CN111744891A - Method for cleaning surface of adsorption table of grinding machine - Google Patents
Method for cleaning surface of adsorption table of grinding machine Download PDFInfo
- Publication number
- CN111744891A CN111744891A CN202010443516.9A CN202010443516A CN111744891A CN 111744891 A CN111744891 A CN 111744891A CN 202010443516 A CN202010443516 A CN 202010443516A CN 111744891 A CN111744891 A CN 111744891A
- Authority
- CN
- China
- Prior art keywords
- adsorption
- polymer
- liquid
- cleaning
- given liquid
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000001179 sorption measurement Methods 0.000 title claims abstract description 117
- 238000000034 method Methods 0.000 title claims abstract description 49
- 238000000227 grinding Methods 0.000 title claims abstract description 29
- 238000004140 cleaning Methods 0.000 title claims abstract description 28
- 239000007788 liquid Substances 0.000 claims abstract description 75
- 229920000642 polymer Polymers 0.000 claims abstract description 50
- 239000002245 particle Substances 0.000 claims abstract description 31
- 239000012535 impurity Substances 0.000 claims abstract description 25
- 239000011148 porous material Substances 0.000 claims abstract description 19
- 239000000203 mixture Substances 0.000 claims description 26
- 238000010438 heat treatment Methods 0.000 claims description 8
- 239000000463 material Substances 0.000 claims description 7
- 239000007787 solid Substances 0.000 claims description 6
- 239000008367 deionised water Substances 0.000 claims description 5
- 229910021641 deionized water Inorganic materials 0.000 claims description 5
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 5
- 239000011248 coating agent Substances 0.000 claims description 4
- 238000000576 coating method Methods 0.000 claims description 4
- 238000002156 mixing Methods 0.000 claims description 4
- 239000012466 permeate Substances 0.000 claims description 4
- 238000001035 drying Methods 0.000 claims description 3
- 229920002635 polyurethane Polymers 0.000 claims description 3
- 239000004814 polyurethane Substances 0.000 claims description 3
- 239000011347 resin Substances 0.000 claims description 3
- 229920005989 resin Polymers 0.000 claims description 3
- 238000007790 scraping Methods 0.000 claims description 3
- 229920001187 thermosetting polymer Polymers 0.000 claims description 3
- 238000005266 casting Methods 0.000 claims description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 abstract description 22
- 229910052710 silicon Inorganic materials 0.000 abstract description 22
- 239000010703 silicon Substances 0.000 abstract description 22
- 230000007547 defect Effects 0.000 abstract description 3
- 239000000919 ceramic Substances 0.000 description 3
- 239000004205 dimethyl polysiloxane Substances 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 229920000435 poly(dimethylsiloxane) Polymers 0.000 description 3
- -1 polydimethylsiloxane Polymers 0.000 description 3
- 238000005520 cutting process Methods 0.000 description 2
- 238000007711 solidification Methods 0.000 description 2
- 230000008023 solidification Effects 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000003749 cleanliness Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000011086 high cleaning Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 229910021421 monocrystalline silicon Inorganic materials 0.000 description 1
- 239000000047 product Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B7/00—Cleaning by methods not provided for in a single other subclass or a single group in this subclass
- B08B7/0014—Cleaning by methods not provided for in a single other subclass or a single group in this subclass by incorporation in a layer which is removed with the contaminants
-
- B08B1/165—
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B13/00—Accessories or details of general applicability for machines or apparatus for cleaning
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/27—Work carriers
- B24B37/28—Work carriers for double side lapping of plane surfaces
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/34—Accessories
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C35/00—Heating, cooling or curing, e.g. crosslinking or vulcanising; Apparatus therefor
- B29C35/02—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C39/00—Shaping by casting, i.e. introducing the moulding material into a mould or between confining surfaces without significant moulding pressure; Apparatus therefor
- B29C39/02—Shaping by casting, i.e. introducing the moulding material into a mould or between confining surfaces without significant moulding pressure; Apparatus therefor for making articles of definite length, i.e. discrete articles
- B29C39/10—Shaping by casting, i.e. introducing the moulding material into a mould or between confining surfaces without significant moulding pressure; Apparatus therefor for making articles of definite length, i.e. discrete articles incorporating preformed parts or layers, e.g. casting around inserts or for coating articles
Abstract
The invention discloses a method for cleaning the surface of an adsorption table of a grinding machine, which comprises the following steps: supplying a given liquid to a surface of an adsorption stage to fill pores of the surface of the adsorption stage with the given liquid; pouring a polymer on the surface of the adsorption platform to enable the polymer to coat impurity particles on the surface of the adsorption platform after being cured; removing the solidified polymer coated with the foreign particles from the surface of the adsorption stage. The method skillfully utilizes the polymer curing process to coat the impurity particles on the surface of the adsorption table, and can effectively remove the impurity particles on the surface of the adsorption table, thereby improving the surface quality of the ground silicon wafer and reducing the generation of silicon wafer defects.
