CN111809144B - Mask plate and manufacturing method thereof - Google Patents
Mask plate and manufacturing method thereof Download PDFInfo
- Publication number
- CN111809144B CN111809144B CN202010281455.0A CN202010281455A CN111809144B CN 111809144 B CN111809144 B CN 111809144B CN 202010281455 A CN202010281455 A CN 202010281455A CN 111809144 B CN111809144 B CN 111809144B
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- China
- Prior art keywords
- metal layer
- boss
- mask
- frame
- mask strip
- Prior art date
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Classifications
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/04—Coating on selected surface areas, e.g. using masks
- C23C14/042—Coating on selected surface areas, e.g. using masks using masks
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/24—Vacuum evaporation
Abstract
The application discloses a mask plate and a manufacturing method thereof, comprising the following steps: the frame is provided with a hollow evaporation area; the lug boss is formed on one side of the frame, extends along a rectangular track surrounding the evaporation area, and is provided with grooves parallel to at least one group of opposite sides; the metal layer is filled in the groove, and the surface of the metal layer is flush with the surface of the boss; and at least one mask strip which is bridged on the group of opposite sides of the boss and partially covers the evaporation area, wherein the mask strip and the metal layer are made of the same metal, and the mask strip and the metal layer are welded at the intersection of the mask strip and the metal layer of the boss, and the metal layer and the mask strip are made of the same material, so that the welding strength between the mask strip and the frame is ensured; the frame is made of common stainless steel, so that the cost in the whole evaporation process is reduced.
Description
Technical Field
The application relates to a technology in the field of film evaporation, in particular to a mask plate and a manufacturing method thereof.
Background
OLED (Organic Light-Emitting Diode) display devices have been listed as a next generation display technology with great development prospects due to the advantages of thinness, lightness, wide viewing angle, active Light emission, continuous and adjustable Light emission color, low cost, fast response speed, small energy consumption, low driving voltage, wide working temperature range, simple production process, high Light emission efficiency, flexible display, and the like. In the process of manufacturing an OLED display device, a mask plate is generally used as an evaporation mask to form an evaporation pattern on a substrate.
The mask strips of the existing precision metal mask plate are fixed on a metal Frame (Frame) in a laser welding mode. In order to ensure firm welding, the metal frame and the fine mask strips are made of the same raw materials. In order to reduce thermal expansion during vapor deposition, invar36 is used in the actual production of the masking tape, and thus Invar36 is also used for the metal frame.
Invar36 is a special low expansion iron-nickel alloy with an ultra-low expansion coefficient, where control of the carbon and manganese composition is important. Cold deformation can reduce the coefficient of thermal expansion, and heat treatment in a specific temperature range can stabilize the coefficient of thermal expansion. Density: ρ=8.1 g/cm3, melting temperature range: 1430 ℃, curie temperature 230 ℃, specific heat: 515J/Kg. Invar36 on the market is relatively expensive (about 3 times that of common 304 stainless steel), and has more consumables, thus increasing the evaporation cost.
Disclosure of Invention
Aiming at the problems existing in the prior art, the application aims to provide a mask plate and a manufacturing method thereof, and the mask plate and the manufacturing method thereof ensure the welding strength between the mask strip and the frame by arranging a metal layer on the frame, wherein the metal layer and the mask strip are made of the same material; the frame is made of common stainless steel, so that the cost in the whole evaporation process is reduced; after the mask strips are damaged, the frame can be recovered, and the metal layer of the boss positioned on the frame can be repaired or thickened for reprocessing.
According to one aspect of the present application, there is provided a mask plate, including:
the frame is provided with a hollow evaporation area;
the lug boss is formed on one side of the frame, extends along a rectangular track surrounding the evaporation area, and is provided with grooves parallel to at least one group of opposite sides;
the metal layer is filled in the groove, and the surface of the metal layer is flush with the surface of the boss; and
and at least one mask strip which is bridged on the group of opposite sides of the boss and partially covers the evaporation area, wherein the mask strip and the metal layer are made of the same metal, and the mask strip and the metal layer are welded at the intersection of the mask strip and the metal layer of the boss.
Preferably, the material of the boss is SUS stainless steel, and the mask strip and the metal layer are made of an invar36 alloy.
Preferably, the thickness of the metal layer is 1um to 1000um.
Preferably, the length of the metal layer is 1 mm-2000 mm, and the width of the metal layer is 1 mm-50 mm.
Preferably, the metal layer is formed by chemical deposition or thermal spraying.
Preferably, the number of the second metal mask stripes is greater than three.
