CN111800955A - Method for double-sided solder resist printing of 5G power amplifier board sheet - Google Patents
Method for double-sided solder resist printing of 5G power amplifier board sheet Download PDFInfo
- Publication number
- CN111800955A CN111800955A CN202010692107.2A CN202010692107A CN111800955A CN 111800955 A CN111800955 A CN 111800955A CN 202010692107 A CN202010692107 A CN 202010692107A CN 111800955 A CN111800955 A CN 111800955A
- Authority
- CN
- China
- Prior art keywords
- plate
- power amplifier
- area
- printing
- double
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 229910000679 solder Inorganic materials 0.000 title claims abstract description 38
- 238000000034 method Methods 0.000 title claims abstract description 26
- 238000010019 resist printing Methods 0.000 title claims description 12
- 238000007639 printing Methods 0.000 claims abstract description 44
- 210000004904 fingernail bed Anatomy 0.000 claims abstract description 11
- 239000000463 material Substances 0.000 claims abstract description 11
- 238000003466 welding Methods 0.000 claims abstract description 8
- 210000000282 nail Anatomy 0.000 claims description 11
- 238000003801 milling Methods 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 3
- 241001391944 Commicarpus scandens Species 0.000 description 2
- 230000003321 amplification Effects 0.000 description 2
- 238000003199 nucleic acid amplification method Methods 0.000 description 2
- 239000004215 Carbon black (E152) Substances 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 229930195733 hydrocarbon Natural products 0.000 description 1
- 150000002430 hydrocarbons Chemical class 0.000 description 1
- 238000003672 processing method Methods 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Printing Plates And Materials Therefor (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
The invention discloses a method for double-sided solder mask printing of a 5G power amplifier board thin plate, and relates to the technical field of circuit board solder mask processing. The method comprises the following steps: s1, performing anti-welding pretreatment on the sheet material, wherein the sheet material is a spliced plate of the power amplifier thin plate; s2, solder mask printing is carried out on one surface of the plate; s3, putting a base plate on the nail bed, placing the plate on the base plate, enabling the printed surface to face the base plate, and performing anti-welding printing on the other surface of the plate; s4, baking the board with two sides printed with solder resist; s5, exposure; the base plate is provided with a boss area, the jointed plate is provided with a non-effective unit area, and the boss area corresponds to the non-effective unit area. According to the invention, the base plate is erected on the nail bed, so that the steps of baking the board can be carried out after the board is subjected to double-sided printing during solder mask printing, only one step of baking the board is needed, and the problem of low solder mask printing efficiency of the power amplifier sheet is solved.
Description
Technical Field
The invention relates to the technical field of circuit board solder mask processing, in particular to a method for double-sided solder mask printing of a 5G power amplifier board thin plate.
Background
In the solder resist printing process of circuit boards, there are generally two processing methods:
the first method comprises the following steps: the thin plate with the thickness less than 1.0mm cannot support a nail bed because of 3-4kg of printing pressure, insufficient strength and easy deformation and bending during printing, and a manufacturing process of printing twice and baking twice is adopted. Printing the first surface on the platform, pre-baking, printing the second surface, and pre-baking. The method needs to print twice independently and bake twice in advance, and has low efficiency.
And the second method comprises the following steps: the plate with the thickness of more than 1.0mm has certain supporting strength, is not easy to deform under the printing pressure of 3-4kg, can be made of a nail bed made of stainless steel Pin nails, and can be printed on the plane of a machine table normally through a nail erecting process, then the printed solder-resisting first surface is placed on the nail bed, and the printed solder-resisting second surface is printed normally, so that the double-sided printing of solder-resisting ink is realized, and the pre-baking is completed after the double-sided printing is completed.
The power amplifier board is a thin board type, and the thickness of the finished board is generally less than 0.7 mm. When the solder mask is printed, the board is thin, the board is deformed during printing, printing cannot be performed, and if the Pin nails are encrypted, the board is easy to break and scrap, so that the conventional nail bed erecting process cannot be adopted to perform double-sided printing on the board. However, the production efficiency is extremely low by adopting the two-time printing and two-time pre-baking processing.
Disclosure of Invention
The invention aims to solve the technical problem of low solder mask printing efficiency of a 5G power amplifier sheet.
