CN111796199B - Power supply network uniformity and power consumption testing method - Google Patents

Abstract

The invention provides a power supply network uniformity and power consumption testing method. The power network uniformity and power consumption testing method comprises the steps of utilizing a plurality of general circuit units to be fully distributed with a testing circuit; providing a supply voltage to each of the general circuit units by using a power supply network; specifying a power consumption of each of the general circuit units; calculating the power consumption density of the test circuit and the power consumption density of the general circuit unit; and judging whether the power consumption density of the test circuit is the same as that of the general circuit unit or not, wherein when the power consumption density of the test circuit is the same as that of the general circuit unit, judging whether the power supply network is uniform or not, and when the power consumption density of the test circuit is different from that of the general circuit unit, representing that a tool for operating the test method breaks down.

Description

Power Network Uniformity and Power Consumption Test Method

technical field

The invention relates to a method for testing the uniformity and power consumption of a power supply network.

Background technique

During chip signoff, not only static timing analysis (STA) must meet the design requirements, but also the voltage drop (IRdrop) must also meet the design requirements. Since the actual system power supply goes through the printed circuit board (PCB) and the package to the bumps on the chip surface, and then through the pads in contact with the bumps and the power mesh inside the chip to supply power to the chip. The circuit power supply of the system will generate system power plane noise and conduction voltage drop on this series of power distribution networks. Therefore, the chip signoff includes the signoff of the voltage drop, but the voltage drop standards of different circuit design manufacturers may be different.

After the voltage drop, the voltage received by the general circuit units on the chip will have a large difference, which will lead to the difference between the delay time of the general circuit unit and the result of the pre-silicon verification (pre-silicon), so that the overall circuit cannot achieve expected performance. Therefore, it is necessary for us to test the uniformity of the power network and the maximum load power consumption of the power network in advance, so as to better design a qualified power network.

Contents of the invention

The invention proposes a method for testing the uniformity and power consumption of a power supply network, which can confirm whether the power supply network is uniform, and effectively test whether the designed power supply network is sufficient to bear the designed power loss.

In view of this, the present invention proposes a test method for power network uniformity and power consumption, including using a plurality of general circuit units to fill the test circuit; using the power network to provide a supply voltage for each of the general circuit units; specifying each The power consumption of the general circuit unit; calculating the power consumption density of the test circuit and the power consumption density of the general circuit unit; and judging whether the power consumption density of the test circuit and the power consumption density of the general circuit unit are same, wherein when the power consumption density of the test circuit is the same as that of the general circuit unit, it is judged whether the power supply network is uniform; Different consumption densities indicate a failure of the tool running the test method.

Description of drawings

FIG. 1 is a schematic diagram of a test circuit 100 according to an embodiment of the present invention;

FIG. 2A is a schematic diagram of a power supply network 200 according to an embodiment of the present invention;

FIG. 2B is a three-dimensional schematic diagram of the block 210 in FIG. 2A;

FIG. 3 is a flowchart of a testing method 300 according to an embodiment of the present invention;

FIG. 4 is a flowchart of a method 400 for judging whether a power supply network is uniform according to an embodiment of the present invention;

FIG. 5 is a flowchart of a method 500 for judging whether a power supply network is uniform according to another embodiment of the present invention;

FIG. 6 is a flowchart of a method 600 for judging whether the power supply voltage drop of a general circuit unit is uniform according to an embodiment of the present invention; and

FIG. 7 is a flowchart of a method 700 for judging whether a power supply voltage drop of a general circuit unit is uniform according to another embodiment of the present invention.

detailed description

The following descriptions are examples of the present invention. Its purpose is to illustrate the general principle of the present invention and should not be regarded as a limitation of the present invention. The scope of the present invention should be defined by the claims.

It can be understood that although the terms "first", "second", "third" and the like may be used herein to describe various components, components, regions, layers, and/or sections, these components, components, Regions, layers, and/or sections should not be limited by these terms, and these terms are only used to distinguish different components, components, regions, layers, and/or sections. Thus, a first component, component, region, layer, and/or section discussed below could be termed a second component, component, region, layer, or section without departing from the teachings of some embodiments of the present disclosure. and/or sections.

