CN111769728A - Highly integrated motor control system - Google Patents
Highly integrated motor control system Download PDFInfo
- Publication number
- CN111769728A CN111769728A CN202010735530.6A CN202010735530A CN111769728A CN 111769728 A CN111769728 A CN 111769728A CN 202010735530 A CN202010735530 A CN 202010735530A CN 111769728 A CN111769728 A CN 111769728A
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- igbt
- phase
- copper bar
- circuit board
- radiator
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- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 39
- 229910052802 copper Inorganic materials 0.000 claims abstract description 39
- 239000010949 copper Substances 0.000 claims abstract description 39
- 238000001746 injection moulding Methods 0.000 claims abstract description 33
- 239000003990 capacitor Substances 0.000 claims abstract description 28
- 238000003466 welding Methods 0.000 claims description 17
- 230000010354 integration Effects 0.000 claims description 10
- 238000000034 method Methods 0.000 claims description 10
- 238000005070 sampling Methods 0.000 claims description 9
- 230000006698 induction Effects 0.000 claims description 6
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 5
- 238000004519 manufacturing process Methods 0.000 description 5
- 238000005516 engineering process Methods 0.000 description 4
- 238000009434 installation Methods 0.000 description 4
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 239000004519 grease Substances 0.000 description 2
- 229920001296 polysiloxane Polymers 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 230000000295 complement effect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 239000012778 molding material Substances 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 239000000741 silica gel Substances 0.000 description 1
- 229910002027 silica gel Inorganic materials 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 238000004804 winding Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
- H02M1/00—Details of apparatus for conversion
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/70—Bipolar devices
- H01L29/72—Transistor-type devices, i.e. able to continuously respond to applied control signals
- H01L29/739—Transistor-type devices, i.e. able to continuously respond to applied control signals controlled by field-effect, e.g. bipolar static induction transistors [BSIT]
- H01L29/7393—Insulated gate bipolar mode transistors, i.e. IGBT; IGT; COMFET
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02K—DYNAMO-ELECTRIC MACHINES
- H02K11/00—Structural association of dynamo-electric machines with electric components or with devices for shielding, monitoring or protection
- H02K11/30—Structural association with control circuits or drive circuits
- H02K11/33—Drive circuits, e.g. power electronics
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/005—Constructional details common to different types of electric apparatus arrangements of circuit components without supporting structure
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/02—Arrangements of circuit components or wiring on supporting structure
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2089—Modifications to facilitate cooling, ventilating, or heating for power electronics, e.g. for inverters for controlling motor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2089—Modifications to facilitate cooling, ventilating, or heating for power electronics, e.g. for inverters for controlling motor
- H05K7/20927—Liquid coolant without phase change
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0007—Casings
- H05K9/002—Casings with localised screening
- H05K9/0022—Casings with localised screening of components mounted on printed circuit boards [PCB]
- H05K9/0024—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Thermal Sciences (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Ceramic Engineering (AREA)
- Inverter Devices (AREA)
Abstract
The invention discloses a highly integrated motor control system, which relates to the field of Insulated Gate Bipolar Transistor (IGBT), and comprises a control and drive integrated circuit board, an IGBT module, a capacitor, a three-phase output bus bar, a shielding cover for a sensor, a three-phase copper bar injection molding part and a radiator for the IGBT.
Description
Technical Field
The invention relates to the field of Insulated Gate Bipolar Transistors (IGBT), in particular to a highly integrated motor control system.
Background
The traditional motor control system is generally large in size and loose in interior in structure, generally adopts the modes of bolt connection, wire harness connection and the like, and heat-conducting silicone grease is required to be filled between components, so that the size and the weight are large, the thermal resistance of the system is generally large, and the reliability is not ideal.
Moreover, the components are generally small in size, are assembled one by one, need manual operation no matter in connection of wire harnesses or fixation of bolts, are low in production efficiency, and are not suitable for automatic batch manufacturing.
Disclosure of Invention
The invention aims to provide a highly integrated motor control system, which adopts direct-connection mutual welding processes in different modes, has better reliability and consistency compared with the scheme on the market, has the technical characteristics of compact structure, high integration level, light weight, flexible platform expansion and the like, saves the traditional bolt connection and wire harness connection in design, is more convenient to assemble, is suitable for automatic batch manufacturing, and provides a process foundation for assembly with higher automation degree.
