CN111805780A - Method and system for precisely machining curved surface of single crystal diamond - Google Patents
Method and system for precisely machining curved surface of single crystal diamond Download PDFInfo
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- CN111805780A CN111805780A CN202010571080.1A CN202010571080A CN111805780A CN 111805780 A CN111805780 A CN 111805780A CN 202010571080 A CN202010571080 A CN 202010571080A CN 111805780 A CN111805780 A CN 111805780A
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/04—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B1/00—Processes of grinding or polishing; Use of auxiliary equipment in connection with such processes
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
- G06T17/00—Three dimensional [3D] modelling, e.g. data description of 3D objects
- G06T17/20—Finite element generation, e.g. wire-frame surface description, tesselation
Abstract
The invention provides a method and a system for precisely processing a curved surface of a single crystal diamond, which comprises a pulse optical fiber laser, a beam expander, a focusing lens, a three-dimensional precise motion platform, a spherical elastic grinding body, a cooling liquid and catalyst mixed circulating device and a computer, wherein the pulse optical fiber laser is arranged on the front end of the spherical elastic grinding body; the cooling liquid and catalyst mixing and circulating device comprises a stirring mechanism and a liquid flow circulating device mechanism, wherein the stirring mechanism is used for uniformly mixing the cooling liquid and the catalyst, and the liquid flow circulating mechanism is used for recovering the used catalyst and the cooling liquid and sending the used catalyst and the cooling liquid back to the stirring mechanism; the invention realizes the differential graphitization of different positions of the single crystal diamond by utilizing the dynamic ablation of laser and the fixed point action of the catalyst, and continuously removes graphite by matching with a grinding mode, thereby greatly improving the processing efficiency of the single crystal diamond, solving the industrial problem that the single crystal diamond has extremely high hardness and is difficult to process into a curved surface, and providing a new method and a new device for processing the curved surface of the single crystal diamond.
Description
Technical Field
The invention relates to the field of diamond processing, in particular to a method and a system for precisely processing a curved surface of a single crystal diamond.
Background
Diamond is a mineral composed of elemental carbon and is currently the hardest substance found on earth. The single crystal diamond has the highest hardness, rigidity, refractive index and thermal conductivity coefficient in the nature, and excellent characteristics such as extremely high abrasion resistance and chemical stability, is widely applied in the fields of mechanical processing, optical materials, electronic and electric appliances, gem processing and the like, and has very wide application prospects in high and new technical fields such as light, heat, electricity, sound and the like.
The single crystal diamond has particularly excellent optical performance, such as high refractive index, high Young modulus, low thermal expansion coefficient, high breakdown electric field and the like, so that the research on the processing of diamond optical devices is widely regarded in the world; however, diamond has extremely strong anisotropy, the performance difference of the same crystal plane and different crystal directions of diamond is great, and the hardness, the rigidity and the wear resistance are extremely high, which brings great difficulty to the processing of diamond optical devices, especially the processing of curved surfaces.
At present, a mechanical grinding method is a method for processing diamond with the most extensive application and the most mature technical conditions, the main working form is generally that fine diamond abrasive particles are coated on a cast iron grinding disc rotating at a high speed, the processed diamond crystal is contacted with the grinding disc under certain pressure, and the processing of the diamond crystal is realized through the opposite grinding of the diamond abrasive particles and the surface of the diamond crystal, but the method has extremely low efficiency, poor surface grinding quality and can not realize the processing of a curved surface; the patent of application No. 201810534195.6 discloses a 3D free-form surface diamond processing machine, which can process different curved surfaces, but still belongs to the category of mechanical counter-grinding, and cannot overcome the difficulties of extremely high hardness and wear resistance of diamond, and cannot realize high-efficiency and high-quality processing.
The application of the novel laser processing technology which is started in recent years in the field of diamond is mostly limited to cutting and grooving, and the novel laser processing technology cannot be applied to normal processing of the surface of the diamond; the patent of application number CN201910847236.1 discloses a grinding method of typical crystal faces of monocrystalline diamond assisted in situ by laser, and the grinding method is assisted by a laser method and a mechanical grinding method, so that the difficulty of difficult grinding of diamond is overcome, and high-efficiency grinding is realized, but the grinding method cannot be applied to curved surface processing.
At present, no method or device in the industry can realize the efficient precision machining of the curved surface of the single crystal diamond.