It is worth noting that the following disclosure may provide multiple embodiments or examples for practicing different features of the present invention. The specific component examples and arrangements described below are only used to briefly illustrate the spirit of the present invention, and are not intended to limit the scope of the present invention. In addition, the following description may reuse the same component symbols or words in multiple examples. However, the purpose of repeated use is only to provide simplified and clear description, not to limit the relationship between the various embodiments and/or configurations discussed below. Furthermore, descriptions of one feature described in the following specification as being connected to, coupled to, and/or formed on another feature, etc., may actually include many different embodiments, including those features being in direct contact, or including other additional features. The features are formed between the features, etc., such that the features are not in direct contact.

FIG. 1 is a schematic diagram of a test circuit 100 according to an embodiment of the present invention. As shown in FIG. 1 , the test circuit 100 has an area of X*Y and includes a plurality of general circuit units 120 - 1 , 120 - 2 , . . . , 120 -N, wherein N is a positive integer. According to an embodiment of the present invention, the test circuit 100 is used to couple the power supply network to test the uniformity and maximum power consumption of the power supply network. The placement density (placement density) of general circuit units in the test circuit 100 is 100%. 100% means that the area where the test circuit 100 is already filled with general circuit units (that is, the area with an area of X*Y) cannot accommodate any general circuit units. Generally speaking, in an actual circuit, the placement density of general circuit units is about 70%. Since the placement density of general circuit units in the test circuit 100 is higher than that of a circuit coupled to a power mesh in actual applications, Therefore, the maximum load power consumption of the power network estimated by the test circuit 100 is sufficient to support the power supply to the actual circuit.

According to an embodiment of the present invention, the test circuit 100 includes at least one type of general circuit units 120-1 to 120-N, and the area of each general circuit unit is determined according to power consumption, that is, the power of the general circuit unit The greater the consumption, the larger the area. The area of each general circuit unit is the product of a coefficient and the area of a virtual circuit unit (reference circuit unit), and the power consumption of the general circuit unit is also the product of the power consumption of the reference circuit unit and the coefficient. Therefore, no matter whether the general circuit units 120-1˜120-N are of the same type or not, the power consumption value of the general circuit units per unit area (such as the area of each reference circuit unit) is the same, so that the power consumption of the test circuit 100 The density is uniform, wherein the power consumption density refers to the power consumption of a general circuit unit per unit area.

According to an embodiment of the present invention, the circuit units can be divided into general circuit units and fillers, and the general circuit units 120-1 to 120-N can be non-fillers such as inverters, buffers, flip-flops, and logic gates. circuit unit. Since the filling units do not consume any power consumption, only common circuit units can be used to fill the circuit area 110 -N, wherein full means that the placement density of the common circuit units is 100%. According to another embodiment of the present invention, after filling the circuit region 110 -N with common circuit units, filling units can also be used to fill gaps in the circuit region 110 -N.

In addition, the test circuit 100 receives supply voltages through the power network, such as power supply voltages VDD, VSS, virtual power supply voltages, reference voltages and the like. That is to say, each general circuit unit 120 - 1 - 120 -N in the test circuit 100 is powered through the power network. According to an embodiment of the present invention, the test circuit 100 is disposed on at least one layer of the chip, and the chip also includes a power supply network disposed on at least one other metal layer and/or via layer, and the at least one metal layer is disposed on a multi-stage The power wiring and the through hole for transmitting each supply voltage, and a plurality of through holes for wiring are arranged on the at least one through hole layer.

FIG. 2A is a schematic diagram of a power network according to an embodiment of the present invention. As shown in FIG. 2A , the test circuit 100 is coupled to a power network 200 . The power network 200 includes a first metal layer M1 , a second metal layer M2 , a seventh metal layer M7 , an eleventh metal layer M11 , a twelfth metal layer M12 and a thirteenth metal layer M13 . In addition, metal layers are coupled through vias (VIA).

The thirteenth metal layer M13 is coupled to a plurality of bumps BUMP, through which the plurality of bumps BUMP is coupled to pins of the package, and then coupled to wires on the printed circuit board through the pins of the package. According to an embodiment of the present invention, the thirteen metal layers included in the power network 200 are used for illustration and explanation, and the present invention is not limited thereto.

FIG. 2B is a schematic diagram of the wiring of each layer in the block 210 of FIG. 2A . As shown in FIG. 2B, the first metal layer M1, the second metal layer M2, the seventh metal layer M7, and the eleventh metal layer M11 respectively include a plurality of segment wires, as illustrated by the arrows, the supply voltage passes through these segment wires The wirings connected together are used to supply power to each general circuit unit in the test circuit 100. For the convenience of expression, the wirings connected by the segmented wirings are referred to as the wirings below. The arrow lines in FIG. The wiring of each segment is connected into one wiring, and the wiring of each layer in the block 210 shown in FIG. 2B can be connected into multiple wirings.

