CN211104913U - Semiconductor wafer's fluting device - Google Patents
Semiconductor wafer's fluting device Download PDFInfo
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- CN211104913U CN211104913U CN201921725185.7U CN201921725185U CN211104913U CN 211104913 U CN211104913 U CN 211104913U CN 201921725185 U CN201921725185 U CN 201921725185U CN 211104913 U CN211104913 U CN 211104913U
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Abstract
The utility model discloses a semiconductor wafer's fluting device, including base, support frame and air duct, the ventilation hole has been seted up to the intermediate position of base, and the inboard in ventilation hole is provided with the fan, first sliding tray has been seted up to the inside of base, the top of slider is provided with the clamp splice, and the inboard of clamp splice is provided with the rubber protection pad, the below of support frame is provided with the fly leaf, and the below of fly leaf is connected with electronic liter telescopic link, the top of air duct is provided with the mount pad, and is provided with the bellows above the mount pad, the inside of mount pad is connected with the revolving fragment through torque spring, and the inner wall of mount pad is provided with the stopper. This semiconductor wafer's fluting device can be convenient clear up the sweeps that produces among the fluting device fluting process and collect, avoids the sweeps to remain on semiconductor wafer's surface, and can be effective convenient carry out cooling to semiconductor wafer and fluting device, has improved the practicality of device.
Description
Technical Field
The utility model relates to a semiconductor wafer production technical field specifically is a semiconductor wafer's fluting device.
Background
The wafer refers to a circular chip made of semiconductor integrated circuits, and the semiconductor wafer needs to be grooved on the surface during the manufacturing process, so that a grooving device for the semiconductor wafer is needed, but the grooving device for the semiconductor wafer on the market still has some disadvantages, such as:
1. most of slotting devices for semiconductor wafers in the current market are inconvenient to clean and collect scraps generated in the slotting process, so that the scraps are remained on the surface of the semiconductor wafer, and the normal work of the slotting device is influenced;
2. most of the semiconductor wafer slotting devices in the current market are inconvenient for cooling the slotting devices and the semiconductor wafers, so that the temperature is too high in the semiconductor wafer processing process, and the processing effect is influenced.
We have therefore proposed a semiconductor wafer notching device that solves the above-mentioned problems.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a semiconductor wafer's fluting device to solve the inconvenient problem of collecting and inconvenient cooling treatment of carrying out the cooling to semiconductor wafer of clearing up the sweeps of the fluting device of the last semiconductor wafer of existing market that above-mentioned background art provided.
In order to achieve the above object, the utility model provides a following technical scheme: a slotting device for a semiconductor wafer comprises a base, a supporting frame and an air duct, wherein a ventilation hole is formed in the middle of the base, a fan is arranged on the inner side of the ventilation hole, a filter screen is arranged above the ventilation hole, a first sliding groove is formed in the base, a sliding block is arranged in the first sliding groove, a threaded rod penetrates through the middle of the sliding block, a clamping block is arranged above the sliding block, a rubber protective pad is arranged on the inner side of the clamping block, a scrap collecting groove is arranged on the outer side of the clamping block, a movable plate is arranged below the supporting frame, an electric lifting and shrinking rod is connected below the movable plate, a slotting tool bit is arranged on the right side of the movable plate, a mounting seat is arranged above the air duct, a corrugated pipe is arranged above the mounting seat, an air inlet pipe is arranged above the corrugated pipe, and a rotating piece is connected inside the mounting, and the inner wall of the mounting seat is provided with a limiting block.
Preferably, the slider is "T" font structure, and the slider constitutes block sliding structure with first sliding tray to the slider is integrated structure with the clamp splice, and the slider is connected with the threaded rod meshing moreover.
Preferably, the scrap collecting tank and the clamping blocks are of an integrated structure, and the inner diameter of the upper end of the scrap collecting tank is larger than the outer diameter of the clamping blocks.
Preferably, the inside of both sides of the support frame is provided with a second sliding groove, and the second sliding groove and the movable plate form a clamping sliding structure.
