CN111785524A - High temperature resistant polymer aluminium solid capacitor - Google Patents
High temperature resistant polymer aluminium solid capacitor Download PDFInfo
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- CN111785524A CN111785524A CN202010679127.6A CN202010679127A CN111785524A CN 111785524 A CN111785524 A CN 111785524A CN 202010679127 A CN202010679127 A CN 202010679127A CN 111785524 A CN111785524 A CN 111785524A
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- solid capacitor
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- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 title claims abstract description 78
- 229910052782 aluminium Inorganic materials 0.000 title claims abstract description 78
- 229920000642 polymer Polymers 0.000 title claims abstract description 59
- 239000003990 capacitor Substances 0.000 title claims abstract description 54
- 239000007787 solid Substances 0.000 title claims abstract description 48
- 239000004411 aluminium Substances 0.000 title claims description 7
- 239000003822 epoxy resin Substances 0.000 claims abstract description 66
- 229920000647 polyepoxide Polymers 0.000 claims abstract description 66
- 229920001940 conductive polymer Polymers 0.000 claims abstract description 40
- 239000004593 Epoxy Substances 0.000 claims abstract description 15
- 238000007711 solidification Methods 0.000 claims abstract description 3
- 230000008023 solidification Effects 0.000 claims abstract description 3
- 239000010410 layer Substances 0.000 claims description 78
- 239000011888 foil Substances 0.000 claims description 32
- 239000011325 microbead Substances 0.000 claims description 30
- 238000001035 drying Methods 0.000 claims description 15
- 239000006185 dispersion Substances 0.000 claims description 13
- 239000000178 monomer Substances 0.000 claims description 13
- 239000007800 oxidant agent Substances 0.000 claims description 13
- 150000001338 aliphatic hydrocarbons Chemical class 0.000 claims description 11
- GYZLOYUZLJXAJU-UHFFFAOYSA-N diglycidyl ether Chemical compound C1OC1COCC1CO1 GYZLOYUZLJXAJU-UHFFFAOYSA-N 0.000 claims description 11
- -1 glycidyl ester Chemical class 0.000 claims description 11
- 239000011521 glass Substances 0.000 claims description 9
- 239000004845 glycidylamine epoxy resin Substances 0.000 claims description 9
- 239000000919 ceramic Substances 0.000 claims description 7
- 239000011324 bead Substances 0.000 claims description 6
- 239000000463 material Substances 0.000 claims description 6
- AFEQENGXSMURHA-UHFFFAOYSA-N oxiran-2-ylmethanamine Chemical compound NCC1CO1 AFEQENGXSMURHA-UHFFFAOYSA-N 0.000 claims description 2
- 239000013047 polymeric layer Substances 0.000 claims 2
- 238000006116 polymerization reaction Methods 0.000 abstract description 4
- 230000032683 aging Effects 0.000 abstract description 3
- 230000002035 prolonged effect Effects 0.000 abstract description 3
- 238000005470 impregnation Methods 0.000 description 23
- 238000004804 winding Methods 0.000 description 12
- 239000007788 liquid Substances 0.000 description 9
- 230000001590 oxidative effect Effects 0.000 description 8
- 235000015895 biscuits Nutrition 0.000 description 6
- 238000004519 manufacturing process Methods 0.000 description 6
- 230000035939 shock Effects 0.000 description 5
- 239000002390 adhesive tape Substances 0.000 description 3
- 238000005520 cutting process Methods 0.000 description 3
- 229920002521 macromolecule Polymers 0.000 description 3
- 238000004806 packaging method and process Methods 0.000 description 3
- 239000002245 particle Substances 0.000 description 2
- 230000002265 prevention Effects 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 239000003792 electrolyte Substances 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- 238000005096 rolling process Methods 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 229910052715 tantalum Inorganic materials 0.000 description 1
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 description 1
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G9/00—Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
- H01G9/004—Details
- H01G9/08—Housing; Encapsulation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G9/00—Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
- H01G9/15—Solid electrolytic capacitors
- H01G9/153—Skin fibre
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- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
Abstract