According to an aspect of the present application, there is provided a method of manufacturing a mask, comprising:
providing a frame, wherein the frame comprises an evaporation area;
a boss is formed on one side of the frame in an extending mode along a rectangular track surrounding the evaporation area;
forming grooves parallel to at least one pair of opposite sides of the boss on the surfaces of the opposite sides;
filling metal into the grooves to form metal layers, wherein the surfaces of the metal layers are flush with the surfaces of the bosses;
bridging at least one mask strip across the set of opposite sides of the boss and partially covering the evaporation region, wherein the mask strip and the metal layer are made of the same metal;
and welding the mask strip and the metal layer at the intersection of the mask strip and the metal layer of the boss.
Preferably, the material of the boss is SUS stainless steel, and the mask strip and the metal layer are made of an invar36 alloy.
Preferably, the metal layer is formed in the groove by electroplating.
Preferably, the metal layer is formed in the groove by thermal spraying.
Preferably, the metal layer is formed in the recess by chemical deposition.
The beneficial effects of the technical scheme are as follows:
according to the mask plate and the manufacturing method thereof, the metal layer is arranged on the frame and is made of the same material as the mask strip, so that the welding strength between the mask strip and the frame is ensured;
the frame is made of common stainless steel, so that the cost in the whole evaporation process is reduced;
after the mask strips are damaged, the frame can be recovered, and the metal layer of the boss positioned on the frame can be repaired or thickened for reprocessing.
Other features and advantages of the present application, as well as the structure and operation of various embodiments of the present application, are described in detail below with reference to the accompanying drawings. It should be noted that the present application is not limited to the specific embodiments described herein. These examples are presented herein for illustrative purposes only.
Drawings
Other features, objects and advantages of the present application will become more apparent upon reading of the detailed description of non-limiting embodiments, made with reference to the following drawings.
FIG. 1 is a schematic plan view of a mask plate;
FIG. 2 is a schematic cross-sectional view along AA' in FIG. 1;
FIG. 3 is a schematic cross-sectional view taken along BB' in FIG. 1;
fig. 4 is a schematic flow chart of a mask plate manufacturing method.
List of reference numerals:
10. frame
11. Vapor deposition region
20. Boss
21. First groove
22. Second groove
30. Mask strip
41. A first metal layer
411. First intersection
42. Second metal layer
421. Second intersection
The features and advantages of the present application will become more apparent from the following detailed description taken in conjunction with the accompanying drawings. Throughout the drawings, like reference numerals designate corresponding elements. In the drawings, like reference numbers generally indicate identical, functionally similar, and/or structurally similar elements.
Detailed Description
The following description of the embodiments of the present application will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present application, but not all embodiments. All other embodiments, which can be made by a person skilled in the art based on the embodiments of the application without any inventive effort, are intended to fall within the scope of the application.
The terms "first," "second," and the like, as used herein, do not denote any order, quantity, or importance, but rather are used to distinguish one element from another. The word "comprising" or "comprises", and the like, means that elements or items preceding the word are included in the element or item listed after the word and equivalents thereof, but does not exclude other elements or items. The terms "connected" or "connected," and the like, are not limited to physical or mechanical connections, but may include electrical connections, whether direct or indirect. "upper", "lower", "left", "right", etc. are used merely to indicate relative positional relationships, which may also be changed when the absolute position of the object to be described is changed.
It should be noted that, without conflict, the embodiments of the present application and features of the embodiments may be combined with each other.
The application is further described below with reference to the drawings and specific examples, which are not intended to be limiting.
According to one aspect of the application, a mask is provided.