Preferably, the height of the lower end of the air duct is greater than that of the lower end of the slotted cutter head, and the air duct penetrates through the movable plate and is communicated with the corrugated pipe.
Preferably, the mounting seat is of a hollow cylindrical structure, the mounting seat and the rotating piece form an elastic structure through a torsion spring, and the rotating piece is in clearance fit with the inner wall of the mounting seat.
Compared with the prior art, the beneficial effects of the utility model are that: a notching device for the semiconductor wafer;
1. the automatic slotting device is provided with a scrap collecting groove, an air guide pipe and a corrugated pipe, when slotting work of the slotting device is finished, the electric telescopic rod pushes the movable plate to move upwards along the second sliding groove, the corrugated pipe is extruded in the moving process of the movable plate, gas in the corrugated pipe is blown to the surface of a semiconductor wafer through the air guide pipe, and scraps are blown into the scrap collecting groove;
2. be provided with fan and air duct, when the fluting device carried out the fluting work, the fan began work, increased the circulation of air of semiconductor wafer bottom, and the air duct blows the air to the upper surface of semiconductor wafer simultaneously, can be effectively convenient carry out cooling to semiconductor wafer and fluting device through this structure, prevents the fluting in-process semiconductor wafer high temperature.
Drawings
FIG. 1 is a schematic view of the main sectional structure of the present invention;
FIG. 2 is a schematic view of the top view of the scrap collecting tank of the present invention;
FIG. 3 is a schematic view of the bellows structure of the present invention;
fig. 4 is the utility model discloses the mount pad structural schematic diagram that bends over.
In the figure: 1. a base; 2. a vent hole; 3. a fan; 4. a filter screen; 5. a first sliding groove; 6. a slider; 7. a threaded rod; 8. a clamping block; 9. a rubber protection pad; 10. a scrap collecting tank; 11. a support frame; 1101. a second sliding groove; 12. a movable plate; 13. an electric telescopic rod; 14. a slotting cutter head; 15. an air duct; 16. a bellows; 17. an air inlet pipe; 18. a mounting seat; 19. a rotating sheet; 20. a limiting block; 21. a torsion spring.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
Referring to fig. 1-4, the present invention provides a technical solution: a slotting device for a semiconductor wafer comprises a base 1, a vent hole 2, a fan 3, a filter screen 4, a first sliding groove 5, a slide block 6, a threaded rod 7, a clamping block 8, a rubber protection pad 9, a scrap collecting tank 10, a support frame 11, a second sliding groove 1101, a movable plate 12, an electric lifting and contracting rod 13, a slotting cutter head 14, an air duct 15, a corrugated pipe 16, an air inlet pipe 17, a mounting seat 18, a rotating sheet 19, a limiting block 20 and a torsion spring 21, wherein the vent hole 2 is formed in the middle of the base 1, the fan 3 is arranged on the inner side of the vent hole 2, the filter screen 4 is arranged above the vent hole 2, the first sliding groove 5 is formed in the base 1, the slide block 6 is arranged in the first sliding groove 5, the threaded rod 7 penetrates through the middle of the slide block 6, the clamping block 8 is arranged above the slide block 6, and the rubber protection pad 9 is arranged, a scrap collecting groove 10 is formed in the outer side of the clamping block 8, a movable plate 12 is arranged below the supporting frame 11, an electric telescopic rod 13 is connected below the movable plate 12, a slotted tool bit 14 is arranged on the right side of the movable plate 12, an installation seat 18 is arranged above the air guide pipe 15, a corrugated pipe 16 is arranged above the installation seat 18, an air inlet pipe 17 is arranged above the corrugated pipe 16, a rotating sheet 19 is connected to the inside of the installation seat 18 through a torsion spring 21, and a limiting block 20 is arranged on the inner wall of the installation seat 18;
