CN111745740A - Method for manufacturing a receiving hole for a carrier strip for electronic components, method for manufacturing a carrier strip for electronic components, and carrier strip obtained - Google Patents
Method for manufacturing a receiving hole for a carrier strip for electronic components, method for manufacturing a carrier strip for electronic components, and carrier strip obtained Download PDFInfo
- Publication number
- CN111745740A CN111745740A CN202010603173.8A CN202010603173A CN111745740A CN 111745740 A CN111745740 A CN 111745740A CN 202010603173 A CN202010603173 A CN 202010603173A CN 111745740 A CN111745740 A CN 111745740A
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- punching needle
- paper base
- manufacturing
- punching
- carrier strip
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 34
- 238000000034 method Methods 0.000 title claims abstract description 18
- 238000004080 punching Methods 0.000 claims description 107
- 238000005056 compaction Methods 0.000 claims description 4
- 230000000149 penetrating effect Effects 0.000 claims description 2
- 239000000758 substrate Substances 0.000 claims description 2
- 239000000428 dust Substances 0.000 claims 2
- 238000002360 preparation method Methods 0.000 abstract description 4
- 238000005265 energy consumption Methods 0.000 abstract description 3
- 238000000465 moulding Methods 0.000 abstract 1
- 238000003825 pressing Methods 0.000 description 6
- 230000000052 comparative effect Effects 0.000 description 3
- 238000003860 storage Methods 0.000 description 2
- 230000004075 alteration Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000010892 electric spark Methods 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B26—HAND CUTTING TOOLS; CUTTING; SEVERING
- B26F—PERFORATING; PUNCHING; CUTTING-OUT; STAMPING-OUT; SEVERING BY MEANS OTHER THAN CUTTING
- B26F1/00—Perforating; Punching; Cutting-out; Stamping-out; Apparatus therefor
- B26F1/24—Perforating by needles or pins
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
- B65D73/00—Packages comprising articles attached to cards, sheets or webs
- B65D73/0042—Packages comprising articles attached to cards, sheets or webs the articles being retained within a window, hole or other cut-out portion of a single card
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
- B65D73/00—Packages comprising articles attached to cards, sheets or webs
- B65D73/02—Articles, e.g. small electrical components, attached to webs
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Life Sciences & Earth Sciences (AREA)
- Forests & Forestry (AREA)
- Perforating, Stamping-Out Or Severing By Means Other Than Cutting (AREA)
Abstract
The invention belongs to the field of electronic component manufacturing, and relates to an electronic component carrier tape, in particular to a manufacturing method of an electronic component carrier tape accommodating hole, a preparation method of the tape and an obtained tape. The carrier strip manufactured by the invention has high dimensional precision, good hole type of the receiving holes and no burr in the holes, and does not need the burr removing procedure required by the traditional carrier strip manufacturing procedure, thereby greatly reducing the production energy consumption, being not limited by the burr removing procedure, greatly improving the molding quantity of the receiving holes of the carrier strip each time and improving the manufacturing procedure efficiency.
Description
Technical Field
The invention belongs to the field of electronic component manufacturing, and relates to an electronic component carrier tape, in particular to a manufacturing method of an electronic component carrier tape accommodating hole, a preparation method of the tape and an obtained tape.
Background
With the chip-type and miniaturization of electronic components, the precision requirement of carrier tapes for packaging and transporting the electronic components is higher and higher. The carrier strip is formed by arranging an index hole and an accommodating hole on a paper base with thickness, and the accommodating hole not only needs to meet the requirement of accommodating electronic components, but also needs to facilitate the taking out of the electronic components. This means that the shape of the receiving holes, the degree of dimensional accuracy, and the presence or absence of burrs in the holes are critical factors in evaluating the carrier strip.
Chinese patent publication No. CN103862524B, 2016, 7, 20, discloses a carrier tape manufacturing mold and a carrier tape manufacturing method, in which a tape is disposed between a punch and a die, and the punch and the die are brought close to each other to form a cavity in the tape.
Korean patent application laid-open No. KR1020200010989A discloses a carrier tape processing mold device having upper and lower guide plates, which realizes formation of a receiving hole by a paper base, which is vertically moved into the lower guide plate by a punch pin fixed to the upper guide plate, on 31.1.2020.
