CN111775353A - High-efficient solar cell silicon chip cutterbar - Google Patents
High-efficient solar cell silicon chip cutterbar Download PDFInfo
- Publication number
- CN111775353A CN111775353A CN202010524873.8A CN202010524873A CN111775353A CN 111775353 A CN111775353 A CN 111775353A CN 202010524873 A CN202010524873 A CN 202010524873A CN 111775353 A CN111775353 A CN 111775353A
- Authority
- CN
- China
- Prior art keywords
- cutting
- block
- support
- locating
- shell
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 title claims abstract description 72
- 229910052710 silicon Inorganic materials 0.000 title claims abstract description 72
- 239000010703 silicon Substances 0.000 title claims abstract description 72
- 238000005520 cutting process Methods 0.000 claims abstract description 150
- 238000005507 spraying Methods 0.000 claims abstract description 16
- 239000002173 cutting fluid Substances 0.000 claims abstract description 12
- 230000000712 assembly Effects 0.000 claims abstract description 8
- 238000000429 assembly Methods 0.000 claims abstract description 8
- 238000000034 method Methods 0.000 claims abstract description 8
- 239000002070 nanowire Substances 0.000 claims abstract description 4
- 238000001125 extrusion Methods 0.000 claims description 36
- 239000000463 material Substances 0.000 claims description 31
- 230000005540 biological transmission Effects 0.000 claims description 29
- 238000000926 separation method Methods 0.000 claims description 12
- 238000003860 storage Methods 0.000 claims description 10
- 230000000903 blocking effect Effects 0.000 claims description 7
- 238000005096 rolling process Methods 0.000 claims description 7
- 230000000750 progressive effect Effects 0.000 claims description 6
- 235000012431 wafers Nutrition 0.000 abstract description 16
- 230000008569 process Effects 0.000 description 6
- 238000005192 partition Methods 0.000 description 5
- 238000003825 pressing Methods 0.000 description 5
- 238000005299 abrasion Methods 0.000 description 4
- 238000000227 grinding Methods 0.000 description 4
- 238000012423 maintenance Methods 0.000 description 3
- 230000009471 action Effects 0.000 description 2
- 230000008901 benefit Effects 0.000 description 2
- 230000008859 change Effects 0.000 description 2
- 238000002360 preparation method Methods 0.000 description 2
- 230000002035 prolonged effect Effects 0.000 description 2
- 230000009467 reduction Effects 0.000 description 2
- 239000002699 waste material Substances 0.000 description 2
- 241000251468 Actinopterygii Species 0.000 description 1
- 230000003139 buffering effect Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 230000003746 surface roughness Effects 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/04—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools
- B28D5/045—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools by cutting with wires or closed-loop blades
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
- B28D5/0076—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for removing dust, e.g. by spraying liquids; for lubricating, cooling or cleaning tool or work
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
- B28D5/0082—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
- H01L31/1804—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof comprising only elements of Group IV of the Periodic System
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
- Y02E10/547—Monocrystalline silicon PV cells
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Abstract
The invention discloses a high-efficiency solar cell silicon wafer cutter, which comprises a rack, a cylinder, a cutting device and a three-jaw chuck; the method is characterized in that: the cutting device comprises a shell arranged at the top end of the air cylinder, a plurality of wire containing blocks arranged on the shell, a first cavity arranged in the shell, a rack rod arranged in the first cavity, a motor arranged on one side of the shell and used for driving the rack rod to rotate, a plurality of groups of cutting assemblies arranged in the first cavity, and a cutting fluid spraying structure arranged above the shell; the cutting assemblies are arranged in an equal amount corresponding to the nano wire blocks; the cutting device is provided in plurality. According to the invention, through the arrangement of the cutting assembly, the continuous and simultaneous cutting of multiple silicon wafers is realized, the cutting efficiency of the silicon wafers is effectively increased, the waiting time is reduced, the requirement for manual adjustment after cutting is reduced, the labor cost is effectively saved, the concentricity is better during cutting, and the cutting quality is better.
Description
Technical Field
The invention belongs to the technical field of solar panel production, and particularly relates to a high-efficiency solar cell silicon wafer cutter.
Background
At present, a silicon wafer cutting machine adopts a mode of a knife saw blade or a grinding wheel blade when cutting a silicon wafer. And grinding the silicon rod by the blade or the grinding wheel under a certain acting force in a high-speed running state to finally prepare the silicon wafer.
Traditional sword saw piece and grinding wheel piece carry out the cutting mode to the silicon chip, monolithic cutting mode latency is longer, need the manual work after cutting a slice adjust the cutting that carries out next piece afterwards, this cutting mode efficiency is lower, and only carries out the monolithic cutting at every turn, has wasted a large amount of costs of labor when the inefficiency, thereby the condition emergence such as the silicon chip fracture that leads to appears the condition of skew in the concentricity easily appears simultaneously in the cutting.
Disclosure of Invention
The invention provides a high-efficiency solar cell silicon wafer cutter which saves cost and improves quality in order to overcome the defects of the prior art.
