CN111805832A - Network cable interface processing method - Google Patents

Network cable interface processing method Download PDF

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Publication number
CN111805832A
CN111805832A CN202010694979.2A CN202010694979A CN111805832A CN 111805832 A CN111805832 A CN 111805832A CN 202010694979 A CN202010694979 A CN 202010694979A CN 111805832 A CN111805832 A CN 111805832A
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China
Prior art keywords
parts
network cable
cable interface
processing method
heating
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Pending
Application number
CN202010694979.2A
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Chinese (zh)
Inventor
谢青梅
唐小莉
谢安琼
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Suzhou Huaqing Yuding Electronic Equipment System Integration Co ltd
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Suzhou Huaqing Yuding Electronic Equipment System Integration Co ltd
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Priority to CN202010694979.2A priority Critical patent/CN111805832A/en
Publication of CN111805832A publication Critical patent/CN111805832A/en
Pending legal-status Critical Current

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/0025—Preventing defects on the moulded article, e.g. weld lines, shrinkage marks
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C37/00—Component parts, details, accessories or auxiliary operations, not covered by group B29C33/00 or B29C35/00
    • B29C37/02—Deburring or deflashing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • B29C45/72—Heating or cooling
    • B29C45/7207—Heating or cooling of the moulded articles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • B29C45/72—Heating or cooling
    • B29C45/73—Heating or cooling of the mould
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K13/00—Use of mixtures of ingredients not covered by one single of the preceding main groups, each of these compounds being essential
    • C08K13/04—Ingredients characterised by their shape and organic or inorganic ingredients
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/04—Carbon
    • C08K3/041—Carbon nanotubes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C08K3/2279—Oxides; Hydroxides of metals of antimony
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/04—Oxygen-containing compounds
    • C08K5/09—Carboxylic acids; Metal salts thereof; Anhydrides thereof
    • C08K5/098—Metal salts of carboxylic acids
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K7/00—Use of ingredients characterised by shape
    • C08K7/22—Expanded, porous or hollow particles
    • C08K7/24—Expanded, porous or hollow particles inorganic
    • C08K7/26—Silicon- containing compounds

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  • Chemical & Material Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Materials Engineering (AREA)
  • Nanotechnology (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Compositions Of Macromolecular Compounds (AREA)

Abstract

The invention discloses a network cable interface processing method, which comprises the following steps: A. firstly, sequentially placing network cable interface molds in a containing tank side by side; B. adding a heating medium into the accommodating tank, and putting a constant-temperature heating pipe into the accommodating tank; C. injecting raw materials into the network cable interface mould; D. meanwhile, the heating medium uniformly heats the network cable interface mould; E. after heating, opening the die, and immediately putting the semi-finished product of the network cable interface into cold water for cooling; F. and finally, deburring to obtain a finished product of the network cable interface.