In order to solve the above problems, the present invention proposes the following technical solutions:
a method for double-sided solder resist printing of a 5G power amplifier board sheet comprises the following steps:
s1, performing anti-welding pretreatment on the sheet material, wherein the sheet material is a spliced plate of the power amplifier thin plate;
s2, solder mask printing is carried out on one surface of the plate;
s3, putting a base plate on the nail bed, placing the plate on the base plate, enabling the printed surface to face the base plate, and performing anti-welding printing on the other surface of the plate;
s4, baking the board with two sides printed with solder resist;
s5, exposure;
the base plate is provided with a boss area, the jointed plate is provided with a non-effective unit area, and the boss area corresponds to the non-effective unit area.
The technical scheme is that a boss is arranged in the boss area, and the unilateral size of the boss is 0.2-1mm smaller than that of the non-effective unit area.
The technical scheme is that the height of the boss is not less than 1.5 mm.
The further technical scheme is that the number of the bosses is the same as that of the non-effective unit areas.
The further technical scheme is that the backing plate is provided with at least 2 positioning Pin nails.
The invention also provides a base plate which is applied to the method for the double-sided solder resist printing of the 5G power amplifier plate thin plate, wherein the base plate is provided with a boss area, the jointed plate is provided with an ineffective unit area, and the boss area corresponds to the ineffective unit area.
The technical scheme is that a boss is arranged in the boss area, and the unilateral size of the boss is 0.2-1mm smaller than that of the non-effective unit area.
The technical scheme is that the height of the boss is not less than 1.5 mm.
The further technical scheme is that the number of the bosses is the same as that of the non-effective unit areas.
The further technical scheme is that the backing plate is provided with at least 2 positioning Pin nails.
The further technical scheme is that the boss is processed on the base plate in a depth control milling mode.
The further technical scheme is that the total thickness of the backing plate is 3-5 mm.
Compared with the prior art, the invention can achieve the following technical effects:
according to the method for the double-sided solder resist printing of the 5G power amplifier sheet, the base plate is erected on the nail bed, so that the step of baking the sheet can be carried out after the double-sided printing of the sheet is finished during the solder resist printing, only one step of baking the sheet is needed, the problem of low solder resist printing efficiency of the power amplifier sheet is solved, the solder resist printing process of the power amplifier sheet (less than 0.7 mm) is simplified, the printing efficiency is improved, and the production cost is reduced.
According to the base plate provided by the invention, the non-effective unit area with a large area of the power amplifier sheet is utilized, and the boss area is arranged to correspond to the non-effective unit area, so that the area of the boss area is enough to support the plate, the plate is ensured not to deform under stress during printing, and the problem of low solder mask printing efficiency of the power amplifier sheet (less than 0.7 mm) is solved.
Drawings
FIG. 1 is a flow chart of a method for double-sided solder mask printing of a 5G power amplifier board sheet provided by the invention;
FIG. 2 is a flow chart of solder mask printing of a conventional power amplifier sheet;
FIG. 3 is a schematic diagram of a finished power amplifier board;
fig. 4 is a schematic view of a backing plate according to the present invention.
Reference numerals
The method comprises the steps of routing an empty area 1, a power amplifier groove area 2, a boss 3, a backing plate 4 and a positioning Pin nail 5.
Detailed Description
The technical solutions in the embodiments will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, wherein like reference numerals represent like elements in the drawings. It is apparent that the embodiments to be described below are only a part of the embodiments of the present invention, and not all of them. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
It will be understood that the terms "comprises" and/or "comprising," when used in this specification and the appended claims, specify the presence of stated features, integers, steps, operations, elements, and/or components, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and/or groups thereof.
It is also to be understood that the terminology used in the description of the embodiments of the invention herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the embodiments of the invention. As used in the description of embodiments of the present invention and the appended claims, the singular forms "a," "an," and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise.
The term "shim plate" is also referred to as a "boss plate".
Referring to fig. 1-2, an embodiment of the present invention provides a method for double-sided solder mask printing of a 5G power amplifier board sheet, including the following steps:
s1, performing anti-welding pretreatment on the sheet material, wherein the sheet material is a spliced plate of the power amplifier thin plate;
s2, solder mask printing is carried out on one surface of the plate;
s3, putting a base plate on the nail bed, placing the plate on the base plate, enabling the printed surface to face the base plate, and performing anti-welding printing on the other surface of the plate;
s4, baking the board with two sides printed with solder resist;
s5, exposure;
the base plate is provided with a boss area, the jointed plate is provided with a non-effective unit area, and the boss area corresponds to the non-effective unit area.