A highly integrated motor control system comprises a control and drive integrated circuit board, an IGBT module, a capacitor, a three-phase output bus bar, a shielding cover for a sensor, a three-phase copper bar injection molding piece and a radiator for the IGBT, wherein the IGBT module is welded on the radiator for the IGBT;
electric capacity and three-phase copper bar injection molding are installed respectively in the both sides of radiator for the IGBT, female below of arranging of three-phase output is equipped with the shield cover for the sensor, and female and three-phase copper bar injection molding integrated into one piece of arranging of three-phase output, control drive integration circuit board is respectively through circuit board erection column and circuit board fixing support fixed connection on the shell and the three-phase copper bar injection molding of electric capacity to cover female the arranging of three-phase output.
Preferably, an IGBT collector of the upper bridge and an IGBT emitter of the lower bridge of the IGBT module are respectively connected with the positive electrode and the negative electrode of a capacitor output copper bar of the capacitor, and an IGBT gate of the IGBT module is directly welded with the control and drive integrated circuit board.
Preferably, the IGBT module is formed by arranging IGBT tubes side by side to form a three-phase full bridge.
Preferably, the capacitor is installed in a capacitor installation groove on the left side of the radiator for the IGBT, the three-phase copper bar injection molding is installed in an injection molding installation plate on the right side of the radiator for the IGBT, and a water pipe is respectively arranged at the front end and the rear end of the radiator for the IGBT.
Preferably, the IGBT module is directly welded on an IGBT welding boss on the radiator for the IGBT through a vacuum welding process, and a temperature sensor setting block is arranged on the rear side of the IGBT welding boss.
Preferably, be equipped with the shield cover slot on the drive integration circuit board, and its bottom still installs magnetic induction chip and temperature sensor support, the temperature sensor support is located the temperature sensor and sets up the piece directly over.
Preferably, the outside of electric capacity still is equipped with positive input terminal of high voltage direct current and high voltage direct current negative input terminal, and the top of electric capacity is equipped with the spacing hole of control panel, still be connected with busbar voltage sampling pin on the electric capacity output copper bar, busbar voltage sampling pin still welds on control drive integration circuit board.
Preferably, the outer side of the three-phase copper bar injection molding piece is also provided with a three-phase copper bar outlet.
The invention has the advantages that: simple structure has adopted the direct mutual welding technology of different modes, compares scheme reliability and uniformity on the market better, and this design has technical characterstic such as compact structure, integrated level height, light in weight, platform extension are nimble, has saved traditional bolted connection and pencil connection in the design simultaneously, and the assembly is more simple and convenient, is fit for automatic batch manufacturing, also provides the technology basis for the assembly of higher degree of automation.
Drawings
FIG. 1 is an exploded view of the front side view of the device of the present invention;
FIG. 2 is an exploded view of the rear view of the device of the present invention;
the device comprises a control and drive integrated circuit board 1, a 101, a shield slot, 102, a magnetic induction chip 103, a temperature sensor support, 2, an IGBT module, 201, an IGBT collector, 202, an IGBT emitter, 203, an IGBT gate pole, 3, a capacitor, 301, a high-voltage direct current positive input terminal, 302, a high-voltage direct current negative input terminal, 303, a capacitor output copper bar, 304, a bus voltage sampling pin, 305, a control board limiting hole, 306, a circuit board mounting column, 4, a three-phase output busbar, 5, a shield for a sensor, 6, a three-phase copper bar injection molding part, 601, a circuit board fixing support, 602, a three-phase copper bar outlet, 7, a radiator for the IGBT, 701, a capacitor mounting groove, 702, an injection molding part mounting plate, 703, a water pipe, 8, an IGBT welding boss, 801 and a temperature sensor setting block.
Detailed Description
In order to make the technical means, the creation characteristics, the achievement purposes and the effects of the invention easy to understand, the invention is further described below by combining the specific embodiments.
As shown in fig. 1 to 2, a highly integrated motor control system comprises a control and drive integrated circuit board 1, an IGBT module 2, a capacitor 3, a three-phase output bus bar 4, a sensor shield 5, a three-phase copper bar injection molding 6 and a radiator 7 for IGBT, wherein the IGBT module 2 is welded on the radiator 7 for IGBT, each phase of the IGBT module 2 is composed of 2 IGBT tubes of an upper bridge and a lower bridge, the 2 IGBT tubes are horizontally arranged side by side, an IGBT collector 201 and an IGBT emitter 202 of the IGBT module 2 are connected with a capacitor output copper bar 303 of the capacitor 3, and an output end of the IGBT collector 201 and the IGBT emitter 202 are connected with the three-phase output bus bar 4;
The IGBT collector 201 of the upper bridge and the IGBT emitter 202 of the lower bridge of the IGBT module 2 are respectively connected with the positive electrode and the negative electrode of a capacitor output copper bar 303 of a capacitor 3, and the IGBT gate electrode 203 of the IGBT module 2 is directly welded with the control and drive integrated circuit board 1.
And the IGBT module 2 is formed by arranging 6 IGBT tubes side by side to form a three-phase full bridge.
