CN111799090A - High-temperature and high-humidity resistant dry capacitor - Google Patents
High-temperature and high-humidity resistant dry capacitor Download PDFInfo
- Publication number
- CN111799090A CN111799090A CN201911126871.7A CN201911126871A CN111799090A CN 111799090 A CN111799090 A CN 111799090A CN 201911126871 A CN201911126871 A CN 201911126871A CN 111799090 A CN111799090 A CN 111799090A
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- Prior art keywords
- capacitor
- shell component
- electrode
- temperature
- high temperature
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- 239000003990 capacitor Substances 0.000 title claims abstract description 127
- 239000000463 material Substances 0.000 claims abstract description 17
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 10
- 229910052802 copper Inorganic materials 0.000 claims abstract description 10
- 239000010949 copper Substances 0.000 claims abstract description 10
- 238000004382 potting Methods 0.000 claims abstract description 9
- 238000007789 sealing Methods 0.000 claims description 9
- 238000003780 insertion Methods 0.000 claims description 8
- 230000037431 insertion Effects 0.000 claims description 8
- 230000017525 heat dissipation Effects 0.000 abstract description 8
- 238000005516 engineering process Methods 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 229920001707 polybutylene terephthalate Polymers 0.000 description 2
- 239000000047 product Substances 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 230000008602 contraction Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 239000012466 permeate Substances 0.000 description 1
- -1 polybutylene terephthalate Polymers 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G2/00—Details of capacitors not covered by a single one of groups H01G4/00-H01G11/00
- H01G2/08—Cooling arrangements; Heating arrangements; Ventilating arrangements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G2/00—Details of capacitors not covered by a single one of groups H01G4/00-H01G11/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G2/00—Details of capacitors not covered by a single one of groups H01G4/00-H01G11/00
- H01G2/10—Housing; Encapsulation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G2/00—Details of capacitors not covered by a single one of groups H01G4/00-H01G11/00
- H01G2/10—Housing; Encapsulation
- H01G2/103—Sealings, e.g. for lead-in wires; Covers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
- H01R4/28—Clamped connections, spring connections
- H01R4/30—Clamped connections, spring connections utilising a screw or nut clamping member
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- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
Abstract
The invention discloses a high-temperature and high-humidity resistant dry capacitor, which comprises a capacitor lower shell component, a high-temperature and high-humidity resistant encapsulating material, a capacitor upper shell component, an electrode column, a connecting copper strip and a capacitor core, wherein the top of the capacitor lower shell component is provided with the capacitor upper shell component which is fixedly connected with the capacitor lower shell component through screws, the capacitor lower shell component and the capacitor upper shell component form a complete capacitor shell, the capacitor core is arranged in the capacitor shell, the high-temperature and high-humidity resistant encapsulating material is filled between the capacitor core and the capacitor shell, the upper part of the capacitor upper shell component is provided with a mounting hole for mounting the electrode column, the two electrode columns are respectively arranged in the mounting hole, the high-temperature and high-humidity resistant dry capacitor has a simple, reasonable and effective structure, and can effectively improve the heat dissipation, while avoiding leakage of potting material.
Description
Technical Field
The invention relates to the technical field of capacitors, in particular to a high-temperature and high-humidity resistant dry capacitor.
Background
The capacitor product is used as a component in equipment in various industries, and along with the continuous improvement of science and technology, the equipment technology is continuously improved, and especially the requirement on the use environment of the capacitor is higher and higher when the capacitor product is used on a large scale in the prior power electronic devices. At present, common epoxy resin adopted by most capacitors is used as a potting material for filling or encapsulating the capacitors, the capacitors are influenced by weather, and under the condition of large temperature difference between the environment temperature in winter and summer, the capacitors can cause separation between a shell and the potting material due to expansion with heat and contraction with cold, so that the safe and stable operation of the capacitors is greatly influenced. Meanwhile, when the capacitor operates in a high-humidity environment, moisture can permeate into the capacitor, the insulating property of the capacitor is damaged, and the service life of the capacitor is greatly shortened.
In the prior patent (publication number CN 202736755U), a high temperature and high humidity resistant dry capacitor includes an electrode, a capacitor core sealed inside the capacitor, and an internal connection copper tape connecting the electrode and the capacitor core, and further includes a metal housing, and a PBT (polybutylene terephthalate) cover plate assembly with a lower end partially clamped into the housing; the capacitor core is connected with the copper strip and then installed inside the capacitor shell, and after the cover plate assembly is installed, high-temperature and high-humidity resistant encapsulating materials are filled inside the capacitor.
