CN111796706A - Panel, preparation method thereof, touch display screen and electronic equipment - Google Patents

Panel, preparation method thereof, touch display screen and electronic equipment Download PDF

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Publication number
CN111796706A
CN111796706A CN202010440512.5A CN202010440512A CN111796706A CN 111796706 A CN111796706 A CN 111796706A CN 202010440512 A CN202010440512 A CN 202010440512A CN 111796706 A CN111796706 A CN 111796706A
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China
Prior art keywords
region
area
conductive film
mask pattern
pattern
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CN202010440512.5A
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Chinese (zh)
Inventor
张礼冠
田舒韵
许建勇
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Nanchang OFilm Display Technology Co Ltd
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Nanchang OFilm Display Technology Co Ltd
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Priority to CN202010440512.5A priority Critical patent/CN111796706A/en
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    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/0412—Digitisers structurally integrated in a display
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/044—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
    • G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
    • G06F2203/04103—Manufacturing, i.e. details related to manufacturing processes specially suited for touch sensitive devices

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  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Human Computer Interaction (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Position Input By Displaying (AREA)

Abstract

The invention relates to a panel and a preparation method thereof, a touch display screen and electronic equipment, wherein the preparation method of the panel comprises the following steps: providing a substrate, wherein the substrate comprises a first surface and a second surface which are oppositely arranged; a photosensitive conductive film is arranged on the first surface; providing a mask plate, wherein the mask plate comprises a complete development area and a plurality of development reserved areas, two adjacent development reserved areas are separated by the complete development area, each development reserved area comprises a first area, the light transmittance of the first area is gradually increased in the direction from one side of the first area to the other opposite side, and the mask plate is used for exposing the photosensitive conductive film; and developing the exposed photosensitive conductive film to completely develop the area of the photosensitive conductive film opposite to the completely developed area and partially develop the area of the photosensitive conductive film opposite to the development reserved area to form a mask pattern. The invention improves the adhesive force of the mask pattern on the substrate.

Description

Panel, preparation method thereof, touch display screen and electronic equipment
Technical Field
The invention relates to an electronic part, in particular to a panel and a preparation method thereof, a touch display screen and electronic equipment.
Background
In the related art, in the process of manufacturing the circuit layer of the circuit board, a substrate is provided first, and then the substrate is sequentially subjected to processes of coating, dry film pressing, exposure, development, etching, film stripping and the like. However, the above process is complicated, and the adhesion of the circuit layer prepared by the above process is poor.
Disclosure of Invention
Accordingly, there is a need for a panel, a method for manufacturing the panel, a touch display screen and an electronic device, so as to solve the problems of complicated process of the circuit layer and poor adhesion of the circuit layer.
A method for preparing a panel comprises the following steps:
providing a substrate, wherein the substrate comprises a first surface and a second surface which are oppositely arranged;
a photosensitive conductive film is arranged on the first surface;
providing a mask plate, wherein the mask plate comprises a complete development area and a plurality of development reserved areas, two adjacent development reserved areas are spaced through the complete development area, each development reserved area comprises a first area, and the light transmittance of the first area is gradually increased in the direction from one side of the first area to the other opposite side of the first area; setting the mask plate to be opposite to the photosensitive conductive film, and exposing the photosensitive conductive film by using the mask plate; and
developing the exposed photosensitive conductive film to enable the area of the photosensitive conductive film opposite to the complete development area to be completely developed and enable the area of the photosensitive conductive film opposite to the development reserved area to be partially developed to form a mask pattern, wherein the mask pattern comprises a first pattern formed in the area of the photosensitive conductive film opposite to the first area; the first pattern comprises a first side surface and a second side surface which are oppositely arranged and respectively intersected with the first surface, the first side surface is perpendicular to the first surface, in the direction from one side of the mask pattern close to the first surface to one side far away from the first surface, the distance between the first side surface and a figure cut by a reference plane on the second side surface is gradually reduced, and the reference plane is a plane parallel to the first surface.
According to the preparation method of the panel, the photosensitive conductive film (such as the transferable transparent conductive film) has flexibility, conductivity and high transparency, so that the photosensitive conductive film can replace ITO (indium tin oxide) to prepare the conductive layer (the conductive layer comprises a plurality of mask patterns) through exposure and development, processes such as coating, etching and stripping are omitted, and the forming process of the conductive layer is simplified. In addition, in the direction from the side of the mask pattern close to the first surface to the side far away from the first surface, the distance between the second side surface of the first pattern and the first side surface is gradually reduced by the screenshot of the reference plane, so that the first pattern can avoid the phenomenon that the lower end of the first pattern is hollowed out to be suspended based on the characteristic of the second side surface, and the adhesive force of the mask pattern on the substrate is further improved.