The invention relates to a high-temperature-resistant high-molecular aluminum solid capacitor, which solves the problems of poor high-temperature-resistant strength and poor anti-seismic performance of the high-molecular solid capacitor in the prior art. The utility model provides a high temperature resistant polymer aluminum solid capacitor, includes the plain son, the core of plain son is wrapped, wraps in proper order from inside to outside and is equipped with the conductive polymerization layer of first polymer, epoxy layer, the conductive polymerization layer of second polymer, epoxy antidetonation layer and aluminum hull, epoxy antidetonation layer is formed by the epoxy solution solidification that contains the microballon. According to the invention, through the arrangement of the double-layer epoxy resin, the epoxy resin protects the conductive polymer chain, the possibility of electric leakage of the polymer aluminum solid capacitor is reduced by utilizing the self characteristics of the epoxy resin, and the high-temperature resistance and ageing resistance of the polymer aluminum solid are improved, so that the service life of the polymer aluminum solid capacitor is prolonged, and the high-temperature resistant polymer aluminum solid capacitor is realized.
Description
Technical Field
The invention relates to a high-temperature-resistant high-molecular aluminum solid capacitor.
Background
The polymer solid capacitor is also called a polymer electrolytic capacitor, and is a solid electrolytic capacitor which replaces the traditional electrolyte with a polymer conductive material (PEDT), and the polymer solid electrolytic capacitor and the polymer solid tantalum electrolytic capacitor are two types at present.
The polymer solid capacitor is a main heat-generating device when in work, but if excessive heat is generated in work, the heat damage of the capacitor and other electronic elements can be influenced, so that the high temperature resistance of the polymer solid capacitor is improved, and the problem which needs to be solved is always solved; in addition, the working environment of the polymer solid capacitor is complex, and if the components of the bearing capacitor are accidentally knocked down, the fixed capacitor is extruded, so that a high-strength solid capacitor with certain shock resistance is lacked;
therefore, a high-temperature-resistant polymer aluminum solid capacitor is proposed, which improves the high-temperature resistance and the shock strength of the polymer aluminum solid capacitor, thereby improving the service life of the polymer aluminum solid capacitor.
Disclosure of Invention
The invention aims to provide a high-temperature-resistant high-molecular aluminum solid capacitor, which solves the problems of poor high-temperature-resistant strength and poor anti-seismic performance of the high-molecular solid capacitor in the prior art.
In order to achieve the purpose, the invention adopts the following technical scheme:
the utility model provides a high temperature resistant polymer aluminum solid capacitor, includes the plain son, the core of plain son is wrapped, wraps in proper order from inside to outside and is equipped with the conductive polymerization layer of first polymer, epoxy layer, the conductive polymerization layer of second polymer, epoxy antidetonation layer and aluminum hull, epoxy antidetonation layer is formed by the epoxy solution solidification that contains the microballon.
Preferably, the element comprises two pins, a positive aluminum foil and a negative aluminum foil which are respectively wound on the two pins, inner-layer electrolytic paper with two ends respectively wound on the positive aluminum foil and the negative aluminum foil, and outer-layer electrolytic paper wrapped outside the inner-layer electrolytic paper.
Preferably, the first polymer conductive polymer layer is formed by impregnating a conductive polymer monomer, an oxidizing agent and one or more of a dispersion liquid with an element under pressure and then drying the impregnated conductive polymer monomer, oxidizing agent and dispersion liquid.
Preferably, the epoxy resin layer is formed by impregnating a base material covering the first polymer conductive polymer layer with at least one of a glycidyl ether type epoxy resin, a glycidyl ester type epoxy resin, a glycidyl amine type epoxy resin, and an aliphatic hydrocarbon type epoxy resin under pressure, and then drying the impregnated base material.