Description

Network cable interface processing method
Technical Field
The invention relates to the technical field of network cable interface processing, in particular to a network cable interface processing method.
Background
The network interface refers to an interface between a network card and a network, and a common network interface is RJ-45, which is used for connection of a twisted pair. RJ-45 is commonly called as a 'crystal head', and belongs to a twisted-pair Ethernet interface type. The RJ-45 plug can only be inserted along a fixed direction, and a plastic elastic sheet is arranged to be clamped with the RJ-45 slot to prevent the RJ-45 plug from falling off. The RJ-45 interface is the most common network cable interface and is of the twisted pair ethernet interface type. It is used not only in the most basic 10Base-T Ethernet network, but also in the mainstream 100Base-TX fast Ethernet and 1000Base-TX gigabit Ethernet. Although the transmission media used by them are twisted pair types, they use different versions of twisted pair types, such as the first three types of lines used in 10Base-T to the six types of lines supporting 1000Base-TX giga rate, and the middle 100Base-TX uses so-called five-type and ultra-five-type lines, and may be six types of lines. The appearance of these RJ-45 interfaces is identical, like a flat "T". Connected with it is an RJ-45 connector.
The current network cable interface has a single processing mode, and the obtained network cable interface has poor toughness, easy deformation and short service life, so the improvement is needed.
Disclosure of Invention
The present invention is directed to a method for processing a network cable interface, so as to solve the problems set forth in the background art.
In order to achieve the purpose, the invention provides the following technical scheme: a network cable interface processing method comprises the following steps:
A. firstly, sequentially placing network cable interface molds in a containing tank side by side;
B. adding a heating medium into the accommodating tank, and putting a constant-temperature heating pipe into the accommodating tank;
C. injecting raw materials into the network cable interface mould;
D. meanwhile, the heating medium uniformly heats the network cable interface mould;
E. after heating, opening the die, and immediately putting the semi-finished product of the network cable interface into cold water for cooling;
F. and finally, deburring to obtain a finished product of the network cable interface.
Preferably, the heating medium in the step B is water, and the heating temperature is 80-90 ℃.
Preferably, the raw material components in the step C comprise, by weight, 30-40 parts of low molecular weight epoxy resin, 8-14 parts of antimony trioxide, 3-9 parts of zinc oxide, 4-12 parts of mica powder, 10-20 parts of barium sulfate, 4-10 parts of titanium dioxide, 3-9 parts of carbon nano tubes, 5-15 parts of thionyl chloride, 8-20 parts of diatomite, 5-12 parts of barium stearate and 5-10 parts of calcium petroleum sulfonate.
Preferably, the cooling time in the step E is 10min-18 min.
Compared with the prior art, the invention has the beneficial effects that: the processing method adopted by the invention is simple to operate, can improve the toughness and the anti-deformation capability of the network cable interface, is not easy to damage and has long service life; according to the invention, after high-temperature raw materials are injected into the die, the die is heated at a constant temperature, so that the phenomenon of cracking or deformation of the product caused by cooling of the raw materials in the die can be prevented, and the processing quality of a network cable interface can be improved; in addition, the adopted raw materials can effectively improve the compatibility among materials, improve the stability of the finished product material, enhance the surface strength and toughness of the material and improve the comprehensive performance of the finished product.
Detailed Description
The technical solutions in the embodiments of the present invention are clearly and completely described below, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
The first embodiment is as follows:
the invention provides the following technical scheme: a network cable interface processing method comprises the following steps:
A. firstly, sequentially placing network cable interface molds in a containing tank side by side;
B. adding a heating medium into the accommodating tank, and putting a constant-temperature heating pipe into the accommodating tank;
C. injecting raw materials into the network cable interface mould;
D. meanwhile, the heating medium uniformly heats the network cable interface mould;
E. after heating, opening the die, and immediately putting the semi-finished product of the network cable interface into cold water for cooling;
F. and finally, deburring to obtain a finished product of the network cable interface.
In this embodiment, the heating medium in step B is water, and the heating temperature is 80 ℃.
In this embodiment, the raw material components in step C include, by weight, 30 parts of low molecular weight epoxy resin, 8 parts of antimony trioxide, 3 parts of zinc oxide, 4 parts of mica powder, 10 parts of barium sulfate, 4 parts of titanium dioxide, 3 parts of carbon nanotubes, 5 parts of thionyl chloride, 8 parts of diatomaceous earth, 5 parts of barium stearate, and 5 parts of calcium petroleum sulfonate.
In this embodiment, the cooling time in step E is 10 min.
Example two:
a network cable interface processing method comprises the following steps:
A. firstly, sequentially placing network cable interface molds in a containing tank side by side;
B. adding a heating medium into the accommodating tank, and putting a constant-temperature heating pipe into the accommodating tank;
C. injecting raw materials into the network cable interface mould;
D. meanwhile, the heating medium uniformly heats the network cable interface mould;
E. after heating, opening the die, and immediately putting the semi-finished product of the network cable interface into cold water for cooling;
F. and finally, deburring to obtain a finished product of the network cable interface.
In this embodiment, the heating medium in step B is water, and the heating temperature is 90 ℃.
In this embodiment, the raw material components in step C include, by weight, 40 parts of low molecular weight epoxy resin, 14 parts of antimony trioxide, 9 parts of zinc oxide, 12 parts of mica powder, 20 parts of barium sulfate, 10 parts of titanium dioxide, 9 parts of carbon nanotubes, 15 parts of thionyl chloride, 20 parts of diatomaceous earth, 12 parts of barium stearate, and 10 parts of calcium petroleum sulfonate.
