CN111783380A - Design method of packaging device and entity packaging device - Google Patents
Design method of packaging device and entity packaging device Download PDFInfo
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- CN111783380A CN111783380A CN202010600319.3A CN202010600319A CN111783380A CN 111783380 A CN111783380 A CN 111783380A CN 202010600319 A CN202010600319 A CN 202010600319A CN 111783380 A CN111783380 A CN 111783380A
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- 238000004806 packaging method and process Methods 0.000 title claims abstract description 131
- 238000000034 method Methods 0.000 title claims abstract description 32
- 238000004088 simulation Methods 0.000 claims abstract description 124
- 239000007787 solid Substances 0.000 claims abstract description 43
- 238000012360 testing method Methods 0.000 claims abstract description 42
- 239000000463 material Substances 0.000 claims abstract description 10
- 239000002184 metal Substances 0.000 claims description 59
- 230000035882 stress Effects 0.000 description 74
- 238000010586 diagram Methods 0.000 description 7
- 238000009826 distribution Methods 0.000 description 4
- 238000005538 encapsulation Methods 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- 238000000465 moulding Methods 0.000 description 4
- 229910000679 solder Inorganic materials 0.000 description 3
- 150000001875 compounds Chemical class 0.000 description 2
- 238000005336 cracking Methods 0.000 description 2
- 238000009662 stress testing Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 230000008602 contraction Effects 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 230000009977 dual effect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 238000001000 micrograph Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012536 packaging technology Methods 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 230000008646 thermal stress Effects 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical class O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F30/00—Computer-aided design [CAD]
- G06F30/30—Circuit design
- G06F30/39—Circuit design at the physical level
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
- H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
- H01L23/49575—Assemblies of semiconductor devices on lead frames
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F2113/00—Details relating to the application field
- G06F2113/18—Chip packaging
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F2119/00—Details relating to the type or aim of the analysis or the optimisation
- G06F2119/14—Force analysis or force optimisation, e.g. static or dynamic forces
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/34—Strap connectors, e.g. copper straps for grounding power devices; Manufacturing methods related thereto
- H01L2224/39—Structure, shape, material or disposition of the strap connectors after the connecting process
- H01L2224/40—Structure, shape, material or disposition of the strap connectors after the connecting process of an individual strap connector
- H01L2224/401—Disposition
- H01L2224/40151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/40221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/40245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
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Abstract
The application discloses a design method of a packaging device and a solid packaging device. The design method of the packaging device comprises the steps of firstly constructing a simulation model of the packaging device, wherein the simulation model is composed of a plurality of component parts, and each component part is provided with corresponding material parameters; then the simulation model is placed in a physical field to obtain a stress value at a preset position; and then judging whether the simulation model is directly output as the structure of the solid packaging device or continuously improving the simulation model by modifying the sizes of part of the components according to the stress value. According to the method and the device, the stress test is completed at the structural design stage of the solid packaging device and the simulation model is improved according to the stress test result by constructing the simulation model of the packaging device and calculating the stress of the packaging device, so that the output simulation model of the packaging device meets the requirement of the stress test, the dependence of the stress test of the packaging device on the solid packaging device is reduced, and the failure rate of the solid packaging device is also reduced.
Description
Technical Field
The present application relates to the field of packaging technologies, and in particular, to a method for designing a packaged device and a solid packaged device.
Background
Packaged devices typically include a variety of materials, some of which may deform when the packaged device is subjected to different usage environments, thereby accumulating stress within the packaged device, which may, to a certain extent, cause cracks within the packaged device, thereby causing the packaged device to fail. The technical problem cannot be found in the production stage of the packaged device, and can be found only when the physical packaged device is subjected to stress testing after being produced, namely the stress testing of the packaged device has higher dependence on the physical packaged device.
Disclosure of Invention
The technical problem mainly solved by the application is to provide a design method of a packaging device and a solid packaging device, which can reduce the dependence of the stress test of the packaging device on the solid packaging device.
