CN220718797U - Copper-clad pretreatment equipment for integrated circuit board - Google Patents
Copper-clad pretreatment equipment for integrated circuit board Download PDFInfo
- Publication number
- CN220718797U CN220718797U CN202321447331.0U CN202321447331U CN220718797U CN 220718797 U CN220718797 U CN 220718797U CN 202321447331 U CN202321447331 U CN 202321447331U CN 220718797 U CN220718797 U CN 220718797U
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- China
- Prior art keywords
- integrated circuit
- circuit board
- table top
- top surface
- copper
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- 239000000428 dust Substances 0.000 claims abstract description 41
- 238000000227 grinding Methods 0.000 claims description 7
- 238000005498 polishing Methods 0.000 abstract description 16
- 238000004140 cleaning Methods 0.000 abstract description 5
- 238000007517 polishing process Methods 0.000 abstract description 3
- 239000012634 fragment Substances 0.000 abstract description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 7
- 229910052802 copper Inorganic materials 0.000 description 7
- 239000010949 copper Substances 0.000 description 7
- 239000011248 coating agent Substances 0.000 description 5
- 238000000576 coating method Methods 0.000 description 5
- 230000006872 improvement Effects 0.000 description 5
- 238000010521 absorption reaction Methods 0.000 description 3
- 230000008878 coupling Effects 0.000 description 2
- 238000010168 coupling process Methods 0.000 description 2
- 238000005859 coupling reaction Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 230000002146 bilateral effect Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 238000010329 laser etching Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Landscapes
- Grinding Of Cylindrical And Plane Surfaces (AREA)
Abstract
The utility model relates to the technical field of electronic processing, in particular to copper-clad pretreatment equipment for an integrated circuit board. The electric dust collector comprises a table top, a first electric slide rail, a second electric slide rail, an electric slide block and the like, wherein the left and right symmetry of the top surface of the table top is provided with a dust leakage groove, the front part of the top surface of the table top is embedded with the first electric slide rail, and the first electric slide rail is provided with the first electric slide block in a sliding manner. According to the utility model, the air cylinder drives the push rod, and then the push rod drives the L-shaped clamping block to clamp and fix the integrated circuit board, so that the integrated circuit board is ensured not to deviate in the polishing process, and meanwhile, the push plate and the threaded rod are matched for use, so that the integrated circuit board polishing machine can be suitable for polishing integrated circuit boards with different thicknesses, and dust and fragments generated in polishing are fully collected by utilizing the common cleaning of the dust collector and the brush, and the integrated circuit board polishing machine is convenient to clean in a concentrated manner.
Description
Technical Field
The utility model relates to the technical field of electronic processing, in particular to copper-clad pretreatment equipment for an integrated circuit board.
Background
Copper coating is to take the idle space on a circuit board as a reference surface and fill the reference surface with solid copper, wherein the copper areas are also called copper filling, the traditional integrated circuit board is divided into two modes when copper coating, namely full-face coating and later etching are firstly carried out, single-line copper coating is carried out secondly, most of the first mode is adopted, but the mode is easy to lead to the warpage of a board surface due to overhigh temperature in the early stage, so that the surface of the circuit board needs to be grooved at a certain distance before copper coating to improve the heat dissipation effect of the board surface, but the circuit board is light in texture, and the later operation requires high precision on the surface, half-point errors are not allowed, so that when the surface of the circuit board is grooved, laser etching is only preferred, but after larger holes are etched by laser, a residual board which cannot fall is left at an orifice of the circuit board, and burrs are left at the edge.
According to the chinese patent publication CN115476218A, a copper-clad pretreatment device for a circuit board is proposed, which comprises a main body device, a polishing cleaning chamber is arranged in the main body device, a circuit board placing base is fixedly connected to the bottom surface of the inner wall of the polishing cleaning chamber, a traversing treatment rack is movably connected to the upper surface of the circuit board placing base, and an air injection rack is fixedly connected to the upper surface of the traversing treatment rack.
Above-mentioned patent starts the clearance motor through external power supply and drives piece clearance roller and begin anticlockwise rotation, clears up the piece, and in rotatory grinding roller is polished and piece that piece clearance roller cleared up then is inhaled the side collecting vat in, carries the dust bag through the conveyer pipe and temporarily stores, makes things convenient for subsequent processing, but in the in-service use, the device makes the integrated circuit board clear up repeatedly after polishing again, but does not fasten the processing to the integrated circuit board, and the integrated circuit board consequently causes the damage at this in-process can appear the skew.
Disclosure of Invention
In order to overcome the defect that the prior device lacks fastening treatment to an integrated circuit board during polishing and cleaning, the utility model aims to provide copper-clad pretreatment equipment with a clamping function for the integrated circuit board.