In one embodiment, the development reserved area comprises a second area connected with the first area, the light transmittance of the first area and the light transmittance of the second area are gradually increased or gradually decreased in a direction from a side where the first area and the second area are far away from each other to a side where the first area and the second area are close to each other, and the mask pattern comprises a second pattern formed in an area where the photosensitive conductive film is opposite to the second area when the exposed photosensitive conductive film is developed; the second pattern comprises a third side face and a fourth side face which are oppositely arranged and respectively intersected with the first surface, the third side face is perpendicular to the first surface and is opposite to the first side face, and the distance between the graph cut by the reference plane and the third side face of the fourth side face is gradually reduced in the direction from one side of the mask pattern close to the first surface to one side far away from the first surface. Thus, the adhesive force of the mask pattern is further improved.
In one embodiment, the photosensitive conductive film is a positive film, the fully developed area is completely transparent, and the light transmittance of the first area and the light transmittance of the second area are gradually reduced from 100% in a direction from a side where the first area and the second area are far away from each other to a side where the first area and the second area are close to each other; or, the photosensitive conductive film is a negative film, the completely developed area is opaque, and the light transmittances of the first area and the second area are gradually increased from 0% in a direction from one side of the first area and the second area, which are far away from each other, to the side of the second area, which is close to each other. Therefore, the mask pattern is convenient to form.
In one embodiment, the edge of the first region is in contact with the edge of the second region, the light transmittance of the first region and the light transmittance of the second region are linearly gradually changed to be equal in a direction from a side where the first region and the second region are far away from each other to a side where the first region and the second region are close to each other, and when the exposed photosensitive conductive film is developed, a cross-sectional shape of the mask pattern, which is a plane perpendicular to the extending direction of the length of the mask pattern, is a triangle. The circuit layer presents clear appearance aesthetic feeling.
In one embodiment, the development reserved area comprises a third area arranged between the first area and the second area, the light transmittance of the third area is constant, the light transmittance of the first area and the light transmittance of the second area are linearly gradually changed to be equal to the light transmittance of the third area in the direction from the side where the first area and the second area are far away from each other to the side where the first area and the second area are close to each other, and when the exposed photosensitive conductive film is developed, a pattern of the mask pattern cut by a plane perpendicular to the extension direction of the length of the mask pattern is trapezoidal. The circuit layer presents clear appearance aesthetic feeling.
In one embodiment, the light transmittance of the first region is gradually changed at a rate equal to that of the second region, and when the exposed photosensitive conductive film is developed, an acute angle formed between the second side surface and the first surface is equal to an acute angle formed between the fourth side surface and the first surface. The adhesion force of the two opposite sides of the mask pattern and the substrate is ensured to be equal.
In one embodiment, the development reserved region extends along a first direction, when the exposed photosensitive conductive film is developed, the mask patterns extend along the first direction, a plurality of mask patterns form a first conductive layer, and after the step of developing the exposed photosensitive conductive film, the preparation method further comprises the following steps:
arranging a second conductive layer on the second surface, so that the first conductive layer and the second conductive layer form a coupling capacitor, and obtaining a touch panel with a touch function; the second conductive layer includes a plurality of electrode patterns arranged in parallel at intervals, the electrode patterns extending in a second direction crossing the first direction.
In this way, one of the first conductive layer and the second conductive layer can be used as an emitter, and the other can be used as a sense electrode, so that the prepared substrate can be used as a touch panel.
A panel, comprising:
the substrate comprises a first surface and a second surface which are arranged oppositely; and
the first conducting layer is arranged on the first surface and comprises a photosensitive conducting film, the first conducting layer comprises a plurality of mask patterns arranged at intervals, each mask pattern comprises a first pattern, each first pattern comprises a first side surface and a second side surface which are oppositely arranged and are respectively intersected with the first surface, the first side surfaces are perpendicular to the first surface, the distance between a figure cut by a reference plane on the second side surfaces and the first side surfaces is gradually reduced in the direction from one side, close to the first surface, of each mask pattern to one side far away from the first surface, and the reference plane is a plane parallel to the first surface.
The panel can replace ITO to prepare the conducting layer (the conducting layer comprises a plurality of mask patterns) through exposure and development because the photosensitive conducting film (such as a transferable transparent conducting film) has flexibility, conductivity and high transparency, thereby omitting the processes of coating, etching, stripping and the like and simplifying the forming process of the conducting layer. In addition, in the direction from the side of the mask pattern close to the first surface to the side far away from the first surface, the distance between the second side surface of the first pattern and the first side surface is gradually reduced by the screenshot of the reference plane, so that the first pattern can avoid the phenomenon that the lower end of the first pattern is hollowed out to be suspended based on the characteristic of the second side surface, and the adhesive force of the mask pattern on the substrate is further improved.