The capacitor 3 is installed in a capacitor installation groove 701 on the left side of the radiator 7 for the IGBT, the three-phase copper bar injection molding part 6 is installed in an injection molding part installation plate 702 on the right side of the radiator 7 for the IGBT, and the front end and the rear end of the radiator 7 for the IGBT are respectively provided with a water pipe 703.
The IGBT module 2 is directly welded on an IGBT welding boss 8 on an IGBT radiator 7 through a vacuum welding process, and a temperature sensor setting block 801 is arranged on the rear side of the IGBT welding boss 8. The solder bumps 8 are used to solder the IGBT module 2 to the IGBT heat sink 7 and ensure that an effective electrical gap is maintained with the IGBT heat sink 7.
The integrated drive circuit board 1 is provided with a shielding case slot 101, the bottom of the integrated drive circuit board is also provided with a magnetic induction chip 102 and a temperature sensor support 103, and the temperature sensor support 103 is located right above the temperature sensor setting block 801.
The outside of electric capacity 3 still is equipped with positive input terminal 301 of high voltage direct current and high voltage direct current negative input terminal 302, and the top of electric capacity 3 is equipped with the spacing hole 305 of control panel, still be connected with busbar voltage sampling pin 304 on electric capacity output copper bar 303, busbar voltage sampling pin 304 still welds on control drive integration circuit board 1. The bus voltage sampling pin 304 is used for controlling the control and drive integrated circuit board 1 to collect bus voltage, and is directly welded with the control and drive integrated circuit board 1.
The outer side of the three-phase copper bar injection molding piece 6 is also provided with a three-phase copper bar outlet 602.
The specific implementation mode and principle are as follows:
the high-current IGBT module 2 packaged by single tubes is selected, the three-phase full bridge consists of 6 single tubes, 2 single tubes of an upper bridge and a lower bridge of a same-phase bridge arm are arranged in a 180-degree complementary mode to form a same-phase bridge arm, 6 tubes are arranged side by side to form the three-phase full bridge, and the three-phase full bridge is directly welded with a radiator through a vacuum welding process, so that the space is saved, the traditional heat-conducting silicone grease is saved, and the thermal resistance of a system is;
the IGBT radiator 7 is integrally designed with the capacitor mounting groove 701 and the injection molding mounting plate 702, the inner part of the IGBT radiator 7 is designed by adopting a fin structure so as to increase the effective radiating area, the upper surface and the lower surface of the radiator are welded and formed by a friction welding process, the structure is more compact, and the surface of the radiator is subjected to nickel plating treatment;
the capacitor 3 is arranged in the capacitor mounting groove 701 and is positioned on the side edge of the IGBT module, and a capacitor output copper bar 303 of the capacitor 3 is directly connected with an input terminal of the IGBT module 2 by adopting a laser welding process to replace a conventional bolt fastening connection mode, so that the inductance of a main loop is reduced, and the reliability of a system is improved;
the temperature sensor setting block 801 is located on the IGBT welding boss 8 near the IGBT module and located at the water outlet of the IGBT radiator 7, a groove is designed on the temperature sensor setting block 801, a temperature sensor is fixed on the temperature sensor support 103 in advance, the temperature sensor support 103 is welded on the control and drive integrated circuit board 1, the temperature sensor is just positioned in the groove after the control and drive integrated circuit board 1 is installed, and heat-conducting silica gel is pre-embedded in the groove to play a role in fixing and heat transfer;
the three-phase output bus bar 4 of the controller and the three-phase copper bar injection molding piece 6 are welded directly with the output terminal of the IGBT module 2 by adopting an integrated injection molding process, and the other end of the three-phase output bus bar 4 is directly connected with a three-phase winding of the motor;
the phase current sensor adopts a magnetic induction chip technology to replace the traditional HALL sensor technology, the magnetic induction chip is integrated on a control drive integrated circuit board, a shielding case 5 for the sensor and a three-phase output bus bar 4 are integrally molded by injection, the three-phase output bus bar 4 is arranged right below the chip, the shielding case 5 for the sensor is arranged below the three-phase output bus bar 4, the three-phase output bus bar 4 and the shielding case 5 for the sensor are insulated by injection molding materials, and the sensor is fixed by the shielding case 5 in an injection molding mode;
the control and drive integrated circuit board 1 is integrally designed, the integrated circuit board is fixed on a shell of the capacitor 3 and a three-phase copper bar injection molding part 6, and a drive bonding pad is connected with a gate pole pin of the IGBT module 2 through tin soldering and is directly welded with a positive pole pin of the capacitor 3 at the same time for bus voltage sampling.