In order to achieve the purpose, the invention adopts the following technical scheme: a high-efficiency solar cell silicon wafer cutter comprises a rack placed on the ground, a cylinder arranged on the rack, a cutting device arranged on the cylinder, and a three-jaw chuck arranged on the rack; the cutting device comprises a shell arranged at the top end of the air cylinder, a plurality of wire containing blocks arranged on the shell, a first cavity arranged in the shell, a rack rod arranged in the first cavity, a motor arranged on one side of the shell and used for driving the rack rod to rotate, a plurality of groups of cutting assemblies arranged in the first cavity, and a cutting fluid spraying structure arranged above the shell; the cutting assemblies are arranged in an equal amount corresponding to the nano wire blocks; the cutting devices are provided in plurality; according to the invention, through the arrangement of the cutting assemblies, through the mutual matching among a plurality of groups of cutting assemblies, the continuous multi-sheet simultaneous cutting of the silicon wafer is effectively realized, meanwhile, the wire containing blocks on a plurality of cutting devices are mutually clamped, the wire containing block on the cutting device is clamped into the gap between two corresponding wire containing blocks on another cutting device, so that when the silicon rod is cut, the triangular chuck for clamping the silicon rod rotates slowly, the uniform cutting of the wire cutting is ensured, the silicon rod is uniformly cut in a plurality of directions, the silicon rod receives the force of a plurality of directions towards the circle center, the concentricity of the silicon rod is ensured, the deviation caused by the force of a single side is avoided, on the other hand, the conditions of product quality reduction and the like caused by the change of the concentricity of the silicon rod in the cutting process are effectively avoided, and the concentricity is better during the cutting, the better cutting efficiency that has effectively increased the silicon chip of cutting quality reduces latency, once only cuts the polylith simultaneously and will reduce the manual regulation after cutting and get the demand, has effectively practiced thrift the cost of labor.
The cutting assembly comprises a moving plate arranged in the first cavity, a first support arranged on the moving plate, a first guide wheel arranged on the first support, a second support arranged on the side wall of the first cavity, a second guide wheel arranged on the second support, an extending block arranged on the yarn containing block, a third guide wheel arranged in the extending block, an accommodating groove arranged on the yarn containing block, a cutting wire arranged in the accommodating groove, a third support arranged on the side wall of the first cavity, a tightening structure used for pulling the moving plate to move, a transmission structure arranged on the third support, an extrusion plate arranged on the moving plate, a progressive structure arranged on the moving plate and a reset structure arranged in the yarn containing block; when the silicon rod starts to work, the tightening structure pulls the moving plate to move towards the direction of the material, so that the transmission structure drives the cutting wire to move, the cutting wire is contacted with the surface of the silicon rod at the moment, meanwhile, the second guide wheel fixed on the inner wall of the first cavity body is sleeved with the guide sleeve of the third guide wheel to further change the direction, the first guide wheel is fixedly connected with the moving sheet, so the distance between the first guide wheel and the second guide wheel is gradually increased along with the movement of the moving sheet, thereby tightening the cutting wire, ensuring that the cutting wire is always attached to the cutting position of the silicon rod and always keeps a certain pressure, therefore, the cutting wire is always in a cutting state in the cutting process, the loosening and slipping condition is not easy to generate, meanwhile, the waste of the cutting part in the process of cutting the material is greatly reduced by adopting a wire cutting mode, the cutting loss is reduced, and the cost of reducing the material yield is effectively provided.
The tightening structure comprises a take-up device arranged on the outer wall of the shell, a fourth support arranged on the shell, a fourth guide wheel arranged on the fourth support, a through hole formed in the shell, a fifth support arranged on the inner wall of the first cavity, a fifth guide wheel arranged on the fifth support, and a rope body used for connecting the take-up device and the moving plate; the take-up device is always in a tightening state, so that the moving block is pulled to move towards the silicon rod direction, the space is saved through the pulling mode of the rope body, the collision between internal machines is avoided, the abrasion of instruments is effectively reduced, the maintenance cost is reduced, meanwhile, the rope body is provided with certain elasticity, the cutting wire is enabled to have certain buffering in the pulling process, the situation that the cutting wire is broken due to the over-tightening of the cutting wire is avoided, the unnecessary loss is caused, and the cost is saved.
The transmission structure comprises a first sliding groove arranged on the third support, a transmission wheel arranged in the first sliding groove, transmission teeth arranged in the radial direction of the transmission wheel, a rotating block arranged on the transmission wheel, a first sliding block sleeved on the rotating block, a first elastic piece arranged in the first sliding groove and used for resetting the first sliding block, a separation plate arranged on the transmission wheel, a notch arranged on the moving plate, a first guide plate arranged on the separation plate, a through hole arranged on the separation plate and used for allowing a cutting wire to pass through, a second guide plate arranged in the through hole and a tensioning structure arranged on the third support; the driving wheel comprises a wheel body, a fracture formed in the wheel body, a connecting column arranged in the fracture and a rolling piece arranged on the connecting column; when the moving piece starts to move, the moving piece drives the driving wheel which can move in the first sliding groove to move, when the driving wheel moves to a certain distance, the driving teeth are meshed with the threaded rod at the moment, so that the driving wheel is driven to rotate by the rotation of the threaded rod, the driving wheel is divided into two parts which are connected in a mode of passing through the connecting column, the rolling parts on the connecting column are abutted against the inner wall of the notch on the partition plate, the sliding friction mode of the common mandrel and the shaft sleeve is changed into rolling friction in a mode of contacting with a plurality of bearing points, so that the friction force is effectively reduced, the driving wheel rotates more smoothly, the cutting wire is wound on the driving wheel for a circle, certain guidance is carried out on the cutting wire in a mode of the first guide plate, the abrasion of the cutting wire is reduced, the partition plate separates the inlet and the outlet of the cutting wire wound on the driving wheel, and the self, the damage of the cutting wire is caused, the loss of the cutting wire is effectively reduced, the service life of the product is prolonged, and the maintenance cost is reduced; the cutting wire rolled by the cutting driving wheel rotates for half a circle on the driving wheel, then enters the other side of the separation plate through the guide of the second guide plate, due to the fact that the surface roughness of the cutting wire is large, the cutting wire is greatly abraded due to the contact between the cutting wire and the cutting wire, the cutting wire is separated through the separation plate, the abrasion of the cutting wire is reduced, the service life is prolonged, and the maintenance cost is reduced.