Preferably, the second polymer conductive polymer layer is formed by impregnating a base material covered with the epoxy resin layer with one or more of a conductive polymer monomer, an oxidizing agent and a dispersion liquid under pressure and then drying the impregnated base material.
Preferably, the epoxy resin anti-seismic layer is formed by mixing microbeads with at least one of glycidyl ether epoxy resin, glycidyl ester epoxy resin, glycidyl amine epoxy resin and aliphatic hydrocarbon epoxy resin, immersing the element covered with the second polymer conductive polymer layer in the solution under pressure, and drying.
Preferably, the micro-beads are composed of any one or more of ceramic micro-beads, vitrified micro-beads or glass micro-beads.
The manufacturing method of the high-temperature-resistant polymer aluminum solid capacitor comprises the following steps of:
s1: manufacturing a biscuit, cutting the anode aluminum foil, the cathode aluminum foil and the electrolytic paper according to the design size through a rolling machine, respectively riveting the anode pin and the cathode pin on the anode aluminum foil and the cathode aluminum foil, then winding two ends of the inner layer of electrolytic paper outside the anode aluminum foil and the cathode aluminum foil, then winding the outer layer of electrolytic paper outside the inner layer of electrolytic paper, winding the outer layer of electrolytic paper into a circular or square shape, and finally winding a high-temperature-resistant insulating adhesive tape on the periphery of the circular or square shape to fix the outer layer of electrolytic paper to form the biscuit;
s2: a first impregnation stage, in which the element is impregnated in any one or more of a conductive polymer monomer, an oxidant or a dispersion liquid, and a pressurized impregnation environment is set to accelerate the impregnation efficiency of the solution and the element, and after impregnation, a first high molecular conductive polymer layer is formed by drying treatment;
s3: a second impregnation step of impregnating the element subjected to the treatment of the step S2 in at least one of a glycidyl ether epoxy resin, a glycidyl ester epoxy resin, a glycidyl amine epoxy resin, and an aliphatic hydrocarbon epoxy resin under a pressurized atmosphere, and then drying the impregnated element to form an epoxy resin anti-seismic layer;
s4: a third impregnation stage, in which the element treated in the step S3 is impregnated in any one or more of a conductive polymer monomer, an oxidant or a dispersion liquid under a pressurized environment, and is dried to form a second polymer conductive polymer layer;
s5: in the fourth impregnation stage, micro bead particles are added into at least one of glycidyl ether epoxy resin, glycidyl ester epoxy resin, glycidyl amine epoxy resin and aliphatic hydrocarbon epoxy resin, the micro beads consist of any one or more of ceramic micro beads, vitrified micro beads or glass micro beads, and then the element treated in the step S4 is impregnated in the solution under a pressurized environment and then is dried to form an epoxy resin anti-seismic layer;
s6: and packaging the element processed in the step S5 with an aluminum shell.
The invention has at least the following beneficial effects:
1. through double-deck epoxy's setting, epoxy forms the protection to electrically conductive polymer chain, utilizes epoxy's self characteristic, has reduced the possibility of polymer aluminium solid capacitor electric leakage, has improved the high temperature resistance ageing resistance's of polymer aluminium solid performance to improve polymer aluminium solid capacitor's life, realized a high temperature resistant polymer aluminium solid capacitor.
2. Through being in the interior doping of outer epoxy resin antidetonation layer with the microballon, no matter ceramic microballon, glass bead or glass bead all have very strong thermal-insulated fire prevention and rebound's performance to improve polymer aluminum solid capacitor's heat-resisting degree and intensity, the power of microballon degradable conduction to the condenser, with the damage that greatly reduced equipment brought because of vibrations for the condenser, improve the shock resistance of condenser, thereby improved polymer aluminum solid's life.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings needed to be used in the description of the embodiments are briefly introduced below, and it is obvious that the drawings in the following description are some embodiments of the present invention, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without creative efforts.
