CN111775355A - IC semiconductor chip cutting clamp - Google Patents
IC semiconductor chip cutting clamp Download PDFInfo
- Publication number
- CN111775355A CN111775355A CN202010675204.0A CN202010675204A CN111775355A CN 111775355 A CN111775355 A CN 111775355A CN 202010675204 A CN202010675204 A CN 202010675204A CN 111775355 A CN111775355 A CN 111775355A
- Authority
- CN
- China
- Prior art keywords
- base
- storage box
- dust
- semiconductor chip
- chip cutting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
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Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
- B28D5/0082—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
- B28D5/0076—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for removing dust, e.g. by spraying liquids; for lubricating, cooling or cleaning tool or work
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Processing Of Stones Or Stones Resemblance Materials (AREA)
Abstract
The invention discloses an IC semiconductor chip cutting clamp which comprises a base and two side plates on the upper part of the base, wherein the two side plates are both arranged on the side edge of the upper part of the base in a sliding mode, the upper part of the base is connected with an elastic base plate, one side of the end part of the base is connected with a water inlet pipe, the other side of the end part of the base is connected with a water outlet pipe, a bent cooling water pipe is connected between the water inlet pipe and the water outlet pipe, and the cooling. Through installation dust absorption board and storing box for in the chip cutting, the dust absorption board can absorb the dust that the cutting produced, and the dust is inhaled the inside of dust absorption board, enters into the inside of bin at last, and the dust can obtain good processing. And the dust with larger weight can enter the inside of the storage box in the process of moving to the dust collection plate, and large impurities can be stored in the storage box. When the impurity in the storing box is cleared up, take out the storing box from the inside of loading groove and can accomplish and empty. Impurity clearance convenient and fast.
Description
Technical Field
The invention relates to a cutting clamp, in particular to an IC semiconductor chip cutting clamp, and belongs to the field of chip processing application.
Background
The semiconductor chip is etched and wired on the semiconductor wafer to form a semiconductor device capable of realizing a certain function. Semiconductor materials such as gallium arsenide and germanium are also commonly included, not just silicon chips. In order to make the size of the semiconductor chip meet the actual use standard, the chip is often cut. And during cutting, the chip is clamped and fixed by using a clamp, so that the cutting precision is ensured.
The existing semiconductor chip cutting clamp still has certain defects in use. The existing semiconductor chip cutting clamp is simple in structure, not convenient and fast enough for clamping chips, and the chips are easy to damage in the cutting process. Meanwhile, impurities generated in cutting are difficult to clean, influence on cutting of the chip and simultaneously pollute the environment.
Disclosure of Invention
The invention aims to provide an IC semiconductor chip cutting clamp which can solve the problems that the existing semiconductor chip cutting clamp is simple in structure, cannot clamp a chip conveniently and quickly enough, and the chip is easy to damage in the cutting process. Meanwhile, impurities generated in cutting are difficult to clean, influence on cutting of the chip and simultaneously pollute the environment.
The purpose of the invention can be realized by the following technical scheme:
the utility model provides a IC semiconductor chip cutting jig, includes base and two curb plates on its upper portion, two the equal slidable mounting of curb plate is at the upper portion side of base, and the upper portion of base is connected with flexible backing plate, and tip one side of base is connected with the inlet tube, and the tip opposite side is connected with the outlet pipe, is connected with crooked condenser tube between inlet tube and the outlet pipe, and condenser tube installs the inside at the base.
Preferably, the top both sides of base all are provided with the sliding tray along width direction, and the elastic backing plate is run through on the upper portion of sliding tray, and the inside of sliding tray installs the slide rail along length direction, and electronic slider is all installed to the bottom both sides of curb plate, and electronic slider slidable mounting is on the slide rail.
Preferably, the detachable storing box is installed to the top one end of base, and storing box bottom both sides all are connected with the inserted bar, and the top of base is provided with the loading groove in the below of storing box, and the size of loading groove and the size looks adaptation of storing box all are provided with the jack at the inside both ends of loading groove, and the inserted bar is pegged graft in the inside of jack.
Preferably, the top one end of base is connected with the bin, and the storing box sets up between bin and curb plate, and the dust absorption board is installed to one side that the bin is close to the storing box.
Preferably, a sealing gasket is arranged at the joint of the storage box and the loading groove.