Description
Technical Field
The invention relates to the technical field of double-sided grinding, in particular to a method for cleaning the surface of an adsorption table of a grinding machine.
Background
In the silicon wafer manufacturing process, after a monocrystalline silicon rod is subjected to a wire cutting procedure, surface damages such as wire marks and microcracks exist on the surface of the obtained silicon wafer, and a double-side grinding process is generally adopted to reduce or eliminate the surface damages.
The double-sided grinding process is used as a connecting process of linear cutting and a subsequent process, has important significance, and the surface quality of the ground silicon wafer directly influences the processing precision of the subsequent process. The double-sided lapping machine is generally composed of a silicon wafer positioning unit, a silicon wafer cleaning unit, a processing table, an adsorption table and the like. The adsorption platform adsorbs the silicon wafer through vacuum, and the processing platform processes the silicon wafer through installing a specific grinding wheel. The double-side grinding process has high requirement on the surface cleanliness of the adsorption table, and if impurity particles exist on the surface of the adsorption table, when a silicon wafer is adsorbed on the surface of the adsorption table, a local silicon wafer is jacked up, so that the jacked part of the silicon wafer is excessively ground in the processing process. When the silicon wafer recovers the original shape, a recess is formed on the surface of the silicon wafer, thereby affecting the subsequent processing quality of the silicon wafer.
The existing method for cleaning the surface of the adsorption table mainly utilizes a relatively flat blade for wiping, and the cleaning method has certain problems: first, the material of the adsorption table is soft, which may damage the surface of the adsorption table during the wiping process, and in addition, the wiping process needs to be repeated many times, which results in low cleaning efficiency.
Disclosure of Invention
In order to solve the above problems in the prior art, the present invention provides a method for cleaning the surface of the adsorption table of a grinding machine. The technical problem to be solved by the invention is realized by the following technical scheme:
the invention provides a method for cleaning the surface of an adsorption table of a grinding machine, which comprises the following steps:
supplying a given liquid to a surface of an adsorption stage to fill pores of the surface of the adsorption stage with the given liquid;
pouring a polymer on the surface of the adsorption platform to enable the polymer to coat impurity particles on the surface of the adsorption platform after being cured;
removing the solidified polymer coated with the foreign particles from the surface of the adsorption stage.
In one embodiment of the present invention, supplying a given liquid to a surface of an adsorption stage to fill pores of the surface of the adsorption stage with the given liquid includes:
supplying a given liquid to the adsorption table surface by using a liquid supply device until the given liquid completely covers the adsorption table surface;
stopping the supply of the given liquid to allow the given liquid to permeate and fill the pores of the surface of the adsorption stage.
In one embodiment of the present invention, after stopping supplying the given liquid to allow the given liquid to permeate and fill the pores of the surface of the adsorption stage, the method further includes:
scraping off the excessive given liquid on the surface of the adsorption table by using a scraper;
and drying the surface of the adsorption table to keep the surface of the adsorption table dry.
In one embodiment of the invention, the scraper is made of a foamed polyurethane material.
In one embodiment of the invention, the given liquid is deionized water.
In one embodiment of the present invention, the pouring of the polymer on the surface of the adsorption platform to coat the foreign particles on the surface of the adsorption platform after the polymer is cured comprises:
uniformly mixing the polymer body and the condensate according to a preset proportion to form a liquid mixture;
pouring the liquid mixture on the surface of the adsorption table until the liquid mixture completely covers the surface of the adsorption table;
solidifying the liquid mixture to form a solid polymer and coating the solid polymer with impurity particles on the surface of the adsorption platform.
