CN111752041B - Preparation method and reflection structure of mini-LED lamp panel - Google Patents

Preparation method and reflection structure of mini-LED lamp panel Download PDF

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CN111752041B
CN111752041B CN202010651038.0A CN202010651038A CN111752041B CN 111752041 B CN111752041 B CN 111752041B CN 202010651038 A CN202010651038 A CN 202010651038A CN 111752041 B CN111752041 B CN 111752041B
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plate
reflecting
reflector
mini
substrate
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CN111752041A (en
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浩育涛
王硕
张亚莉
张树柏
耿霄霖
翟明
桑建
孙海威
周昊
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BOE Technology Group Co Ltd
BOE Jingxin Technology Co Ltd
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BOE Technology Group Co Ltd
BOE Jingxin Technology Co Ltd
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    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
    • G02F1/1336—Illuminating devices
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
    • G02F1/1336—Illuminating devices
    • G02F1/133602—Direct backlight
    • G02F1/133603—Direct backlight with LEDs
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
    • G02F1/1336—Illuminating devices
    • G02F1/133602—Direct backlight
    • G02F1/133605—Direct backlight including specially adapted reflectors

Abstract

The invention relates to the technical field of liquid crystal display, in particular to a backlight source using micro light-emitting diodes, and discloses a method for preparing a mini-LED lamp panel and a reflection structure, wherein the method comprises the following steps: bonding a reflecting plate with a substrate welded with a mini-LED to form a mini-LED lamp panel, wherein the reflecting plate comprises a plurality of reflecting sheets, each reflecting sheet is provided with an opening, and a gap is formed between every two adjacent reflecting sheets; and carrying out dispensing packaging. When heated, the reflector plates have size change mainly based on thermal contraction, and because each reflector plate is independent, the size change of thermal contraction is only limited in the reflector plates, and the accumulation effect of the whole reflector plate is avoided. Therefore, the displacement of the opening is effectively reduced in a mode that the reflecting plate is divided into a plurality of mutually spaced reflecting sheets; and because the displacement volume of trompil reduces, reduced the reflector plate and the component on the base plate and taken place the probability of interfering the extrusion, promoted the reliability of mini-LED lamp plate.

Description

Preparation method and reflection structure of mini-LED lamp panel
Technical Field
The invention relates to the technical field of liquid crystal display, in particular to a method for manufacturing a mini-LED lamp panel and a reflection structure.
Background
With the progress of liquid crystal display technology, backlights increasingly use micro-light emitting diodes (mini-LEDs).
The mini-LED lamp panel in the prior art comprises a substrate and a reflecting plate attached to the substrate, wherein holes are formed in the reflecting plate to avoid an LED array and other components on the substrate.
However, the difference between the thermal shrinkage rate of the reflector and the substrate is large, so that the reflector can undergo thermal shrinkage under a high-temperature environment to cause the displacement of the opening, and the phenomenon of interference extrusion between the opening of the reflector and a device on the lamp panel is easy to occur, thereby causing the defect of the mini-LED lamp panel.
Disclosure of Invention
The invention provides a method for preparing a mini-LED lamp panel and a reflection structure, and the method for preparing the mini-LED lamp panel can effectively reduce the phenomenon that the opening of a reflector plate and components on a substrate are subjected to interference extrusion, so that the performance of the mini-LED lamp panel is guaranteed.
In order to achieve the purpose, the invention provides the following technical scheme:
a method for preparing a mini-LED lamp panel comprises the following steps: bonding a reflecting plate with a substrate to form a mini-LED lamp panel, wherein the reflecting plate comprises a plurality of reflecting sheets, each reflecting sheet is provided with an opening for avoiding a component on the substrate, and a space is arranged between every two adjacent reflecting sheets; and dispensing and packaging the mini-LED lamp panel.
According to the method for preparing the mini-LED lamp panel, when the reflector plate is heated, as the interval is reserved between every two adjacent reflector plates in the reflector plate, namely, each reflector plate is independently heated, heat transfer does not occur between the plurality of reflector plates, and compared with a mode that the reflector plate is heated as a whole, the phenomenon that the heat shrinkage cumulant is overlarge due to overlarge heating area can be avoided.
Therefore, the mode that the reflecting plate is divided into a plurality of mutually-spaced reflecting sheets effectively reduces the heat shrinkage of the reflecting plate, and the displacement of the opening is reduced; and because the displacement volume of trompil reduces, then effectively reduced the reflector plate and the components and parts on the base plate and taken place the probability of interfering the extrusion, promoted the reliability of mini-LED lamp plate.