In a specific embodiment, the boss area is provided with a boss, and the unilateral size of the boss is 0.2-1mm smaller than that of the non-effective unit area, so that the boss is ensured not to exceed the non-effective unit area.
For example, the unilateral dimension of the mesa is 0.5mm less than the unilateral dimension of the inactive cell region.
In an embodiment, the height of the boss is ≧ 1.5 mm.
It will be appreciated that the boss is provided on the shim plate, integral with the shim plate. The boss can be processed by the backing plate through depth control milling, so that the maximum height of the boss is determined by the thickness of the backing plate.
In a specific embodiment, the number of bosses is the same as the number of inactive cell areas.
It should be noted that the inactive cell area includes a power amplification slot area 2 and a waste material gong-blank area 1 (as shown in fig. 3), and therefore, the number of the bosses 3 is the same as the sum of the number of the power amplification slot areas 2 and the number of the gong-blank areas 1, so that the bosses 3 have a sufficient supporting area.
In the scheme provided by the invention, the solder mask printing efficiency of the power amplifier sheet is improved, and the precondition is that a processing mode of printing the power amplifier sheet twice and baking the power amplifier sheet once is adopted, but the power amplifier sheet is too thin and cannot be processed by adopting a conventional mode of erecting a nail bed by a backing plate, so that the applicant of the invention discovers that the power amplifier sheet has the following characteristics through research on the power amplifier sheet:
1. the size of the single board is small, the length and width of the finished product are generally within 100mm, and the finished product has a large power amplifier slot area and a large routing area;
2. the base material of the power amplifier board is a material filled with hydrocarbon and ceramic, the rigidity and the strength of the material are high, and the board is brittle and easy to break.
Based on the characteristics, the backing plate used for double-sided printing has to have high-strength support, and the support area is large enough, so that the plate is uniformly stressed and is not deformed during printing.
Therefore, when the supporting area of the cushion plate is equal to the areas of the power amplifier groove area and the gong-free area, the cushion plate has the largest supporting area, and the board can be stressed uniformly during printing.
It can be understood that the power amplifier slot area and the gong-blank area of the power amplifier thin plates with different performances or types are not completely the same, so that the shape and the support area of the boss can be reset along with the difference of the power amplifier thin plates, and the boss is ensured not to exceed the non-effective unit area as long as the boss area corresponds to the non-effective unit area and the unilateral size of the boss is 0.2-1mm smaller than the unilateral size of the non-effective unit area. The method for the double-sided solder resist printing of the 5G power amplifier sheet can be realized.
In a specific embodiment, the backing plate is provided with at least 2 positioning Pin nails.
For example, the pad is provided with 4 positioning Pin nails, respectively at 4 vertices of the pad.
Referring to fig. 4, the invention further provides a backing plate, which is applied to the method for double-sided solder resist printing of the 5G power amplifier sheet, wherein the backing plate 4 is provided with a boss area, the jointed board is provided with an inactive unit area, and the boss area corresponds to the inactive unit area.
In one embodiment, the boss area is provided with a boss 3, and the unilateral size of the boss 3 is 0.2-1mm smaller than that of the non-effective unit area, so that the boss is ensured not to exceed the non-effective unit area.
In an embodiment, the height of the boss 3 is ≧ 1.5 mm.
It will be appreciated that the boss 3 is provided on the backing plate 4, integral with the backing plate 4. The boss 3 can be processed by the backing plate 4 through depth control milling, so that the maximum height of the boss 3 can be determined by the thickness of the backing plate.
In an embodiment, the non-effective unit area includes a power amplifier slot area 2 and a gong-blank area 1, and the number of the bosses 3 is the same as the sum of the number of the power amplifier slot area 2 and the number of the gong-blank area 1, so that the bosses 3 have sufficient supporting area, and the board is ensured to be stressed uniformly and not deformed during printing.
In one embodiment, the backing plate 4 is provided with at least 2 positioning Pin nails 5.
For example, the pad is provided with 4 positioning Pin nails 5, respectively at 4 vertices of the pad 4.