Disclosure of Invention
The invention aims to provide a method and a system for precisely processing a curved surface of a single crystal diamond, which can graphitize a set part of the diamond to be processed by utilizing a mode of dynamic ablation of laser and matching with fixed-point action of a catalyst, realize high-precision and high-efficiency processing of the curved surface of the single crystal diamond, and solve the problems that the processing efficiency of the existing single crystal diamond is extremely low and the curved surface cannot be processed.
In order to achieve the purpose, the invention adopts the following technical scheme:
a method for precisely processing a curved surface of a single crystal diamond comprises the following steps:
step 1: setting processing parameters;
constructing a 3D curved surface data model according to the geometric dimension characteristics of the curved surface to be processed of the diamond to be processed, importing the model into a computer, and setting processing parameters in the computer; the processing parameters comprise processing beats, light-emitting parameters of a pulse optical fiber laser, the rotating modes and the rotating speeds of the spherical elastic grinding body and the diamond to be processed, and the flow and the stirring speed of a cooling liquid and catalyst mixture; the light emitting parameters of the pulse fiber laser comprise a power parameter, a Q frequency parameter and a pulse width parameter;
step 2: initializing a processing device;
placing the diamond to be processed on a processing station, adjusting the coordinate of a three-dimensional precision motion platform, driving a pulse optical fiber laser, a beam expander and a focusing lens to move, focusing the laser beam on the position where the diamond to be processed has the most removed materials, and taking the position as a processing reference point;
and step 3: generating a processing track;
taking the coordinate of the three-dimensional precision motion platform when the laser beam is focused on the processing reference point as an initial point coordinate, correspondingly substituting the initial point coordinate into the 3D curved surface data model in the step 1 in a computer, and calculating the motion track of the three-dimensional precision motion platform;
and 4, step 4: removing the surface material of the diamond to be processed;
the pulse fiber laser emits laser beams under the conditions of set power parameters, Q frequency parameters and pulse width parameters, and the laser beams penetrate through the diamond to be processed and are focused on the processing surface and generate high temperature on the processing surface through heat conduction; the cooling liquid and catalyst mixing and circulating device works according to the set flow and stirring speed, and the uniformly mixed cooling liquid and catalyst are continuously and stably poured at the contact part of the diamond to be processed and the spherical elastic grinding body; the spherical elastic grinding body and the diamond to be processed rotate according to the set rotating mode and speed, so that a uniform liquid film is formed on the processing surface by the mixture of the cooling liquid and the catalyst, and graphite generated by the diamond to be processed through carbonization at high temperature under the action of the catalyst is ground and removed; the three-dimensional precision motion platform moves at a constant speed according to the motion track calculated in the step 3;
and 5: removing the diamond material to be processed in a layered manner;
processing the surface of the diamond to be processed according to the control process of the step 4, controlling a three-dimensional precision motion platform by a computer to drive a pulse optical fiber laser to move towards the direction far away from the diamond to be processed after the processing time reaches the processing takt time set in the step 1, wherein the moving distance is equal to the material removal thickness of the processing reference point position of the diamond to be processed at the current time;
step 6: and repeating the step 4 and the step 5 until the pulsed optical fiber laser moves in a segmented mode in the direction far away from the diamond to be processed according to the set processing takt time for a specified distance, wherein the specified distance is equal to the total thickness of theoretical materials of the diamond to be processed at the processing reference point, and the processing of the curved surface of the diamond to be processed is completed.
A single crystal diamond curved surface precision machining system comprises a pulse optical fiber laser, a beam expander, a focusing lens, a three-dimensional precision motion platform, a spherical elastic grinding body, a cooling liquid and catalyst mixed circulation device and a computer;
the pulse fiber laser is used for emitting parallel laser beams with fixed wavelength under the control of a computer and carrying out ablation processing on the diamond to be processed;
the beam expander is used for expanding the diameter of the laser beam generated by the pulse fiber laser;
a focusing lens for focusing the parallel laser beam;
the three-dimensional precision motion platform is used for fixing the pulse optical fiber laser, the beam expanding lens and the focusing lens and driving the pulse optical fiber laser, the beam expanding lens and the focusing lens to move in the three-dimensional direction of X, Y, Z, wherein the pulse optical fiber laser, the beam expanding lens and the focusing lens are sequentially arranged on the three-dimensional precision motion platform, and a laser beam penetrating through the focusing lens vertically irradiates to the back of a processing curved surface of the diamond to be processed;
the spherical elastic grinding body is in contact with the processing curved surface of the diamond to be processed and is used for grinding and polishing the processing curved surface of the diamond to be processed to remove graphitized components;
the cooling liquid and catalyst mixing and circulating device is used for stirring and mixing the cooling liquid and the catalyst uniformly and pouring the uniformly mixed cooling liquid and catalyst into a contact part of the diamond to be processed and the spherical elastic grinding body;
and the computer is used for controlling the action of the pulse fiber laser, the three-dimensional precision motion platform, the spherical elastic grinding body and the cooling liquid and catalyst mixed circulating device.