The tensioning structure comprises a second sliding groove arranged on the third support, a second sliding block arranged in the second sliding groove, a sixth guide wheel arranged on the second sliding block, a blocking piece arranged at the top end of the second sliding groove, and a second elastic piece arranged on the blocking piece and used for resetting the second sliding block; the cutting wire is clamped and stopped suddenly due to friction in the cutting process, if the cutting wire is in the limit of a tight state at the moment, the cutting wire is broken possibly, so that the cutting wire is lost, and on the other hand, the cutting wire is effectively deviated from the toothed bar due to the existence of the tensioning structure, so that the phenomenon that the cutting wire is rolled into the toothed bar in the moving process of the cutting wire in the cutting process, so that the cutting wire is broken due to the abrasion of instruments and unnecessary loss is avoided.
The extrusion plate comprises a through groove arranged on the shell, an extrusion piece arranged on the moving block and balls arranged on the extrusion piece; the material cutting part is continuously reduced along with cutting, so that the moving block continuously moves towards the direction of the material, the cutting wire is tightened, the extruding sheet arranged on the moving block is continuously clamped into the cut notch to extrude the cutting part of the silicon rod, one end of the cutting groove of the silicon rod is pressed towards the shell by the cutting wire, the extruding sheet continuously generates a supporting force opposite to the direction of the cutting groove on the silicon rod, the silicon rod is supported to a certain extent, the concentricity of the silicon rod is ensured, the deviation of the silicon rod is reduced on the other hand, when the silicon chip deviates slightly, the silicon chip contacts the ball, a supporting force is further provided for the silicon chip, the continuous deformation of the silicon chip is avoided, the silicon chip is prevented from being broken due to deformation, the loss of the material and the waste of the cost are avoided, and the cut silicon chip is more uniform, the quality is better.
The progressive structure comprises a long block arranged on one side of the moving piece, a third sliding chute arranged on the other side of the moving piece, a fourth sliding chute arranged at the bottom of the third sliding chute, a third sliding block arranged in the fourth sliding chute, a fifth sliding chute arranged on the side wall of the fourth sliding chute, a fourth sliding block arranged in the fifth sliding chute, a first clamping port arranged on the fourth sliding block, and a third elastic piece arranged in the fifth sliding chute and used for resetting the fourth sliding block, the sliding rod is arranged in the sixth sliding groove, the fifth sliding block is sleeved on the sliding rod, the fourth elastic piece is arranged in the sixth sliding groove and used for resetting the fifth sliding block, the second clamping port is arranged on the fifth sliding block, the first rotating piece is arranged on the fifth sliding block, and one end of the rotating rod is rotatably connected to the inner wall of the shell; when the machine starts to operate, the moving piece farthest from the triangular chuck moves, the fourth sliding blocks on the other moving pieces are clamped into the second clamping ports on the fifth sliding blocks at the moment, so that the fifth sliding blocks are in a fixed state, the rotating rod plays a supporting role at the moment so as to limit the sliding pieces, when the first moving piece moves to a certain position, the long blocks on the first moving piece slide to the bottom of the third sliding groove so as to extrude the third sliding blocks to move upwards, the fourth sliding blocks are extruded to move inwards by the movement of the third sliding blocks, so that the fourth sliding blocks are unlocked to lock the fifth sliding blocks, the fifth sliding blocks move upwards under the action of the fourth elastic piece, the rotating rod plays a role in slightly drawing the moving pieces to the silicon rod at the moment, the structure is stable, the silicon wafers on the outermost side are guaranteed to be cut most preferentially, and the middle section is effectively prevented from being broken in advance, thereby the material anterior segment that leads to does not have the centre gripping of triangle chuck to the material shake cutting skew that leads to, even the condemned possibility of material, thereby effectively improved the quality of product, effectively reduced the loss of raw materials, reduced the input of cost.
The cutting fluid spraying structure comprises a box body arranged on the rack, a sixth support arranged above the shell, a material storage pipeline erected on the sixth support, a first conveying pipe connected with the box body and the material storage pipeline, a second conveying pipe arranged on the material storage pipeline, a plurality of material spraying nozzles arranged on the conveying pipeline, and a pipe inlet arranged on the wire accommodating block; the second material conveying pipe is embedded in the accommodating groove through the pipe inlet; the second conveying pipeline is arranged in the containing line block and conveys materials around the cutting part, the groove cut at the moment is of a notch structure, cutting fluid can stay better, the utilization rate of the cutting fluid is fully improved, the material spraying nozzles face to the circle center of the cutting part, the spraying of the cutting fluid is more uniform, the cutting efficiency is effectively improved, and the quality of a final cutting finished product is improved.
The resetting structure comprises an electric track arranged at the bottom of the accommodating groove, an electric slider arranged in the electric track, a wire hole formed in the electric slider, an extrusion block arranged on the electric slider, a slope arranged on the extrusion block, a graver arranged below the extrusion block, a seventh support arranged on the extrusion block, an extrusion wheel arranged on the seventh support, second rotating parts arranged at two sides of the accommodating groove, a cover plate arranged on the second rotating parts, an extension block arranged at one side of the cover plate and a groove arranged at the other side of the cover plate; the cover plate rotates around the second rotating piece to be covered, so that the extending blocks on the adjacent cover plates are pressed through the grooves; when cutting begins, the electric slider moves along the electric track, so that the electric slider moves to the top end position above the wire containing block from the lower part, the cover plate is opened along with the movement of the electric slider, the cutting wire is limited at the moment, the surface of the silicon rod is attached, cutting preparation is carried out, after cutting is finished, the electric slider resets and moves along the electric track, the wire hole arranged on the electric slider pulls the cutting wire to move upwards, the slope surface on the extrusion block extrudes the cover plate on the second rotating part to cover downwards, and then the extrusion block is extruded and fixed by the extrusion wheel positioned behind the extrusion block through the groove between the extrusion block and the electric slider, the groove on the near-end cover plate extrudes the extension block on the adjacent cover plate at the moment, so that the fixation is finished, the structure can strain and collect the cutting wire through the movement of the electric slider, the cover plate is closed, so that the accommodating groove is closed, thereby accomodate convenient subsequent processing with the cutting wire to the cost that the manual work needs with the line playback has been reduced.