Based on the above, the invention has simple structure, adopts direct-connection mutual welding processes of different modes, has better reliability and consistency compared with the scheme on the market, has the technical characteristics of compact structure, high integration level, light weight, flexible platform expansion and the like, simultaneously omits the traditional bolt connection and wire harness connection in design, is simpler and more convenient to assemble, is suitable for automatic batch manufacturing, and provides a process foundation for assembly with higher automation degree.
It will be appreciated by those skilled in the art that the invention may be embodied in other specific forms without departing from the spirit or essential characteristics thereof. The embodiments disclosed above are therefore to be considered in all respects as illustrative and not restrictive. All changes which come within the scope of or equivalence to the invention are intended to be embraced therein.
Claims (8)
1. The highly integrated motor control system is characterized by comprising a control and drive integrated circuit board (1), an IGBT module (2), a capacitor (3) and a three-phase output busbar (4), a shielding cover (5) for a sensor, a three-phase copper bar injection molding part (6) and a radiator (7) for the IGBT, wherein the IGBT module (2) is welded on the radiator (7) for the IGBT, each phase of the IGBT module (2) is composed of 2 IGBT tubes of an upper bridge and a lower bridge, the 2 IGBT tubes are horizontally arranged side by side, an IGBT collector electrode (201) and an IGBT emitter electrode (202) of the IGBT module (2) are connected with a capacitor output copper bar (303) of the capacitor (3), and the output end of the IGBT module is connected with the three-phase output busbar (4);
electric capacity (3) and three-phase copper bar injection molding (6) install respectively in the both sides of radiator (7) for the IGBT, female (4) below of arranging of three-phase output is equipped with shield cover (5) for the sensor, and female (4) of three-phase output and three-phase copper bar injection molding (6) integrated into one piece, control drive integration circuit board (1) is respectively through circuit board erection column (306) and circuit board fixing support (601) fixed connection on shell and three-phase copper bar injection molding (6) of electric capacity (3) to cover female (4) of three-phase output.
2. A highly integrated motor control system according to claim 1, characterized in that: an IGBT collector electrode (201) of an upper bridge and an IGBT emitter electrode (202) of a lower bridge of the IGBT module (2) are respectively connected with the positive electrode and the negative electrode of a capacitance output copper bar (303) of a capacitance (3), and an IGBT gate pole (203) of the IGBT module (2) is directly welded with the control and drive integrated circuit board (1).
3. A highly integrated motor control system according to claim 1, characterized in that: and the IGBT module (2) is formed by arranging 6 IGBT tubes side by side to form a three-phase full bridge.
4. A highly integrated motor control system according to claim 1, characterized in that: the capacitor (3) is arranged in a capacitor mounting groove (701) on the left side of the radiator (7) for the IGBT, the three-phase copper bar injection molding piece (6) is arranged in an injection molding piece mounting plate (702) on the right side of the radiator (7) for the IGBT, and the front end and the rear end of the radiator (7) for the IGBT are respectively provided with a water pipe (703).
5. A highly integrated motor control system according to claim 1, characterized in that: the IGBT module (2) is directly welded on an IGBT welding boss (8) on the radiator (7) for the IGBT through a vacuum welding process, and a temperature sensor setting block (801) is arranged on the rear side of the IGBT welding boss (8).
6. A highly integrated motor control system according to claim 5, wherein: be equipped with shield cover slot (101) on drive integration circuit board (1), and magnetic induction chip (102) and temperature sensor support (103) are still installed to its bottom, temperature sensor support (103) are located temperature sensor and set up directly over piece (801).
7. A highly integrated motor control system according to claim 1, characterized in that: the outside of electric capacity (3) still is equipped with positive input terminal (301) of high voltage direct current and high voltage direct current negative input terminal (302), and the top of electric capacity (3) is equipped with spacing hole of control panel (305), still be connected with busbar voltage sampling pin (304) on electric capacity output copper bar (303), busbar voltage sampling pin (304) still weld on control drive integrated circuit board (1).
8. A highly integrated motor control system according to claim 1, characterized in that: and a three-phase copper bar outlet (602) is also arranged on the outer side of the three-phase copper bar injection molding piece (6).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010735530.6A CN111769728A (en) | 2020-07-28 | 2020-07-28 | Highly integrated motor control system |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010735530.6A CN111769728A (en) | 2020-07-28 | 2020-07-28 | Highly integrated motor control system |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN111769728A true CN111769728A (en) | 2020-10-13 |
Family
ID=72727467
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202010735530.6A Pending CN111769728A (en) | 2020-07-28 | 2020-07-28 | Highly integrated motor control system |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN111769728A (en) |
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2020
- 2020-07-28 CN CN202010735530.6A patent/CN111769728A/en active Pending
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