In one embodiment of the invention, the liquid mixture covers the surface of the adsorption platform in a thickness of 2-4 mm.
In one embodiment of the invention, the polymer is a thermosetting resin.
In one embodiment of the invention, the predetermined ratio is 1:5 to 1: 20.
In one embodiment of the present invention, solidifying the liquid mixture comprises:
heating the liquid mixture at a temperature of 25-30 ℃ for 50-80min using a hand-held hot plate to solidify the liquid mixture.
Compared with the prior art, the invention has the beneficial effects that:
1. the method for cleaning the surface of the adsorption table of the grinding machine skillfully utilizes the solidification process of the polymer to coat the impurity particles on the surface of the adsorption table, can effectively remove the impurity particles, improve the surface quality of the ground silicon wafer, reduce the generation of silicon wafer defects, has high cleaning efficiency, and can not damage the surface of the adsorption table.
2. Because the material of the adsorption table is porous ceramic, the cleaning method firstly utilizes deionized water to fill the pores on the surface of the adsorption table before the polymer is solidified to coat impurity particles, so that the polymer poured subsequently can be prevented from entering the pores on the surface of the adsorption table and being difficult to remove.
The present invention will be described in further detail with reference to the accompanying drawings and examples.
Drawings
Fig. 1 is a schematic structural view of a double-side grinder according to an embodiment of the present invention;
FIG. 2 is a flow chart of a method for cleaning a surface of an adsorption stage of a grinding machine according to an embodiment of the present invention;
fig. 3 is a flowchart illustrating steps of casting a polymer according to an embodiment of the present invention.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the drawings of the embodiments of the present invention. The foregoing and other technical matters, features and effects of the present invention will be apparent from the following detailed description of the embodiments, which is to be read in connection with the accompanying drawings. The technical means and effects of the present invention adopted to achieve the predetermined purpose can be more deeply and specifically understood through the description of the specific embodiments, however, the attached drawings are provided for reference and description only and are not used for limiting the technical scheme of the present invention.
It is noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that an article or device that comprises a list of elements does not include only those elements but may include other elements not expressly listed. Without further limitation, an element defined by the phrase "comprising an … …" does not exclude the presence of additional like elements in the article or device comprising the element. The terms "connected" or "coupled" and the like are not restricted to physical or mechanical connections, but may include electrical connections, whether direct or indirect. "upper", "lower", "left", "right", and the like are used merely to indicate relative positional relationships, and when the absolute position of the object being described is changed, the relative positional relationships are changed accordingly.
Referring to fig. 1, fig. 1 is a schematic structural diagram of a double-side grinder according to an embodiment of the present invention. The double side grinder includes a processing table 100, a processing grinding wheel 200, and an adsorption table 300, wherein the processing grinding wheel 200 is disposed at a lower end of the processing table 100. In grinding, the adsorption stage 300 adsorbs a workpiece (e.g., a silicon wafer) by vacuum, and the processing grinding wheel 200 rotates at the lower end of the processing stage 100 to process the silicon wafer.
After the silicon wafer is ground, impurity particles generated in the grinding process usually remain on the surface of the adsorption table. In order to effectively clean impurity particles remained on the surface of the adsorption table, the embodiment of the invention provides a cleaning method for the surface of the adsorption table of a grinding machine. Referring to fig. 2, fig. 2 is a flowchart illustrating a method for cleaning a surface of an adsorption stage of a grinding machine according to an embodiment of the present invention.
The cleaning method comprises the following steps:
s1: supplying a given liquid to a surface of an adsorption stage to fill pores of the surface of the adsorption stage with the given liquid;
specifically, a given liquid is supplied to the surface of the adsorption table by a liquid supply device until the given liquid completely covers the surface of the adsorption table; stopping the supply of the given liquid to allow the given liquid to permeate and fill the pores of the surface of the adsorption stage.
The liquid supply device of the embodiment is arranged on the grinder and positioned below the adsorption table, and can supply given liquid to the surface of the adsorption table through a pipeline under the manual operation or automatic control. In this embodiment, the given liquid is deionized water. It should be noted that in other embodiments, the given liquid may also be another solution, as long as the solution is incompatible with the polymers described below. Specifically, when the given liquid has covered the entire surface of the adsorption stage, the liquid supply means is turned off, and the supply of the given liquid is stopped. Since the material of the adsorption platform is porous ceramic, the given liquid on the surface of the adsorption platform can be filled into the pores on the surface of the adsorption platform, so that the subsequently added polymer can be prevented from flowing into the pores to increase the subsequent cleaning load.