The technical proposal is as follows: a copper-clad pretreatment equipment for an integrated circuit board comprises a table top, wherein chip leakage grooves are formed in bilateral symmetry of the top surface of the table top, and the copper-clad pretreatment equipment is characterized by further comprising a first electric sliding rail, a second electric sliding rail, a first electric sliding block, a second electric sliding block, a hairbrush, a fixed clamping block, an L-shaped clamping block, a supporting block, a telescopic rod, a motor, a polishing machine, a cylinder, a push rod, a reset spring and a gear set.
As the improvement of above-mentioned scheme, still including the baffle, the mesa top surface is all fixed mounting along the edge except all three in front has the baffle, opens at the baffle back has the spacing groove.
As the improvement of above-mentioned scheme, still including slider three, dust catcher, dust absorption pipe, fixed mounting has the spout behind the mesa, slidable mounting has slider three on the spout, and slider three top surface fixed mounting has the dust catcher, and the dust absorption pipe is installed in the front of dust catcher, and the dust absorption pipe is located fixed fixture block Fang Ji after the spacing groove through the baffle runs through the supporting shoe.
As the improvement of above-mentioned scheme, still including push pedal and threaded rod, mesa top surface mid-section slidable mounting has the push pedal, and the push pedal bottom surface rotates to be connected with the threaded rod, threaded rod and mesa threaded connection.
As the improvement of above-mentioned scheme, still including the dust collection box, the dust collection box has been placed to mesa left and right sides lower part slip, and two dust collection boxes are located under the corresponding hourglass bits groove.
Compared with the prior art, the utility model has the following advantages: according to the utility model, the air cylinder drives the push rod, and then the push rod drives the L-shaped clamping block to clamp and fix the integrated circuit board, so that the integrated circuit board is ensured not to deviate in the polishing process, and meanwhile, the push plate and the threaded rod are matched for use, so that the integrated circuit board polishing machine can be suitable for polishing integrated circuit boards with different thicknesses, and dust and fragments generated in polishing are fully collected by utilizing the common cleaning of the dust collector and the brush, and the integrated circuit board polishing machine is convenient to clean in a concentrated manner.
Drawings
Fig. 1 is a schematic perspective view of the present utility model.
Fig. 2 is a schematic rear view of the present utility model.
Fig. 3 is a schematic view of a part of a three-dimensional structure of the present utility model.
Fig. 4 is a schematic cross-sectional view of a mesa according to the present utility model.
Fig. 5 is a schematic perspective view of the support block, the cleaner and the gear set of the present utility model.
Reference numerals in the figures: the dust collection device comprises a table top, a 2-baffle, a 3-electric slide rail I, a 301-electric slide rail II, a 302-slide way, a 4-chip leakage groove, a 5-electric slide block I, a 501-electric slide block II, a 502-slide block III, a 6-brush, a 7-fixed clamping block, an 8-L-shaped clamping block, a 9-supporting block, a 10-telescopic rod, a 11-motor, a 12-dust collector, a 1201-dust collection pipe, a 13-grinding machine, a 14-push plate, a 15-cylinder, a 16-push rod, a 17-return spring, an 18-threaded rod, a 19-gear set and a 20-dust collection box.
Detailed Description
The following describes the technical scheme with reference to specific embodiments, and it should be noted that: terms indicating orientations, such as up, down, left, right, etc., are used herein only with respect to the position of the illustrated structure in the corresponding drawings. The parts themselves are numbered herein, for example: first, second, etc. are used solely to distinguish between the described objects and do not have any sequential or technical meaning. And the application is said to be as follows: connection, coupling, unless specifically stated otherwise, includes both direct and indirect connection (coupling).