Optionally, the method for manufacturing the reflective plate includes: perforating the reflecting plate to form an opening; and after the maximum unit size of the reflector plate is determined according to the length of the opening, the length of the component on the substrate, the tolerance size and the heat shrinkage rate of the reflector plate, cutting the reflector plate to form a plurality of reflector plates, and ensuring that an interval is reserved between every two adjacent reflector plates.
Optionally, the method of cutting the reflection plate includes: adhering the reflecting plate to the protective layer; and cutting the reflecting plate to form a plurality of reflecting sheets and ensuring the integrity of the protective layer.
Optionally, the method for bonding the reflection plate to the substrate includes: bonding the reflecting plate bonded with the protective layer to the surface of the substrate provided with the component, and ensuring that the opening of the reflecting plate can avoid the component; and tearing off the protective layer.
Optionally, the preparation method of the reflector plate comprises the following steps: determining the maximum unit size of the reflector plate according to the required opening length, the length of the component on the substrate, the tolerance size and the heat shrinkage rate of the reflector plate, selecting the reflector plate with the size smaller than the maximum unit size, and punching each reflector plate to form an opening; a plurality of reflective sheets are spliced to form a reflective plate.
Optionally, the forming of the reflection plate includes: and adhering a plurality of reflection sheets to the protective layer so that the reflection sheets are spliced with each other on the protective layer to form the reflection plate.
Optionally, the method for bonding the reflection plate and the substrate includes: bonding the reflecting plate bonded with the protective layer to the surface of the substrate provided with the component, and ensuring that the opening of the reflecting plate can avoid the component; and tearing off the protective layer.
The present invention also provides a reflective structure comprising: the reflecting plate comprises a plurality of reflecting sheets, each reflecting sheet is provided with an opening for avoiding components on the substrate, and a space is arranged between every two adjacent reflecting sheets.
Optionally, the reflective structure further comprises a protective layer; the protective layer is a complete structure; the protective layer is adhered to the reflective plate.
Optionally, the reflective structure further comprises an adhesive layer; the adhesive layer is used for adhering the reflecting sheet to the surface of the substrate provided with the component.
Drawings
FIG. 1 is a schematic diagram showing the relative positions of an opening and an LED component on a substrate;
fig. 2 is a flowchart of a method for manufacturing a mini-LED lamp panel according to embodiment 1 of the present invention;
FIG. 3 is a schematic structural diagram after step S101 in embodiment 1 of the present invention is completed;
fig. 4 is a schematic structural diagram after step S102 in embodiment 1 is completed;
FIGS. 5-6 are exploded views of step S103 according to embodiment 1 of the present invention;
FIG. 7 is a schematic structural diagram of a reflective structure according to an embodiment of the present invention;
FIG. 8 is a schematic diagram of a reflective structure bonded to a substrate according to an embodiment of the present invention;
fig. 9 is a flowchart of a method for manufacturing a mini-LED lamp panel according to embodiment 2 of the present invention.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be obtained by a person skilled in the art without making any creative effort based on the embodiments in the present invention, belong to the protection scope of the present invention.
The preparation method of the mini-LED lamp panel provided by the embodiment of the invention comprises the following steps: bonding a reflector plate 1 with a substrate a to form a mini-LED lamp panel, wherein the reflector plate 1 comprises a plurality of reflector plates 2, each reflector plate 2 is provided with an opening 3 for avoiding a component b on the substrate a, and a space is arranged between every two adjacent reflector plates 2; and dispensing and packaging the mini-LED lamp panel.
The method for manufacturing the mini-LED lamp panel provided by the embodiment has the advantages that when the reflecting plate 1 is heated, because the interval is reserved between every two adjacent reflecting sheets 2 in the reflecting plate 1, namely, each reflecting sheet 2 is independently heated respectively, no heat is transferred between the reflecting sheets 2, and compared with a mode that the reflecting plate 1 is heated as a whole, the phenomenon that the heat shrinkage cumulant is too large due to too large heated area can be avoided.
Therefore, the way of dividing the reflector 1 into a plurality of mutually spaced reflectors 2 effectively reduces the thermal shrinkage of the reflector 1, and reduces the displacement of the opening 3; and because the displacement volume of trompil 3 reduces, then effectively reduced reflecting plate 1 and the component b on the base plate a and taken place the probability of interfering the extrusion, promoted the reliable ability of mini-LED lamp plate.