According to the invention, through the arrangement of the cutting assembly, the continuous and simultaneous cutting of multiple silicon wafers is realized, the cutting efficiency of the silicon wafers is effectively increased, the waiting time is reduced, the requirement for manual adjustment after cutting is reduced, the labor cost is effectively saved, the concentricity is better during cutting, and the cutting quality is better.
Drawings
FIG. 1 is a schematic structural diagram of the present invention.
Fig. 2 is a schematic perspective view of the cutting device.
Fig. 3 is a right side view of the cutting device.
Fig. 4 is a schematic perspective cross-sectional view taken along line a-a of fig. 3.
Fig. 5 is an enlarged schematic view of a portion a of fig. 4.
Fig. 6 is a partially enlarged schematic view of fig. 5.
Fig. 7 is an enlarged schematic view of B in fig. 4.
Fig. 8 is an enlarged schematic view at C in fig. 4.
Fig. 9 is a perspective cross-sectional view of fig. 3 taken along line B-B.
Fig. 10 is a partially enlarged schematic view of fig. 9.
Fig. 11 is a perspective cross-sectional view of fig. 3 taken along line C-C.
Fig. 12 is a partially enlarged schematic view of fig. 11.
Fig. 13 is a partially enlarged schematic view of the transmission structure.
Fig. 14 is a left side view of the transmission structure.
Fig. 15 is a schematic perspective cross-sectional view of fig. 14 taken along line D-D.
Detailed Description
As shown in fig. 1-15, a high-efficiency solar cell silicon wafer cutter comprises a frame 1, a cylinder 2, a cutting device 3 and a three-jaw chuck 4; the cutting machine is characterized in that a rack 1 is placed on the ground, a cylinder 2 is arranged on the rack, the cylinder is the prior art which can be directly purchased in the market, the structure is not repeated here, the number of the cylinder is two, a cutting device 3 is arranged on the cylinder, a three-jaw chuck 4 is arranged on the rack, the three-jaw chuck is the same as the chuck structure on a common lathe, the structure is not repeated here, the structure is the prior art, the structure is not repeated here, the number of the cutting device is two, the cutting device is symmetrically arranged, and the cutting device is used for balancing the stress of materials, so that the materials are; the cutting device 3 comprises a shell 31, a wire accommodating block 32, a first cavity 33, a toothed bar 34, a motor 35, a cutting assembly 5 and a cutting fluid spraying structure 6; the cutting assembly 5 is provided with a plurality of groups, the cutting assembly is arranged in the same amount as the wire containing blocks and is arranged in the first cavity, and the cutting fluid spraying structure 6 is arranged above the shell; the motor is the prior art which can be directly bought in the market, and the details are not repeated here.
As shown in fig. 5 and 8, the cutting assembly 5 includes a moving plate 51, a first bracket 52, a first guide wheel 53, a second bracket 54, a second guide wheel 55, an extension block 56, a third guide wheel 57, a receiving groove 58, a cutting wire 59, a third bracket 510, a tightening structure 7, a transmission structure 8, a pressing plate 9, a progressive structure 10, and a return structure 12; a movable plate 51 is arranged in the first cavity, a first support 52 is arranged on the movable plate, a first guide wheel 53 is arranged on the first support, a second support 54 is arranged on the side wall of the first cavity, a second guide wheel 55 is arranged on the second support, an extension block 56 is arranged on the wire containing block, a third guide wheel 57 is arranged in the extension block, an accommodating groove 58 is arranged on the wire containing block, a cutting wire 59 is arranged in the accommodating groove, the cutting wire is an annular cutting wire which is connected end to end and can be directly purchased and obtained from the market in the prior art, a third support 510 is arranged on the side wall of the first cavity, a tightening structure 7 is used for pulling movement, a transmission structure 8 is arranged on the third support, a movable plate extrusion plate 9 is arranged on the movable plate, a progressive structure 10 is arranged on the movable plate, and a reset structure 12 is arranged in the wire containing block; the first guide wheel is a movable guide wheel arranged on the moving block, and the second guide wheel and the third guide wheel are fixed guide wheels fixedly connected to the first cavity.
As shown in fig. 4 and 7, the tightening structure 7 includes a wire take-up device 71, a fourth bracket 72, a fourth guide wheel 73, a through hole 74, a fifth bracket 75, a fifth guide wheel 76, and a rope body 77; take-up 71 is located on the casing outer wall, take-up is provided with a torsional spring for the casing centre, all possess the structure of certain contractility to the rope on both sides, and fourth support 72 is located on the casing, fourth leading wheel 73 locates on the fourth support, through-hole 74 is seted up in on the casing, fifth support 75 is located on the first cavity inner wall, fifth leading wheel 76 locates on the fifth support, the rope body 77 is used for connecting take-up with the movable plate.