The technical scheme disclosed above can realize the manufacture of the carrier tape, but the formed through receiving hole has the problems of low dimensional precision and hole shape deviation, and the access of electronic components can be seriously influenced by the burr phenomenon generated at the fracture part (in the hole) of the punched paper base. In order to eliminate the burrs in the hole, a burr removing process is required to be performed on the accommodating hole after the accommodating hole is formed, such as hot air, electric spark, laser and other burr removing modes. These measures require additional energy consumption, reduce the efficiency of the carrier tape manufacturing process to some extent, and inevitably cause damage to the carrier tape during the process.
Disclosure of Invention
The invention aims to solve the defects of the receiving holes in the bearing strip in the punching process, and provides a manufacturing method of the receiving holes of the bearing strip of the electronic component.
The technical scheme adopted by the invention is as follows:
a method for manufacturing a receiving hole of a carrier tape for electronic components, comprising the steps of compacting a paper base having a receiving hole for a preformed carrier tape to reduce the thickness of the paper base in the receiving hole, and punching a through receiving hole.
Preferably, the paper base is compacted through a first punching needle and a second punching needle which are arranged up and down correspondingly.
The method specifically comprises the following steps:
a. the paper base to be punched enters a platform between a first punching needle and a second punching needle which are arranged correspondingly up and down, and the platform is provided with a through hole for the first punching needle and the second punching needle to pass through in the vertical direction;
b. the second punching needle adjusts the initial position to the lower surface of the paper base, and the end face of the second punching needle limits the upward jacking distance d1 of the paper base to be between 0 and 30 mu m;
c. under the condition that the paper base is pressed tightly, the first punching needle descends until the first punching needle abuts against the second punching needle, the paper base penetrating through the accommodating hole portion is preformed in a compaction mode, and the thickness of the paper base in the compaction mode is reduced to 33-50%;
d. the first punching needle and the second punching needle simultaneously descend, and the first punching needle completes punching of the through accommodating hole;
e. and after blanking, the first punching needle and the second punching needle respectively return to the original positions.
According to the technical scheme, the paper base of the accommodating hole of the preformed carrier strip is compacted by the first punching needle and the second punching needle, the thickness of the paper base of the accommodating hole is reduced, punching of the through accommodating hole is achieved by the first punching needle, and the manufactured carrier strip is high in size precision, good in accommodating hole shape and free of burrs in the hole.
Preferably, the distance d1 that the second punch pin end faces push the paper base up is limited to between 0 and 20 μm.
Preferably, the second punch pin end face pushes the paper base upward by a distance d1= 0.
Preferably, in step d, the first punch pin and the second punch pin descend at the same speed.
Preferably, in step c, the thickness of the compacted paper substrate is reduced to 40-45%.
Preferably, in the step e, after the blanking is completed, the second punching needle continues to descend to a channel for removing end face paper scraps, and the second punching needle ascends to the initial position after the second punching needle finishes removing the paper scraps.
The two opposite sides of the channel are respectively provided with an air outlet and an air suction opening, the air outlet continuously removes paper scraps remained on the end face of the second punching needle, and the air suction opening continuously discharges the paper scraps out of the channel;
preferably, the first punching needle and the second punching needle are controlled by a first servo motor and a second servo motor respectively. The first punching needle and the second punching needle are controlled by respective servo motors to control accurate strokes, and the stroke matching of paper base punching can be guaranteed.
The invention also provides a preparation method of the electronic component carrier strip, which comprises the manufacturing method of the accommodating hole.
The invention also provides an electronic component carrier tape containing the preparation method.
The bearing belt strip manufactured by the scheme has the following advantages:
(1) the bearing strip has high dimensional precision, good hole type of the accommodating hole and no burr in the hole;
(2) the accuracy of the dimension (A0, A0 ') of the receiving hole in the width direction of the carrier tape and the accuracy of the dimension (B0, B0') in the length direction of the carrier tape are improved to +/-5 mu m relative to the thickness direction of the carrier tape, and the dimensional accuracy is improved by about 70 percent relative to the dimensional accuracy of the prior art;
(3) because the burr removing procedure required by the traditional carrier tape manufacturing procedure is not needed, the production energy consumption is greatly reduced, the limitation of the burr removing procedure is avoided, the forming quantity of the carrier tape receiving holes at each time can be greatly increased, and the manufacturing procedure efficiency is improved.
Drawings
FIG. 1 is a simplified apparatus diagram of the manufacturing method of example 1.