In order to solve the technical problem, the application adopts a technical scheme that:
provided is a design method of a packaged device, including: constructing a simulation model of a packaging device, wherein the simulation model of the packaging device is composed of a plurality of component parts, and each component part is provided with corresponding material parameters; placing the simulation model of the packaging device in a physical field, and obtaining a stress value at a preset position of the simulation model of the packaging device; judging whether the stress value is smaller than a preset stress threshold value or not; if the current simulation model of the packaged device is smaller than the current simulation model of the packaged device, outputting the current simulation model of the packaged device as the structure of the entity packaged device; otherwise, adjusting the size of at least part of the components in the simulation model of the packaged device, and returning to the step of constructing the simulation model of the packaged device.
Wherein the step of obtaining the stress value at the predetermined position of the simulation model of the packaged device comprises: dividing the simulation model of the packaging device into a plurality of grids, and acquiring the stress value of the simulation model of the packaging device at the position corresponding to each grid; and acquiring the average value of the stress values of a plurality of grids corresponding to the preset positions and taking the average value as the stress value at the preset positions.
The solid packaging device is a DFN packaging device, and the packaging device simulation model is a DFN packaging device simulation model; the packaging device simulation model comprises a frame, a chip positioned on one side of the frame, a metal sheet and a plastic packaging layer; the non-functional surface of the chip faces the frame, the metal sheet is positioned on one side of the functional surface of the chip, the bonding pad on the functional surface of the chip is electrically connected with the frame through the metal sheet, and the plastic package layer covers the metal sheet and the chip; the predetermined position is a position where the solid packaging device is in contact with a testing ejector rod of a packaging device testing machine.
Wherein when the stress value at the predetermined position is not less than the stress threshold, the step of adjusting the dimensions of at least part of the components in the packaged device simulation model comprises: reducing the area of the metal sheet at the predetermined location.
Wherein the step of reducing the area of the metal sheet at the predetermined position comprises: and removing part of the metal sheet at the preset position to form a groove on the metal sheet at the preset position.
Wherein the physical field comprises a temperature variation field, and the step of placing the packaged device simulation model in the physical field comprises: and placing the packaged device simulation model in a temperature change field, so that the temperature of the packaged device simulation model is changed from a first temperature to a second temperature.
Wherein the material parameter comprises a coefficient of thermal expansion.
Wherein the step of constructing a simulation model of the packaged device comprises: and constructing the packaged device simulation model in ANSYS software.
In order to solve the above technical problem, another technical solution adopted by the present application is:
and providing a solid packaging device, wherein the structure of the solid packaging device is formed by the design method in the technical scheme.
Wherein, the solid packaging device is a DFN packaging device, including: the chip packaging structure comprises a frame, a chip positioned on one side of the frame, a metal sheet and a plastic packaging layer; the non-functional surface of the chip faces the frame, the metal sheet is positioned on one side of the functional surface of the chip, the bonding pad on the functional surface of the chip is electrically connected with the frame through the metal sheet, and the plastic package layer covers the metal sheet and the chip; the metal sheet is provided with a groove at a preset position, and the preset position is a position where the solid packaging device is contacted with a testing ejector rod of a packaging device testing machine.
The beneficial effect of this application is: different from the situation of the prior art, the design method of the packaging device provided by the application firstly constructs a simulation model of the packaging device, the simulation model is composed of a plurality of component parts, and each component part is provided with corresponding material parameters; then the simulation model is placed in a physical field to obtain a stress value at a preset position; and then judging whether the simulation model is directly output as the structure of the solid packaging device or continuously improving the simulation model by modifying the sizes of part of the components according to the stress value. According to the method and the device, the stress test is completed at the structural design stage of the solid packaging device and the simulation model is improved according to the stress test result by constructing the simulation model of the packaging device and calculating the stress of the packaging device, so that the output simulation model of the packaging device meets the requirement of the stress test, the dependence of the stress test of the packaging device on the solid packaging device is reduced, and the failure rate of the solid packaging device is also reduced.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings needed to be used in the description of the embodiments will be briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present application, and it is obvious for those skilled in the art to obtain other drawings without creative efforts. Wherein:
FIG. 1 is a schematic flow chart diagram illustrating an embodiment of a method for designing a packaged device according to the present application;
FIG. 2 is a schematic diagram of a structure of an embodiment of a simulation model of a packaged device;
FIG. 3 is a schematic flow chart illustrating one embodiment of the step included in step S12 in FIG. 1;
FIG. 4a is a stress distribution diagram of a simulation model of a packaged device before adjustment of a metal sheet;
FIG. 4b is a stress distribution diagram of the simulation model of the packaged device after the adjustment of the metal sheet;
FIG. 5 is a comparative scanning electron microscope image before and after the adjustment of the metal piece.