As shown in fig. 4, 10, 13 and 15, the transmission structure 8 includes a first sliding chute 81, a transmission wheel 82, a transmission tooth 83, a rotating block 84, a first sliding block 85, a first elastic member 86, a separation plate 87, a notch 88, a first guide plate 89, a through opening 810, a second guide plate 811 and a tensioning structure 11; the first sliding groove 81 is formed in the third support, the transmission wheel 82 is arranged in the first sliding groove, the transmission teeth 83 are arranged in the radial direction of the transmission wheel, the rotating block 84 is arranged on the transmission wheel, the first sliding block 85 is sleeved on the rotating block, the first elastic piece 86 is arranged in the first sliding groove and used for resetting the first sliding block, the separation plate 87 is arranged on the transmission wheel, the notch 88 is arranged on the moving plate, the first guide plate 89 is arranged on the separation plate, the through hole 810 is formed in the separation plate and used for allowing a cutting wire to pass through, the second guide plate 811 is arranged in the through hole, and the tensioning structure 11 is arranged on the third support; the driving wheel 82 comprises a wheel body 821, a fracture 822, a connecting column 823 and a rolling element 824; the fracture 822 is formed in the wheel body, the connecting column 823 is formed in the fracture, and the rolling piece 824 is formed on the connecting column; when the moving block is positioned at the farthest end, the partition plate is clamped in the notch, the moving piece plays a supporting role for the wheel body, the transmission teeth on the wheel body are separated from the rack rod by a certain distance, when the moving block starts to move, the transmission teeth are firstly meshed with the rack rod, then the wheel body is remained at the tail end of the first chute along with the continuous movement of the moving piece and is fixed, and the partition plate slowly slides from the notch but is always positioned in the partition plate; the spliced pole uses the wheel body center to evenly radially arrange as the centre of a circle, is provided with 3, the rolling member sets up to the bearing, leads to and is equipped with 3.
As shown in fig. 5 to 6, the tensioning structure 11 includes a second sliding chute 111, a second sliding block 112, a sixth guide wheel 113, a blocking plate 114, and a second elastic member 115; the second sliding groove 111 is formed in the third support, the second sliding block 112 is formed in the second sliding groove, the sixth guide wheel 113 is formed in the second sliding block, the blocking piece 114 is formed in the top end of the second sliding groove, and the second elastic piece 115 is formed in the blocking piece and used for resetting the second sliding block.
As shown in fig. 4, the pressing plate 9 includes a through groove 91, a pressing piece 92, and a ball 93; the through groove 91 is arranged on the shell, the extrusion piece 92 is arranged on the moving block, and the ball 93 is arranged on the extrusion piece; the extrusion piece is a flat lamellar structure, and the shape can be adjusted, and the shape that sets up here to the door that falls down sets up the ball structure here, and the advantage of ball can be thought arbitrary direction and roll with the ball, and the mode of contact is the form of point contact, can adapt to the rotation of any direction to reduce the possibility to the fish tail on silicon chip surface, increased the quality of silicon chip.
As shown in fig. 11-12, the progressive structure 10 includes a long block 101, a third sliding chute 102, a fourth sliding chute 103, a third sliding block 104, a fifth sliding chute 105, a fourth sliding block 106, a first clamping interface 107, a third elastic member 108, a sixth sliding chute 109, a sliding rod 1010, a fifth sliding block 1011, a fourth elastic member 1012, a second clamping interface 1013, a first rotating member 1014, and a rotating rod 1015; the long block 101 is arranged on one side of the moving piece, the third sliding groove 102 is arranged on the other side of the moving piece, the fourth sliding groove 103 is arranged at the bottom of the third sliding groove, the third sliding block 104 is arranged in the fourth sliding groove, the fifth sliding groove 105 is arranged on the side wall of the fourth sliding groove, the fourth sliding block 106 is arranged in the fifth sliding groove, the first clamping port 107 is arranged on the fourth sliding block, an inclined surface is arranged on the first clamping port, when the third sliding block moves upwards, the fourth sliding block is pushed to move inwards through the inclined surface, the third elastic element 108 is arranged in the fifth sliding groove and is used for resetting the fourth sliding block, the sixth sliding groove 109 is arranged on the moving piece, the sliding rod 1010 is arranged in the sixth sliding groove, the fifth 1012 sliding block is sleeved on the sliding rod, the fourth elastic element is arranged in the sixth sliding groove and is used for resetting the fifth sliding block, and the second clamping port 1013 is arranged on the fifth sliding block, when the fourth sliding block is clamped into the second clamping port, the fifth sliding block is in a fixed state, the fourth elastic piece is in a stretching state, the first rotating piece 1014 is arranged on the fifth sliding block, and one end of the rotating rod 1015 is rotatably connected to the inner wall of the shell; one end of the rotating rod is fixedly connected to the inner wall, the other end of the rotating rod is connected with the first rotating piece, and the first rotating piece is connected in a hinged mode.
As shown in fig. 4 and 8, the cutting fluid spraying structure 6 comprises a box body 61, a sixth support 62, a storage pipeline 63, a first delivery pipe 64, a second delivery pipe 65, a material spraying nozzle 66 and a pipe inlet 67; a box body 61 is arranged on the rack, a sixth support 62 is arranged above the shell, a material storage pipeline 63 is erected on the sixth support, a first conveying pipe 64 is connected to the box body and the material storage pipeline, a second conveying pipe 65 is arranged on the material storage pipeline, a plurality of positions of a material spraying nozzle 66 are uniformly provided with 5 positions, the material spraying nozzle is arranged on the conveying pipeline, and a pipe inlet 67 is arranged on the wire accommodating block; the second conveying pipeline is embedded in the accommodating groove through the pipe inlet.
As shown in fig. 4 and 7-8, the reduction structure 12 includes a motor-driven rail 121, a motor-driven slider 122, a wire hole 123, a pressing block 124, a slope 125, a nicking tool 126, a seventh support 127, a pressing wheel 128, a second rotating member 129, a cover plate 130, an extending block 131, and a groove 132; the electric rail 121 is arranged at the bottom of the containing groove, the electric slider 122 is arranged in the electric rail, the electric rail and the electric slider are both in the prior art, and details are not repeated here, the wire hole 123 is arranged on the electric slider, the extrusion block 124 is arranged on the electric slider, the extrusion block is connected with the electric slider through an elongated thin plate, the arrangement of the structure is convenient for the cover plate below to pass through, the slope 125 is arranged on the extrusion block, the slope is a structure which extrudes the cover plate inwards to cover the cover plate, the graver 126 is arranged below the extrusion block, the graver carves a scratch on the surface of the silicon rod when rotating, so that when cutting the cutting wire at the back, a positioning effect is achieved, and the subsequent cutting is smoother and smoother, the seventh support 127 is arranged on the extrusion block, the extrusion wheel 128 is arranged on the seventh support, the second rotating member 129 is arranged at two sides of the accommodating groove, the cover plate 130 is arranged on the second rotating member, the cover plate is a rectangular sheet-shaped body, the extending block 131 is arranged at one side of the cover plate, and the groove 132 is arranged at the other side of the cover plate; the cover plates are rotatably covered around the second rotating member to press the extending blocks on the adjacent cover plates through the grooves.