FIG. 3 is a flowchart of a method for testing uniformity and power consumption of a power supply network according to an embodiment of the present invention. As shown in FIG. 3 , firstly, a plurality of general circuit units are filled with the test circuit 100 (step S31 ). According to an embodiment of the present invention, the general circuit unit may be a non-filling unit such as an inverter, a buffer, a flip-flop, and a logic gate.

According to the type of the general circuit unit, power consumption is specified for each general circuit unit used to fill the test circuit 100 of FIG. 1 (step S32 ). According to an embodiment of the present invention, when specifying the power consumption of a general circuit unit for the first time, it is specified arbitrarily according to process parameters and experience.

According to an embodiment of the present invention, the maximum power consumption that the test circuit 100 can carry is directly proportional to the power consumption density of a general circuit unit. That is to say, the power consumption density of the general circuit unit is proportional to the voltage drop (IR-Drop, hereinafter referred to as the voltage drop of the general circuit unit) generated by the supply voltage for the test circuit 100 in FIG. 1 in the general circuit unit.

According to an embodiment of the present invention, the general circuit unit placement density of the test circuit 100 of FIG. 1 is 100%, which can make the power consumption density of the test circuit 100 equal to the power consumption density of the general circuit unit, wherein the power consumption density of the general circuit unit is The ratio of the power consumption of each general circuit unit to the area of the circuit area occupied by this general circuit unit. Generally speaking, the ratio of the power consumption of one type of general circuit unit to the area of the circuit area occupied by this type of general circuit unit, and the ratio of the power consumption of another type of general circuit unit to the area of the circuit area occupied by this other type of general circuit unit The ratio of the areas of the regions is equal.

Next, it is judged whether the power consumption density of the test circuit 100 is the same as that of the general circuit unit (step S33 ). When it is judged that the power consumption density of the test circuit 100 is different from the power consumption density of the general circuit unit, it means that the simulation tool for running the uniformity and power consumption test method 300 of the power supply network is wrong, so the uniformity and power consumption of the power supply network are stopped. The test method 300 deals with mocking tool issues. According to an embodiment of the present invention, the probability that the power consumption density of the test circuit 100 is different from that of the general circuit units is very small.

Going back to step S33, when it is judged that the power consumption density of the test circuit 100 is the same as that of the general circuit unit, it is judged whether the power supply network 200 is uniform (S34). When it is judged that the power network 200 is uneven, redesign the power network 200 ( S37 ), and return to step S31 to re-execute the power network uniformity and power consumption test method 300 . When it is judged that the power supply network 200 is uniform, it is judged whether the voltage drop of the general circuit unit is uniform (S36), wherein, the voltage drop of the general circuit unit means that the supply voltage supplies power to the general circuit unit of the test circuit 100 through the power supply network 200 the resulting voltage drop.

When it is judged that the voltage drop of the general circuit unit is uneven, after redesigning the power supply network 300 (step S37 ), return to step S31 to re-execute the verification method 300 . According to an embodiment of the present invention, when it is judged that the voltage drop of the general circuit unit is not uniform, find out the maximum voltage drop, and analyze the cause of the maximum voltage drop, and then redesign the power supply network 200 . According to an embodiment of the present invention, the cause of the uneven voltage drop of the general circuit unit may be that one or more segments of traces are missing in the metal layer, or one or more through holes are missing in a certain perforated layer.

When it is determined that the voltage drop of the general circuit unit is uniform, it is determined whether the maximum voltage drop of the general circuit unit is less than the design threshold and whether the maximum load power consumption of the power network 200 is greater than a preset value (S38). When the maximum voltage drop of the general circuit unit is less than the design threshold value, and the maximum load power consumption of the power network 200 is greater than the preset value, it means that the power network 200 meets the design requirements, so the uniformity and power consumption test method 300 of the power network is ended. . When the maximum voltage drop of the general circuit unit is not less than the design threshold or the maximum load power consumption of the power network 200 is not greater than the preset value, execute step S35 to improve the performance of the power network 200 and then execute the verification method 300 again. According to an embodiment of the present invention, the design threshold and the preset value are set based on the developer's experience. When the maximum voltage drop of a general circuit unit is equal to the design threshold, the power consumption of the test circuit 100 is equal to that of the power network 200. The maximum power consumption that can be tolerated.