Detailed Description
The invention is further illustrated below with reference to specific examples and experimental data. It is to be understood that the embodiments of the present invention are merely for illustrating the present invention and not for limiting the present invention, and that various substitutions and alterations made according to the common knowledge and conventional means in the art without departing from the technical idea of the present invention are included in the scope of the present invention.
Example 1
A method of manufacturing a carrier strip receiving hole for an electronic component, comprising:
a. the paper base 400 enters and is fixed on a platform 300 between a first punching needle 100 and a second punching needle 200 which are arranged up and down, and the platform 300 is fixedly provided with a through hole 300a through which the first punching needle 100 and the second punching needle 200 can pass; the first punching needle 100 and the second punching needle 200 have the same shape and size, and are selected according to the specification of the receiving hole of the required carrier strip, for example, the cross section width and the length of the end part of the first punching needle are respectively 0.790mm and 0.990mm, and the end surface of the first punching needle close to the paper base 400 has no R angle;
b. the second punching pin 200 adjusts the initial position to the lower surface of the paper base 400 (the end face of the second punching pin 200 is close to the paper base 400 through the through hole 300a on the platform 300), and the distance d1 between the end face of the second punching pin 200 and the lower surface of the paper base 400 is limited to d1= 0;
c. under the condition that the paper base 400 is tightly pressed by the pressing part, the first punching pin 100 descends until the paper base 400 which is preformed to penetrate through the receiving hole part is pressed and compacted by the second punching pin 200, and the thickness of the compacted paper base 400 is reduced to 33-35%;
d. the first punch pin 100 and the second punch pin 200 descend at the same speed at the same time, and the first punch pin 100 completes punching of the through receiving hole;
e. after blanking, the first punching needle 100 moves upwards to restore to the original position, the pressing part leaves the paper base 400, the second punching needle 200 continues to move downwards to a channel for clearing paper scraps on the end face of the second punching needle, the two opposite sides of the channel are respectively provided with an air outlet and an air suction opening, the air outlet continuously clears the residual paper scraps on the end face of the second punching needle 200, and the air suction opening continuously discharges the paper scraps out of the channel; the second punch pin 200 moves upward to the initial position after finishing removing paper scraps. The dimensions of the receiving holes obtained are shown in Table 1.
Example 2
A method of manufacturing a carrier strip receiving hole for an electronic component, comprising:
a. the paper base 400 enters and is fixed on a platform 300 between a first punching needle 100 and a second punching needle 200 which are arranged up and down, and the platform 300 is fixedly provided with a through hole 300a through which the first punching needle 100 and the second punching needle 200 can pass; the first punching needle 100 and the second punching needle 200 are the same in shape and size and are selected according to the specification of a receiving hole of a required carrier strip, for example, the width and the length of the cross section of the end part of the first punching needle are respectively 0.660mm and 1.170mm, the end surface of the first punching needle close to the paper base 400 has no R angle, and the first punching needle 100 and the second punching needle 200 are respectively controlled by a first servo motor and a second servo motor to travel;
b. the second punching pin 200 adjusts the initial position to the lower surface of the paper base 400 (the end face of the second punching pin 200 is close to the paper base 400 through the through hole 300a on the platform 300), and the distance d1 that the paper base is pushed upwards by the end face of the second punching pin 200 is limited to 25 μm;
c. under the condition that the paper base 400 is tightly pressed by the pressing part, the first punching pin 100 descends until the paper base 400 which is preformed to penetrate through the receiving hole part is pressed against the second punching pin 200, and the thickness of the paper base 400 is reduced to 41-46%;
d. the first punch pin 100 and the second punch pin 200 descend at the same speed at the same time, and the first punch pin 100 completes punching of the through receiving hole;
e. after blanking, the first punching needle 100 moves upwards to restore to the original position, the pressing part leaves the paper base 400, the second punching needle 200 continues to move downwards to a channel for clearing paper scraps on the end face of the second punching needle, the two opposite sides of the channel are respectively provided with an air outlet and an air suction opening, the air outlet continuously clears the residual paper scraps on the end face of the second punching needle 200, and the air suction opening continuously discharges the paper scraps out of the channel; the second punch pin 200 moves upward to the initial position after finishing removing paper scraps. The dimensions of the receiving holes obtained are shown in Table 1.