In one embodiment, the mask pattern includes a second pattern connected to the first pattern, the second pattern includes a third side and a fourth side that are opposite to each other and intersect with the first surface, the third side is perpendicular to the first surface and opposite to the first side, and a distance between a pattern cut by the reference plane and the third side is gradually reduced in a direction from a side of the mask pattern close to the first surface to a side away from the first surface. Thus, the adhesion force of the mask pattern on the substrate can be further improved.
In one embodiment, the first side face is in contact connection with the third side face, and a figure of the mask pattern, which is cut by a plane vertical to the extending direction of the length of the mask pattern, is a triangle; or the mask pattern comprises a third pattern which is arranged between the first pattern and the second pattern and is in contact with the first side face and the third side face, and the figure of the mask pattern, which is cut by a plane vertical to the length extension direction of the mask pattern, is a trapezoid. Thus, the circuit layer (the first conductive layer) can be made to present clear appearance aesthetic feeling.
In one embodiment, an acute angle value formed by the second side surface and the first surface is equal to an acute angle value formed by the fourth side surface and the first surface. The adhesion force of the two opposite sides of the mask pattern and the substrate is ensured to be equal.
In one embodiment, the substrate is a flexible substrate and the panel is a flexible circuit board.
In one embodiment, the panel is a touch panel, the mask pattern extends along a first direction, the panel includes a second conductive layer disposed on the second surface, the second conductive layer includes a plurality of electrode patterns disposed in parallel at intervals, the electrode patterns extend along a second direction crossing the first direction, and the first conductive layer and the second conductive layer form a coupling capacitor. In this way, one of the first conductive layer and the second conductive layer can be used as an emitter, and the other can be used as a sense electrode, so that the substrate can be used as a touch panel.
A touch display screen, comprising:
a display panel; and
the touch panel is stacked on the display panel.
Therefore, the touch display screen has better bending performance and the conductive pattern has better adhesive force.
An electronic device, comprising:
a terminal body; and
the touch display screen is connected with the terminal body.
Therefore, the touch display screen has better bending performance and the conductive pattern has better adhesive force.
Drawings
Fig. 1 is a schematic structural diagram of a panel according to an embodiment of the present invention;
FIG. 2 is a schematic sectional view taken along line II-II in FIG. 1;
FIG. 3 is a schematic cross-sectional view of a panel according to another embodiment;
fig. 4 is a schematic structural diagram of a touch panel according to an embodiment of the invention;
fig. 5 is a schematic structural diagram of a touch display screen according to an embodiment of the present invention;
fig. 6 is a schematic structural diagram of an electronic device according to an embodiment of the present invention;
FIG. 7 is a schematic view of a process for manufacturing a panel according to an embodiment of the present invention;
FIG. 8 is a schematic diagram of an embodiment of exposing a transferable transparent conductive film using a halftone mask;
FIG. 9 is a schematic diagram of another embodiment of exposing a transferable transparent conductive film using a halftone mask.
Detailed Description
In order to make the aforementioned objects, features and advantages of the present invention comprehensible, embodiments accompanied with figures are described in detail below. In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present invention. This invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein, but rather should be construed as broadly as the present invention is capable of modification in various respects, all without departing from the spirit and scope of the present invention.
It will be understood that when an element is referred to as being "secured to" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used in the description of the invention herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items.
Referring to fig. 1 and 2, a panel 10 according to an embodiment of the present application includes a substrate 100 and a first conductive layer 200. The material of the substrate 100 may be a flexible insulating material, for example, a polymer material such as Polyimide (PI), Polycarbonate (PC), Polyethersulfone (PES), polyethylene terephthalate (PET), polyethylene naphthalate (PEN), Polyarylate (PAR), or glass Fiber Reinforced Plastic (FRP), but is not limited thereto. When the material of the substrate 100 is Polyimide (PI), especially Colorless Polyimide (CPI), it has better bending resistance and insulation performance. The substrate 100 includes a first surface 110 and a second surface 120 that are oppositely disposed.