Example 1
The copper-clad pretreatment equipment for the integrated circuit board comprises a table top 1, an electric slide rail I3, an electric slide rail II 301, an electric slide block I5, an electric slide block II 501, a hairbrush 6, a fixed clamping block 7, an L-shaped clamping block 8, a supporting block 9, a telescopic rod 10, a motor 11, a grinding machine 13, a cylinder 15, a push rod 16, a return spring 17 and a gear set 19, wherein chip leakage grooves 4 are symmetrically arranged on the top surface of the table top 1, the electric slide rail I3 is embedded in the front part of the top surface of the table top 1, the electric slide rail I5 is slidingly arranged on the electric slide rail I3, a hairbrush 6 is fixedly connected on the electric slide block I5, the brush head of the hairbrush 6 is parallel to the table top 1, limit grooves are symmetrically arranged on the front part of the top surface of the table top 1, L-shaped clamping blocks 8 are slidingly arranged on the two limit grooves, the two L-shaped clamping blocks 8 are positioned behind the electric slide rail I3, the bottom surfaces of the two L-shaped clamping blocks 8 are respectively connected with the push rod 16 through bolts, the rear part of the bottom surface of the table top 1 is provided with an air cylinder 15 through bolts, a piston rod of the air cylinder 15 is connected with the other ends of two push rods 16 through welding, a reset spring 17 is fixedly connected between two L-shaped clamping blocks 8 and a limit groove of the table top 1, the rear end of the top surface of the table top 1 is fixedly provided with a fixed clamping block 7, the rear part of the top surface of the table top 1 is internally provided with a second electric slide rail 301, the second electric slide rail 301 is slidingly provided with a second electric slide block 501, the second electric slide block 501 is fixedly connected with a supporting block 9, the middle part of the supporting block 9 is fixedly provided with a gear set 19, the gear set 19 is divided into a gear and a rack, the gear is fixedly connected with an output shaft of a motor 11, the rack is fixedly connected with the supporting block 9, the gear is meshed with the rack, the upper part of the rear part of the supporting block 9 is slidingly connected with the motor 11, the output shaft of the motor 11 is fixedly connected with the gear set 19, the front part of the gear set 19 is fixedly connected with a telescopic rod 10, a grinder 13 is arranged in front of the movable rod of the telescopic rod 10.
As shown in figure 1, the table top is further provided with a baffle plate 2, the edges of the three edges except the front surface of the top surface of the table top 1 are provided with the baffle plate 2 through bolts, and the back surface of the baffle plate 2 is provided with a limit groove.
As shown in fig. 2-5, the vacuum cleaner further comprises a third slider 502, a vacuum cleaner 12 and a vacuum cleaner pipe 1201, wherein a chute 302 is fixedly arranged at the rear of the table top 1, the third slider 502 is slidably arranged on the chute 302, the vacuum cleaner 12 is fixedly arranged on the top surface of the third slider 502, the vacuum cleaner pipe 1201 is arranged in front of the vacuum cleaner 12, and the vacuum cleaner pipe 1201 penetrates through the supporting block 9 through the limit groove of the baffle 2 and then is positioned above the fixed clamping block 7.
As shown in fig. 3 and 4, the table top 1 further comprises a push plate 14 and a threaded rod 18, the push plate 14 is slidably arranged in the middle of the top surface of the table top 1, the threaded rod 18 is rotatably connected to the bottom surface of the push plate 14, and the threaded rod 18 is in threaded connection with the table top 1.
As shown in fig. 1, the dust collecting device also comprises dust collecting boxes 20, wherein the dust collecting boxes 20 are slidably arranged at the lower parts of the left side and the right side of the table top 1, and the two dust collecting boxes 20 are respectively positioned under the corresponding chip leaking grooves 4.
When in use, an integrated circuit board is placed on a push plate 14 in the middle of the top surface of a table top 1, a threaded rod 18 on the bottom surface of the push plate 14 is rotated to adjust the height so that the integrated circuit board is flush with a fixed clamping block 7, a cylinder 15 is started, a piston rod of the cylinder 15 is contracted to drive two push rods 16 to move, a return spring 17 is stretched, an L-shaped clamping block 8 on the push rod 16 is adjusted to clamp the integrated circuit board, after the adjustment is completed, a telescopic rod 10 is adjusted again so that a grinding machine 13 is positioned right above the integrated circuit board, then the device is started, a dust suction pipe 1201 in front of the dust suction pipe 12 is started, dust generated by grinding is sucked, a motor 11 behind the supporting block 9 drives the grinding machine 13 in front of the telescopic rod 10 to move up and down through a gear set 19, a part on the supporting block 9 is driven by a second electric sliding block 501 to move left and right along with the supporting block 9 to drive the dust suction pipe 1201 to move left and right, the dust suction pipe 1201 drives the third slider 502 under the dust collector 12 to synchronously slide left and right along the sliding groove 302 so as to follow the dust suction work in the polishing process, after polishing is completed, the motor 11 drives the polishing machine 13 to move upwards to restore to the initial state, the second electric slider 501, the motor 11 and the polishing machine 13 stop operating, the first electric slider 5 drives the hairbrush 6 above to move left and right along the first electric sliding rail 3 to clean stubborn chips on the polished integrated circuit board, the cleaned chips fall into the dust box 20 along the chip leakage groove 4 on the table top 1, after the first electric slider 5 stops operating, the integrated circuit board pretreatment is completed, the cylinder 15 under the table top 1 extends to drive the movement of the two push rods 16, the reset spring 17 resets, the L-shaped clamping block 8 on the push rods 16 releases clamping the integrated circuit board, and the polished integrated circuit board is conveniently taken down.
Finally, it should be noted that: the foregoing description is only illustrative of the preferred embodiments of the present utility model, and although the present utility model has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that modifications may be made to the embodiments described, or equivalents may be substituted for elements thereof, and any modifications, equivalents, improvements or changes may be made without departing from the spirit and principles of the present utility model.