In one embodiment, the boss 3 is machined on the backing plate 4 by depth control milling.
In one embodiment, the total thickness of the backing plate 4 is 3-5 mm.
It can be understood that, in power amplifier thin plates with different performances or types, the power amplifier groove area and the gong-blank area are not completely the same, so that the shape and the support area of the boss can be reset along with the difference of the power amplifier thin plates, as long as the requirement that the boss area corresponds to the non-effective unit area and the unilateral size of the boss is 0.2-1mm smaller than the unilateral size of the non-effective unit area is met, the boss is ensured not to exceed the non-effective unit area, and the backing plate shown in fig. 4 is only one embodiment, but not the limitation of the specific structure of the backing plate in the scheme.
In the above embodiments, the descriptions of the respective embodiments have respective emphasis, and for parts that are not described in detail in a certain embodiment, reference may be made to related descriptions of other embodiments.
While the invention has been described with reference to specific embodiments thereof, it will be understood by those skilled in the art that various changes in form and details may be made therein without departing from the spirit and scope of the invention as defined by the appended claims. Therefore, the protection scope of the present invention shall be subject to the protection scope of the claims.
Claims (10)
1. A method for double-sided solder resist printing of a 5G power amplifier board thin plate is characterized by comprising the following steps:
s1, performing anti-welding pretreatment on the sheet material, wherein the sheet material is a spliced plate of the power amplifier thin plate;
s2, solder mask printing is carried out on one surface of the plate;
s3, putting a base plate on the nail bed, placing the plate on the base plate, enabling the printed surface to face the base plate, and performing anti-welding printing on the other surface of the plate;
s4, baking the board with two sides printed with solder resist;
s5, exposure;
the base plate is provided with a boss area, the jointed plate is provided with a non-effective unit area, and the boss area corresponds to the non-effective unit area.
2. The method for double-sided solder mask printing of the 5G power amplifier board sheet as claimed in claim 1, wherein the projection area is provided with a projection, and the size of one side of the projection is 0.2-1mm smaller than that of one side of the non-effective unit area.
3. The method for double-sided solder mask printing of the 5G power amplifier board sheet according to claim 2, wherein the height of the boss is ≧ 1.5 mm.
4. The method for double-sided solder mask printing of the 5G power amplifier board sheet as claimed in claim 3, wherein the number of the bosses is the same as the number of the non-effective unit areas.
5. The method for double-sided solder mask printing of the 5G power amplifier board sheet as claimed in claim 4, wherein the backing board is provided with at least 2 positioning Pin nails.
6. A backing plate for use in the method of double-sided solder mask printing of a 5G power amplifier board sheet as claimed in any one of claims 1 to 5, wherein the backing plate is provided with a raised area and the panels are provided with inactive cell areas, the raised area corresponding to the inactive cell areas.
7. The underlay sheet of claim 6, wherein the raised areas are provided with raised bosses having a unilateral dimension that is 0.2-1mm smaller than a unilateral dimension of the non-active cell area.