In the process of implementing the invention, the inventor finds that at least the following problems in the prior art are not solved: 1. the heat dissipation effect of the capacitor is poor, and the internal expansion of the capacitor is easy to occur; 2. the connection position of the cover plate assembly and the metal shell is not subjected to sufficient sealing treatment, and the leakage of the potting material is easily caused when the potting ring is performed.
Disclosure of Invention
The invention aims to provide a high-temperature and high-humidity resistant dry capacitor to solve the problems in the prior art.
In order to achieve the purpose, the invention provides the following technical scheme: a high-temperature and high-humidity resistant dry capacitor comprises a capacitor lower shell component, a high-temperature and high-humidity resistant encapsulating material, a capacitor upper shell component, an electrode column, a connecting copper strip and a capacitor core, the top of the capacitor lower shell component is provided with a capacitor upper shell component which is fixedly connected with the capacitor lower shell component through screws, the capacitor lower shell component and the capacitor upper shell component form a complete capacitor shell, the capacitor core is arranged in the capacitor shell, high-temperature and high-humidity resistant encapsulating materials are filled between the capacitor core and the capacitor shell, the upper part of the capacitor upper shell component is provided with a mounting hole for mounting an electrode column, the two electrode columns are arranged in the mounting hole and are respectively arranged in the mounting hole, and the two electrode columns are respectively and electrically connected with the positive electrode and the negative electrode of the capacitor core through connecting copper strips.
Preferably, the external surface of the electrode column is provided with threads, the surface of the electrode column is sleeved with a conducting ring, the conducting ring is embedded in the capacitor upper shell component, and the surface of the electrode column is in threaded connection with a locking nut.
Preferably, a filling hole is formed in the center of the top of the capacitor upper shell assembly, a sealing layer is fixedly adhered to the surface of the capacitor upper shell assembly, and the filling hole is covered by the sealing layer.
Preferably, the capacitor lower case assembly has heat dissipation fins disposed on an outer surface thereof at equal intervals.
Preferably, the radiating fins are internally provided with radiating holes.
Preferably, the top of the capacitor lower shell component is provided with an insertion groove, the lower part of the capacitor upper shell component is provided with a protruding plate, and the protruding plate is inserted into the insertion groove.
Compared with the prior art, the invention has the beneficial effects that:
1. according to the invention, the radiating fins are arranged on the outer surface of the lower shell component of the capacitor at equal intervals, and the radiating holes are formed in the radiating fins, so that the contact area between the lower shell component of the capacitor and air can be increased, and the radiating efficiency of the lower shell component of the capacitor can be improved.
2. The top of shell subassembly is provided with the inserting groove under the condenser, and the lower part of shell subassembly is provided with the protrusion board on the condenser, and the protrusion board pegs graft in the inside of inserting groove, can carry out further sealedly to the hookup location of shell subassembly on shell subassembly and the condenser under the condenser through above-mentioned structure, avoids the problem of embedment material leakage, and simple structure, and is with low costs.
3. Through the cooperation of the conducting ring sleeved on the surface of the electrode column and the locking nut, the conductor sleeved on the surface of the electrode column can be effectively prevented from falling off.
Drawings
The accompanying drawings, which are included to provide a further understanding of the invention and are incorporated in and constitute a part of this specification, illustrate embodiments of the invention and together with the description serve to explain the principles of the invention and not to limit the invention. In the drawings:
FIG. 1 is a schematic view of the overall internal structure of the present invention;
FIG. 2 is a schematic view of the overall surface structure of the present invention;
FIG. 3 is a schematic view of the bottom surface structure of the lower housing assembly of the capacitor of the present invention;
fig. 4 is an enlarged schematic view of the structure at the position a of the present invention.
In the figure: 1. a capacitor lower housing component; 2. high temperature and high humidity resistant potting material; 3. a capacitor upper housing component; 4. conducting rings; 5. an electrode column; 6. locking the nut; 7. connecting the copper strips; 8. a capacitor core; 9. a heat sink; 10. a sealing layer; 11. filling the hole; 12. heat dissipation holes; 13. a protruding plate.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present invention more apparent, the technical solutions of the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings of the embodiments of the present invention, and it is obvious that the described embodiments are some, but not all embodiments of the present invention. All other embodiments, which can be obtained by a person skilled in the art without any inventive step based on the embodiments of the present invention, are within the scope of the present invention. Thus, the following detailed description of the embodiments of the present invention, presented in the figures, is not intended to limit the scope of the invention, as claimed, but is merely representative of selected embodiments of the invention. All other embodiments, which can be obtained by a person skilled in the art without any inventive step based on the embodiments of the present invention, are within the scope of the present invention.