According to an embodiment of the present invention, improving the performance of the power network ( S35 ) includes increasing the line width of at least one layer of the power network 200 . According to another embodiment of the present invention, improving the performance of the power supply network ( S35 ) includes increasing the wiring density of at least one layer of the power supply network 200 . For the metal layer, increasing the density of the wires includes increasing the width of the wires and/or increasing the number of wires, wherein when the number of wires increases, the number of corresponding vias may also increase. For the via layer, increasing the density of wiring includes increasing the number of vias.

FIG. 4 is a flowchart of a method 400 for judging whether a power supply network is uniform according to an embodiment of the present invention. The method 400 for judging whether a power supply network is uniform corresponds to step S34 in FIG. 3 . As shown in FIG. 4, a power consumption value (S41) is designated for each general circuit unit in the test circuit 100, and this power consumption value has the highest priority, so that the general circuit unit is not affected by the toggle rate (toggle rate), clock signal and other factors. According to an embodiment of the present invention, the specified power consumption values of the same type of general circuit units are the same, and the specified power consumption values of different types of general circuit units are different, and the specified power consumption values of each general circuit unit are equal to the corresponding coefficients The power consumption density of the test circuit 100 is equal to the product of the power consumption of the reference circuit unit, wherein the corresponding coefficient is equal to the ratio of the area of each type of power consumption unit to the reference circuit unit.

Next, obtain the resistance of each wire of the power network 200 through which the supply voltage supplies power to the test circuit 100 through the power network 200 (step S42 ). For example, as shown in FIG. 2B , the power network 200 includes a plurality of wires through which the supply voltage supplies power to each general circuit unit. Step S42 is to obtain the resistance value of each wire shown in FIG. 2B .

Subsequently, among the obtained resistances of each track, the difference between the maximum resistance value and the minimum resistance value is calculated (step S43), and it is judged that the difference between the maximum resistance value and the minimum resistance value is different from that of each line. Whether or not the ratio of the average values of the resistances of the wires is smaller than a threshold value (step S44). When the ratio of the difference between the maximum resistance value and the minimum resistance value to the average value of the resistance of each line is not less than the threshold value, it is judged that the power supply network 200 is uneven (step S45), and proceeds to step S37, The power network 200 is redesigned. When the ratio of the difference between the maximum resistance value and the minimum resistance value to the average resistance value of each wire is less than the threshold value, it is determined that the power supply network 200 is uniform (step S46 ), and proceed to step S36 .

FIG. 5 is a flowchart of a method 500 for judging whether the power network is uniform according to another embodiment of the present invention, wherein the method 500 for determining whether the power network is uniform corresponds to step S34 in FIG. 3 . As shown in FIG. 5 , first directly specify the power consumption value corresponding to each general circuit unit in the test circuit 100 (S51), and the power consumption value has the highest priority, so that the general circuit unit is not affected by the toggle rate (toggle rate) during the test. , clock signal and other factors. According to an embodiment of the present invention, the specified power consumption values of the same type of general circuit units are the same, and the specified power consumption values of different types of general circuit units are different, and the specified power consumption values of each power consumption unit are equal to the corresponding coefficient and reference The product of the power consumption of the circuit unit makes the power consumption of the test circuit 100 uniform, wherein the corresponding coefficient is equal to the ratio of the area of each type of power consumption unit to the reference circuit unit.

Next, obtain the current of each wire of the power network 200 when the supply voltage supplies power to the test circuit 100 through the power network 200 (step S52 ). And, it is judged whether the currents finally output to the test circuit 100 are regular (step S53). Specifically, it is to obtain the current distribution of the test circuit 100, and judge whether the current distribution finally flowing to the test circuit 100 is regular, wherein the regularity means that each coupling point presents the same current distribution state, and the current distribution state refers to The closer to the coupling point of the trace and the test circuit 100 , the larger the current, and the farther away from the coupling point of the trace and the test circuit 100 , the smaller the current.

According to an embodiment of the present invention, whether the current distribution of the test circuit 100 is regular can be displayed in color blocks according to the magnitude of the current, and an image capture device is used to detect whether the color blocks of each coupling point are of the same color (for example, both are red) and are separated from the coupling points. The farther the color block changes uniformly (for example, it becomes light red synchronously), it is judged whether the power supply network 200 is uniform.