Example 3
An electronic component carrier tape obtained by the following manufacturing method:
1.a step of forming a through index hole on the paper base 400 having a certain thickness;
2. the step of forming a through hole for receiving an electronic component on the paper base 400 with a certain thickness comprises the following specific steps:
a. the paper base 400 enters and is fixed on the platform 300 between the first punching needle 100 and the second punching needle 200, and the platform 300 is fixedly provided with a through hole 300a through which the first punching needle 100 and the second punching needle 200 can pass; the first punching needle 100 and the second punching needle 200 have the same shape and size, and are selected according to the specification of the receiving hole of the required carrier strip, for example, the cross section width and length of the end part of the first punching needle are respectively 1.000mm and 1.800mm, the end surface of the first punching needle close to the paper base 400 has no R angle, and the first punching needle 100 and the second punching needle 200 are respectively controlled by a first servo motor and a second servo motor to travel;
b. the second punching pin 200 adjusts the initial position to the lower surface of the paper base 400 (the end face of the second punching pin 200 is close to the paper base 400 through the through hole 300a on the platform 300), and the distance d1 that the paper base is pushed upwards by the end face of the second punching pin 200 is limited to 30 μm;
c. under the condition that the paper base 400 is tightly pressed by the pressing part, the first punching pin 100 descends until the paper base 400 which is preformed to penetrate through the receiving hole part is pressed against the second punching pin 200, and the thickness of the paper base 400 is reduced to 45-50%;
d. the first punch pin 100 and the second punch pin 200 descend at the same speed at the same time, and the first punch pin 100 completes punching of the through receiving hole;
e. after blanking, the first punching needle 100 moves upwards to restore to the original position, the pressing part leaves the paper base 400, the second punching needle 200 continues to move downwards to a channel for clearing paper scraps on the end face of the second punching needle, the two opposite sides of the channel are respectively provided with an air outlet and an air suction opening, the air outlet continuously clears the residual paper scraps on the end face of the second punching needle 200, and the air suction opening continuously discharges the paper scraps out of the channel; the second punch pin 200 moves upward to the initial position after finishing removing paper scraps. The dimensions of the receiving holes obtained are shown in Table 1.
The effect data achieved by the above embodiment is shown in table 1:
TABLE 1 storage well size data generated in the examples
Remarking:
1, A: the cross section of the end part of the first punch pin is wide
2, B: the first punch pin has a long end section
3, a0, a 0': the upper side and the lower side of the accommodating hole are wide
4, B0, B0': the upper side and the lower side of the accommodating hole are long
The errors of the relative sizes (A0 and A0 ', B0 and B0') of the containing holes in the thickness direction of the paper base are all within 5 mu m in the 3 examples.
Comparative example 1:
the difference from example 1 is that the second punch pin is not provided, and the receiving hole is punched directly by the first punch pin to obtain the tape receiving hole. The dimensions of the receiving holes obtained are shown in Table 2.
TABLE 2 storage well size data generated for comparative example 1
Comparative example 2:
the difference from example 1 was that d1 was 40 μm, and punching according to the procedure described in example 1 was found to result in poor pitch of tape index holes.
Claims (10)
1.A method for manufacturing a receiving hole of a carrier tape for electronic parts and components, characterized in that,
the paper base with preformed holes for holding the bearing strip is compacted to reduce the thickness of the paper base and then punched to form through holes.
2. The method of manufacturing a carrier strip receiving hole for electronic components as claimed in claim 1, wherein the paper substrate is subjected to the compacting process by a first punch pin and a second punch pin which are disposed up and down in correspondence with each other.
3.A method of manufacturing an electronic component carrier tape receiving hole as claimed in claim 1, comprising the steps of:
a. the paper base to be punched enters a platform between a first punching needle and a second punching needle which are arranged correspondingly up and down, and the platform is provided with a through hole for the first punching needle and the second punching needle to pass through in the vertical direction;
b. the second punching needle adjusts the initial position to the lower surface of the paper base, and the end face of the second punching needle limits the upward jacking distance d1 of the paper base to be between 0 and 30 mu m;
c. under the condition that the paper base is pressed tightly, the first punching needle descends until the first punching needle abuts against the second punching needle, the paper base penetrating through the accommodating hole portion is preformed in a compaction mode, and the thickness of the paper base in the compaction mode is reduced to 33-50%;
d. the first punching needle and the second punching needle simultaneously descend, and the first punching needle completes punching of the through accommodating hole;
e. and after blanking, the first punching needle and the second punching needle respectively return to the original positions.
4. A method for forming carrier strip receiving holes for electronic components as claimed in claim 1, wherein the distance d1 that the paper base is pushed up by the end face of the second punch pin is limited to 0-20 μm.