The cooling liquid and catalyst mixing and circulating device comprises a stirring mechanism and a liquid flow circulating device mechanism, wherein the stirring mechanism is used for uniformly mixing the cooling liquid and the catalyst, and the liquid flow circulating mechanism is used for recycling the used catalyst and the cooling liquid and sending the used catalyst and the cooling liquid back to the stirring mechanism.
The invention has the beneficial effects that:
the invention solves the industrial problem that the single crystal diamond has extremely high hardness and is difficult to process into a curved surface, and provides a new method and a new device for processing the curved surface of the single crystal diamond;
the differential graphitization of different positions of the single crystal diamond is realized by utilizing the dynamic laser ablation and the catalyst fixed-point action, and the graphite is continuously removed in a grinding mode, so that the processing efficiency of the single crystal diamond is greatly improved;
aiming at different processing curved surfaces, the invention only needs to adjust the processing movement track, does not need to frequently replace hardware accessories, and has good universality and low processing cost.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, and it is obvious that the drawings in the following description are some embodiments of the present invention, and other drawings can be obtained by those skilled in the art without creative efforts.
FIG. 1 is a flow chart of a method of the present invention;
FIG. 2 is a schematic structural view of the present invention;
fig. 3 is a schematic view of a circular arc curved surface according to the present invention.
Detailed Description
The technical solutions of the present invention will be described clearly and completely with reference to the accompanying drawings, and it should be understood that the described embodiments are some, but not all embodiments of the present invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
As shown in fig. 1 and 3: the invention relates to a method for precisely processing a curved surface of a single crystal diamond, which comprises the following steps:
step 1: setting processing parameters;
constructing a 3D curved surface datamation model according to the geometric dimension characteristics of the curved surface to be processed of the diamond 7 to be processed, importing the model into a computer, and setting processing parameters in the computer; the processing parameters comprise processing beats, light-emitting parameters of the pulse optical fiber laser 1, rotation modes and speeds of the spherical elastic grinding body 5 and the diamond 7 to be processed, and flow and stirring speeds of a cooling liquid and catalyst mixture; the light emitting parameters of the pulse fiber laser 1 comprise a power parameter, a Q frequency parameter and a pulse width parameter;
specifically, the light-emitting parameters of the pulse optical fiber laser 1 mainly include laser power, wavelength, pulse width and Q frequency, and the light-emitting parameters are set to control the energy density and power density of the laser beam, so that the laser beam forms high temperature on the processing surface of the diamond 7 to be processed, and the effect of the diamond 7 to be processed and the spherical elastic grinding body 5 are not damaged;
furthermore, the spherical elastic grinding body 5 and the diamond 7 to be processed rotate relatively, so that the cooling liquid and the catalyst can reach the processing surface more easily, the processing surfaces of the spherical elastic grinding body 5 and the diamond 7 to be processed are uniformly heated, a carbonization layer on the processing surface of the diamond 7 to be processed can be removed in time, and the processing efficiency is improved; the rotation mode and the speed are set, so that high-temperature damage is avoided, and a better grinding effect is obtained;
further, setting the flow rate and the stirring speed of the mixture of the cooling liquid and the catalyst, and preferably uniformly mixing the liquid flow and uniformly covering the processing surface of the 7 diamond sheets to be processed with the catalyst;
step 2: initializing a processing device;
placing the single crystal diamond to be processed on a processing station, enabling the single crystal diamond to be processed to be in contact with the spherical elastic grinding body 5, enabling the contact surface to have contact pressure, adjusting the X, Y, Z axis coordinate position of the three-dimensional precise motion platform 4, driving the pulse optical fiber laser 1, the beam expander 2 and the focusing lens 3 to move, enabling the laser beam to be focused at the position where the material of the diamond 7 to be processed is removed most, and enabling the position to be used as a processing reference point;
and step 3: generating a processing track;