Detailed Description
The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is apparent that the described embodiments are only a part of the embodiments of the present application, and not all of the embodiments. All other embodiments that can be obtained by a person skilled in the art without making any inventive step based on the embodiments in the present application belong to the protection scope of the present application.
Referring to fig. 1, fig. 1 is a schematic flow chart illustrating an embodiment of a design method of a package device according to the present application, the design method including the following steps:
s11, constructing a simulation model of the packaging device, wherein the simulation model of the packaging device is composed of a plurality of components, and each component is provided with corresponding material parameters.
Specifically, a packaged device simulation model may be built in ANSYS software. In the present application, the solid Package device corresponding to the Package device simulation model is a DFN (Dual Flat No-lead Package) Package device, and the Package device simulation model is a DFN Package device simulation model. Referring to fig. 2, fig. 2 is a schematic structural diagram of an embodiment of a simulation model of a package device, the simulation model of the package device is composed of a plurality of components, and specifically includes a frame 11, a chip 12 located on one side of the frame 11, a metal sheet 13, a plastic encapsulation layer, a bonding layer connecting the frame 11 and the chip 12, and a bonding layer connecting the chip 12 and the metal sheet 13, wherein a non-functional surface of the chip 12 faces the frame 11, the metal sheet 13 is located on one side of a functional surface of the chip 12, a pad on the functional surface of the chip 12 is electrically connected to the frame 11 through the metal sheet 13, and the plastic encapsulation layer covers the metal sheet 13 and the metal sheet 13The chip 12, the molding layer and the bonding layer are not shown in fig. 2 for clarity of illustration. After building the simulation model of the packaged device, corresponding material parameters are set for each component part, preferably the thermal expansion coefficient of each component part. Specifically, as shown in table 1, table 1 shows the thermal expansion coefficients of the package device simulation model and the component parts, where the unit of the thermal expansion coefficient is 10-6℃-1。
TABLE 1 thermal expansion coefficients of the component parts and simulation model of the packaged device
| Component parts | Coefficient of thermal expansion |
| Frame structure | 17.3 |
| Metal sheet | 17.3 |
| Solder layer | 29 |
| Chip and method for manufacturing the same | 2.6 |
| Plastic packaging layer | 10 |
And S12, placing the simulation model of the packaging device in a physical field, and acquiring the stress value at the preset position of the simulation model of the packaging device.
After a simulation model of the package device is constructed and material parameters of each component are set, the simulation model of the package device is placed in a physical field, which is a temperature change field in the embodiment. The step of placing the packaged device simulation model in a physical field comprises:
and placing the packaged device simulation model in a temperature change field, so that the temperature of the packaged device simulation model is changed from the first temperature to the second temperature.
And then acquiring the stress value at the preset position of the simulation model of the packaged device in ANSYS software.
Due to the fact that the thermal expansion coefficients of all the components of the solid packaging device are different, when the solid packaging device undergoes temperature change, the expansion degree and the contraction degree of all the components are different, warping deformation and other phenomena can be caused, stress is accumulated in the solid packaging device, cracks are prone to being generated at stress concentration positions, failure and cracking of the solid packaging device are caused, detection of products of the solid packaging device is unqualified, and yield is reduced. Further, the plastic sealing layer generates gas at a high temperature to form saturated water vapor, and as the amount of the vapor increases, thermal stress is generated in the packaged device, and cracks are also easily generated at the stress concentration portion. In response to the technical problem, the present application provides a design method for a package device, which constructs a simulation model of the package device in software in a simulation manner before the solid package device is produced, and obtains a stress value at a predetermined position for further judgment.
Specifically, the deformation of each component part after undergoing a temperature change can be calculated using the following formula:
where Δ l is the amount of deformation, l is the length of the object, α (t) is the coefficient of thermal expansion of the object, t1、t2Respectively, the initial temperature and the final temperature experienced by each component part.