FIG. 1 is an expanded view of the internal structure of the element;
fig. 2 is a schematic sectional view of the internal structure of the capacitor.
In the figure: 1. a prime; 101. a pin; 102. a positive aluminum foil; 103. a negative aluminum foil; 104. inner layer electrolytic paper; 105. outer layer electrolytic paper; 2. a first polymer conductive polymer layer; 3. an epoxy resin layer; 4. a second polymer conductive polymer layer; 5. an epoxy resin anti-seismic layer; 6. and (4) an aluminum shell.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention is described in further detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.
Example one
Referring to fig. 1 and 2, a high-temperature-resistant polymer aluminum solid capacitor comprises a prime element 1, wherein a first polymer conductive polymer layer 2, an epoxy resin layer 3, a second polymer conductive polymer layer 4, an epoxy resin anti-seismic layer 5 and an aluminum shell 6 are sequentially wrapped on a core bag of the prime element 1 from inside to outside, the epoxy resin anti-seismic layer 5 is formed by curing an epoxy resin solution containing micro beads, and the micro beads are formed by any one or more of ceramic micro beads, vitrified micro beads or glass micro beads; the element 1 comprises two pins 101, a positive aluminum foil 102 and a negative aluminum foil 103 respectively wound on the two pins 101, an inner layer electrolytic paper 104 with two ends respectively wound on the positive aluminum foil 102 and the negative aluminum foil 103, and an outer layer electrolytic paper 105 wrapped outside the inner layer electrolytic paper 104, wherein the first macromolecule conductive polymer layer 2 is formed by pressure impregnation of the element 1 in one or more of conductive polymer monomer, oxidant and dispersion liquid, and then dried, the epoxy resin layer 3 is formed by pressure impregnation of the element 1 covered with the first macromolecule conductive polymer layer 2 in at least one of glycidyl ether epoxy resin, glycidyl ester epoxy resin, glycidyl amine epoxy resin and aliphatic hydrocarbon epoxy resin, and then dried, and the second macromolecule conductive polymer layer 4 is formed by pressure impregnation of the element 1 covered with the epoxy resin layer 3 in the conductive polymer monomer, the conductive polymer layer, After one or more of an oxidant and a dispersion liquid is added, drying is carried out to form the epoxy resin anti-seismic layer 5, and after microbeads are doped in at least one of glycidyl ether epoxy resin, glycidyl ester epoxy resin, glycidyl amine epoxy resin and aliphatic hydrocarbon epoxy resin, the pigment 1 which is covered with the second high-molecular conductive polymer layer 4 is soaked in the solution under pressure and then dried to form the second high-molecular conductive polymer layer;
the manufacturing method of the high-temperature-resistant polymer aluminum solid capacitor comprises the following steps of:
s1: manufacturing a biscuit 1, cutting a positive aluminum foil 102, a negative aluminum foil 103 and electrolytic paper according to the design size through a coil nailing machine, respectively riveting a positive pin 101 and a negative pin 101 on the positive aluminum foil 102 and the negative aluminum foil 103, then winding two ends of an inner layer of electrolytic paper 104 outside the positive aluminum foil 102 and the negative aluminum foil 103, then winding an outer layer of electrolytic paper 105 outside the inner layer of electrolytic paper 104, winding the electrolytic paper around a circular or square shape, and finally winding a high-temperature-resistant insulating adhesive tape on the periphery of the circular or square shape to fix the electrolytic paper to form the biscuit 1;
s2: a first impregnation stage, in which the element 1 is impregnated in any one or more of a conductive polymer monomer, an oxidant or a dispersion liquid, and a pressurized impregnation environment is set to accelerate the impregnation efficiency of the solution and the element 1, and after impregnation, the first polymer conductive polymer layer 2 is formed by drying treatment;
s3: a second impregnation step of impregnating element 1 treated in step S2 in at least one of glycidyl ether epoxy resin, glycidyl ester epoxy resin, glycidyl amine epoxy resin, and aliphatic hydrocarbon epoxy resin under pressure, and then drying the impregnated element to form epoxy resin anti-seismic layer 5;