Fig. 1 is a schematic plan view of a mask plate. Referring to fig. 1, the mask shown in fig. 1 includes a frame 10, the frame 10 is made of a metal material, and an outer contour of the frame 10 is rectangular or square. The center of the frame 10 is hollowed out to form an evaporation area 11, and the evaporation area 11 is rectangular. In the vapor deposition process, the vapor deposition region 11 faces the substrate, and vapor deposition is performed by the vapor deposition source through the vapor deposition region 11. A boss 20 is provided on one side of the frame 10, and the boss 20 surrounds the vapor deposition area 11 of the frame 10, i.e., the boss 20 is obtained by extending along a rectangular track, so that the outline of the boss 20 is also rectangular. The surfaces of at least one pair of opposite sides of the boss 20 are provided with grooves parallel to the opposite sides, i.e. the surface of the boss 20 is provided with a first groove 21 and a second groove 22, the first groove 21 is arranged on the surface of one opposite side of the pair of opposite sides, and the second groove 22 is arranged on the surface of the other opposite side of the pair of opposite sides. The first grooves 21 extend in a direction parallel to the opposite side of the boss 20 where they are located, i.e. the first grooves 21 are parallel to the opposite side where they are located. Similarly, the second groove 22 is also in a direction parallel to the opposite side of the boss 20 where it is located, i.e. the second groove 22 is parallel to the opposite side where it is located. The first groove 21 and the second groove 22 are parallel to each other. A first metal layer 41 is provided in the first recess 21 and a second metal layer 42 is provided in the second recess 22. The first metal layer 41 completely fills the first groove 21, and the surface of the first metal layer 41 and the surface of the boss 20 are flush with each other, so as to ensure the accuracy of welding the first metal layer 41 and the mask strip 30. The second metal layer 42 completely fills the second recess 22, and the surface of the second metal layer 42 and the surface of the boss 20 are flush with each other. The thickness of the first metal layer 41 is 1um to 1000um, preferably 30um; the thickness of the second metal layer 42 is 1um to 1000um, preferably 30um. The length of the first metal layer 41 is 1mm to 2000mm, preferably 1500mm, and the width of the metal layer of the first metal layer 41 is 1mm to 50mm, preferably 15mm; the length of the second metal layer 42 is 1mm to 2000mm, preferably 1500mm, and the width of the metal layer of the second metal layer 42 is 1mm to 50mm, preferably 15mm. The material of the boss 20 is SUS, and the material of the mask bar 30 and the metal layer is Invar36 alloy. SUS stainless steel refers to 304 stainless steel. SUS is Japanese Material Standard, and 304 stainless steel is a grade of stainless steel produced according to American ASTM standards. 304 corresponds to the (0 Cr18Ni 9) stainless steel of our country, japan also refers to the united states name, which is called: SUS304.
Referring again to fig. 1, the mask plate includes at least one mask bar 30, and after the mask bar 30 is tensioned by the screen tensioning machine, the mask bar is bridged across a set of opposite sides of the boss 20 and partially covers the vapor deposition area 11. The mask bar 30 shown in fig. 1 has both ends in contact with the first metal layer 41 and the second metal layer 42, respectively, and the contact of the mask bar 30 with the first metal layer 41 forms a first intersection 411, and the contact area of the mask bar 30 with the second metal layer 42 forms a second intersection 421. At the first and second intersections 411 and 421, the mask bar 30 and the first and second metal layers 41 and 42 are laser welded such that the mask bar 30 is fixed to the boss 20 of the frame 10. The material of the boss 20 and the frame 10 is SUS stainless steel, and the material of the first and second metal layers 41 and 42 is Invar36 alloy, and the material of the mask bar 30 is Invar36 alloy, that is, the material of the mask bar 30 is different from the material of the boss 20, so that the use of Invar36 alloy for the entire frame 10 and boss 20 can be avoided, and the material can be saved.
Fig. 2 is a schematic cross-sectional view along AA' in fig. 1. Fig. 3 is a schematic cross-sectional view along BB' in fig. 1. Referring to fig. 2 and 3, a boss 20 is provided to the frame 10, and the boss 20 surrounds the vapor deposition region 11 of the frame 10. In some embodiments, the number of mask strips 30 provided to the frame 10 is greater than three. The first and second metal layers 41 and 42 may be formed by different methods, for example, the first and second metal layers 41 and 42 are formed in the first and second grooves 21 and 22 by electroplating; or the first metal layer 41 and the second metal layer 42 are formed in the grooves by thermal spraying; or the first and second metal layers 41 and 42 are formed by chemical deposition in the first and second grooves 21 and 22.
According to one aspect of the application, a method for manufacturing a mask plate is provided.
Fig. 4 is a schematic flow chart of a mask plate manufacturing method. The mask plate manufacturing method shown in fig. 4 specifically includes step S101, step S102, step S103, step S104, step S105, and step S106. In step S101, a frame 10 is provided, and the frame 10 includes an evaporation area 11. In step S102, a boss 20 is formed on one side of the frame 10 along a rectangular track surrounding the evaporation area 11. In step S103, grooves parallel to the opposite sides are formed on the surfaces of at least one set of opposite sides of the boss 20. I.e. a first recess 21 and a second recess 22 are provided in the surface of the boss 20. In step S104, the metal is filled in the groove to form a metal layer, wherein the surface of the metal layer is flush with the surface of the boss 20. The first metal layer 41 is provided in the first groove 21, the second metal layer 42 is provided in the second groove 22, and the first metal layer 41 and the second metal layer 42 may be formed by different methods, for example, the first metal layer 41 and the second metal layer 42 may be formed in the first groove 21 and the second groove 22 by electroplating; or the first metal layer 41 and the second metal layer 42 are formed in the grooves by thermal spraying; or the first and second metal layers 41 and 42 are formed by chemical deposition in the first and second grooves 21 and 22. In step S105, at least one mask bar 30 is bridged across a set of opposite sides of the boss 20 and partially covers the evaporation region 11, wherein the mask bar 30 and the metal layer are made of the same metal. In step S106, the mask bar 30 and the metal layers 41 and 42 are welded at the intersections of the mask bar 30 and the metal layers of the boss 20.