5. The method of manufacturing an electronic component carrier tape receiving hole as claimed in claim 4, wherein the second punch pin end faces lift the paper base upward by a distance d1= 0.
6. The method of manufacturing an electronic component carrier strip receiving hole as claimed in claim 1, wherein in step d, the first punch pin and the second punch pin are moved down at the same speed.
7. The method of manufacturing carrier strip receiving openings for electronic components of claim 1 wherein in step c the thickness of the base of densified paper is reduced to 40-45%.
8. The method as claimed in claim 1, wherein in step e, after the punching step, the second punch pin moves down to a position where a passage for removing paper dust on the end face is formed, and moves up to the initial position after the second punch pin removes the paper dust.
9. A method for producing a carrier tape for electronic parts, comprising the method for producing a receiving hole according to any one of claims 1 to 8.
10. An electronic component carrier tape produced by the production method according to claim 9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010603173.8A CN111745740B (en) | 2020-06-29 | 2020-06-29 | Method for manufacturing a receiving hole for a carrier strip for electronic components, method for manufacturing a carrier strip for electronic components, and carrier strip obtained |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010603173.8A CN111745740B (en) | 2020-06-29 | 2020-06-29 | Method for manufacturing a receiving hole for a carrier strip for electronic components, method for manufacturing a carrier strip for electronic components, and carrier strip obtained |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN111745740A true CN111745740A (en) | 2020-10-09 |
| CN111745740B CN111745740B (en) | 2022-02-22 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202010603173.8A Active CN111745740B (en) | 2020-06-29 | 2020-06-29 | Method for manufacturing a receiving hole for a carrier strip for electronic components, method for manufacturing a carrier strip for electronic components, and carrier strip obtained |
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Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004099096A (en) * | 2002-09-09 | 2004-04-02 | Asahi Kogei Kk | Carrier tape and method for manufacturing the same |
| CN200984602Y (en) * | 2006-08-28 | 2007-12-05 | 无锡相川铁龙电子有限公司 | Blanking die of the ultrathin element of the notebook-type computer card reader |
| CN204471944U (en) * | 2015-02-12 | 2015-07-15 | 苏州和钧新能源有限公司 | Hole punched device and the battery insulation PE bag using this device to be formed |
| US20160332319A1 (en) * | 2008-11-06 | 2016-11-17 | Wilson Tool International Inc. | Punch assemblies and methods for modifying |
| CN207325721U (en) * | 2017-10-31 | 2018-05-08 | 常州豪乐金业机械有限公司 | A kind of yoke plate punching system for being suitable for automatically removing burr |
| CN108856445A (en) * | 2017-05-15 | 2018-11-23 | 倍科有限公司 | Stamping device |
-
2020
- 2020-06-29 CN CN202010603173.8A patent/CN111745740B/en active Active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004099096A (en) * | 2002-09-09 | 2004-04-02 | Asahi Kogei Kk | Carrier tape and method for manufacturing the same |
| CN200984602Y (en) * | 2006-08-28 | 2007-12-05 | 无锡相川铁龙电子有限公司 | Blanking die of the ultrathin element of the notebook-type computer card reader |
| US20160332319A1 (en) * | 2008-11-06 | 2016-11-17 | Wilson Tool International Inc. | Punch assemblies and methods for modifying |
| CN204471944U (en) * | 2015-02-12 | 2015-07-15 | 苏州和钧新能源有限公司 | Hole punched device and the battery insulation PE bag using this device to be formed |
| CN108856445A (en) * | 2017-05-15 | 2018-11-23 | 倍科有限公司 | Stamping device |
| CN207325721U (en) * | 2017-10-31 | 2018-05-08 | 常州豪乐金业机械有限公司 | A kind of yoke plate punching system for being suitable for automatically removing burr |
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| Publication number | Publication date |
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| CN111745740B (en) | 2022-02-22 |
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Application publication date: 20201009 Assignee: ZHEJIANG JIEMEI ELECTRONIC INFORMATION MATERIAL CO.,LTD. Assignor: ZHEJIANG JIEMEI ELECTRONIC & TECHNOLOGY Co.,Ltd. Contract record no.: X2023330000551 Denomination of invention: Manufacturing method, preparation method, and obtained strip storage hole for electronic component carrying strip Granted publication date: 20220222 License type: Common License Record date: 20230830 |