The specific operation process is as follows, now the silicon rod is clamped into the three-jaw chuck 4, then the air cylinder 2 pulls the cutting device 3 to retract, when the cutting device is in place, the electric slide block 122 will move along the electric track 121, so as to move from the lower part of the wire containing block 32 to the upper top end position, at this time the cover plate 130 will open along with the movement of the electric slide block, and the graver 126 on the electric slide block will make a slight mark on the fixed position for providing the positioning of the cutting wire 59, at this time the cutting wire will lose the limit, so as to adhere to the surface of the silicon rod for preparation of cutting, the motor 35 is started to rotate the toothed bar 34, at this time the driving wheel 82 on the moving piece farthest away and the toothed bar are engaged with each other, so that the toothed bar drives the driving wheel to rotate, so as to make the cutting wire rotate along a plurality of guide wheels, and at this time the cutting fluid in the box will enter the, then the silicon wafers are sprayed to a cutting area through a second material conveying pipe 65 and finally a material spraying nozzle 66, as the cutting continues, the long block 101 on the first moving plate slides to the bottom of the third sliding groove 102, so that the third sliding block 104 is extruded to move upwards, the third sliding block moves to extrude the fourth sliding block 106 to move inwards, so that the fourth sliding block is unlocked to lock the fifth sliding block 106, the fifth sliding block moves upwards under the action of the fourth elastic part 1012, at the moment, the rotating rod 1015 slightly plays a role in pulling the moving plate 51 to a silicon rod, at the moment, the second moving plate is unlocked, the driving wheel on the second moving plate is driven to be meshed with the toothed rod to rotate in the moving process of the second moving plate, so that the cutting wires on the second moving plate start to cut, the processes are repeated, so that a plurality of silicon wafers are cut simultaneously, the extruding plate 92 arranged on the moving plate simultaneously clamps the cutting into the cut notch 88, extruding the cut part of the silicon rod, wherein one end of a cutting groove of the silicon rod is pressed towards the shell by the cutting wire, the extruding sheet continuously generates a supporting force opposite to the direction of the silicon rod to support the silicon rod to a certain degree, and simultaneously the concentricity of the silicon rod is ensured, on the other hand, the deviation of the silicon rod is reduced, when the silicon chip slightly deviates, the silicon chip contacts the ball 93 to further provide a supporting force for the silicon chip, until the silicon chip cut off finally is temporarily isolated and stored among the extruding sheets, after all cutting is finished, the movable sheet can be reset manually, the silicon chip is taken out in a one-time mode, after the step is finished, the electric slide block resets and moves along the electric track, the wire hole arranged on the electric slide block pulls the cutting wire to move upwards, the slope 125 on the extruding block downwards covers the cover plate 130 on the extruding second rotating piece, subsequently through the groove between extrusion piece and the electronic slider, it is fixed by the extrusion wheel extrusion that is located the extrusion piece rear, and recess 132 on the apron of near-end this moment will extrude extension piece 131 on the adjacent apron to the completion is fixed, thereby the setting of this structure will be through the removal of electronic slider taut and collect the cutting wire, thereby the holding tank is closed to closed apron, thereby accomodate convenient subsequent processing with the cutting wire, repeats above-mentioned step.
While there have been shown and described what are at present considered the fundamental principles and essential features of the invention and its advantages, it will be apparent to those skilled in the art that the invention is not limited to the details of the foregoing exemplary embodiments, but is capable of other specific forms without departing from the spirit or essential characteristics thereof. The present embodiments are therefore to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.
Furthermore, it should be understood that although the present description refers to embodiments, not every embodiment may contain only a single embodiment, and such description is for clarity only, and those skilled in the art should integrate the description, and the embodiments may be combined as appropriate to form other embodiments understood by those skilled in the art.
Claims (9)
1. A high-efficiency solar cell silicon wafer cutter comprises a stand (1) placed on the ground, a cylinder (2) arranged on the stand, a cutting device (3) arranged on the cylinder, and a three-jaw chuck (4) arranged on the stand; the method is characterized in that: the cutting device (3) comprises a shell (31) arranged at the top end of the air cylinder, a plurality of wire accommodating blocks (32) arranged on the shell, a first cavity (33) arranged in the shell, a rack bar (34) arranged in the first cavity, a motor (35) arranged on one side of the shell and used for driving the rack bar to rotate, a plurality of groups of cutting assemblies (5) arranged in the first cavity, and a cutting fluid spraying structure (6) arranged above the shell; the cutting devices are provided in plurality; the cutting assemblies are arranged in equal amount corresponding to the nano wire blocks.
2. A high efficiency solar cell silicon wafer cutter as defined in claim 1 wherein: cutting assembly (5) is including locating movable plate (51) in the first cavity, locating first support (52) on the movable plate, locating first leading wheel (53) on the first support, locating second support (54) on the first cavity lateral wall, locating second leading wheel (55) on the second support, locating extend block (56) on the line block, locating third leading wheel (57) in the extend block, set up holding tank (58) on the line block, locate cutting filament (59) in the holding tank, locate third support (510) on the first cavity lateral wall, be used for stimulateeing tightening structure (7) that the movable plate removed, locate transmission structure (8) on the third support, locate stripper plate (9) on the movable plate, locate grading structure (10) on the movable plate, And the resetting structure (12) is arranged in the nano-wire block.