taking the coordinate of the three-dimensional precision motion platform 4 as an initial point coordinate when the laser beam is focused on the processing reference point, correspondingly substituting the initial point coordinate into the 3D curved surface data model in the step 1 in a computer, and calculating the motion track of the three-dimensional precision motion platform 4;
and 4, step 4: removing the surface material of the diamond 7 to be processed;
the pulse fiber laser 1 emits laser beams under the conditions of set power parameters, Q frequency parameters and pulse width parameters, the laser beams penetrate through the diamond 7 to be processed and are focused on the processing surface, and high temperature is generated on the processing surface through heat conduction; the cooling liquid and catalyst mixing and circulating device 6 works according to the set flow and stirring speed, and the uniformly mixed cooling liquid and catalyst are continuously and stably poured at the contact part of the diamond 7 to be processed and the spherical elastic grinding body 5; the spherical elastic grinding body 5 and the diamond 7 to be processed rotate according to the set rotating mode and speed, so that a uniform liquid film is formed on the processing surface by the mixture of the cooling liquid and the catalyst, and graphite generated by the diamond 7 to be processed through carbonization at high temperature under the action of the catalyst is ground and removed; the three-dimensional precision motion platform 4 moves at a constant speed according to the motion track calculated in the step 3; the laser focusing position on the surface of the diamond 7 to be processed has high temperature, the carbonization is faster, the position with large laser defocusing amount has low temperature and the carbonization is slow, so that the difference of different positions on the surface of the diamond 7 to be processed is eliminated, and the automatic processing process of the curved surface of the diamond 7 to be processed is started;
and 5: removing the diamond 7 material to be processed in a layered manner;
processing the surface of the single crystal diamond according to the control process of the step 4, wherein after the processing time reaches the processing takt time set in the step 1, along with the removal of the surface material of the diamond 7 to be processed, the defocusing amount of laser is increased, the focusing energy is reduced, and the laser processing spark is weakened, the three-dimensional precision motion platform 4 is controlled by the computer to drive the pulse optical fiber laser 1 to move towards the direction far away from the diamond 7 to be processed, and the moving distance is equal to the material removal thickness of the processing reference point of the diamond 7 to be processed at the current time;
step 6: after the pulse optical fiber laser 1 moves in the direction far away from the diamond 7 to be processed, defocusing amount of laser is reduced, laser energy is focused again, spark of laser processing is enhanced, and the steps 4 and 5 are repeated until the pulse optical fiber laser 1 moves in a segmented mode in the direction far away from the diamond 7 to be processed according to set processing takt time and an appointed distance is reached, the total thickness of theoretical materials of the machining reference point of the diamond 7 to be processed is removed by the appointed distance, and machining of the curved surface of the diamond 7 to be processed is completed.
In order to facilitate better understanding of the technical solution of the present invention for those skilled in the art, the following will further describe the technical solution of the present invention by taking the processing of the arc curved surface as an example:
step 1: setting processing parameters;
constructing a 3D curved surface datamation model according to the geometric dimension characteristics of the curved surface to be processed of the diamond 7 to be processed, importing the model into a computer, and setting processing parameters in the computer; the processing parameters comprise processing beats, light-emitting parameters of the pulse optical fiber laser 1, rotation modes and speeds of the spherical elastic grinding body 5 and the diamond 7 to be processed, and flow and stirring speeds of a cooling liquid and catalyst mixture; the light emitting parameters of the pulse fiber laser 1 comprise a power parameter, a Q frequency parameter and a pulse width parameter;
specifically, the 3D curved surface datamation model is expressed in an array form in a computer as follows:
the R represents a 3D data model array of the curved surface to be processed, and the 3D geometric shape of the curved surface to be processed can be generated by utilizing the R array data; (x)mn,ymn,zmn) And representing the numerical points of the R array in a three-dimensional coordinate system.