The first Conductive layer 200 is disposed on the first surface 110 and includes a photosensitive Conductive film, the photosensitive Conductive film can be directly exposed to light for exposure, and the first Conductive layer 200 can be formed by development after exposure without performing an etching process after attaching a dry film and development, and the photosensitive Conductive film can be, for example, a transferable Transparent Conductive film (TCTF), that is, the first Conductive layer 200 is formed by exposing and developing the transferable Transparent Conductive film. The formed first conductive layer 200 can be used as a circuit layer, and the panel 10 can be a Flexible Printed Circuit (FPC), and the manufactured flexible printed circuit also has good flexibility because the transferable transparent conductive film has flexibility and conductivity.
Referring to fig. 1 and 2, in an embodiment, the first conductive layer 200 includes a plurality of mask patterns 210 disposed at intervals, and the term "plurality" in the embodiments of the present application refers to two, three, four, or more. The mask pattern 210 includes a first pattern 211 and a second pattern 212 connected to each other.
The first pattern 211 includes a first side surface 2111 and a second side surface 2112 which are oppositely disposed and respectively intersect with the first surface 110, the first side surface 2111 is perpendicular to the first surface 110, and a distance from the first side surface 2111 to the second side surface 2112 is gradually reduced in a direction from a side of the mask pattern 210 close to the first surface 110 to a side away from the first surface 110 (the X-axis direction is illustrated), and the reference plane is a plane parallel to the first surface 110. In one embodiment, FIG. 2 illustrates the second side 2112 as a slope inclined to the first surface 110, wherein the acute angle between the slope and the first surface 110 is phi1From 30 to 75, for example 45. It is understood that in other embodiments, the second side 2112 can be curved.
The second pattern 212 includes a third side 2121 and a fourth side 2122 opposite to each other and intersecting the first surface 110, the third side 2121 is perpendicular to the first surface 110 and opposite to the first side 2111, and the cross-sectional view of fig. 2 illustrates the contact fit of the two. The distance from the fourth side 2122 to the third side 2121, as viewed by the reference plane, gradually decreases in a direction from a side of the mask pattern 210 close to the first surface 110 to a side far from the first surface 110. In one embodiment, fig. 2 illustrates that the fourth side 2122 is a slope inclined from the first surface 110, and the acute angle between the slope and the first surface 110 is phi2From 30 to 75, for example 45. It is understood that in other embodiments, the fourth side 2122 may also be curved.
It should be noted that although fig. 2 illustrates that the mask pattern 210 includes the first pattern 211 and the second pattern 212, the mask pattern 210 may include only the first pattern 211, and the second pattern 212 may be omitted.
Since the photosensitive conductive film of the panel 10 has flexibility, conductivity and high transparency, the photosensitive conductive film can replace ITO to prepare the first conductive layer 200 of the present invention by exposure and development, thereby eliminating the processes of plating, etching, stripping, and the like, and simplifying the formation process of the first conductive layer 200. Moreover, the arrangement of the first pattern 211 based on the second side 2112 and the arrangement of the second pattern 212 based on the fourth side 2122 can prevent the mask pattern 210 from being hollowed out due to over-development during the developing process, so that the adhesion between the mask pattern 210 and the substrate 100 can be improved. Compared to the related art where a step is formed between the mask pattern 210 and the substrate 100 (i.e., the second side 2112 and the fourth side 2122 are perpendicular to the first surface 110), the second side 2112 and the fourth side 2122 are tilted for over-development, and even if the second side 2112 and the fourth side 2122 are over-developed, the lower end of the mask pattern 210 is not hollowed out and suspended.
In an embodiment, as shown in fig. 2, the first side 2111 is connected to the third side 2121, and the mask pattern 210 is triangular in a cross-section taken by a plane perpendicular to the extending direction of the length of the mask pattern 210. In other embodiments, referring to fig. 3, the mask pattern 210 includes a third pattern 213 disposed between the first pattern 211 and the second pattern 212 and contacting the first side 2111 and the third side 2121, and the mask pattern 210 has a trapezoidal shape as viewed from a plane perpendicular to a direction in which the length of the mask pattern 210 extends. Based on the shape of the cross section of the mask pattern 210 being triangular or trapezoidal, the aesthetic feeling of the wiring arrangement can be improved.
In one embodiment, the acute angle value Φ formed between the second side 2112 and the first surface 1101Equal to the acute angle phi formed between the fourth side 2122 and the first surface 1102. Wherein the acute angle value Φ formed between the second side 2112 and the first surface 1101Is 30 to 75, e.g. phi1Is 45 degrees. The acute angle phi formed between the fourth side 2122 and the first surface 1102Is 30 to 75, e.g. phi2Is 45 degrees. The adhesion force between the two opposite sides of the mask pattern 210 and the substrate 100 is ensured to be equal, and the adhesion stability of the mask pattern 210 is further improved.