3. A high efficiency solar cell silicon wafer cutter as defined in claim 1 wherein: tightening structure (7) is including locating take-up (71) on the casing outer wall, locating fourth support (72) on the casing, locating fourth leading wheel (73) on the fourth support, set up in through-hole (74) on the casing, locate fifth support (75) on the first cavity inner wall, locate fifth leading wheel (76) on the fifth support, be used for connecting take-up with rope body (77) of movable plate.
4. A high efficiency solar cell silicon wafer cutter as defined in claim 1 wherein: the transmission structure (8) comprises a first sliding groove (81) arranged on the third support, a transmission wheel (82) arranged in the first sliding groove, transmission teeth (83) arranged in the radial direction of the transmission wheel, a rotating block (84) arranged on the transmission wheel, a first sliding block (85) sleeved on the rotating block, a first elastic part (86) arranged in the first sliding groove and used for resetting the first sliding block, a separation plate (87) arranged on the transmission wheel, a notch (88) arranged on the moving plate, a first guide plate (89) arranged on the separation plate, a through hole (810) arranged on the separation plate and used for allowing a cutting wire to pass through, a second guide plate (811) arranged in the through hole, and a tensioning structure (11) arranged on the third support; the driving wheel (82) comprises a wheel body (821), a fracture (822) formed in the wheel body, a connecting column (823) formed in the fracture, and a rolling piece (824) formed on the connecting column.
5. A high efficiency solar cell silicon wafer cutter as defined in claim 1 wherein: the tensioning structure (11) comprises a second sliding groove (111) arranged on the third support, a second sliding block (112) arranged in the second sliding groove, a sixth guide wheel (113) arranged on the second sliding block, a blocking piece (114) arranged at the top end of the second sliding groove, and a second elastic piece (115) arranged on the blocking piece and used for resetting the second sliding block.
6. A high efficiency solar cell silicon wafer cutter as defined in claim 1 wherein: the extrusion plate (9) comprises a through groove (91) arranged on the shell, an extrusion piece (92) arranged on the moving block, and balls (93) arranged on the extrusion piece.
7. A high efficiency solar cell silicon wafer cutter as defined in claim 1 wherein: progressive structure (10) is including locating long piece (101) of moving piece one side, locating third spout (102) of moving piece opposite side, locating fourth spout (103) of third spout bottom, locating third slider (104) in the fourth spout, locating fifth spout (105) on the fourth spout lateral wall, locating fourth slider (106) in the fifth spout, offer and locate first joint mouth (107) on the fourth slider, locate be used for reseing in the fifth spout third elastic component (108) of fourth slider, offer and locate sixth spout (109) on the moving piece, locate litter (1010) in the sixth spout, cover and locate fifth slider (1011) on the litter, locate be used for reseing in the sixth spout fourth elastic component (1012) of fifth slider, offer and locate second joint mouth (1013) on the fifth slider, A first rotating piece (1014) arranged on the fifth sliding block, and a rotating rod (1015) with one end rotatably connected with the inner wall of the shell.
8. A high efficiency solar cell silicon wafer cutter as defined in claim 1 wherein: the cutting fluid spraying structure (6) comprises a box body (61) arranged on the rack, a sixth support (62) arranged above the shell, a material storage pipeline (63) erected on the sixth support, a first conveying pipe (64) connected with the box body and the material storage pipeline, a second conveying pipe (65) arranged on the material storage pipeline, a plurality of material spraying nozzles (66) arranged on the conveying pipeline, and a material inlet pipe opening (67) arranged on the wire containing block; the second conveying pipeline is embedded in the accommodating groove through the pipe inlet.
9. A high efficiency solar cell silicon wafer cutter as defined in claim 1 wherein: the resetting structure (12) comprises an electric track (121) arranged at the bottom of the accommodating groove, an electric slider (122) arranged in the electric track, a wire hole (123) formed in the electric slider, an extrusion block (124) arranged on the electric slider, a slope (125) arranged on the extrusion block, a graver (126) arranged below the extrusion block, a seventh support (127) arranged on the extrusion block, an extrusion wheel (128) arranged on the seventh support, second rotating members (129) arranged on two sides of the accommodating groove, a cover plate (130) arranged on the second rotating members, an extension block (131) arranged on one side of the cover plate, and a groove (132) arranged on the other side of the cover plate; the cover plates are rotatably covered around the second rotating member to press the extending blocks on the adjacent cover plates through the grooves.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010524873.8A CN111775353B (en) | 2020-06-10 | 2020-06-10 | High-efficient solar cell silicon chip cutterbar |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010524873.8A CN111775353B (en) | 2020-06-10 | 2020-06-10 | High-efficient solar cell silicon chip cutterbar |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN111775353A true CN111775353A (en) | 2020-10-16 |
| CN111775353B CN111775353B (en) | 2022-05-31 |
Family
ID=72755872