Specifically, in order to make the laser defocusing amount small, the surface materials of 7 diamond sheets to be processed are removed in a layered manner, so as to ensure the high efficiency of laser processing, and the layered removal relates to the setting of processing beats;
step 2: initializing a processing device;
placing the single crystal diamond to be processed on a processing station, enabling the single crystal diamond to be processed to be in contact with the spherical elastic grinding body 5, enabling the contact surface to have contact pressure, adjusting the X, Y, Z axis coordinate position of the three-dimensional precise motion platform 4, driving the pulse optical fiber laser 1, the beam expander 2 and the focusing lens 3 to move, enabling the laser beam to be focused at the position where the material of the diamond 7 to be processed is removed most, and enabling the position to be used as a processing reference point; in this embodiment, the data in the array R corresponding to the processing reference point is (0,0, 0); the laser defocusing amount of the processing reference point is 0, and the laser defocusing amounts of other positions are not 0;
and step 3: generating a processing track;
taking the coordinate of the three-dimensional precision motion platform 4 as an initial point coordinate when the laser beam is focused on the processing reference point, correspondingly substituting the initial point coordinate into the 3D curved surface data model in the step 1 in a computer, and calculating the motion track of the three-dimensional precision motion platform 4;
specifically, first, the coordinates (x) of the three-dimensional precision motion platform 4 when the laser beam is focused on the processing reference point0,y0,z0) And then correspondingly substituting the starting point coordinates into the 3D curved surface data model to calculate a motion track array R' of the three-dimensional precision motion platform 4:
wherein R' represents a three-dimensional motion track point array of the three-dimensional precision motion platform, and the R array is initialized by using the initial point coordinate to obtain an initial motion track of the three-dimensional precision motion platform; (x)mn+x0,ymn+y0,zmn+z0) And representing the numerical points of the R' array in a three-dimensional coordinate system.
The three-dimensional precision motion platform 4 then performs row-by-row and column-by-column motion according to the coordinate data of the array R', as shown in FIG. 3, and completes grid scanning;
and 4, step 4: removing the surface material of the diamond 7 to be processed;
the pulse fiber laser 1 emits laser beams under the conditions of set power parameters, Q frequency parameters and pulse width parameters, the laser beams penetrate through the diamond 7 to be processed and are focused on the processing surface, and high temperature is generated on the processing surface through heat conduction; the cooling liquid and catalyst mixing and circulating device 6 works according to the set flow and stirring speed, and the uniformly mixed cooling liquid and catalyst are continuously and stably poured at the contact part of the diamond 7 to be processed and the spherical elastic grinding body 5; the spherical elastic grinding body 5 and the diamond 7 to be processed rotate according to the set rotating mode and speed, so that a uniform liquid film is formed on the processing surface by the mixture of the cooling liquid and the catalyst, and graphite generated by the diamond carbonization under the action of high temperature and the catalyst is ground and removed; the three-dimensional precision motion platform 4 moves at a constant speed according to the motion track array R' in a manner shown in FIG. 3, the laser focusing position on the surface of the diamond 7 to be processed is high in temperature and faster in carbonization, the laser defocusing amount is large, the position is low in temperature and slow in carbonization, so that the difference removal of different positions on the surface of the diamond is realized, and the automatic processing of the arc curved surface of the diamond 7 to be processed is realized;
and 5: removing the diamond 7 material to be processed in a layered manner;
processing the surface of the single crystal diamond according to the control process of the step 4, after the processing time reaches the processing takt time set in the step 1, along with the removal of the surface material of the diamond 7 to be processed, the defocusing amount of laser is increased, the focusing energy is reduced, the laser processing spark is weakened, at the moment, the computer controls the three-dimensional precise motion platform 4 to drive the pulse optical fiber laser 1 to move towards the direction (Z axis direction) far away from the diamond sheet, the moving distance is equal to the material removal thickness tau of the processing reference point position of the diamond 7 to be processed in the current time period, and the motion track array of the three-dimensional precise motion platform 4:
wherein R'1Representing the three-dimensional motion track point array after the position of the three-dimensional precision motion platform is adjusted, enabling the laser defocusing amount to return to zero again after the adjustment, and starting a new round of material removal; (x)mn+x0,ymn+y0,zmn+z0+ τ) denotes R'1And (4) numerical points of the array in a three-dimensional coordinate system.
Step 6:
after the pulse optical fiber laser 1 moves towards the direction (Z-axis direction) far away from the diamond 7 to be processed, the defocusing amount of the laser is reduced, the energy of the laser is refocused, the spark of the laser processing is enhanced, the step 4 and the step 5 are repeated until the pulse optical fiber laser 1 moves in a segmented mode to a specified distance towards the direction (Z-axis direction) far away from the diamond 7 to be processed according to the set processing beat, and the total thickness tau is removed by moving the specified distance to be equal to the theoretical material removing thickness of the processing reference point of the diamond 7 to be processedallRealizing the surface material of the diamond 7 to be processedRemoving the layers; at this time, the laser processing sparks on all the processing surfaces of the diamond 7 to be processed are continuous and consistent in light intensity, and the processing of the arc curved surface of the diamond 7 to be processed is completed.