In an embodiment, referring to fig. 4, the panel 10 is a touch panel, that is, the panel 10 has a touch feedback function. At this time, the mask pattern 210 is defined to extend along a first direction, the panel 10 further includes a second conductive layer 300, the second conductive layer 300 is disposed on the second surface 120, the second conductive layer 300 includes a plurality of electrode patterns disposed in parallel and spaced apart, the electrode patterns extend along a second direction crossing the first direction, and the first conductive layer 200 and the second conductive layer 300 form a coupling capacitor. In order to protect the second conductive layer 300, the second conductive layer 300 may be connected to the protective cover by an adhesive layer.
It should be noted that one of the first conductive layer 200 and the second conductive layer 300 is, for example, a transmitting electrode layer (generally abbreviated as TX electrode), and the other is, for example, a receiving electrode layer (generally abbreviated as RX electrode). In order to realize the touch function of the panel 10, a plurality of signal lines (not shown) are disposed on the substrate 100, and the plurality of signal lines are electrically connected to the first conductive layer 200 and the second conductive layer 300 respectively, so as to transmit the electrical signals of the first conductive layer 200 and the second conductive layer 300 to the FPC. The signal line may be, for example, a silver (Ag) line or a gold (Au) line obtained by printing, exposing, or irradiating, and the material of the signal line is not limited herein.
Referring to fig. 5, when the panel 10 can be used as a touch panel, the panel 10 with touch function can be stacked and attached to the display panel 20 to form a touch display screen 30. The display panel 10 may adopt an LCD (Liquid crystal display) screen for displaying information, and the LCD screen may be a TFT (Thin Film Transistor) screen, an IPS (In-Plane Switching) screen, or an SLCD (split Liquid crystal display) screen. In another embodiment, the display panel 10 may adopt an OLED (Organic Light-Emitting display) screen for displaying information, and the OLED screen may be an AMOLED (Active Matrix Organic Light-Emitting Diode) screen or a Super AMOLED (Super Active Matrix Organic Light-Emitting Diode) screen or a Super AMOLED Plus (Super Active Matrix Organic Light-Emitting Diode) screen, which will not be described herein again.
The invention further provides an electronic device 1000, and referring to fig. 6, the invention will describe the electronic device 1000 by taking a smart phone as an example. Those skilled in the art will readily understand that the electronic device 1000 of the present application may also be any device having communication and storage functions, such as a tablet computer, a notebook computer, a portable phone, a video phone, a digital still camera, an electronic book reader, a Portable Multimedia Player (PMP), a mobile medical device, and other intelligent terminals, and the representation form of the electronic device 1000 is not limited herein. For wearable devices such as smart watches, the same applies to the electronic device 1000 according to the embodiments of the present application.
This electronic equipment 1000 includes touch-sensitive display screen 30, back lid 40 and center 50, and touch-sensitive display screen 30 and back lid 40 connect in the both sides that center 50 carried on the back mutually and enclose and close and form accommodating space, and accommodating space can be used for installing devices such as mainboard, power of electronic equipment 1000. The rear cover 40 and the middle frame 50 form a terminal body of the electronic device 1000, and the rear cover 40 and the middle frame 50 may be integrally formed or detachably connected. The side of the touch display screen 30 facing away from the rear cover 40 includes a displayable region 301, the displayable region 301 may form all or part of the side of the touch display screen 30 facing away from the rear cover 40, and the displayable region 301 is used for displaying image information.
Referring to fig. 7, the present invention also provides a method for manufacturing a panel 10, including the steps of:
in step S810, referring to fig. 8, the substrate 100 is provided. The substrate 100 includes a first surface 110 and a second surface 120 that are oppositely disposed. The substrate 100 is made of an insulating material, for example, a polymer material such as Polyimide (PI), Polycarbonate (PC), Polyethersulfone (PES), polyethylene terephthalate (PET), polyethylene naphthalate (PEN), Polyarylate (PAR), or glass Fiber Reinforced Plastic (FRP), but is not limited thereto. When the material of the substrate 100 is Polyimide (PI), especially Colorless Polyimide (CPI), it has better bending resistance and insulation performance.
In step S820, the photosensitive conductive film 200a is disposed on the first surface 110. The photosensitive Conductive film 200a may be, for example, a transferable Transparent Conductive film (TCTF), the transferable Transparent Conductive film may be transferred to the first surface 110, and the transferable Transparent Conductive film 200a may be formed on the substrate 100 by a lamination process.