The punching process can adopt laser punching, chemical etching or multiple modes of punching by utilizing a cutter die and the like, can be specifically determined by referring to actual working condition requirements, and is not limited.
Then, the reflecting plate 1 and the substrate a are bonded to each other by a soft material and a hard material, and optionally by a manual jig or an automatic alignment device.
In addition, the opening 3 may be a through hole or a blind hole, and is not limited specifically, so that when the reflection plate 1 is attached to the substrate a, the opening 3 may accommodate the component b on the substrate a.
Also, the size and number of the reflective sheets 2 may be decided according to the following method:
determining the maximum unit size of the reflector plate 2, namely the size of the prepared reflector plate 2 needs to be smaller than the maximum unit size;
the maximum cell size formula is:
Figure BDA0002574982610000041
fig. 1 is a schematic diagram of relative positions of the opening and the LED device on the substrate, referring to the above formula and fig. 1, wherein:
z is the maximum cell size;
f is the length of the opening 3;
d is the length of the LED device;
h is the dimensional tolerance of the processes such as bonding and the like;
g is the thermal shrinkage of the reflecting sheet 2.
In addition, other physical quantities marked in fig. 1 are explained, and in fig. 1:
e is the width of the opening 3 of the reflector plate 2;
c is the width of the LED device;
x is the maximum displacement allowed by the aperture 3 of the reflector plate 2.
For example, a 65 inch (1400mm by 800mm) mini-LED lamp panel was prepared as follows:
the LED device size is: 150 μm (c) 500 μm (d);
the size of the opening 3 of the reflector plate 2 is as follows: 0.6mm (e) 2mm (f);
the heat shrinkage ratio (g) of the reflecting sheet 2 was: 1 per mill @150 ℃/h;
the dimensional tolerance (h) of the processes such as bonding and the like is as follows: +/-0.5 mm;
and x ═ f/2-d/2 ═ 0.75mm, the size of heat shrinkage remaining to the reflecting sheet 2 is x- | h | ═ 0.25 mm; the above values are then substituted into the maximum cell size equation to calculate: z is 250 mm;
then calculate the row number and the column number of reflector plate 2 specifically, because the length and width size of mini-LED lamp plate is 1400mm 800mm, then calculate:
1400/250 is 5.6, the integer is 6;
800/250 is 3.2, and takes the integer 4.
From the above data, the reflective sheets 2 may be distributed in 4 rows and 6 columns, and 24(4 × 6) reflective sheets 2 in total;
and finally, determining the specific size of the reflector plate 2 by using the length and width of the mini-LED lamp panel:
the length of the reflector sheet 2 is: 1400(mm)/6 ≈ 233.3 (mm);
the width of the reflector sheet 2 is: 800 (mm)/4-200 (mm);
it can be seen that the length of the reflector sheet 2 and the width of the reflector sheet 2 are both smaller than the maximum unit size of the reflector sheet 2, and the requirements are satisfied.
Example 1
The method for manufacturing the reflection plate 1 includes: perforating the reflecting plate 1 to form an opening 3; after the maximum unit size of the reflector plate is determined according to the length of the opening, the length of the component on the substrate, the tolerance size and the thermal shrinkage rate of the reflector plate, the reflector plate 1 is cut to form a plurality of reflector plates 2, and a gap is ensured between every two adjacent reflector plates 2.
The method of cutting the reflection plate 1 includes: adhering the reflection plate 1 to the protective layer 4; the reflection plate 1 is cut to form a plurality of reflection sheets 2 and ensure the integrity of the protective layer 4.
The method for bonding the reflecting plate 1 and the substrate a comprises the following steps: bonding the reflecting plate 1 bonded with the protective layer 4 to the surface of the substrate a provided with the component b, and ensuring that the open hole 3 of the reflecting plate 1 can avoid the component b; the protective layer 4 is torn off.