In summary, according to the mask plate and the manufacturing method thereof, the metal layer is arranged on the frame, and the metal layer and the mask strip are made of the same material, so that the welding strength between the mask strip and the frame is ensured; the frame is made of common stainless steel, so that the cost in the whole evaporation process is reduced; after the mask strips are damaged, the frame can be recovered, and the metal layer of the boss positioned on the frame can be repaired or thickened for reprocessing.
The foregoing is a further detailed description of the application in connection with the preferred embodiments, and it is not intended that the application be limited to the specific embodiments described. It will be apparent to those skilled in the art that several simple deductions or substitutions may be made without departing from the spirit of the application, and these should be considered to be within the scope of the application.
Claims (8)
1. A mask plate, comprising:
the frame is provided with a hollow evaporation area;
the lug boss is formed on one side of the frame, extends along a rectangular track surrounding the evaporation area, and is provided with grooves parallel to at least one group of opposite sides;
the metal layer is filled in the groove, and the surface of the metal layer is flush with the surface of the boss; and
at least one mask strip which is bridged on the group of opposite sides of the boss and partially covers the evaporation area, wherein the mask strip and the metal layer are made of the same metal, and the mask strip and the metal layer are welded at the intersection of the mask strip and the metal layer of the boss; the thickness of the metal layer is 1-1000 mu m;
the boss is made of SUS stainless steel, and the mask strip and the metal layer are made of Invar36 alloy.
2. The mask plate according to claim 1, wherein the length of the metal layer is 1mm to 2000mm, and the width of the metal layer is 1mm to 50mm.
3. The mask plate according to claim 1, wherein the metal layer is formed by chemical deposition or thermal spraying.
4. The mask plate according to claim 1, wherein the number of mask stripes is greater than three.
5. A mask plate manufacturing method is characterized by comprising the following steps:
providing a frame, wherein the frame comprises an evaporation area;
a boss is formed on one side of the frame in an extending mode along a rectangular track surrounding the evaporation area;
forming grooves parallel to at least one pair of opposite sides of the boss on the surfaces of the opposite sides;
filling metal into the grooves to form metal layers, wherein the surfaces of the metal layers are flush with the surfaces of the bosses;
bridging at least one mask strip across the set of opposite sides of the boss and partially covering the evaporation region, wherein the mask strip and the metal layer are made of the same metal; and
welding the mask strip and the metal layer at the intersection of the mask strip and the metal layer of the boss
The boss is made of SUS stainless steel, and the mask strip and the metal layer are made of invar36 alloy.
6. The method of claim 5, wherein the metal layer is formed in the recess by electroplating.
7. The method of claim 5, wherein the metal layer is formed in the recess by thermal spraying.
8. The method of claim 5, wherein the metal layer is formed in the recess by chemical deposition.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910294024 | 2019-04-12 | ||
| CN2019102940245 | 2019-04-12 |
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| Publication Number | Publication Date |
|---|---|
| CN111809144A CN111809144A (en) | 2020-10-23 |
| CN111809144B true CN111809144B (en) | 2023-09-12 |
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| CN202010281455.0A Active CN111809144B (en) | 2019-04-12 | 2020-04-10 | Mask plate and manufacturing method thereof |
| CN202020529356.5U Active CN212051625U (en) | 2019-04-12 | 2020-04-10 | Mask plate |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202020529356.5U Active CN212051625U (en) | 2019-04-12 | 2020-04-10 | Mask plate |
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| CN111809144B (en) * | 2019-04-12 | 2023-09-12 | 上海和辉光电股份有限公司 | Mask plate and manufacturing method thereof |
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2020
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- 2020-04-10 CN CN202020529356.5U patent/CN212051625U/en active Active
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| JP2002069619A (en) * | 2000-08-25 | 2002-03-08 | Nec Corp | Metal-mask structural body and its production method |
| JP2017092186A (en) * | 2015-11-06 | 2017-05-25 | Ｓｈマテリアル株式会社 | Method of manufacturing lead frame |
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Also Published As
| Publication number | Publication date |
|---|---|
| CN111809144A (en) | 2020-10-23 |
| CN212051625U (en) | 2020-12-01 |
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