After the solid packaging device is produced, the solid packaging device needs to be tested on a testing machine, a testing ejector rod on the testing machine can be in contact with a preset position of the solid packaging device and applies pressure stress, cracks are easy to generate at the position, and therefore the preset position is the position where the solid packaging device is in contact with the testing ejector rod of the packaging device testing machine.
And S13, judging whether the stress value is smaller than a preset stress threshold value.
And after the stress value at the preset position of the simulation model of the packaging device is obtained in ANSYS software, judging whether the stress value is smaller than a preset stress threshold value. To determine whether the physical package device corresponding to the constructed simulation model of the package device meets the requirement of the stress test, the relationship between the stress value at the predetermined position of the simulation model of the package device and the preset stress threshold needs to be determined. The stress threshold may be set based on manufacturing experience.
And S14, if yes, outputting the current packaged device simulation model as the structure of the entity packaged device.
If the stress value at the preset position of the simulation model of the packaging device is smaller than the preset stress threshold value, the situation that cracks are not generated after the preset position of the entity packaging device corresponding to the constructed simulation model of the packaging device is contacted with the test ejector rod, and the failure and the cracking of the entity packaging device are not caused is shown. The current simulation model of the packaged device can be output as the structure of the solid packaged device so as to produce the solid packaged device according to the simulation model of the packaged device.
And S15, otherwise, adjusting the size of at least part of the components in the simulation model of the packaged device, and returning to the step of constructing the simulation model of the packaged device.
If the stress value at the preset position of the simulation model of the packaging device is not less than the preset stress threshold value, it is indicated that cracks are likely to be generated after the preset position of the entity packaging device corresponding to the constructed simulation model of the packaging device is contacted with the test ejector rod, so that the entity packaging device is failed and cracked. That is, the package device simulation model constructed this time does not meet the requirement of the stress test, the sizes of at least part of the components in the package device simulation model need to be adjusted, and the step of constructing the package device simulation model is returned to adjust the structure of the current package device simulation model.
According to the method, the stress test is completed in the structural design stage of the entity packaging device and the simulation model is improved according to the stress test result by constructing the simulation model of the packaging device and calculating the stress at the preset position, so that the output simulation model of the packaging device meets the requirement of the stress test, the dependence of the stress test of the packaging device on the entity packaging device is reduced, the failure rate of the entity packaging device is reduced, and the yield is improved. And the scheme for adjusting the simulation model of the packaging device is easy to operate and low in cost.
Further, with continuing reference to fig. 1 and fig. 2, step S15 in the above embodiment includes: and reducing the area of the metal sheet at a preset position, wherein the preset position is a position where the solid packaging device is contacted with a test ejector rod of a packaging device testing machine, namely a position where cracks are more easily generated.
In this application, the solid packaging device uses the metal sheet 13 to electrically connect the bonding pad on the functional surface of the chip 12 and the frame 11, so that the function of rewiring is achieved, the current bearing capacity of the packaging device can be improved, the on-resistance of the packaging device is reduced, and the heat dissipation performance of the packaging device can be improved. However, if the area of the metal sheet 13 is too large, the deformation space of each component part inside the package device may be insufficient, and stress may be easily accumulated, thereby causing cracks. Therefore, a reasonable shape and area of the metal sheet 13 are required. Therefore, if the stress value at the predetermined position of the package device simulation model is not less than the preset stress threshold, the area of the metal sheet 13 at the predetermined position can be reduced.
Specifically, a part of the metal sheet 13 at a predetermined position is removed, so that the metal sheet 13 forms a groove at the predetermined position, for example, when the predetermined position is on the lower side of the metal sheet 13 in fig. 2, the groove shown in fig. 2 is formed in the middle of the lower side of the metal sheet 13, and a new packaged device simulation model is obtained. And then acquiring the stress value at the preset position and judging the relation between the stress value and the stress threshold, if the stress value is still greater than the stress threshold at the moment, further expanding the groove on the basis of the current groove, for example, expanding the groove in the figure 2 to the left and the right to obtain an updated version of the simulation model of the packaging device. And circulating the steps until the stress value at the preset position is not greater than the stress threshold value, outputting the latest version of the simulation model of the packaging device as the structure of the entity packaging device, and carrying out the next production link.