Fig. 2 is a flowchart of a method for manufacturing a mini-LED lamp panel according to embodiment 1 of the present invention, and as shown in fig. 2, in this embodiment, the mini-LED lamp panel may be manufactured according to the following steps:
step S101, punching the reflecting plate 1 to form open holes 3, and ensuring that the open holes 3 are distributed to correspond to the components b on the substrate a;
step S102, adhering the reflecting plate 1 and the protective layer 4, determining the maximum unit size of the reflecting sheet according to the length of the opening, the length of the component on the substrate, the tolerance size and the heat shrinkage rate of the reflecting sheet, and then cutting the reflecting plate 1 to divide the reflecting plate 1 into a plurality of reflecting sheets 2 with intervals, and ensuring that the protective layer 4 cannot be cut;
step S103, adhering the reflecting plate 1 adhered with the protective layer 4 to the surface of the substrate a provided with the component b, ensuring that the component b on the substrate a corresponds to the open hole 3 and does not interfere with the open hole 3 to form a mini-LED lamp panel, and then tearing off the protective layer 4;
and step S104, dispensing and packaging the mini-LED lamp panel.
Fig. 3 is a schematic structural diagram after step S101 in embodiment 1 of the present invention is completed, fig. 4 is a schematic structural diagram after step S102 in embodiment 1 of the present invention is completed, fig. 5 to fig. 6 are schematic exploded schematic step S103 in embodiment 1 of the present invention, and referring to fig. 3 to fig. 6, it can be known that, in this manufacturing method of this embodiment, since the protective layer 4 is adhered to the reflective plate 1 before cutting, even if the reflective plate 1 is cut into a plurality of reflective sheets 2, the relative positions between the plurality of reflective sheets 2 are fixed, as shown in fig. 4; as shown in fig. 5-6, the protective layer 4 can move as a whole with the plurality of reflective sheets 2 during the pasting process, so that the relative positions of the plurality of reflective sheets 2 of the subsequent bonded substrate a are not changed, and the matching accuracy of the opening 3 on the reflective sheet 2 and the component b on the substrate a can be ensured. In addition, because the protective layer 4 is not cut, the integrity of the protective layer 4 is kept, the protective layer 4 can be torn off after the reflecting plate 1 is attached to the substrate a more conveniently, the operation is simple and convenient, and the preparation efficiency is improved.
Example 2
The method for manufacturing the reflection plate 1 includes: determining the maximum unit size of the reflector plate according to the required opening length, the length of the component on the substrate, the tolerance size and the heat shrinkage rate of the reflector plate, selecting the reflector plate with the size smaller than the maximum unit size, and punching each reflector plate 2 to form an opening 3; a plurality of reflection sheets 2 are spliced to form a reflection plate 1.
The forming step of the reflection plate 1 includes: a plurality of reflection sheets 2 are adhered to the protective layer 4 so that the reflection sheets 2 are spliced to each other at the protective layer 4 to form the reflection plate 1.
The method for bonding the reflecting plate 1 and the substrate a comprises the following steps: bonding the reflecting plate 1 bonded with the protective layer 4 to the surface of the substrate a provided with the component b, and ensuring that the open hole 3 of the reflecting plate 1 can avoid the component b; the protective layer 4 is torn off.
Fig. 7 is a flowchart of a method for manufacturing a mini-LED lamp panel according to embodiment 2 of the present invention, and as shown in fig. 7, in this embodiment, the mini-LED lamp panel may be manufactured according to the following steps:
step S201, determining the maximum unit size of the reflector plate according to the required opening length, the length of the component on the substrate, the tolerance size and the heat shrinkage rate of the reflector plate, selecting the reflector plate 2 with the size smaller than the maximum unit size, and punching each reflector plate 2 to form an opening 3;
step S202, splicing and sticking a plurality of reflector plates 2 on a protective layer 4 to enable the plurality of reflector plates 2 to form a reflector plate 1 and ensure that the distribution of openings 3 on the reflector plates 2 corresponds to components b on a substrate a;
step S203, adhering the reflecting plate 1 adhered with the protective layer 4 to the surface of the substrate a provided with the component b, ensuring that the component b on the substrate a corresponds to the open hole 3 and does not interfere with the open hole 3 to form a mini-LED lamp panel, and then tearing off the protective layer 4;
and step S204, dispensing and packaging the mini-LED lamp panel.
The preparation method of the embodiment can also meet the requirement that the protective layer 4 and the reflecting plate 1 move as a whole, and the relative position between the plurality of reflecting sheets 2 of the follow-up bonding substrate a cannot be changed, so that the matching accuracy of the open hole 3 on the reflecting sheet 2 and the component b on the substrate a can be ensured. In addition, as the reflector plate 2 is perforated, and the reflector plates 2 are spliced to form the reflector plate 1, the size of the reflector plate 2 does not need to be overlarge, so that the perforation process is simpler and more convenient to operate, and the preparation efficiency is improved. In addition, in the manufacturing method of the present embodiment, the completeness of the protective layer 4 is also retained, and after the reflective plate 1 is bonded to the substrate a, the protective layer 4 can be easily torn off, so that the operation is simple and convenient.