8. The pad of claim 7, wherein the height of the boss is ≧ 1.5 mm.
9. The pallet of claim 8, wherein the number of bosses is the same as the number of inactive cell areas.
10. The pallet of claim 9, wherein the pallet is provided with at least 2 locating Pin pegs.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010692107.2A CN111800955B (en) | 2020-07-17 | 2020-07-17 | Method for double-sided solder resist printing of 5G power amplification plate sheet |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010692107.2A CN111800955B (en) | 2020-07-17 | 2020-07-17 | Method for double-sided solder resist printing of 5G power amplification plate sheet |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN111800955A true CN111800955A (en) | 2020-10-20 |
| CN111800955B CN111800955B (en) | 2024-06-11 |
Family
ID=72807595
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202010692107.2A Active CN111800955B (en) | 2020-07-17 | 2020-07-17 | Method for double-sided solder resist printing of 5G power amplification plate sheet |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN111800955B (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2022127436A1 (en) * | 2020-12-17 | 2022-06-23 | 广东科翔电子科技股份有限公司 | Accompanying backing plate for solder-resisting development of ultra-thick pcb |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201645968U (en) * | 2010-04-30 | 2010-11-24 | 惠州中京电子科技股份有限公司 | PCB screen print backing plate |
| CN201776976U (en) * | 2010-05-25 | 2011-03-30 | 深圳市深联电路有限公司 | Base plate device for ultrathin PCB double-surface screen printing |
| CN103373050A (en) * | 2013-07-04 | 2013-10-30 | 深圳市五株科技股份有限公司 | Soldermask double-surfaced printing method and device for circuit board |
| CN103582308A (en) * | 2013-10-21 | 2014-02-12 | 安徽华印机电股份有限公司 | Spacer used for silk screen of printed circuit board |
| CN109587972A (en) * | 2019-01-22 | 2019-04-05 | 西安微电子技术研究所 | A kind of printed board welding resistance craft printed on both sides tooling |
| CN110602894A (en) * | 2019-08-26 | 2019-12-20 | 江门崇达电路技术有限公司 | Method for improving solder mask printing efficiency of circuit board |
-
2020
- 2020-07-17 CN CN202010692107.2A patent/CN111800955B/en active Active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201645968U (en) * | 2010-04-30 | 2010-11-24 | 惠州中京电子科技股份有限公司 | PCB screen print backing plate |
| CN201776976U (en) * | 2010-05-25 | 2011-03-30 | 深圳市深联电路有限公司 | Base plate device for ultrathin PCB double-surface screen printing |
| CN103373050A (en) * | 2013-07-04 | 2013-10-30 | 深圳市五株科技股份有限公司 | Soldermask double-surfaced printing method and device for circuit board |
| CN103582308A (en) * | 2013-10-21 | 2014-02-12 | 安徽华印机电股份有限公司 | Spacer used for silk screen of printed circuit board |
| CN109587972A (en) * | 2019-01-22 | 2019-04-05 | 西安微电子技术研究所 | A kind of printed board welding resistance craft printed on both sides tooling |
| CN110602894A (en) * | 2019-08-26 | 2019-12-20 | 江门崇达电路技术有限公司 | Method for improving solder mask printing efficiency of circuit board |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2022127436A1 (en) * | 2020-12-17 | 2022-06-23 | 广东科翔电子科技股份有限公司 | Accompanying backing plate for solder-resisting development of ultra-thick pcb |
Also Published As
| Publication number | Publication date |
|---|---|
| CN111800955B (en) | 2024-06-11 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP2018107852A (en) | Method of manufacturing lamination layer iron core and apparatus of manufacturing lamination layer iron core | |
| CN111800955A (en) | Method for double-sided solder resist printing of 5G power amplifier board sheet | |
| JP2014069404A (en) | Combination metal mask plate and method for producing the same | |
| CN109287080A (en) | The compression method of asymmetric core plate and asymmetric core plate | |
| TWI488757B (en) | Manufacturing method for solid metal mark plate and solid metal mark plate thereof | |
| US8820200B1 (en) | Modular die system | |
| KR100808674B1 (en) | Method of attaching coverlay on flexible section of rigid-flexible printed circuit board | |
| JP3895825B2 (en) | Printed wiring board cradle and manufacturing method thereof | |
| CN207692162U (en) | A kind of new-type FPC loaders | |
| KR101250400B1 (en) | Lamination device of flim-sheet and Laminating Method using the same | |
| CN111356291A (en) | Board arranging tool and PCB arranging method | |
| CN210099850U (en) | Clamp for processing die | |
| CN109618504B (en) | Jointed board structure of single-sided board and manufacturing method | |
| CN102802355A (en) | Mounting jig | |
| CN218056573U (en) | Copper-based circuit board transferring tool | |
| JPH10216835A (en) | Steel plate camber simple straightening device | |
| CN113043707A (en) | Structure of film for sheet material | |
| JPH11320297A (en) | Press parts assembling device and manufacture of link parts using the press parts assembling device | |
| CN203172144U (en) | Circuit board printing auxiliary tool | |
| CN220216403U (en) | General chamfer mould of lockstitch structure silencer sheet material | |
| CN219778101U (en) | Platform assembly applied to LDI exposure machine | |
| CN215187608U (en) | Back-pressing metal substrate alignment clamp | |
| CN212259424U (en) | Combined typesetting structure of whole flexible circuit board and flexible circuit board | |
| CN220823348U (en) | PCB applied to SMT processing | |
| CN220050636U (en) | Welding positioning tool for side plates of circuit breaker |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |