I (m) And cosine reference sequence C 11(m) =Bcos(2πm/N 1 ) Multiplying and then accumulating and summing to obtain phase-locked quadrature component +.>After digital phase locking is completed, the frequency multiplication term amplitude of the first elastic optical modulator 3 is extracted and obtained>Because the digital signal sequence can be operated in parallel in the FPGA, the multichannel digital phase-locked data processing can obtain the frequency multiplication term amplitude of the second elastic optical modulator 6 in the same way>And the difference frequency term amplitude +.>And expressed as
Calculating a ratio R by using the amplitude ratio of signals with different frequencies according to the extraction result of the digital phase-locked signals in the step (7) I And R is II Is that
According to the digital phase-locked signal extraction result of (7), the amplitude ratio of signals with different frequencies is utilized to combine two elastic optical modulators to stabilize the phase modulation amplitude delta 10 And delta 20 The stress birefringence phase retardation X and the fast axis azimuth angle ρ can be obtained by solving as follows
The modulated optical signal analog-to-digital conversion module 23 is a two-way AD, wherein the AD adopts 16-bit high-precision AD, and the sampling rate of the AD is set to be tens of MHz, so that hundreds of data points are respectively acquired in a single period of fundamental frequency signals of two elasto-modulators, the total sampling data M is set to be tens of thousands of data points, hundreds of elasto-modulation periods can simultaneously realize higher measurement rate and better data extraction signal-to-noise ratio, and the measurement rate can reach tens of ms/data point.
To achieve the optical material stress birefringence distribution measurement, the system control and data processing module 20 drives and controls the two-dimensional sample scanning stage 4 to achieve the two-dimensional scanning operation in the x and y directions through the scanning stage stepper motor control circuit 17. The system control and data processing module 20 outputs an electric pulse signal to scan the sample stage stepping motor control circuit 17 to drive the stepping motor to complete the designated angle rotation, and drives the mechanical transmission structure to push the carrying platform to move in the designated distance and direction. The two-dimensional sample scanning table 4 adopts a high-precision rotating motor and a high-resolution pulse to control the stepping motor to work, is provided with a grating ruler displacement sensor, realizes accurate real-time calibration on the position of the mechanical transmission device, and accurately obtains the position information of sample scanning.
The measuring device directly measures and obtains the stress birefringence phase retardation X and the fast axis azimuth angle rho of the optical material to be measured and the element sample. The direction of the azimuth of the fast axis represents the maximum direction of principal stress, the phase delay amount obtained by direct measurement is brought into the detected light wavelength data lambda, and the delay amount and the optical path difference can be obtained by solving the inversion through the following formula.
Optical materials, elements, are typically characterized by the magnitude of stress birefringence, also commonly referred to as stress birefringence retardation, by optical path differences.
When the optical material and the element thickness d are known, the stress birefringence Δn of the optical material and the element can be further solved.
According to the stress optical coefficient C of the optical material, the stress distribution can be obtained by further solving inversion according to stress birefringence optical path difference (delay amount) in the material and the element.
Wherein sigma 1 Sum sigma 2 The fast axis azimuth angle rho is the direction of larger principal stress, which is the principal stress of two directions perpendicular to each other on the plane of the optical material. The Young's modulus E of the material can be obtained, and the strain distribution of the optical material and the element can be further obtained.
The control computer 24 and the system control and data processing module 20 establish communication through USB, LAN, GPIB, wherein the FPGA of the system control and data processing module 20 completes phase locking data of a plurality of frequency signals, obtains stress birefringence phase retardation and fast axis azimuth angle parameters of the optical material to be tested and the element 5, transmits the phase locking data to the control computer 24 together with the position data of the two-dimensional sample scanning table 4, utilizes the two parameters of the stress birefringence phase retardation and the fast axis azimuth angle obtained by the digital phase locking 201, establishes four-dimensional data sets of two-dimensional coordinates, the stress birefringence phase retardation and the fast axis azimuth angle of the optical material to be tested and the element 5 by combining the scanning position data, and can further invert the parameters of retardation, optical path difference, birefringence, stress, strain and the like of the optical material by adopting the stress birefringence phase retardation. And the position data is used as two-dimensional coordinates, and the measurement results of parameters such as stress birefringence phase delay, fast axis azimuth angle, optical path difference, stress, strain and the like are constructed to form a two-dimensional/three-dimensional graph/parameter table for visual display and storage, so that basis is provided for quality evaluation, screening and the like of optical materials and optical components.
The preferred embodiments of the present invention have been described in detail, but the present invention is not limited to the above embodiments, and various changes can be made within the knowledge of those skilled in the art without departing from the spirit of the present invention, and the various changes are included in the scope of the present invention.