Referring to fig. 1 and 2, in an embodiment of the present invention, a high temperature and high humidity resistant dry capacitor includes a capacitor lower housing assembly 1, a high temperature and high humidity resistant potting material 2, a capacitor upper housing assembly 3, an electrode column 5, a connecting copper strip 7, and a capacitor core 8, the capacitor upper housing assembly 3 is disposed at the top of the capacitor lower housing assembly 1, the capacitor upper housing assembly 3 is fixedly connected to the capacitor lower housing assembly 1 through screws, the capacitor lower housing assembly 1 and the capacitor upper housing assembly 3 form a complete capacitor housing, the capacitor core 8 is disposed inside the capacitor housing, the high temperature and high humidity resistant potting material 2 is filled between the capacitor core 8 and the capacitor housing, a mounting hole for mounting the electrode column 5 is formed in the upper portion of the capacitor upper housing assembly 3, the electrode columns 5 are disposed in two and respectively mounted inside the mounting hole, the two electrode columns 5 are respectively and electrically connected with the positive electrode and the negative electrode of the capacitor core 8 through connecting copper strips 7.
Referring to fig. 1 and 2, a screw thread is disposed on the outer surface of the electrode column 5, a conductive ring 4 is sleeved on the surface of the electrode column 5, the conductive ring 4 is embedded in the capacitor upper housing component 3, and a locking nut 6 is screwed on the surface of the electrode column 5.
Referring to fig. 1, a filling hole 11 is formed in a top center position of the capacitor upper housing component 3, a sealing layer 10 is adhered and fixed on a surface of the capacitor upper housing component 3, and the filling hole 11 is covered by the sealing layer 10.
Referring to fig. 2 and 3, the outer surface of the lower housing component 1 of the capacitor is provided with heat dissipation fins 9 at equal intervals, and the heat dissipation holes 12 are formed inside the heat dissipation fins 9.
Referring to fig. 1-4, the top of the lower housing component 1 of the capacitor is provided with an insertion groove, the lower part of the upper housing component 3 of the capacitor is provided with a protruding plate 13, and the protruding plate 13 is inserted into the insertion groove; through the equidistant fin 9 that sets up on the external surface of shell subassembly 1 under the condenser, and set up louvre 12 in the inside of fin 9, can increase the area of contact of shell subassembly 1 and air under the condenser, be favorable to improving the radiating efficiency of shell subassembly 1 under the condenser, the top of shell subassembly 1 is provided with the inserting groove under the condenser, the lower part of shell subassembly 3 is provided with protrusion board 13 on the condenser, and protrusion board 13 pegs graft in the inside of inserting groove, can carry out further sealing to shell subassembly 1 under the condenser and the hookup location of shell subassembly 3 on the condenser through above-mentioned structure, avoid the problem of embedment material leakage, and simple structure, it is with low costs, through the cooperation of suit at 5 surperficial conducting rings 4 of electrode post and lock nut 6, can effectually avoid the suit to drop at 5 surperficial wires.
The working principle and the using process of the invention are as follows: the invention arranges the radiating fins 9 on the outer surface of the lower shell component 1 of the capacitor at equal intervals, and arranges the radiating holes 12 in the radiating fins 9, the contact area between the capacitor lower shell component 1 and the air can be increased, the heat dissipation efficiency of the capacitor lower shell component 1 is improved, the top of the capacitor lower shell component 1 is provided with an insertion groove, the lower part of the capacitor upper shell component 3 is provided with a convex plate 13, the convex plate 13 is inserted in the insertion groove, the connecting position of the capacitor lower shell component 1 and the capacitor upper shell component 3 can be further sealed by the structure, the leakage problem of the encapsulating material is avoided, the structure is simple, the cost is low, through the cooperation of the conducting ring 4 sleeved on the surface of the electrode column 5 and the locking nut 6, the lead sleeved on the surface of the electrode column 5 can be effectively prevented from falling off.