Fig. 8 is a schematic structural diagram of a reflection structure provided in an embodiment of the present invention, and as shown in fig. 8, an embodiment of the present invention further provides a reflection structure, including: the reflecting plate 1 comprises a plurality of reflecting sheets 2, each reflecting sheet 2 is provided with an opening 3 for avoiding a component b on a substrate a, and an interval is arranged between every two adjacent reflecting sheets 2.
The reflective structure further comprises a protective layer 4; the protective layer 4 is a complete structure; the protective layer 4 is bonded to the reflection plate 1.
In this embodiment, the protective layer 4 can include the protective film 5 and set up in the tectorial membrane of protective film 5 one side and glue 6, and the protective film 5 glues 6 and bonds with the reflecting plate 1 through the tectorial membrane, and after one side that deviates from the protective layer 4 of reflecting plate 1 and base plate a were provided with the surface bonding of components and parts b, tear protective film 5 intercommunication tectorial membrane glue 6 together.
As an alternative embodiment, as shown in fig. 8, the reflecting structure further comprises an adhesive layer 7; the adhesive layer 7 is used to bond the reflective sheet 2 to the surface of the substrate a on which the component b is provided.
Fig. 9 is a schematic view illustrating the reflection structure and the substrate being attached according to an embodiment of the present invention, referring to fig. 8 and 9, in this embodiment, the adhesive layer 7 may include a release film 8 and an adhesive 9 disposed on one side of the release film 8, and the release film 8 is adhered to one side of the reflection sheet 2 departing from the protection layer 4 through the adhesive 9; before the reflector plate 2 is ready to be bonded with the substrate a, the release film 8 is torn off, the adhesive 9 is exposed on one side of the reflector plate 2, which is far away from the protective layer 4, and then the reflector plate 2 is bonded with the surface of the substrate a, which is provided with the component b, through the adhesive 9.
If the preparation method provided in embodiment 1 of the present invention is adopted, the release film 8 may be firstly bonded to the side of the reflection plate 1 away from the protection layer 4 through the adhesive 9, and then the reflection plate 1 is punched and cut.
It will be apparent to those skilled in the art that various changes and modifications may be made in the present application without departing from the spirit and scope of the application. Thus, if such modifications and variations of the present application fall within the scope of the claims of the present application and their equivalents, the present application is intended to include such modifications and variations as well.

Claims (1)

1. A method for preparing a mini-LED lamp panel is characterized by comprising the following steps:
bonding a reflecting plate with a substrate to form a mini-LED lamp panel, wherein the reflecting plate comprises a plurality of reflecting sheets, each reflecting sheet is provided with an opening for avoiding a component on the substrate, and a space is arranged between every two adjacent reflecting sheets;
dispensing and packaging the mini-LED lamp panel;
the preparation method of the reflecting plate comprises the following steps:
perforating the reflecting plate to form an opening;
after determining the maximum unit size of the reflector plate according to the length of the opening, the length of a component on the substrate, the tolerance size and the heat shrinkage rate of the reflector plate, cutting the reflector plate to form a plurality of reflector plates, and ensuring that an interval is reserved between every two adjacent reflector plates so that each reflector plate is independently heated, the heat shrinkage rate of each reflector plate is reduced, and the displacement of the opening on each reflector plate is reduced;
determining the maximum cell size according to the following formula:
Figure FDF0000017305260000011
wherein z is the maximum cell size and f is the open pore length; d is the length of the component on the substrate; h is the tolerance dimension; g is the thermal shrinkage of the reflector plate;
the method of cutting the reflection plate includes:
adhering the reflecting plate to the protective layer;
cutting the reflecting plate to form a plurality of reflecting sheets, and ensuring the completeness of the protective layer so that the protective layer and the plurality of reflecting sheets move as a whole;
the method for bonding the reflecting plate and the substrate comprises the following steps:
bonding the reflecting plate bonded with the protective layer to the surface of the substrate provided with the component, and ensuring that the opening of the reflecting plate can avoid the component;
and tearing off the protective layer.
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