Claims (4)

1. A stress measuring instrument for wide spectrum optical materials and elements, characterized in that: the optical material scanning device comprises a first detection light source (1), a first polarizer (2), a first elastic light modulator (3), a two-dimensional sample scanning table (4), an optical material to be detected and an element (5), a second elastic light modulator (6), a first analyzer (7), a visible light detector (8), a second detection light source (9), a second polarizer (10), a third elastic light modulator (11), a fourth elastic light modulator (12), a second analyzer (13), an infrared photodetector (14), a first LC resonance circuit (15), a second LC resonance circuit (16), a scanning sample table stepper motor control circuit (17), a third LC resonance circuit (18), a fourth LC resonance circuit (19), a system control and data processing moduleThe device comprises a block (20), a first preamplifier (21), a second preamplifier (22), a modulation optical signal analog-to-digital conversion module (23) and a control computer (24), wherein a first polarizer (2), a first photo-elastic modulator (3), an optical material to be detected and an element (5), a second photo-elastic modulator (6), a first polarization analyzer (7) and a visible light detector (8) are sequentially arranged in the optical path direction of a first detection light source (1), a visible light measuring channel is formed, the visible light detector (8) is connected with the first preamplifier (21) through a wire, a second polarizer (10), a third photo-elastic modulator (11), an optical material to be detected and the element (5), a fourth photo-elastic modulator (12), a second polarization analyzer (13) and an infrared photoelectric detector (14) are sequentially arranged in the optical path direction of a second detection light source (9), the second polarizer (11), the optical material to be detected and the element (5), the second photo-elastic modulator (6) is connected with the second preamplifier (22) through wires, the first preamplifier (21) and the second preamplifier (22) are connected with the optical signal analog-to-digital conversion module (23), the data signal conversion module (23) is connected with the second photo-elastic modulator (20) in the optical path direction of the second detection light source (9), and the data processing module is connected with the data analog-to the data module (23) The second elastic light modulator (6) is respectively connected with a first LC resonance circuit (15) and a second LC resonance circuit (16), the third elastic light modulator (11) and the fourth elastic light modulator (12) are respectively connected with a third LC resonance circuit (18) and a fourth LC resonance circuit (19), the optical material to be tested and the element (5) are arranged on the two-dimensional sample scanning table (4), the two-dimensional sample scanning table (4) is connected with a scanning sample table stepping motor control circuit (17), and the first LC resonance circuit (15), the second LC resonance circuit (16), the scanning sample table stepping motor control circuit (17), the third LC resonance circuit (18) and the fourth LC resonance circuit (19) are all connected to a system control and data processing module (20), and the system control and data processing module (20) is connected with a control computer (24); the system control and data processing module (20) comprises a digital phase lock (201) and a signal generator (202), wherein the digital phase lock (201) is connected with the signal generator (202), the digital phase lock (201) is respectively connected with a modulation optical signal analog-to-digital conversion module (23) and a control computer (24), and the signal generator (202) is respectively connected with a first LC resonance circuit (15), a second LC resonance circuit (16), a scanning sample stage stepping motor control circuit (17) and a thirdAn LC resonance circuit (18) and a fourth LC resonance circuit (19); the digital phase lock (201) obtains the fundamental frequency difference frequency signal omega of the first elastic optical modulator (3) and the second elastic optical modulator (6) through the modulation optical signal analog-to-digital conversion module (23) 21 And the fundamental frequency signal omega of the first elasto-optical modulator (3) 1 And a fundamental frequency signal omega of a second elasto-optical modulator (6) 2 The amplitude of the low-frequency signal is equal, and the digital phase lock (201) is used for analyzing and solving the stress birefringence phase delay and the fast axis azimuth angle of the optical material to be tested and the element (5); the system control and data processing module (20) obtains optical path difference, double refraction size, stress distribution and strain distribution parameters of the optical material to be tested and the element (5) by inversion of the detected light source wavelength lambda, the thickness d of the optical material to be tested and the element and the stress optical coefficient C of the optical material to be tested and the element; the first elastic light modulator (3), the second elastic light modulator (6), the third elastic light modulator (11) and the fourth elastic light modulator (12) are all magnesium fluoride octagonal symmetrical structure elastic light modulators, the light transmission ranges of the first elastic light modulator (3), the second elastic light modulator (6), the third elastic light modulator (11) and the fourth elastic light modulator (12) are all 0.18-8 mu m, the modulation frequencies of the first elastic light modulator (3) and the third elastic light modulator (11) are all 40-50kHz, and the modulation frequencies of the second elastic light modulator (6) and the fourth elastic light modulator (12) are all 60-80kHz;
the method for solving the optical path difference comprises the following steps:the delta is an optical path difference, the lambda is the wavelength of a detection light source, and the X is the stress birefringence phase delay amount;
the solving method of the birefringence is as follows:the delta n is the double refraction, and the d is the thickness of the optical material and the element to be measured;
the solving method of the stress distribution comprises the following steps:the delta sigma is stress distribution, the sigma 1 Sum sigma 2 The principal stresses are respectively the principal stresses of the optical material to be measured and the element plane in two directions perpendicular to each other, and C is the stress optical coefficient of the optical material to be measured and the element plane;
the solving method of the strain distribution comprises the following steps:and epsilon is strain distribution, and E is Young's modulus of the optical material and the element to be tested.
2. The broad spectrum optical material and component stress measuring instrument as defined in claim 1 wherein: the visible light detector (8) adopts a silicon photoelectric detector, the spectral response range of the visible light detector (8) is 200-1100nm, the infrared photoelectric detector (14) adopts an indium-arsenic-antimony photoelectric detector, and the spectral response range of the infrared photoelectric detector (14) is 1.0-5.8 mu m.
3. The broad spectrum optical material and component stress measuring instrument as defined in claim 1 wherein: the light transmission range of the first polarizer (2), the first polarizer (7), the second polarizer (10) and the second polarizer (13) is 0.2-6 mu m, and the extinction ratio of the first polarizer (2), the first polarizer (7), the second polarizer (10) and the second polarizer (13) is 10000:1.
4. The broad spectrum optical material and component stress measuring instrument as defined in claim 1 wherein: the system control and data processing module (20) drives and controls the two-dimensional sample scanning table (4) to realize two-dimensional scanning measurement through the scanning sample table stepping motor control circuit (17), the system control and data processing module (20) obtains stress distribution measurement through the two-dimensional scanning measurement, and the system control and data processing module (20) constructs two-dimensional graphs, three-dimensional graphs and parameter tables from the coordinate position data and the stress distribution measurement data to carry out visual display and storage.
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