The invention has the beneficial effects that:
1. by mounting the two movable side plates, the chip to be cut and processed can be placed on the upper part of the base and between the two side plates in operation. The electric slide block drives the side plates to move, so that the two side plates can move towards the chip and are clamped and fixed until the two sides of the chip are clamped, and the two side plates can adapt to chips of different sizes, so that the chip is fixed conveniently and quickly. The bottom of the chip is in contact with the elastic base plate, and the elastic base plate can well coat the chip, so that the chip can be well fixed on the elastic base plate and is not easy to slide, and the chip cannot be damaged in cutting.
2. Through installation dust absorption board and storing box for in the chip cutting, the dust absorption board can absorb the dust that the cutting produced, and the dust is inhaled the inside of dust absorption board, enters into the inside of bin at last, and the dust can obtain good processing. And the dust with larger weight can enter the inside of the storage box in the process of moving to the dust collection plate, and large impurities can be stored in the storage box. When the impurity in the storing box is cleared up, take out the storing box from the inside of loading groove and can accomplish and empty. Impurity clearance convenient and fast.
Drawings
In order to facilitate understanding for those skilled in the art, the present invention will be further described with reference to the accompanying drawings.
Fig. 1 is a schematic view of the overall structure of the present invention.
FIG. 2 is a schematic view of the storage box of the present invention.
FIG. 3 is a bottom view of the side panel of the present invention.
In the figure: 1. a base; 2. a water inlet pipe; 3. an elastic backing plate; 4. a water outlet pipe; 5. a side plate; 6. a sliding groove; 7. a storage box; 8. a dust collection plate; 9. a storage tank; 10. inserting a rod; 11. a jack; 12. a gasket; 13. a slide rail; 14. an electric slider.
Detailed Description
The technical solutions of the present invention will be described clearly and completely with reference to the following embodiments, and it should be understood that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Referring to fig. 1-3, a cutting jig for IC semiconductor chips comprises a base 1 and two side plates 5 on the top of the base 1, wherein the two side plates 5 are both slidably mounted on the side of the top of the base 1, the top of the base 1 is connected with an elastic pad 3, one side of the end of the base 1 is connected with a water inlet pipe 2, the other side of the end is connected with a water outlet pipe 4, a curved cooling water pipe is connected between the water inlet pipe 2 and the water outlet pipe 4, and the cooling water pipe is mounted inside the base 1.
As a technical optimization scheme of the invention, sliding grooves 6 are arranged on both sides of the top of a base 1 along the width direction, the upper parts of the sliding grooves 6 penetrate through an elastic backing plate 3, sliding rails 13 are arranged in the sliding grooves 6 along the length direction, electric sliding blocks 14 are arranged on both sides of the bottom of a side plate 5, and the electric sliding blocks 14 are arranged on the sliding rails 13 in a sliding manner.
As a technical optimization scheme of the invention, one end of the top of the base 1 is provided with a detachable storage box 7, two sides of the bottom of the storage box 7 are both connected with inserted rods 10, the top of the base 1 is provided with a loading groove below the storage box 7, the size of the loading groove is matched with that of the storage box 7, two ends of the interior of the loading groove are both provided with insertion holes 11, and the inserted rods 10 are inserted into the insertion holes 11.
As a technical optimization scheme of the invention, one end of the top of the base 1 is connected with the storage box 9, the storage box 7 is arranged between the storage box 9 and the side plate 5, one side of the storage box 9 close to the storage box 7 is provided with the dust absorption plate 8, and the dust absorption plate 8 can absorb impurities generated by cutting, so that the impurities are not easy to pollute the environment. The storage box 7 and the storage box 9 can store and store impurities.
As a technical optimization scheme of the invention, a sealing gasket 12 is arranged at the joint of the storage box 7 and the loading groove, and the sealing gasket 12 can prevent impurities from falling into the loading groove.
In use, the chip to be cut is placed on the upper part of the base 1 and between the two side plates 5. Electric slider 14 drives curb plate 5 and removes, and then makes two curb plates 5 can remove to the chip, is got fixedly by the clamp until the both sides of chip, and two curb plates 5 can adapt to not unidimensional chip for chip fixed convenient and fast. The bottom of the chip is in contact with the elastic backing plate 3, and the elastic backing plate 3 can coat the chip well, so that the chip can be well fixed on the elastic backing plate 3 and is not easy to slide, and the chip cannot be damaged in cutting.