Step S830, providing a mask 400, where the mask 400 includes a complete development area 410 and a plurality of development retention areas 420, two adjacent development retention areas 420 are separated by the complete development area 410, the development retention areas 420 include a first area 421 and a second area 422 that are connected to each other, and in a direction from a side where the first area 421 and the second area 422 are away from each other to a side where the first area 421 and the second area 422 are close to each other, light transmittance of the first area 421 and light transmittance of the second area 422 are gradually changed (e.g., gradually increased or gradually decreased). The mask plate 400 is disposed to be opposed to the photosensitive conductive film 200a, and the photosensitive conductive film 200a is exposed by the mask plate 400.
In step S840, the exposed photosensitive conductive film 200a is developed, such that the region of the photosensitive conductive film 200a opposite to the completely developed region 410 is completely developed, and the region of the photosensitive conductive film 200a opposite to the development reserved region 420 is partially developed to form a mask pattern 210, where the mask pattern 210 includes a first pattern 211 formed in the region of the photosensitive conductive film 200a opposite to the first region 421, and a second pattern 212 formed in the region of the photosensitive conductive film 200a opposite to the second region 422.
The first pattern 211 includes a first side surface 2111 and a second side surface 2112 disposed opposite to each other and intersecting the first surface 110, the first side surface 2111 is perpendicular to the first surface 110, and a distance from the first side surface 2111 to the second side surface 2112 is gradually decreased in a direction from a side of the mask pattern 210 close to the first surface 110 to a side far from the first surface 110.
The second pattern 212 includes a third side 2121 and a fourth side 2122 oppositely disposed and respectively intersecting the first surface 110, the third side 2121 is perpendicular to the first surface 110 and opposite to the first side 2111, and a distance from the fourth side 2122 to the third side 2121 decreases gradually in a direction from a side of the mask pattern 210 close to the first surface 110 to a side far from the first surface 110.
It should be noted that the reference plane is a plane parallel to the first surface 110.
It is understood that in other embodiments, mask 400 may be provided without including second region 422. That is, the exposed photosensitive conductive film 200a is developed to obtain the first conductive layer 200 having only the first pattern 211.
In an embodiment, the photosensitive conductive film 200a disposed in step S820 is a positive film, the completely developed region 410 of the mask 400 provided in step S830 is completely transparent, and the light transmittances of the first region 421 and the second region 422 are gradually reduced from 100% in a direction from a side where the first region 421 and the second region 422 are far away from each other to a side where the first region 422 is close to each other. In step S840, the area of the photosensitive conductive film 200a opposite to the area with 100% transmittance in the development reserved area 420 is completely developed by the positive developing solution, and the area of the photosensitive conductive film 200a opposite to the area with 100% transmittance in the development reserved area 420 is partially developed by the positive developing solution and reserved, so as to obtain the mask pattern 210 with the second side 2112 or the fourth side 2122. The light transmittance of the first region 421 and the second region 422 can be gradually reduced from 100% to 0%.
In an embodiment, the photosensitive conductive film 200a disposed in step S820 is a negative film, the completely developed area 410 of the mask 400 provided in step S830 is opaque, and the light transmittances of the first area 421 and the second area 422 are gradually increased from 0% in a direction from a side where the first area 421 and the second area 422 are far away from each other to a side where the first area 422 is close to each other. In step S840, the area of the photosensitive conductive film 200a opposite to the area with the light transmittance of 0% in the development reserved area 420 is completely developed by the negative developer, and the area of the photosensitive conductive film 200a opposite to the area with the light transmittance of not 0% in the development reserved area 420 is partially developed by the negative developer and reserved, so as to obtain the mask pattern 210 with the second side 2112 or the fourth side 2122. The light transmittance of the first region 421 and the second region 422 can be gradually increased from 0% to 100%.
In an embodiment, the edge of the first region 421 of the mask 400 provided in step S830 is in contact with the edge of the second region 422, the light transmittance of the first region 421 and the light transmittance of the second region 422 are linearly gradually changed to be equal in a direction from a side where the first region 421 and the second region 422 are away from each other to a side where the first region 422 are close to each other, and when the exposed photosensitive conductive film 200a is developed, a cross-section of the formed mask pattern 210 is triangular by a plane perpendicular to a direction in which the length of the mask pattern 210 extends.
In an embodiment, referring to fig. 9, the mask 400 provided in step S830 further includes a third region 423 disposed between the first region 421 and the second region 422, a light transmittance of the third region 423 is constant, and in a direction from a side where the first region 421 and the second region 422 are far away from each other to a side where the first region 422 is close to each other, the light transmittance of the first region 421 and the light transmittance of the second region 422 are linearly gradually changed to be equal to the light transmittance of the third region 423. When the exposed photosensitive conductive film 200a is developed, the formed mask pattern 210 has a trapezoidal shape as a cross-section taken along a plane perpendicular to the longitudinal extension direction of the mask pattern 410.