Finally, it should be noted that: although the present invention has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that changes may be made in the embodiments and/or equivalents thereof without departing from the spirit and scope of the invention. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (6)
1. The utility model provides a high temperature and high humidity resistant dry capacitor, includes shell subassembly (1) under the condenser, high temperature and high humidity resistant potting material (2), shell subassembly (3) on the condenser, electrode post (5), connection copper strips (7) and electric capacity core (8), its characterized in that: the capacitor comprises a capacitor lower shell component (1), wherein the top of the capacitor lower shell component (1) is provided with a capacitor upper shell component (3), the capacitor upper shell component (3) is fixedly connected with the capacitor lower shell component (1) through screws, the capacitor lower shell component (1) and the capacitor upper shell component (3) form a complete capacitor shell, a capacitor core (8) is arranged in the capacitor shell, a high-temperature and high-humidity resistant encapsulating material (2) is filled between the capacitor core (8) and the capacitor shell, the upper part of the capacitor upper shell component (3) is provided with mounting holes for mounting electrode columns (5), the electrode columns (5) are arranged into two parts and are respectively mounted in the mounting holes, and the electrode columns (5) are respectively electrically connected with the positive electrode and the negative electrode of the capacitor core (8) through connecting copper strips (7).
2. A dry capacitor of high temperature and high humidity resistance as claimed in claim 1, wherein: the capacitor is characterized in that threads are arranged on the outer surface of the electrode column (5), a conducting ring (4) is sleeved on the surface of the electrode column (5), the conducting ring (4) is embedded into the capacitor upper shell component (3), and a locking nut (6) is connected to the surface of the electrode column (5) in a threaded mode.
3. A dry capacitor of high temperature and high humidity resistance as claimed in claim 1, wherein: filling hole (11) have been seted up to the top central point of shell subassembly (3) on the condenser, shell subassembly (3) on the condenser is pasted on the surface and is fixed with sealing layer (10), and sealing layer (10) cover filling hole (11).
4. A dry capacitor of high temperature and high humidity resistance as claimed in claim 1, wherein: and radiating fins (9) are arranged on the outer surface of the capacitor lower shell component (1) at equal intervals.
5. A dry capacitor of high temperature and high humidity resistance as claimed in claim 4, wherein: the radiating fins (9) are internally provided with radiating holes (12).
6. A dry capacitor of high temperature and high humidity resistance as claimed in claim 1, wherein: the top of the capacitor lower shell component (1) is provided with an insertion groove, the lower part of the capacitor upper shell component (3) is provided with a protruding plate (13), and the protruding plate (13) is inserted in the insertion groove.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911126871.7A CN111799090A (en) | 2019-11-18 | 2019-11-18 | High-temperature and high-humidity resistant dry capacitor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911126871.7A CN111799090A (en) | 2019-11-18 | 2019-11-18 | High-temperature and high-humidity resistant dry capacitor |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN111799090A true CN111799090A (en) | 2020-10-20 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201911126871.7A Pending CN111799090A (en) | 2019-11-18 | 2019-11-18 | High-temperature and high-humidity resistant dry capacitor |
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| Country | Link |
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| CN (1) | CN111799090A (en) |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102201553A (en) * | 2010-01-20 | 2011-09-28 | 张力 | Battery or capacitor packaging housing |
| CN202736755U (en) * | 2012-07-16 | 2013-02-13 | 佛山市意壳电容器有限公司 | High temperature resistance high moisture resistance dry type capacitor |
| CN203165669U (en) * | 2013-01-28 | 2013-08-28 | 博耳无锡特种电力电容器有限公司 | Integrated high-voltage parallel capacitor with cooling device |
| CN208127030U (en) * | 2018-04-28 | 2018-11-20 | 鹤壁华瑞电子有限公司 | A kind of capacitor packaging structure |
-
2019
- 2019-11-18 CN CN201911126871.7A patent/CN111799090A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102201553A (en) * | 2010-01-20 | 2011-09-28 | 张力 | Battery or capacitor packaging housing |
| CN202736755U (en) * | 2012-07-16 | 2013-02-13 | 佛山市意壳电容器有限公司 | High temperature resistance high moisture resistance dry type capacitor |
| CN203165669U (en) * | 2013-01-28 | 2013-08-28 | 博耳无锡特种电力电容器有限公司 | Integrated high-voltage parallel capacitor with cooling device |
| CN208127030U (en) * | 2018-04-28 | 2018-11-20 | 鹤壁华瑞电子有限公司 | A kind of capacitor packaging structure |
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| PB01 | Publication | ||
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| RJ01 | Rejection of invention patent application after publication | ||
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Application publication date: 20201020 |