the slide block 6 is of a T-shaped structure, the slide block 6 and the first sliding groove 5 form a clamping sliding structure, the slide block 6 and the clamping block 8 are of an integrated structure, the slide block 6 is meshed with the threaded rod 7, and the position of the slide block 6 can be conveniently adjusted by rotating the threaded rod 7, so that the clamping block 8 is driven to adjust the position;
the scrap collecting tank 10 and the clamping blocks 8 are of an integrated structure, the inner diameter of the upper end of the scrap collecting tank 10 is larger than the outer diameter of the clamping blocks 8, and scraps generated in the process of grooving can be collected through the structure, so that the environment pollution caused by the scraps falling out of the device is prevented;
the second sliding grooves 1101 are formed in the two sides of the supporting frame 11, and the second sliding grooves 1101 and the movable plate 12 form a clamping sliding structure, so that the movable plate 12 can be guided by the structure, and the position of the movable plate 12 is prevented from shifting in the moving process;
the height of the lower end of the air duct 15 is greater than that of the lower end of the slotting cutter head 14, the air duct 15 penetrates through the movable plate 12 and is communicated with the corrugated pipe 16, and by means of the structure, waste chips generated in the slotting process can be blown into the waste chip collecting tank 10, and meanwhile, the slotting cutter head 14 can be cooled;
the mounting seat 18 is a hollow cylindrical structure, the mounting seat 18 and the rotating piece 19 form an elastic structure through the torsion spring 21, and the rotating piece 19 is in clearance fit with the inner wall of the mounting seat 18, so that the bellows 16 can normally suck and exhaust air through the structure, and the air in the bellows 16 is prevented from being exhausted from the upper end.
The working principle is as follows: when the slotting device for the semiconductor wafer is used, firstly, as shown in fig. 1-2, the semiconductor wafer to be slotted is placed above the clamping block 8, the threaded rod 7 is rotated, the threaded rod 7 and the sliding block 6 are engaged, so that the sliding block 6 slides along the first sliding groove 5 and drives the clamping block 8 to slide, the clamping block 8 clamps and fixes the semiconductor wafer, as shown in fig. 1, the power supply of the fan 3 is switched on, and the air fluidity below the semiconductor wafer is improved, so that the semiconductor wafer is cooled;
as shown in fig. 1 and 3, the movable plate 12 is controlled by the electric telescopic rod 13 to slide downwards along the second sliding groove 1101, so that the slotting cutter head 14 approaches the semiconductor wafer, at this time, the bellows 16 stretches, and sucks air into the bellows 16 through the air inlet pipe 17, after slotting is completed, the movable plate 12 moves upwards, at this time, the movable plate 12 presses the bellows 16, as shown in fig. 1 and 3-4, during the compression process of the bellows 16, the air pushes the rotary piece 19 below the bellows 16 to rotate anticlockwise, at this time, the air duct 15 is communicated with the bellows 16, and blows air to the upper surface of the semiconductor wafer through the air duct 15, the limiting block 20 can prevent the rotary piece 19 from rotating backwards and opening, so as to avoid the air duct 15 sucking the waste into the bellows 16, through this structure, the waste generated during slotting can be blown into the waste collecting tank 10 to be collected, the method avoids the sweeps remaining on the surface of the semiconductor wafer to influence the continuous processing of the semiconductor wafer, and can play a role in cooling the semiconductor wafer so as to complete a series of work.
Those not described in detail in this specification are within the skill of the art.
Although the present invention has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that modifications may be made to the embodiments or portions thereof without departing from the spirit and scope of the invention.