In one embodiment, the gradient speed of the light transmittance of the first region 421 is equal to the gradient speed of the light transmittance of the second region 422, and when the exposed photosensitive conductive film 200a is developed, the acute angle formed by the second side 2112 and the first surface 110 is equal to the acute angle formed by the fourth side 2122 and the first surface 110.
It is understood that, in other embodiments, the pattern of the mask pattern 210 cut by a plane perpendicular to the direction in which the length of the mask pattern 410 extends is not limited to the triangle and the trapezoid. For example, in a direction from a side where the first region 421 and the second region 422 are away from each other to a side where the first region 421 and the second region 422 are close to each other, the light transmittance of the first region 421 and the light transmittance of the second region 422 both change in a parabolic manner to be equal to the light transmittance of the third region 423. At this time, when the exposed photosensitive conductive film 200a is developed, the second side 2112 and the fourth side 2122 of the formed mask pattern 210 are both curved surfaces, which can also improve the adhesion of the mask pattern 210.
In an embodiment, the development reserved region 420 of the mask 400 provided in step S830 extends along a first direction, when the exposed photosensitive conductive film 200a is developed, the mask patterns 210 extend along the first direction, the mask patterns 210 form the first conductive layer 200, and after the step of developing the exposed photosensitive conductive film 200a, the second conductive layer 300 may be further disposed on the second surface 120, so that the first conductive layer 200 and the second conductive layer 300 form a coupling capacitor, and the panel 10 with a touch function is obtained. The second conductive layer 300 includes a plurality of electrode patterns arranged in parallel at intervals, the electrode patterns extending in a second direction crossing the first direction.
The technical features of the embodiments described above may be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the embodiments described above are not described, but should be considered as being within the scope of the present specification as long as there is no contradiction between the combinations of the technical features.
The above-mentioned embodiments only express several embodiments of the present invention, and the description thereof is more specific and detailed, but not construed as limiting the scope of the invention. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the inventive concept, which falls within the scope of the present invention. Therefore, the protection scope of the present patent shall be subject to the appended claims.

Claims (15)

1. A method for preparing a panel is characterized by comprising the following steps:
providing a substrate, wherein the substrate comprises a first surface and a second surface which are oppositely arranged;
a photosensitive conductive film is arranged on the first surface;
providing a mask plate, wherein the mask plate comprises a complete development area and a plurality of development reserved areas, two adjacent development reserved areas are spaced through the complete development area, each development reserved area comprises a first area, and the light transmittance of the first area is gradually increased in the direction from one side of the first area to the other opposite side of the first area; setting the mask plate to be opposite to the photosensitive conductive film, and exposing the photosensitive conductive film by using the mask plate; and
developing the exposed photosensitive conductive film to enable the area of the photosensitive conductive film opposite to the complete development area to be completely developed and enable the area of the photosensitive conductive film opposite to the development reserved area to be partially developed to form a mask pattern, wherein the mask pattern comprises a first pattern formed in the area of the photosensitive conductive film opposite to the first area; the first pattern comprises a first side surface and a second side surface which are oppositely arranged and respectively intersected with the first surface, the first side surface is perpendicular to the first surface, in the direction from one side of the mask pattern close to the first surface to one side far away from the first surface, the distance between the first side surface and a figure cut by a reference plane on the second side surface is gradually reduced, and the reference plane is a plane parallel to the first surface.
2. The manufacturing method according to claim 1, wherein the development-retaining region includes a second region connected to the first region, the light transmittance of the first region and the light transmittance of the second region both gradually increase or gradually decrease in a direction from a side where the first region and the second region are away from each other to a side where they are close to each other, and the mask pattern includes a second pattern formed in a region where the photosensitive conductive film is opposed to the second region when the exposed photosensitive conductive film is developed; the second pattern comprises a third side face and a fourth side face which are oppositely arranged and respectively intersected with the first surface, the third side face is perpendicular to the first surface and is opposite to the first side face, and the distance between the graph cut by the reference plane and the third side face of the fourth side face is gradually reduced in the direction from one side of the mask pattern close to the first surface to one side far away from the first surface.
3. The manufacturing method according to claim 2, wherein the photosensitive conductive film is a positive film, the fully developed region is completely light-transmissive, and the light transmittances of the first region and the second region are gradually decreased from 100% in a direction from a side where the first region and the second region are away from each other to a side where the first region and the second region are close to each other; or, the photosensitive conductive film is a negative film, the completely developed area is opaque, and the light transmittances of the first area and the second area are gradually increased from 0% in a direction from one side of the first area and the second area, which are far away from each other, to the side of the second area, which is close to each other.