In the chip cutting process, the dust generated by the cutting is absorbed by the dust absorption plate 8, the dust is absorbed into the dust absorption plate 8 and finally enters the storage box 9, and the dust can be well treated. And in the process that the dust with larger weight moves to the dust absorption plate 8, the dust can enter the storage box 7, and large impurities can be stored in the storage box 7. When the impurities in the storage box 7 are cleaned, the storage box 7 is taken out from the loading groove, and then the dumping can be completed. Impurity clearance convenient and fast.
The preferred embodiments of the invention disclosed above are intended to be illustrative only. The preferred embodiments are not intended to be exhaustive or to limit the invention to the precise embodiments disclosed. Obviously, many modifications and variations are possible in light of the above teaching. The embodiments were chosen and described in order to best explain the principles of the invention and the practical application, to thereby enable others skilled in the art to best utilize the invention. The invention is limited only by the claims and their full scope and equivalents.
Claims (5)
1. The utility model provides a IC semiconductor chip cutting jig, its characterized in that, includes base (1) and two curb plates (5) on its upper portion, two equal slidable mounting in the upper portion side of base (1) of curb plate (5), the upper portion of base (1) is connected with elasticity backing plate (3), and tip one side of base (1) is connected with inlet tube (2), and the tip opposite side is connected with outlet pipe (4), is connected with crooked condenser tube between inlet tube (2) and outlet pipe (4), and condenser tube installs the inside at base (1).
2. The IC semiconductor chip cutting jig according to claim 1, wherein the base (1) is provided with sliding grooves (6) on both sides of the top in the width direction, the elastic pad (3) penetrates through the upper portion of the sliding grooves (6), the sliding grooves (6) are internally provided with sliding rails (13) in the length direction, the side plates (5) are provided with electric sliders (14) on both sides of the bottom, and the electric sliders (14) are slidably mounted on the sliding rails (13).
3. The IC semiconductor chip cutting clamp according to claim 1, wherein a detachable storage box (7) is installed at one end of the top of the base (1), insertion rods (10) are connected to two sides of the bottom of the storage box (7), a loading groove is formed in the top of the base (1) below the storage box (7), the size of the loading groove is matched with that of the storage box (7), insertion holes (11) are formed in two ends of the inside of the loading groove, and the insertion rods (10) are inserted into the insertion holes (11).
4. The IC semiconductor chip cutting jig as claimed in claim 1, wherein a storage box (9) is connected to one end of the top of the base (1), the storage box (7) is disposed between the storage box (9) and the side plate (5), and a dust suction plate (8) is installed on one side of the storage box (9) close to the storage box (7).
5. The IC semiconductor chip cutting jig according to claim 3, wherein a sealing gasket (12) is provided at a junction of the storage box (7) and the loading slot.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202010675204.0A CN111775355A (en) | 2020-07-14 | 2020-07-14 | IC semiconductor chip cutting clamp |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202010675204.0A CN111775355A (en) | 2020-07-14 | 2020-07-14 | IC semiconductor chip cutting clamp |
Publications (1)
Publication Number | Publication Date |
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CN111775355A true CN111775355A (en) | 2020-10-16 |
Family
ID=72768658
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN202010675204.0A Withdrawn CN111775355A (en) | 2020-07-14 | 2020-07-14 | IC semiconductor chip cutting clamp |
Country Status (1)
Country | Link |
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CN (1) | CN111775355A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN113733379A (en) * | 2021-08-24 | 2021-12-03 | 宜昌南玻硅材料有限公司 | Polycrystalline silicon ingot squaring size adjustable ingot table and use method |
-
2020
- 2020-07-14 CN CN202010675204.0A patent/CN111775355A/en not_active Withdrawn
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN113733379A (en) * | 2021-08-24 | 2021-12-03 | 宜昌南玻硅材料有限公司 | Polycrystalline silicon ingot squaring size adjustable ingot table and use method |
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PB01 | Publication | ||
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SE01 | Entry into force of request for substantive examination | ||
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WW01 | Invention patent application withdrawn after publication | ||
WW01 | Invention patent application withdrawn after publication |
Application publication date: 20201016 |