s4: a third impregnation stage, in which the element 1 treated in the step S3 is impregnated in any one or more of a conductive polymer monomer, an oxidant or a dispersion under a pressurized environment, and is dried to form a second polymer conductive polymer layer 4;
s5: in the fourth impregnation stage, micro bead particles are added into at least one of glycidyl ether epoxy resin, glycidyl ester epoxy resin, glycidyl amine epoxy resin and aliphatic hydrocarbon epoxy resin, the micro beads consist of any one or more of ceramic micro beads, vitrified micro beads or glass micro beads, and then the element 1 treated in the step S4 is impregnated into the solution under a pressurized environment and then is dried to form an epoxy resin anti-seismic layer 5;
s6: packaging the element 1 processed in the step S5 with an aluminum shell 6;
in the embodiment, the double-layer epoxy resin is arranged, the epoxy resin protects the conductive polymer chain, the possibility of electric leakage of the polymer aluminum solid capacitor is reduced by utilizing the self characteristics of the epoxy resin, and the high-temperature resistance and ageing resistance of the polymer aluminum solid are improved, so that the service life of the polymer aluminum solid capacitor is prolonged, and the high-temperature resistant polymer aluminum solid capacitor is realized; meanwhile, the micro beads are doped in the epoxy resin anti-seismic layer 5 positioned on the outer layer, and no matter the micro beads are ceramic micro beads, vitrified micro beads or glass micro beads, the micro beads have strong heat insulation, fire prevention and rebound performances, so that the heat resistance and the strength of the high-molecular aluminum solid capacitor are improved, the micro beads can degrade and conduct the force to the capacitor, the damage of the capacitor caused by vibration of equipment is greatly reduced, and the anti-seismic property of the capacitor is improved.
The difference between the first embodiment and the second embodiment
Referring to fig. 1 and 2, a method for manufacturing a high-temperature-resistant polymer aluminum solid capacitor includes the following steps in sequence:
s1: manufacturing a biscuit 1, cutting a positive aluminum foil 102, a negative aluminum foil 103 and electrolytic paper according to the design size through a coil nailing machine, respectively riveting a positive pin 101 and a negative pin 101 on the positive aluminum foil 102 and the negative aluminum foil 103, then winding two ends of an inner layer of electrolytic paper 104 outside the positive aluminum foil 102 and the negative aluminum foil 103, then winding an outer layer of electrolytic paper 105 outside the inner layer of electrolytic paper 104, winding the electrolytic paper around a circular or square shape, and finally winding a high-temperature-resistant insulating adhesive tape on the periphery of the circular or square shape to fix the electrolytic paper to form the biscuit 1;
s2: a first impregnation stage, in which the element 1 is impregnated in any one or more of a conductive polymer monomer, an oxidant or a dispersion liquid, and a pressurized impregnation environment is set to accelerate the impregnation efficiency of the solution and the element 1, and after impregnation, the first polymer conductive polymer layer 2 is formed by drying treatment;
s3: a second impregnation step of impregnating element 1 treated in step S2 in at least one of glycidyl ether epoxy resin, glycidyl ester epoxy resin, glycidyl amine epoxy resin, and aliphatic hydrocarbon epoxy resin under pressure, and then drying the impregnated element to form epoxy resin anti-seismic layer 5;
s4: a third impregnation stage, in which the element 1 treated in the step S3 is impregnated in any one or more of a conductive polymer monomer, an oxidant or a dispersion under a pressurized environment, and is dried to form a second polymer conductive polymer layer 4;
s5: packaging the element 1 processed in the step S4 with an aluminum shell 6;
in this embodiment, the single-layer epoxy resin is provided to a certain extent to improve the heat resistance compared with a capacitor not impregnated with epoxy resin, but the shock resistance of the capacitor is slightly inferior to that of the epoxy resin layer doped with the microbeads, so that the shock resistance and the high temperature resistance of the polymer aluminum solid capacitor are improved, and the service life of the polymer aluminum solid capacitor can be prolonged.