In this embodiment, after stopping supplying the given liquid to allow the given liquid to penetrate and fill the pores on the surface of the adsorption stage, the method further includes:
scraping off the excessive given liquid on the surface of the adsorption table by using a scraper; and drying the surface of the adsorption table to keep the surface of the adsorption table dry.
Preferably, the scraper is made of a foamed polyurethane material, which is selected to reduce damage to the surface of the adsorption table during contact of the scraper with the adsorption table.
After the surplus given liquid on the surface of the adsorption table is scraped, the surface of the adsorption table can be dried or aired, so that the pores on the surface of the adsorption table are filled with the given liquid and other surface areas do not have the given liquid, and therefore all impurity particles on the surface of the adsorption table are exposed in the air, and subsequent polymers can better coat the impurity particles on the surface of the adsorption table.
S2: pouring a polymer on the surface of the adsorption platform to enable the polymer to coat impurity particles on the surface of the adsorption platform after being cured;
specifically, referring to fig. 3, fig. 3 is a flowchart illustrating a step of adding a polymer according to an embodiment of the present invention. S2 of this embodiment specifically includes:
s21: uniformly mixing the polymer body and the condensate according to a preset proportion to form a liquid mixture;
in this embodiment, the polymer is a low surface energy thermosetting resin, preferably polydimethylsiloxane, but is not limited thereto. The predetermined ratio may be 1:5 to 1: 20. Preferably, when the polymer is polydimethylsiloxane, the mixing ratio of the bulk of the polymer and the cured product is 1:10 to obtain the best curing effect.
S22: pouring the liquid mixture on the surface of the adsorption table until the liquid mixture completely covers the surface of the adsorption table;
in the embodiment, the liquid mixture is poured on the surface of the adsorption platform, so that the liquid mixture covers the surface of the adsorption platform and has a thickness of 2-4mm, so that impurity particles on the surface of the adsorption platform can be fully coated.
S23: solidifying the liquid mixture to form a solid polymer and coating the solid polymer with impurity particles on the surface of the adsorption platform.
Specifically, after the liquid mixture of the polymer is uniformly covered on the surface of the adsorption table to a certain thickness (2-4mm), the liquid mixture is heated and cured for 50-80min by using a handheld heating plate at the temperature of 25-30 ℃, and the polymer can cover impurity particles on the surface of the adsorption table in the curing process.
The hand-held heating plate of the present embodiment may be detachably mounted on the double side grinder. The hand-held heating plate may be any suitable heating plate known in the art, and is not limited thereto.
Preferably, when the polymer is polydimethylsiloxane, the heating temperature is 30 ° and the heating time is 60min to ensure sufficient curing.
In other embodiments, the liquid mixture of the polymers that has been mixed and poured on the surface of the adsorption platform may be left to solidify, and the polymer may cover the impurity particles on the surface of the adsorption platform during the solidification process.
S3: removing the solidified polymer coated with the foreign particles from the surface of the adsorption stage.
Specifically, after the liquid mixture of the polymer is completely cured, the cured polymer coated with the impurity particles is removed from the surface of the adsorption table, so that the impurity particles on the surface of the adsorption table can be removed together with the cured polymer without damaging the surface of the adsorption table.
The cleaning method for the surface of the adsorption platform of the grinding machine, disclosed by the embodiment of the invention, skillfully utilizes the polymer curing process to coat the impurity particles on the surface of the adsorption platform, and can effectively remove the impurity particles, so that the surface quality of a ground silicon wafer is improved, the generation of silicon wafer defects is reduced, the cleaning efficiency is high, and the surface of the adsorption platform cannot be damaged. In addition, as the material of the adsorption table is porous ceramic, the method firstly fills the pores on the surface of the adsorption table with deionized water before the polymer curing process is used for coating impurity particles, so that the polymer poured subsequently can be prevented from entering the pores on the surface of the adsorption table and being difficult to remove.