Of course, if the predetermined location is in the middle of the metal sheet, vias may be formed in the middle of the metal sheet to reduce the area of the metal sheet 13, provided that the electrical path of the packaged device is not affected.
In the embodiment, when the current packaged device simulation model does not meet the requirement of the stress test, the packaged device simulation model is adjusted by reducing the area of the preset position of the metal sheet to meet the requirement of the stress test, so that the entity packaged device with higher yield can be produced.
Referring to fig. 3, fig. 3 is a schematic flowchart illustrating an embodiment of the step S12 in fig. 1, where the step S12 specifically includes the following steps:
and S21, placing the packaged device simulation model in a physical field.
Specifically, the physical field is a temperature variation field, that is, the packaged device simulation model is placed in the temperature variation field, so that the temperature of the packaged device simulation model is changed from a first temperature to a second temperature.
And S22, dividing the simulation model of the packaging device into a plurality of grids, and acquiring the stress value of the simulation model of the packaging device at the position corresponding to each grid.
In order to make the simulation result more accurate, a finite element method can be specifically adopted to calculate the stress value of the simulation model of the packaging device, the simulation model of the packaging device is firstly divided into a plurality of very small grids, and the stress value of the corresponding position of each grid is obtained.
And S23, acquiring the average value of the stress values of the grids corresponding to the preset positions and taking the average value as the stress value at the preset positions.
After the stress value at the position corresponding to each grid is obtained, a plurality of grids corresponding to the preset positions are determined, and the average value of the stress of the plurality of grids is used as the stress value at the preset positions, wherein the preset positions are positions where the entity packaging device is in contact with a test ejector rod of a packaging device testing machine, namely positions where cracks are more easily generated.
According to the embodiment, the stress value at the preset position of the simulation model of the packaging device is accurately calculated through the finite element method, so that the shape and the area of the metal sheet can be more accurately adjusted, the simulation model of the packaging device meeting the stress test standard is obtained, and the yield of the entity packaging device produced according to the simulation model of the packaging device is improved.
The following describes a design method of the package device according to the present application with reference to a specific application scenario. Referring to fig. 4a and 4b, fig. 4a is a stress distribution diagram of a simulation model of an encapsulated device before adjusting a metal sheet, and fig. 4b is a stress distribution diagram of a simulation model of an encapsulated device after adjusting a metal sheet. As can be seen from fig. 4a and 4b, the stress value at the predetermined position of the simulation model of the packaged device is reduced from about 96 before the adjustment to about 76 after the adjustment. That is to say, after the metal sheet at the predetermined position is removed and the groove structure is formed, the stress value at the predetermined position can be reduced, and the entity packaging device correspondingly produced by the adjusted simulation model of the packaging device is not easy to crack, so that the yield is higher. In order to verify the simulation effect, the solid packaging devices corresponding to the simulation models of the two packaging devices before and after adjustment in fig. 4a and 4b are produced, a test ejector rod is used for applying compressive stress to a preset position in a later test, and then a scanning electron microscope picture is taken. As a result, as shown in fig. 5, fig. 5 is a comparison graph of the scanning electron microscope before and after the adjustment of the metal sheet, cracks were generated at the predetermined positions of the solid encapsulation device before the adjustment, and cracks were not generated at the predetermined positions of the solid encapsulation device after the adjustment. Therefore, the design method of the packaging device can reduce the dependence of the stress test of the packaging device on the entity packaging device, also reduce the failure rate of the entity packaging device and improve the yield.
The present application also provides a solid package device, the structure of which is formed by the method for designing a package device according to any of the above embodiments. Referring to fig. 2, the solid package device of the present application has the same structure as the simulation model of the package device in fig. 2. Specifically, the solid package device is a DFN package device, and includes a frame 11, a chip 12 located on one side of the frame 11, a metal sheet 13, a molding compound layer, and a solder layer connecting the frame 11 and the chip 12, and connecting the chip 12 and the metal sheet 13, where a non-functional surface of the chip 12 faces the frame 11, the metal sheet 13 is located on one side of a functional surface of the chip 12, a pad on the functional surface of the chip 12 is electrically connected to the frame 11 through the metal sheet 13, and the molding compound layer covers the metal sheet 13 and the chip 12. The molding layer and the solder layer are not shown in fig. 2 for clarity of illustration. The metal sheet 13 is provided with a groove at a predetermined position, and the predetermined position is a position where the package device is in contact with a test ejector pin of the package device tester, that is, a position where cracks are more likely to occur.