The foregoing shows and describes the general principles, essential features, and advantages of the invention. It will be understood by those skilled in the art that the present invention is not limited to the embodiments described above, which are merely illustrative of the principles of the invention, but that various changes and modifications may be made without departing from the spirit and scope of the invention, which fall within the scope of the invention as claimed. The scope of the invention is defined by the appended claims and equivalents thereof.
Claims (7)
1. The utility model provides a high temperature resistant polymer aluminium solid capacitor, includes plain son (1), its characterized in that, on the core package of plain son (1), wrap up first polymer conductive polymer layer (2), epoxy layer (3), second polymer conductive polymer layer (4), epoxy antidetonation layer (5) and aluminum hull (6) from inside to outside in proper order, epoxy antidetonation layer (5) are formed by the epoxy solution solidification that contains the microballon.
2. The high-temperature-resistant polymer aluminum solid capacitor as claimed in claim 1, wherein the element (1) comprises two pins (101), a positive aluminum foil (102) and a negative aluminum foil (103) respectively wound around the two pins (101), an inner layer of electrolytic paper (104) with two ends respectively wound around the positive aluminum foil (102) and the negative aluminum foil (103), and an outer layer of electrolytic paper (105) wrapped outside the inner layer of electrolytic paper (104).
3. The high-temperature-resistant polymer aluminum solid capacitor according to claim 1, wherein the first polymer conductive polymer layer (2) is formed by impregnating the element (1) with one or more of a conductive polymer monomer, an oxidizing agent and a dispersion under pressure and then drying the impregnated element.
4. The high-temperature-resistant polymeric aluminum solid capacitor according to claim 1, wherein the epoxy resin layer (3) is formed by impregnating the element (1) covered with the first polymeric conductive polymeric layer (2) with at least one of glycidyl ether epoxy resin, glycidyl ester epoxy resin, glycidyl amine epoxy resin, and aliphatic hydrocarbon epoxy resin under pressure and then drying.
5. The high-temperature-resistant polymeric aluminum solid capacitor according to claim 1, wherein the second polymeric conductive polymer layer (4) is formed by impregnating the element (1) covered with the epoxy resin layer (3) with one or more of a conductive polymer monomer, an oxidizing agent and a dispersion under pressure and then drying the impregnated element.
6. The high-temperature-resistant polymeric aluminum solid capacitor as claimed in claim 1, wherein the epoxy resin anti-seismic layer (5) is formed by impregnating a base material (1) covered with the second polymeric conductive polymeric layer (4) with pressure after incorporating microbeads into at least one of glycidyl ether type epoxy resin, glycidyl ester type epoxy resin, glycidyl amine type epoxy resin, and aliphatic hydrocarbon type epoxy resin, and drying the impregnated base material.
7. The high temperature resistant polymer aluminum solid capacitor according to claim 1, wherein the beads are composed of any one or more of ceramic beads, glass beads or glass beads.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010679127.6A CN111785524A (en) | 2020-07-15 | 2020-07-15 | High temperature resistant polymer aluminium solid capacitor |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010679127.6A CN111785524A (en) | 2020-07-15 | 2020-07-15 | High temperature resistant polymer aluminium solid capacitor |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112509814A (en) * | 2020-11-11 | 2021-03-16 | 上海永铭电子股份有限公司 | High-temperature and high-humidity resistant laminated aluminum solid-state capacitor and preparation method thereof |
-
2020
- 2020-07-15 CN CN202010679127.6A patent/CN111785524A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112509814A (en) * | 2020-11-11 | 2021-03-16 | 上海永铭电子股份有限公司 | High-temperature and high-humidity resistant laminated aluminum solid-state capacitor and preparation method thereof |
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