When the current distribution of the test circuit 100 does not comply with the above rules, it is judged that the power network 200 is not uniform (step S54 ), and proceed to step S37 to redesign the power network 200 . When the current distribution of the test circuit 100 conforms to the above rules, it is judged that the power supply network 200 is uniform (step S55 ), and then returns to step S36 of FIG. 3 .

According to an embodiment of the present invention, when step S34 in FIG. 3 is executed, one of the method 400 for judging whether the power supply network is uniform in FIG. 4 or the method 500 for judging whether the power supply network is uniform in FIG. 5 may be executed. According to another embodiment of the present invention, when step S34 in FIG. 3 is executed, the method 400 for judging whether the power supply network is uniform in FIG. 4 and the method 500 for judging whether the power supply network is uniform in FIG. 5 can be executed simultaneously.

6 is a flowchart of a method 600 for judging whether the power supply voltage drop of a general circuit unit is uniform according to an embodiment of the present invention, wherein the method 600 for judging whether the power supply voltage drop of a general circuit unit is uniform corresponds to step S36 in FIG. 3 . As shown in FIG. 6 , the unilateral voltage drop of each wire when the supply voltage supplies power to the test circuit 100 through the power network 200 is first obtained (step S61 ). Wherein, the unilateral voltage drop refers to a power drop or a ground bounce of a general circuit unit.

It is judged whether the unilateral voltage drop observed in the test circuit 100 is regular (step S62). This rule means that corresponding to the projected position of each aforementioned bump that provides the supply voltage, the test circuit 100 should present the same unilateral voltage drop distribution state. The smaller the unilateral voltage drop of the circuit unit is, the farther it is from the projected position of the bump, generally the larger the unilateral voltage drop of the circuit unit. According to an embodiment of the present invention, the unilateral voltage drop of a general circuit unit is displayed in color blocks according to the voltage drop size, and the image capture device detects whether the color blocks at the projected position of each bump are of the same color (for example, both are pink) and are far away from the bump. The farther the projection position is, the color of the color block changes uniformly (for example, it turns red synchronously) to judge whether the voltage drop of the general circuit unit is uniform.

When the unilateral voltage drop observed in the test circuit 100 does not conform to the law, it is judged that the voltage drop of the common circuit units in the test circuit 100 is not uniform (step S63), and the step S37 is executed to redesign the power supply network 200. When the unilateral voltage drop observed in the test circuit 100 conforms to the law, it is judged that the voltage drop of the general circuit unit in the test circuit 100 is uniform (step S64), and step S38 is executed to judge the voltage drop of the general circuit unit of the test circuit 100. Whether the maximum voltage drop is less than the unilateral threshold.

7 is a flowchart of a method for judging whether the power supply voltage drop of a general circuit unit is uniform according to another embodiment of the present invention, wherein the method 700 for judging whether the power supply voltage drop of a general circuit unit is uniform corresponds to step S36 in FIG. 3 . As shown in FIG. 7 , first obtain the bilateral voltage drop generated by each trace when the supply voltage supplies power to the test circuit 100 through the power network 200 (step S71 ). Among them, the bilateral voltage drop refers to the sum of the power supply voltage drop and the ground spring voltage drop of the general circuit unit.

It is judged whether the bilateral voltage drop observed in the test circuit 100 is regular (step S72). This rule means that corresponding to the projected position of each aforementioned bump (Bump) that provides the supply voltage, the test circuit 100 should present the same bilateral voltage drop distribution state. Generally, the smaller the bilateral voltage drop of the circuit unit is, the farther it is from the projected position of the bump, the larger the bilateral voltage drop of the general circuit unit is. According to an embodiment of the present invention, the bilateral voltage drop of the general circuit unit is displayed in color blocks according to the voltage drop size, and the image capture device detects whether the color blocks representing the bilateral voltage drop of the general circuit unit at the projected position of each bump are of the same color (for example The same color is pink) and the color of the color block changes uniformly (for example, it turns red synchronously) the farther away from the projection position of the bump, and it is judged whether the voltage drop of the general circuit unit is uniform.

When the bilateral voltage drop observed in the test circuit 100 does not conform to the law, it is judged that the voltage drop of the general circuit unit in the test circuit 100 is not uniform (step S73), and the step S37 is executed to redesign the power supply network 200. When the bilateral voltage drop observed in the test circuit 100 conforms to the law, it is judged that the voltage drop of the general circuit unit in the test circuit 100 is even (step S74), and step S38 is performed to determine the maximum voltage drop of the general circuit unit of the test circuit 100. Whether the voltage drop is less than the bilateral threshold. According to an embodiment of the present invention, the bilateral threshold is twice the unilateral threshold.