The solid packaging device provided by the embodiment is not easy to crack when being contacted with the test ejector rod of the tester subsequently, the failure rate is lower, and the yield is higher.
The above description is only for the purpose of illustrating embodiments of the present application and is not intended to limit the scope of the present application, and all modifications of equivalent structures and equivalent processes, which are made by the contents of the specification and the drawings of the present application or are directly or indirectly applied to other related technical fields, are also included in the scope of the present application.
Claims (10)
1. A method of designing a packaged device, comprising:
constructing a simulation model of a packaging device, wherein the simulation model of the packaging device is composed of a plurality of component parts, and each component part is provided with corresponding material parameters;
placing the simulation model of the packaging device in a physical field, and obtaining a stress value at a preset position of the simulation model of the packaging device;
judging whether the stress value is smaller than a preset stress threshold value or not;
if so, outputting the current simulation model of the packaging device as the structure of the entity packaging device;
otherwise, adjusting the size of at least part of the components in the simulation model of the packaged device, and returning to the step of constructing the simulation model of the packaged device.
2. The design method of claim 1, wherein the step of obtaining stress values at predetermined locations of the simulation model of the packaged device comprises:
dividing the simulation model of the packaging device into a plurality of grids, and acquiring the stress value of the simulation model of the packaging device at the position corresponding to each grid;
and acquiring the average value of the stress values of a plurality of grids corresponding to the preset positions and taking the average value as the stress value at the preset positions.
3. The design method according to claim 1,
the solid packaging device is a DFN packaging device, and the packaging device simulation model is a DFN packaging device simulation model;
the packaging device simulation model comprises a frame, a chip positioned on one side of the frame, a metal sheet and a plastic packaging layer; the non-functional surface of the chip faces the frame, the metal sheet is positioned on one side of the functional surface of the chip, the bonding pad on the functional surface of the chip is electrically connected with the frame through the metal sheet, and the plastic package layer covers the metal sheet and the chip;
the predetermined position is a position where the solid packaging device is in contact with a testing ejector rod of a packaging device testing machine.
4. The design method according to claim 3, wherein when the stress value at the predetermined position is not less than the stress threshold, the step of adjusting the dimensions of at least some of the components in the simulation model of the packaged device comprises:
reducing the area of the metal sheet at the predetermined location.
5. The design method of claim 4, wherein the step of reducing the area of the metal sheet at the predetermined location comprises:
and removing part of the metal sheet at the preset position to form a groove on the metal sheet at the preset position.
6. The design method of claim 1, wherein the physical field comprises a temperature variation field, and wherein the step of placing the packaged device simulation model in the physical field comprises:
and placing the packaged device simulation model in a temperature change field, so that the temperature of the packaged device simulation model is changed from a first temperature to a second temperature.
7. The design method of claim 6, wherein the material parameter comprises a coefficient of thermal expansion.
8. The design method of claim 1, wherein the step of building a simulation model of the packaged device comprises:
and constructing the packaged device simulation model in ANSYS software.
9. A solid-encapsulated device, characterized in that the structure of the solid-encapsulated device is formed by the design method of the encapsulated device according to any of claims 1-8.
10. The physical package device of claim 9, wherein the physical package device is a DFN package device comprising: the chip packaging structure comprises a frame, a chip positioned on one side of the frame, a metal sheet and a plastic packaging layer; the bonding pad on the functional surface of the chip is electrically connected with the frame through the metal sheet, and the plastic package layer covers the metal sheet and the chip; the metal sheet is provided with a groove at a preset position, and the preset position is a position where the solid packaging device is contacted with a testing ejector rod of a packaging device testing machine.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010600319.3A CN111783380A (en) | 2020-06-28 | 2020-06-28 | Design method of packaging device and entity packaging device |
Applications Claiming Priority (1)
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