As shown in fig. 2: the invention relates to a single crystal diamond curved surface precision machining system which is characterized in that: the device comprises a pulse fiber laser 1, a beam expander 2, a focusing lens 3, a three-dimensional precision motion platform 4, a spherical elastic grinding body 5, a cooling liquid and catalyst mixed circulation device 6 and a computer;
the pulse fiber laser 1 is used for emitting parallel laser beams with fixed wavelength under the control of a computer and carrying out ablation processing on the diamond 7 to be processed;
the beam expander 2 is used for expanding the diameter of the laser beam generated by the pulse fiber laser 1 and avoiding the energy accumulation of the laser beam from damaging the focusing lens 33;
the focusing lens 3 is used for focusing the parallel laser beams into a fine light spot with high energy density;
the three-dimensional precision motion platform 4 is used for fixing the pulse optical fiber laser 1, the beam expander 2 and the focusing lens 3 and driving the pulse optical fiber laser 1, the beam expander 2 and the focusing lens 3 to move in the three-dimensional direction of X, Y, Z, so that the position and the defocusing amount of a laser focusing spot are precisely controlled; the pulse optical fiber laser 1, the beam expander 2 and the focusing lens 3 are sequentially arranged on the three-dimensional precision motion platform 4, and the laser beam penetrating through the focusing lens 3 vertically shoots to the back of the processing curved surface of the diamond 7 to be processed;
the spherical elastic grinding body 5 is in contact with the processing curved surface of the diamond 7 to be processed and is used for grinding and polishing the processing curved surface of the diamond 7 to be processed to remove graphitized components; the spherical elastic grinding body 5 has good wear resistance and high temperature resistance, and regular ripples on the surface can effectively grind and polish a processed curved surface;
a cooling liquid and catalyst mixing and circulating device 6 for uniformly stirring and mixing the cooling liquid and the catalyst and pouring the uniformly mixed cooling liquid and catalyst into a contact part of the diamond 7 to be processed and the spherical elastic grinding body 5;
the computer is used for controlling the actions of the pulse fiber laser 1, the three-dimensional precision motion platform 4, the spherical elastic grinding body 5 and the cooling liquid and catalyst mixed circulation device 6; specifically, the pulse optical fiber laser 1, the three-dimensional precision motion platform 4, the rotating unit of the spherical elastic grinding body 5, the rotating unit of the diamond 7 to be processed, and the cooling liquid and catalyst mixing and circulating device 6 are all connected with a computer through cables; the computer controls the light emitting parameters of the pulse fiber laser 1, the action of the three-dimensional precision motion platform 4, the rotation parameters of the spherical elastic grinding body 5 and the diamond 7 to be processed, and the flow and stirring speed of the mixture of the cooling liquid and the catalyst, and the curved surface processing process of the diamond 7 to be processed is automatically realized under the control of the computer.
Preferably, the cooling liquid and catalyst mixing and circulating device 6 comprises a stirring mechanism 61 and a liquid flow circulating device mechanism 62, wherein the stirring mechanism 61 is used for uniformly mixing the cooling liquid and the catalyst, and the liquid flow circulating device mechanism is used for recovering the used catalyst and the cooling liquid and returning the used catalyst and the cooling liquid to the stirring mechanism 61.
The method and the system for precisely processing the curved surface of the single crystal diamond have the following beneficial effects:
the invention solves the industrial problem that the single crystal diamond has extremely high hardness and is difficult to process into a curved surface, and provides a new method and a new device for processing the curved surface of the single crystal diamond;
the differential graphitization of different positions of the single crystal diamond is realized by utilizing the dynamic laser ablation and the catalyst fixed-point action, and the graphite is continuously removed in a grinding mode, so that the processing efficiency of the single crystal diamond is greatly improved;
aiming at different processing curved surfaces, the invention only needs to adjust the processing movement track, does not need to frequently replace hardware accessories, and has good universality and low processing cost.
Finally, it should be noted that: the above embodiments are only used to illustrate the technical solution of the present invention, and not to limit the same; while the invention has been described in detail and with reference to the foregoing embodiments, it will be understood by those skilled in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some or all of the technical features may be equivalently replaced; and the modifications or the substitutions do not make the essence of the corresponding technical solutions depart from the scope of the technical solutions of the embodiments of the present invention.