The invention proposes a verification method, which can effectively verify whether the designed power network is sufficient to bear the power loss of the actual circuit design, and confirm whether the power network is uniform.

Although the embodiments of the present disclosure and their advantages have been disclosed above, it should be understood that those skilled in the art may make changes, substitutions and modifications without departing from the spirit and scope of the present disclosure. In addition, the protection scope of the present disclosure is not limited to the process, machine, manufacture, material composition, device, method and steps in the specific embodiments described in the specification, those skilled in the art can learn from the disclosure of some embodiments of the present disclosure Understand the current or future developed processes, machines, manufacturing, material compositions, devices, methods and steps, as long as they can perform substantially the same function or obtain substantially the same results in the embodiments described here, they can all be based on some embodiments of the present disclosure use. Therefore, the protection scope of the present disclosure includes the above-mentioned process, machine, manufacture, composition of matter, means, method and steps. In addition, each claim constitutes an individual embodiment, and the protection scope of the present disclosure also includes combinations of the individual claims and the embodiments.

Claims (8)

1. A test method for a power supply network, comprising:

arranging a plurality of general circuit units on a test circuit;

providing a supply voltage to each of the general circuit units by using a power supply network;

specifying a power consumption of each of the general circuit units;

calculating the power consumption density of the test circuit and the power consumption density of the general circuit unit; and

judging whether the power consumption density of the test circuit is the same as that of the general circuit unit,

when the power consumption density of the test circuit is the same as that of the general circuit unit, judging whether the power supply network is uniform or not based on the resistance or current of each wire of the power supply network when the supply voltage supplies power to the test circuit through the power supply network,

when the power consumption density of the test circuit is different from that of the general circuit unit, it represents that a tool running the test method is out of order.

2. The test method according to claim 1, wherein the arrangement density of the general circuit cells arranged in the test circuit is 100%.

3. The testing method of claim 1, wherein the determining whether the power network is uniform based on the resistance of each trace of the power network when the test circuit is powered by the supply voltage through the power network comprises:

obtaining resistance distribution of each wire passing through the power network when the supply voltage supplies power to the test circuit, wherein the resistance distribution comprises a maximum resistance value, a minimum resistance value and an average value;

calculating a difference between the maximum resistance value and the minimum resistance value; and

determining whether the ratio of the difference value to the average value is less than a threshold value,

when the ratio is smaller than the threshold value, the power network is judged to be uniform,

and when the ratio is not smaller than the threshold value, judging that the power supply network is not uniform, and redesigning the power supply network.

4. The testing method of claim 1, wherein the determining whether the power network is uniform based on the current of each trace of the power network when the supply voltage powers the test circuit through the power network comprises:

obtaining the current of the test circuit when the supply voltage supplies power to the test circuit through the power supply network; and

judging whether the current is regular or not,

when the current value is regular, the power supply network is judged to be uniform,

when the current value is irregular, the power supply network is redesigned.

5. The test method of claim 1, further comprising:

and when the power supply network is judged to be uniform, judging whether the voltage drop generated when the supply voltage supplies power to the test circuit through the power supply network is uniform or not.

6. The test method of claim 5, further comprising:

when the voltage drop is judged to be uniform, judging whether the maximum voltage drop is smaller than a threshold value and whether the maximum bearing power of the power supply network is larger than a preset value;

when the voltage drop is not smaller than the threshold value or the maximum bearing power consumption is not larger than a preset value, increasing the wiring density of the power supply network; and

and when the voltage drop of the power supply network is smaller than the threshold value and the maximum bearing power consumption is larger than a preset value, ending the test method.

7. The test method of claim 5, wherein said determining whether said voltage drop is uniform further comprises:

acquiring a single-side voltage drop generated when the supply voltage supplies power to the test circuit through the power supply network; and

judging whether the single-side voltage drop is regular or not,

when the single-side voltage drop rule is adopted, the voltage drop is judged to be uniform,

when the single-side voltage drop is irregular, the power supply network is redesigned.

8. The test method of claim 5, wherein said determining whether said voltage drop is uniform further comprises:

obtaining a double-sided voltage drop generated when the supply voltage supplies power to the test circuit through the power supply network; and

determining whether the double-sided voltage drop is regular,

when the bilateral voltage drop rule is adopted, the voltage drop of the power supply network is judged to be uniform,

when the bilateral voltage drop is irregular, the power supply network is redesigned.

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