In this example, the cooling time in step E was 18 min.
Example three:
a network cable interface processing method comprises the following steps:
A. firstly, sequentially placing network cable interface molds in a containing tank side by side;
B. adding a heating medium into the accommodating tank, and putting a constant-temperature heating pipe into the accommodating tank;
C. injecting raw materials into the network cable interface mould;
D. meanwhile, the heating medium uniformly heats the network cable interface mould;
E. after heating, opening the die, and immediately putting the semi-finished product of the network cable interface into cold water for cooling;
F. and finally, deburring to obtain a finished product of the network cable interface.
In this example, the heating medium in step B was water, and the heating temperature was 82 ℃.
In this embodiment, the raw material components in step C include, by weight, 32 parts of low molecular weight epoxy resin, 9 parts of antimony trioxide, 4 parts of zinc oxide, 6 parts of mica powder, 12 parts of barium sulfate, 5 parts of titanium dioxide, 4 parts of carbon nanotubes, 7 parts of thionyl chloride, 10 parts of diatomaceous earth, 7 parts of barium stearate, and 6 parts of calcium petroleum sulfonate.
In this example, the cooling time in step E was 12 min.
Example four:
a network cable interface processing method comprises the following steps:
A. firstly, sequentially placing network cable interface molds in a containing tank side by side;
B. adding a heating medium into the accommodating tank, and putting a constant-temperature heating pipe into the accommodating tank;
C. injecting raw materials into the network cable interface mould;
D. meanwhile, the heating medium uniformly heats the network cable interface mould;
E. after heating, opening the die, and immediately putting the semi-finished product of the network cable interface into cold water for cooling;
F. and finally, deburring to obtain a finished product of the network cable interface.
In this example, the heating medium in step B was water, and the heating temperature was 88 ℃.
In this embodiment, the raw material components in step C include, by weight, 38 parts of low molecular weight epoxy resin, 12 parts of antimony trioxide, 8 parts of zinc oxide, 10 parts of mica powder, 18 parts of barium sulfate, 8 parts of titanium dioxide, 8 parts of carbon nanotubes, 13 parts of thionyl chloride, 18 parts of diatomaceous earth, 11 parts of barium stearate, and 9 parts of calcium petroleum sulfonate.
In this example, the cooling time in step E was 16 min.
Example five:
a network cable interface processing method comprises the following steps:
A. firstly, sequentially placing network cable interface molds in a containing tank side by side;
B. adding a heating medium into the accommodating tank, and putting a constant-temperature heating pipe into the accommodating tank;
C. injecting raw materials into the network cable interface mould;
D. meanwhile, the heating medium uniformly heats the network cable interface mould;
E. after heating, opening the die, and immediately putting the semi-finished product of the network cable interface into cold water for cooling;
F. and finally, deburring to obtain a finished product of the network cable interface.
In this example, the heating medium in step B was water, and the heating temperature was 84 ℃.
In this embodiment, the raw material components in step C include, by weight, 34 parts of low molecular weight epoxy resin, 10 parts of antimony trioxide, 5 parts of zinc oxide, 5 parts of mica powder, 14 parts of barium sulfate, 10 parts of titanium dioxide, 4 parts of carbon nanotubes, 12 parts of thionyl chloride, 12 parts of diatomaceous earth, 11 parts of barium stearate, and 6 parts of calcium petroleum sulfonate.
In this example, the cooling time in step E was 13 min.
Example six:
a network cable interface processing method comprises the following steps:
A. firstly, sequentially placing network cable interface molds in a containing tank side by side;
B. adding a heating medium into the accommodating tank, and putting a constant-temperature heating pipe into the accommodating tank;
C. injecting raw materials into the network cable interface mould;
D. meanwhile, the heating medium uniformly heats the network cable interface mould;
E. after heating, opening the die, and immediately putting the semi-finished product of the network cable interface into cold water for cooling;
F. and finally, deburring to obtain a finished product of the network cable interface.
In this embodiment, the heating medium in step B is water, and the heating temperature is 85 ℃.
In this embodiment, the raw material components in step C include, by weight, 35 parts of low molecular weight epoxy resin, 11 parts of antimony trioxide, 6 parts of zinc oxide, 8 parts of mica powder, 15 parts of barium sulfate, 10 parts of titanium dioxide, 6 parts of carbon nanotubes, 10 parts of thionyl chloride, 14 parts of diatomaceous earth, 9 parts of barium stearate, and 8 parts of calcium petroleum sulfonate.
In this example, the cooling time in step E was 14 min.
Experimental example:
the network cable interface prepared by the embodiments of the invention is used for performance test, and the obtained data is as follows:
compressive Strength (MPA) High temperature resistance (DEG C)
Example one 65 140
Example two 65 145
EXAMPLE III 68 145
Example four 70 148
EXAMPLE five 67 146
EXAMPLE six 70 148
In conclusion, the processing method adopted by the invention is simple to operate, can improve the toughness and the deformation resistance of the network cable interface, is not easy to damage and has long service life; according to the invention, after high-temperature raw materials are injected into the die, the die is heated at a constant temperature, so that the phenomenon of cracking or deformation of the product caused by cooling of the raw materials in the die can be prevented, and the processing quality of a network cable interface can be improved; in addition, the adopted raw materials can effectively improve the compatibility among materials, improve the stability of the finished product material, enhance the surface strength and toughness of the material and improve the comprehensive performance of the finished product.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.