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202010524873.8A Active CN111775353B (en) | 2020-06-10 | 2020-06-10 | High-efficient solar cell silicon chip cutterbar |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN111775353B (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116352902A (en) * | 2023-05-09 | 2023-06-30 | 江苏和丽新能源科技有限公司 | Silicon wafer cutting equipment for manufacturing solar cell panel |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002252187A (en) * | 2001-02-27 | 2002-09-06 | Mitsubishi Electric Corp | Cutter for semiconductor wafer, and method of cutting semiconductor wafer using the same |
| CN102544240A (en) * | 2012-03-09 | 2012-07-04 | 润峰电力有限公司 | Method and device for integrating slicing and flocking of crystalline silicon wafer |
| CN206085370U (en) * | 2016-05-14 | 2017-04-12 | 洛阳金诺机械工程有限公司 | Cutting device of crystal silicon rod |
| CN206510235U (en) * | 2017-02-21 | 2017-09-22 | 嘉兴融茂精密机械有限公司 | A kind of excavation machine tension adjustment mechanism |
| CN109129948A (en) * | 2018-10-24 | 2019-01-04 | 乐山新天源太阳能科技有限公司 | Automatic cycle sprays silicon chip cutter |
| CN109291270A (en) * | 2018-10-10 | 2019-02-01 | 唐燕 | A kind of cutter device of the Silicon Wafer for chip manufacturing |
| CN109664423A (en) * | 2018-12-19 | 2019-04-23 | 南京工程学院 | A kind of tension control system for silicon chip of solar cell cutting |
| CN209440565U (en) * | 2018-10-24 | 2019-09-27 | 乐山新天源太阳能科技有限公司 | The adjustable silicon rod cutting device of Cutting Length |
-
2020
- 2020-06-10 CN CN202010524873.8A patent/CN111775353B/en active Active
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002252187A (en) * | 2001-02-27 | 2002-09-06 | Mitsubishi Electric Corp | Cutter for semiconductor wafer, and method of cutting semiconductor wafer using the same |
| CN102544240A (en) * | 2012-03-09 | 2012-07-04 | 润峰电力有限公司 | Method and device for integrating slicing and flocking of crystalline silicon wafer |
| CN206085370U (en) * | 2016-05-14 | 2017-04-12 | 洛阳金诺机械工程有限公司 | Cutting device of crystal silicon rod |
| CN206510235U (en) * | 2017-02-21 | 2017-09-22 | 嘉兴融茂精密机械有限公司 | A kind of excavation machine tension adjustment mechanism |
| CN109291270A (en) * | 2018-10-10 | 2019-02-01 | 唐燕 | A kind of cutter device of the Silicon Wafer for chip manufacturing |
| CN109129948A (en) * | 2018-10-24 | 2019-01-04 | 乐山新天源太阳能科技有限公司 | Automatic cycle sprays silicon chip cutter |
| CN209440565U (en) * | 2018-10-24 | 2019-09-27 | 乐山新天源太阳能科技有限公司 | The adjustable silicon rod cutting device of Cutting Length |
| CN109664423A (en) * | 2018-12-19 | 2019-04-23 | 南京工程学院 | A kind of tension control system for silicon chip of solar cell cutting |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116352902A (en) * | 2023-05-09 | 2023-06-30 | 江苏和丽新能源科技有限公司 | Silicon wafer cutting equipment for manufacturing solar cell panel |
| CN116352902B (en) * | 2023-05-09 | 2023-08-08 | 江苏和丽新能源科技有限公司 | Silicon wafer cutting equipment for manufacturing solar cell panel |
Also Published As
| Publication number | Publication date |
|---|---|
| CN111775353B (en) | 2022-05-31 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN108400513B (en) | Coaxial double-end cable cutting and stripping mechanism | |
| CN211712253U (en) | System of cutting of packaging film | |
| CN111232729B (en) | Corrugated board trimming and collecting equipment and production process using same | |
| CN111775353B (en) | High-efficient solar cell silicon chip cutterbar | |
| CN114905286B (en) | Integrated aluminum pipe trimming device | |
| CN112645102A (en) | Automatic reel replacing device of adhesive tape splitting machine | |
| CN211957443U (en) | Wire winding and feeding mechanism with fixed-point paint stripping function | |
| CN213919246U (en) | From type production of membrane with deckle edge remove device | |
| CN214023247U (en) | Steel wire shot cutting machine | |
| CN211803134U (en) | Novel steel bar cold-drawing machine | |
| CN104260171A (en) | Cutting processing device for bamboo chips | |
| CN211515779U (en) | Helical blade forming machine | |
| CN115189203A (en) | Cable production equipment and process | |
| CN210649085U (en) | Laser pipe cutting machine | |
| CN111558677B (en) | Thread rolling device of straight thread rolling machine for reinforcing steel bars | |
| CN111469493A (en) | Production device of cone-shaped paper tube | |
| CN208100515U (en) | A kind of chipper | |
| CN216422750U (en) | Limiting device for polyethylene pipe production | |
| CN112448250B (en) | Tin sticky and terminal punching integrated system | |
| CN217095962U (en) | Automatic pipe cutting machine | |
| CN218300771U (en) | Wire stripping machine suitable for multi-specification wire harness | |
| CN104260173A (en) | Bamboo chip forming machine | |
| CN116494362B (en) | Horizontal automatic cutout machine of wet base of honeycomb pottery | |
| CN218255549U (en) | Batch trimming and punching device | |
| CN217912638U (en) | Wire bidirectional cutting mechanism |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20230725 Address after: 337039 Baiyuan, Anyuan District, Nanchang City, Jiangxi Province (No.1 Chongqing Road, Anyuan Economic Transformation Industrial Base, Jiangxi Province) Patentee after: Jiangxi Jinkui Energy Technology Co.,Ltd. Address before: No.288, yidianhong Avenue, Pujiang County, Jinhua City, Zhejiang Province Patentee before: ZHEJIANG PUJIANG ZHONGXING Co.,Ltd. |
|
| TR01 | Transfer of patent right | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20230923 Address after: 337000 by Chenggong Avenue, Economic Transformation Industrial Base, Anyuan District, Pingxiang City, Jiangxi Province Patentee after: Jiangxi Jinkui New Material Technology Co.,Ltd. Address before: 337039 Baiyuan, Anyuan District, Nanchang City, Jiangxi Province (No.1 Chongqing Road, Anyuan Economic Transformation Industrial Base, Jiangxi Province) Patentee before: Jiangxi Jinkui Energy Technology Co.,Ltd. |