Claims (6)
1. The utility model provides a semiconductor wafer's fluting device, includes base (1), support frame (11) and air duct (15), its characterized in that: the air guide device is characterized in that a ventilation hole (2) is formed in the middle of the base (1), a fan (3) is arranged on the inner side of the ventilation hole (2), a filter screen (4) is arranged above the ventilation hole (2), a first sliding groove (5) is formed in the base (1), a sliding block (6) is arranged in the first sliding groove (5), a threaded rod (7) penetrates through the middle of the sliding block (6), a clamping block (8) is arranged above the sliding block (6), a rubber protection pad (9) is arranged on the inner side of the clamping block (8), a scrap collecting groove (10) is arranged on the outer side of the clamping block (8), a movable plate (12) is arranged below the support frame (11), an electric lifting and contracting rod (13) is connected below the movable plate (12), a slotted tool bit (14) is arranged on the right side of the movable plate (12), a mounting seat (18) is arranged above the air guide tube (15), and a corrugated pipe (16) is arranged above the mounting seat (18), an air inlet pipe (17) is arranged above the corrugated pipe (16), a rotating sheet (19) is connected inside the mounting seat (18) through a torsion spring (21), and a limiting block (20) is arranged on the inner wall of the mounting seat (18).
2. The semiconductor wafer notching device of claim 1, wherein: the sliding block (6) is of a T-shaped structure, the sliding block (6) and the first sliding groove (5) form a clamping sliding structure, the sliding block (6) and the clamping block (8) are of an integrated structure, and the sliding block (6) is meshed with the threaded rod (7) and is connected with the threaded rod.
3. The semiconductor wafer notching device of claim 1, wherein: the scrap collecting tank (10) and the clamping blocks (8) are of an integrated structure, and the inner diameter of the upper end of the scrap collecting tank (10) is larger than the outer diameter of the clamping blocks (8).
4. The semiconductor wafer notching device of claim 1, wherein: second sliding grooves (1101) are formed in the two sides of the support frame (11), and the second sliding grooves (1101) and the movable plate (12) form a clamping sliding structure.
5. The semiconductor wafer notching device of claim 1, wherein: the height of the lower end of the air duct (15) is greater than that of the lower end of the slotted tool bit (14), and the air duct (15) penetrates through the movable plate (12) and is communicated with the corrugated pipe (16).
6. The semiconductor wafer notching device of claim 1, wherein: the mounting seat (18) is of a hollow cylindrical structure, the mounting seat (18) and the rotating piece (19) form an elastic structure through the torsion spring (21), and the rotating piece (19) is in clearance fit with the inner wall of the mounting seat (18).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921725185.7U CN211104913U (en) | 2019-10-15 | 2019-10-15 | Semiconductor wafer's fluting device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921725185.7U CN211104913U (en) | 2019-10-15 | 2019-10-15 | Semiconductor wafer's fluting device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN211104913U true CN211104913U (en) | 2020-07-28 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201921725185.7U Active CN211104913U (en) | 2019-10-15 | 2019-10-15 | Semiconductor wafer's fluting device |
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| CN (1) | CN211104913U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112247753A (en) * | 2020-09-28 | 2021-01-22 | 富甲电子(昆山)有限公司 | Die with fixed-point internal deslagging clean production function and use method thereof |
| CN114043558A (en) * | 2021-09-23 | 2022-02-15 | 于烁 | Semiconductor processing method and device |
-
2019
- 2019-10-15 CN CN201921725185.7U patent/CN211104913U/en active Active
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112247753A (en) * | 2020-09-28 | 2021-01-22 | 富甲电子(昆山)有限公司 | Die with fixed-point internal deslagging clean production function and use method thereof |
| CN114043558A (en) * | 2021-09-23 | 2022-02-15 | 于烁 | Semiconductor processing method and device |
| CN114043558B (en) * | 2021-09-23 | 2024-05-28 | 深圳市平台科技有限公司 | Semiconductor processing method and device |
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| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CP01 | Change in the name or title of a patent holder |
Address after: No.158, Nanhu Middle Road, Xuelang street, Binhu District, Wuxi City, Jiangsu Province, 214100 Patentee after: Hoyuan Green Energy Co.,Ltd. Address before: No.158, Nanhu Middle Road, Xuelang street, Binhu District, Wuxi City, Jiangsu Province, 214100 Patentee before: WUXI SHANGJI AUTOMATION Co.,Ltd. |
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| CP01 | Change in the name or title of a patent holder |