4. The manufacturing method according to claim 3, wherein an edge of the first region is in contact with an edge of the second region, a light transmittance of the first region and a light transmittance of the second region are linearly gradually changed to be equal in a direction from a side where the first region and the second region are away from each other to a side where the first region and the second region are close to each other, and a cross-sectional shape of the mask pattern taken by a plane perpendicular to a length extending direction of the mask pattern is a triangle when the exposed photosensitive conductive film is developed.
5. The manufacturing method according to claim 3, wherein the development-retaining region includes a third region disposed between the first region and the second region, a light transmittance of the third region is constant, the light transmittance of the first region and the light transmittance of the second region are linearly changed to be equal to the light transmittance of the third region in a direction from a side where the first region and the second region are away from each other to a side where the first region and the second region are close to each other, and a cross-sectional shape of the mask pattern taken by a plane perpendicular to a direction in which a length of the mask pattern extends is a trapezoid when the exposed photosensitive conductive film is developed.
6. The manufacturing method according to claim 4 or 5, wherein a rate of gradual change of the light transmittance of the first region is equal to a rate of gradual change of the light transmittance of the second region, and when the exposed photosensitive conductive film is developed, an acute angle formed between the second side surface and the first surface is equal to an acute angle formed between the fourth side surface and the first surface.
7. The production method according to claim 1, wherein the development reserve region extends in a first direction, the mask pattern is extended in the first direction when the photosensitive conductive film after exposure is developed, a plurality of the mask patterns form a first conductive layer, and after the step of developing the photosensitive conductive film after exposure, the production method further comprises the steps of:
arranging a second conductive layer on the second surface, so that the first conductive layer and the second conductive layer form a coupling capacitor, and obtaining a touch panel with a touch function; the second conductive layer includes a plurality of electrode patterns arranged in parallel at intervals, the electrode patterns extending in a second direction crossing the first direction.
8. A panel, comprising:
the substrate comprises a first surface and a second surface which are arranged oppositely; and
the first conducting layer is arranged on the first surface and comprises a photosensitive conducting film, the first conducting layer comprises a plurality of mask patterns arranged at intervals, each mask pattern comprises a first pattern, each first pattern comprises a first side surface and a second side surface which are oppositely arranged and are respectively intersected with the first surface, the first side surfaces are perpendicular to the first surface, the distance between a figure cut by a reference plane on the second side surfaces and the first side surfaces is gradually reduced in the direction from one side, close to the first surface, of each mask pattern to one side far away from the first surface, and the reference plane is a plane parallel to the first surface.
9. The panel according to claim 8, wherein the mask pattern comprises a second pattern connected to the first pattern, the second pattern comprising a third side and a fourth side disposed opposite to each other and intersecting the first surface, respectively, the third side being perpendicular to the first surface and opposite to the first side, the fourth side being gradually decreased in distance from the third side as viewed by the reference plane in a direction from a side of the mask pattern closer to the first surface to a side thereof farther from the first surface.
10. The panel according to claim 9, wherein the first side is in contact with the third side, and the mask pattern has a triangular shape as viewed from a plane perpendicular to a direction in which a length of the mask pattern extends; or the mask pattern comprises a third pattern which is arranged between the first pattern and the second pattern and is in contact with the first side face and the third side face, and the figure of the mask pattern, which is cut by a plane vertical to the length extension direction of the mask pattern, is a trapezoid.
11. The panel according to claim 9, characterized in that the acute angle value formed by said second side and said first surface is equal to the acute angle value formed by said fourth side and said first surface.
12. The panel according to any one of claims 8 to 11, wherein the substrate is a flexible substrate and the panel is a flexible circuit board.
13. The panel according to any one of claims 8 to 11, wherein the panel is a touch panel, the mask pattern extends along a first direction, the panel includes a second conductive layer disposed on the second surface, the second conductive layer includes a plurality of electrode patterns disposed at intervals in parallel, the electrode patterns extend along a second direction crossing the first direction, and the first conductive layer and the second conductive layer form a coupling capacitor.
14. A touch display screen, comprising:
a display panel; and
the touch panel of claim 13, stacked on the display panel.
15. An electronic device, comprising:
a terminal body; and
the touch display screen of claim 14, connected to the terminal body.
CN202010440512.5A 2020-05-22 2020-05-22 Panel, preparation method thereof, touch display screen and electronic equipment Withdrawn CN111796706A (en)

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