Claims (3)
1. The method for precisely processing the curved surface of the single crystal diamond is characterized by comprising the following steps of:
step 1: setting processing parameters;
constructing a 3D curved surface data model according to the geometric dimension characteristics of the curved surface to be processed of the diamond to be processed, importing the model into a computer, and setting processing parameters in the computer; the processing parameters comprise processing beats, light-emitting parameters of a pulse optical fiber laser, the rotating modes and the rotating speeds of the spherical elastic grinding body and the diamond to be processed, and the flow and the stirring speed of a cooling liquid and catalyst mixture; the light emitting parameters of the pulse fiber laser comprise a power parameter, a Q frequency parameter and a pulse width parameter;
step 2: initializing a processing device;
placing the diamond to be processed on a processing station, adjusting the coordinate of a three-dimensional precision motion platform, driving a pulse optical fiber laser, a beam expander and a focusing lens to move, focusing the laser beam on the position where the diamond to be processed has the most removed materials, and taking the position as a processing reference point;
and step 3: generating a processing track;
taking the coordinate of the three-dimensional precision motion platform when the laser beam is focused on the processing reference point as an initial point coordinate, correspondingly substituting the initial point coordinate into the 3D curved surface data model in the step 1 in a computer, and calculating the motion track of the three-dimensional precision motion platform;
and 4, step 4: removing the surface material of the diamond to be processed;
the pulse fiber laser emits laser beams under the conditions of set power parameters, Q frequency parameters and pulse width parameters, and the laser beams penetrate through the diamond to be processed and are focused on the processing surface and generate high temperature on the processing surface through heat conduction; the cooling liquid and catalyst mixing and circulating device works according to the set flow and stirring speed, and the uniformly mixed cooling liquid and catalyst are continuously and stably poured at the contact part of the diamond to be processed and the spherical elastic grinding body; the spherical elastic grinding body and the diamond to be processed rotate according to the set rotating mode and speed, so that a uniform liquid film is formed on the processing surface by the mixture of the cooling liquid and the catalyst, and graphite generated by the diamond to be processed through carbonization at high temperature under the action of the catalyst is ground and removed; the three-dimensional precision motion platform moves at a constant speed according to the motion track calculated in the step 3;
and 5: removing the diamond material to be processed in a layered manner;
processing the surface of the diamond to be processed according to the control process of the step 4, controlling a three-dimensional precision motion platform by a computer to drive a pulse optical fiber laser to move towards the direction far away from the diamond to be processed after the processing time reaches the processing takt time set in the step 1, wherein the moving distance is equal to the material removal thickness of the processing reference point position of the diamond to be processed at the current time;
step 6: and repeating the step 4 and the step 5 until the pulsed optical fiber laser moves in a segmented mode in the direction far away from the diamond to be processed according to the set processing takt time for a specified distance, wherein the specified distance is equal to the total thickness of theoretical materials of the diamond to be processed at the processing reference point, and the processing of the curved surface of the diamond to be processed is completed.
2. The utility model provides a single crystal diamond curved surface precision finishing system which characterized in that: the device comprises a pulse fiber laser, a beam expander, a focusing lens, a three-dimensional precision motion platform, a spherical elastic grinding body, a cooling liquid and catalyst mixed circulating device and a computer;
the pulse fiber laser is used for emitting parallel laser beams with fixed wavelength under the control of a computer and carrying out ablation processing on the diamond to be processed;
the beam expander is used for expanding the diameter of the laser beam generated by the pulse fiber laser;
a focusing lens for focusing the parallel laser beam;
the three-dimensional precision motion platform is used for fixing the pulse optical fiber laser, the beam expanding lens and the focusing lens and driving the pulse optical fiber laser, the beam expanding lens and the focusing lens to move in the three-dimensional direction of X, Y, Z, wherein the pulse optical fiber laser, the beam expanding lens and the focusing lens are sequentially arranged on the three-dimensional precision motion platform, and a laser beam penetrating through the focusing lens vertically irradiates to the back of a processing curved surface of the diamond to be processed;
the spherical elastic grinding body is in contact with the processing curved surface of the diamond to be processed and is used for grinding and polishing the processing curved surface of the diamond to be processed to remove graphitized components;
the cooling liquid and catalyst mixing and circulating device is used for stirring and mixing the cooling liquid and the catalyst uniformly and pouring the uniformly mixed cooling liquid and catalyst into a contact part of the diamond to be processed and the spherical elastic grinding body;
and the computer is used for controlling the action of the pulse fiber laser, the three-dimensional precision motion platform, the spherical elastic grinding body and the cooling liquid and catalyst mixed circulating device.