Claims (5)
1. The copper-clad pretreatment equipment for the integrated circuit board comprises a table top (1), wherein a chip leakage groove (4) is formed in the left and right symmetry of the top surface of the table top (1), the copper-clad pretreatment equipment is characterized by further comprising a first electric sliding rail (3), a second electric sliding rail (301), a first electric sliding block (5), a second electric sliding block (501), a hairbrush (6), a fixed clamping block (7), an L-shaped clamping block (8), a supporting block (9), a telescopic rod (10), a motor (11), a grinding machine (13), an air cylinder (15), a push rod (16), a reset spring (17) and a gear set (19), wherein the first electric sliding rail (3) is embedded in the front part of the top surface of the table top (1), the first electric sliding rail (5) is slidingly provided with the first electric sliding block, a hairbrush (6) is fixedly connected on the first electric sliding block (5), the brush head of the hairbrush (6) is parallel to the table top surface (1), limit grooves are symmetrically formed in the front part of the top surface of the table top (1), L-shaped clamping blocks (8) are slidingly placed on the two limit grooves, the two L-shaped clamping blocks (8) are positioned behind the first electric sliding rail (3), the two L-shaped clamping blocks (8) are fixedly connected with the air cylinder (15) respectively, the other end of the push rod (16) is fixedly connected with the piston rod (15), two L type fixture blocks (8) and spacing groove fixedly connected with reset spring (17) of mesa (1), mesa (1) top surface rear end fixed fixture block (7) have, embedded electronic slide rail two (301) of installing in mesa (1) top surface rear portion, sliding mounting has electronic slider two (501) on electronic slide rail two (501), fixedly connected with supporting shoe (9) on electronic slider two (501), supporting shoe (9) middle part fixed mounting has gear train (19), upper portion sliding connection has motor (11) behind supporting shoe (9), the output shaft and the gear train (19) fixed connection of motor (11), the preceding fixedly connected with telescopic link (10) of gear train (19), install polisher (13) in front of the movable link of telescopic link (10).
2. The copper-clad pretreatment equipment for the integrated circuit board according to claim 1, further comprising a baffle plate (2), wherein the baffle plate (2) is fixedly installed on the edges of the top surface of the table top (1) except the edges of the three surfaces of the top surface, and a limit groove is formed in the back of the baffle plate (2).
3. The copper-clad pretreatment equipment for the integrated circuit board according to claim 2, further comprising a third sliding block (502), a dust collector (12) and a dust collection pipe (1201), wherein the sliding groove (302) is fixedly arranged at the rear of the table top (1), the third sliding block (502) is slidably arranged on the sliding groove (302), the dust collector (12) is fixedly arranged on the top surface of the third sliding block (502), the dust collection pipe (1201) is arranged in front of the dust collector (12), and the dust collection pipe (1201) penetrates through the supporting block (9) through the limit groove of the baffle plate (2) and is positioned above the fixed clamping block (7).
4. The copper-clad pretreatment equipment for the integrated circuit board according to claim 1, further comprising a push plate (14) and a threaded rod (18), wherein the push plate (14) is slidably arranged in the middle of the top surface of the table top (1), the threaded rod (18) is rotatably connected to the bottom surface of the push plate (14), and the threaded rod (18) is in threaded connection with the table top (1).
5. The copper-clad pretreatment equipment for an integrated circuit board according to claim 1, further comprising dust boxes (20), wherein dust boxes (20) are slidably arranged at the lower parts of the left side and the right side of the table top (1), and the two dust boxes (20) are respectively positioned under the corresponding chip leakage grooves (4).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321447331.0U CN220718797U (en) | 2023-06-08 | 2023-06-08 | Copper-clad pretreatment equipment for integrated circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321447331.0U CN220718797U (en) | 2023-06-08 | 2023-06-08 | Copper-clad pretreatment equipment for integrated circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN220718797U true CN220718797U (en) | 2024-04-05 |
Family
ID=90485503
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202321447331.0U Active CN220718797U (en) | 2023-06-08 | 2023-06-08 | Copper-clad pretreatment equipment for integrated circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN220718797U (en) |
-
2023
- 2023-06-08 CN CN202321447331.0U patent/CN220718797U/en active Active
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20240613 Address after: No. 346, No.3 Xiaoheyan Road, Dadong District, Shenyang City, Liaoning Province, 110000 Patentee after: Shenyang Zhonghang Changyu Technology Co.,Ltd. Country or region after: China Address before: Room 206, Building 3, 171 He Le Er Street, Shuangliu District, Chengdu City, Sichuan Province, 610213 Patentee before: Long Aiping Country or region before: China |
|
| TR01 | Transfer of patent right |