Claims (4)

1. A network cable interface processing method is characterized in that: the method comprises the following steps:
A. firstly, sequentially placing network cable interface molds in a containing tank side by side;
B. adding a heating medium into the accommodating tank, and putting a constant-temperature heating pipe into the accommodating tank;
C. injecting raw materials into the network cable interface mould;
D. meanwhile, the heating medium uniformly heats the network cable interface mould;
E. after heating, opening the die, and immediately putting the semi-finished product of the network cable interface into cold water for cooling;
F. and finally, deburring to obtain a finished product of the network cable interface.
2. The network cable interface processing method according to claim 1, characterized in that: in the step B, the heating medium is water, and the heating temperature is 80-90 ℃.
3. The network cable interface processing method according to claim 1, characterized in that: and the raw material components in the step C comprise, by weight, 30-40 parts of low molecular weight epoxy resin, 8-14 parts of antimony trioxide, 3-9 parts of zinc oxide, 4-12 parts of mica powder, 10-20 parts of barium sulfate, 4-10 parts of titanium dioxide, 3-9 parts of carbon nanotubes, 5-15 parts of thionyl chloride, 8-20 parts of diatomite, 5-12 parts of barium stearate and 5-10 parts of calcium petroleum sulfonate.
4. The network cable interface processing method according to claim 1, characterized in that: the cooling time in the step E is 10min-18 min.
CN202010694979.2A 2020-07-19 2020-07-19 Network cable interface processing method Pending CN111805832A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202010694979.2A CN111805832A (en) 2020-07-19 2020-07-19 Network cable interface processing method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202010694979.2A CN111805832A (en) 2020-07-19 2020-07-19 Network cable interface processing method

Publications (1)

Publication Number Publication Date
CN111805832A true CN111805832A (en) 2020-10-23

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Country Status (1)

Country Link
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Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN201838801U (en) * 2010-08-20 2011-05-18 宇达电脑（上海）有限公司 Crystal head
CN206406370U (en) * 2017-01-19 2017-08-15 东莞科扬实业有限公司 A kind of crystal head injection mold
CN109456573A (en) * 2017-11-03 2019-03-12 株洲电力机车广缘科技有限责任公司 A kind of poured with epoxy resin insulating materials and preparation method thereof
CN109693334A (en) * 2018-12-29 2019-04-30 厦门市众昕祺科技有限公司 A kind of injection molding process of salad service plate
CN111117118A (en) * 2020-02-10 2020-05-08 江苏宝翼通讯科技有限公司 Formula of raw material for manufacturing crystal head

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN201838801U (en) * 2010-08-20 2011-05-18 宇达电脑（上海）有限公司 Crystal head
CN206406370U (en) * 2017-01-19 2017-08-15 东莞科扬实业有限公司 A kind of crystal head injection mold
CN109456573A (en) * 2017-11-03 2019-03-12 株洲电力机车广缘科技有限责任公司 A kind of poured with epoxy resin insulating materials and preparation method thereof
CN109693334A (en) * 2018-12-29 2019-04-30 厦门市众昕祺科技有限公司 A kind of injection molding process of salad service plate
CN111117118A (en) * 2020-02-10 2020-05-08 江苏宝翼通讯科技有限公司 Formula of raw material for manufacturing crystal head

Non-Patent Citations (2)

* Cited by examiner, † Cited by third party
Title
李银峰、王朝勇: "《碳纳米材料制备及其应用研究》", 31 March 2019, 中国原子能出版社 *
王国建: "《多组分聚合物—原理、结构与性能》", 31 October 2013, 同济大学出版社 *

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Application publication date: 20201023

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