3. A single crystal diamond curve precision machining system according to claim 2, wherein: the cooling liquid and catalyst mixing and circulating device comprises a stirring mechanism and a liquid flow circulating device mechanism, wherein the stirring mechanism is used for uniformly mixing the cooling liquid and the catalyst, and the liquid flow circulating mechanism is used for recycling the used catalyst and the cooling liquid and sending the used catalyst and the cooling liquid back to the stirring mechanism.
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113172342A (en) * | 2021-05-14 | 2021-07-27 | 郑州磨料磨具磨削研究所有限公司 | Laser processing device and method for diamond surface planarization processing |
| CN114453730A (en) * | 2022-03-09 | 2022-05-10 | 西安中科微精光子科技股份有限公司 | Laser processing method of hemispherical revolving body |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101302403A (en) * | 2008-07-03 | 2008-11-12 | 大连理工大学 | Polishing solution for ultra-precise low-damage polish of large size diamond wafer and preparation thereof |
| JP2010188487A (en) * | 2009-02-19 | 2010-09-02 | Kumamoto Univ | Catalyst support type chemical machining method, and machining apparatus using the same |
| CN102516874A (en) * | 2011-11-09 | 2012-06-27 | 大连理工大学 | Polishing liquid for ultra-precision sharpening of diamond cutting tool and preparation method thereof |
| CN102950387A (en) * | 2012-11-18 | 2013-03-06 | 田欣利 | Laser heating auxiliary arc striking micro-explosion processing method and device for engineering ceramic material |
| CN107953148A (en) * | 2017-11-29 | 2018-04-24 | 浙江工业大学 | It is a kind of based on the sapphire wafer polishing method for including neodymium compound mild abrasives fixation grinding tool |
| CN109590811A (en) * | 2018-11-26 | 2019-04-09 | 南京航空航天大学 | A kind of method of laser assisted polishing cvd diamond |
| CN110385521A (en) * | 2019-08-29 | 2019-10-29 | 西安交通大学 | A kind of femtosecond laser processing device and method for the quick deep etching of silicon carbide |
| CN110977145A (en) * | 2019-12-17 | 2020-04-10 | 常州工学院 | Diamond cutter machining method, system and equipment |
-
2020
- 2020-06-19 CN CN202010571080.1A patent/CN111805780B/en active Active
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101302403A (en) * | 2008-07-03 | 2008-11-12 | 大连理工大学 | Polishing solution for ultra-precise low-damage polish of large size diamond wafer and preparation thereof |
| JP2010188487A (en) * | 2009-02-19 | 2010-09-02 | Kumamoto Univ | Catalyst support type chemical machining method, and machining apparatus using the same |
| CN102516874A (en) * | 2011-11-09 | 2012-06-27 | 大连理工大学 | Polishing liquid for ultra-precision sharpening of diamond cutting tool and preparation method thereof |
| CN102950387A (en) * | 2012-11-18 | 2013-03-06 | 田欣利 | Laser heating auxiliary arc striking micro-explosion processing method and device for engineering ceramic material |
| CN107953148A (en) * | 2017-11-29 | 2018-04-24 | 浙江工业大学 | It is a kind of based on the sapphire wafer polishing method for including neodymium compound mild abrasives fixation grinding tool |
| CN109590811A (en) * | 2018-11-26 | 2019-04-09 | 南京航空航天大学 | A kind of method of laser assisted polishing cvd diamond |
| CN110385521A (en) * | 2019-08-29 | 2019-10-29 | 西安交通大学 | A kind of femtosecond laser processing device and method for the quick deep etching of silicon carbide |
| CN110977145A (en) * | 2019-12-17 | 2020-04-10 | 常州工学院 | Diamond cutter machining method, system and equipment |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113172342A (en) * | 2021-05-14 | 2021-07-27 | 郑州磨料磨具磨削研究所有限公司 | Laser processing device and method for diamond surface planarization processing |
| CN113172342B (en) * | 2021-05-14 | 2023-08-18 | 郑州磨料磨具磨削研究所有限公司 | Laser processing device and method for diamond surface planarization processing |
| CN114453730A (en) * | 2022-03-09 | 2022-05-10 | 西安中科微精光子科技股份有限公司 | Laser processing method of hemispherical revolving body |
| CN114453730B (en) * | 2022-03-09 | 2024-04-05 | 西安中科微精光子科技股份有限公司 | Laser processing method of hemispherical revolving body |
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