The foregoing is a more detailed description of the invention in connection with specific preferred embodiments and it is not intended that the invention be limited to these specific details. For those skilled in the art to which the invention pertains, several simple deductions or substitutions can be made without departing from the spirit of the invention, and all shall be considered as belonging to the protection scope of the invention.
Claims (10)
1. A method of cleaning a surface of an adsorption stage of an abrading machine, the method comprising:
supplying a given liquid to a surface of an adsorption stage to fill pores of the surface of the adsorption stage with the given liquid;
pouring a polymer on the surface of the adsorption platform to enable the polymer to coat impurity particles on the surface of the adsorption platform after being cured;
removing the solidified polymer coated with the foreign particles from the surface of the adsorption stage.
2. A method of cleaning a grinding mill suction table surface according to claim 1, characterized in that supplying a given liquid to a suction table surface to fill the pores of the suction table surface with the given liquid comprises:
supplying a given liquid to the adsorption table surface by using a liquid supply device until the given liquid completely covers the adsorption table surface;
stopping the supply of the given liquid to allow the given liquid to permeate and fill the pores of the surface of the adsorption stage.
3. The method of cleaning a grinding mill suction table surface according to claim 2, further comprising, after stopping the supply of the given liquid to cause the given liquid to penetrate and fill pores of the suction table surface:
scraping off the excessive given liquid on the surface of the adsorption table by using a scraper;
and drying the surface of the adsorption table to keep the surface of the adsorption table dry.
4. A method of cleaning the surface of the suction table of a grinding mill according to claim 3, characterized in that the scraper is made of foamed polyurethane material.
5. The method of cleaning a surface of an adsorption table of a grinding mill of claim 1 wherein the given liquid is deionized water.
6. The method of claim 1, wherein the step of casting a polymer on the surface of the adsorption table so that the polymer is solidified to cover the foreign particles on the surface of the adsorption table comprises:
uniformly mixing the polymer body and the condensate according to a preset proportion to form a liquid mixture;
pouring the liquid mixture on the surface of the adsorption table until the liquid mixture completely covers the surface of the adsorption table;
solidifying the liquid mixture to form a solid polymer and coating the solid polymer with impurity particles on the surface of the adsorption platform.
7. A method of cleaning the surface of the suction table of a grinding mill according to claim 6, characterized in that the liquid mixture covers the surface of the suction table with a thickness of 2-4 mm.
8. A method of cleaning the surface of an adsorption table of a grinding mill according to claim 6, wherein the polymer is a thermosetting resin.
9. A method of cleaning the surface of the suction table of a grinding mill according to claim 6, characterized in that the predetermined ratio is 1:5 to 1: 20.
10. A method of cleaning a grinding mill suction table surface according to any of the claims 6 to 9, characterized in that solidifying the liquid mixture comprises:
heating the liquid mixture at a temperature of 25-30 ℃ for 50-80min using a hand-held hot plate to solidify the liquid mixture.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010443516.9A CN111744891B (en) | 2020-05-22 | 2020-05-22 | Method for cleaning surface of adsorption table of grinding machine |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010443516.9A CN111744891B (en) | 2020-05-22 | 2020-05-22 | Method for cleaning surface of adsorption table of grinding machine |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN111744891A true CN111744891A (en) | 2020-10-09 |
| CN111744891B CN111744891B (en) | 2022-06-10 |
Family
ID=72673966
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202010443516.9A Active CN111744891B (en) | 2020-05-22 | 2020-05-22 | Method for cleaning surface of adsorption table of grinding machine |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN111744891B (en) |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001326205A (en) * | 2000-05-16 | 2001-11-22 | Disco Abrasive Syst Ltd | Method and device for cleaning chuck table of grinding device |
| US20030084998A1 (en) * | 1998-07-30 | 2003-05-08 | Souichi Katagiri | Semiconductor device fabricating method |
| CN1930665A (en) * | 2004-03-08 | 2007-03-14 | 日东电工株式会社 | Semiconductor device cleaning member and manufacturing method thereof |
| CN102387872A (en) * | 2009-04-14 | 2012-03-21 | 朗姆研究公司 | Apparatus and method for using a viscoelastic cleaning material to remove particles on a substrate |
| CN102803564A (en) * | 2009-06-24 | 2012-11-28 | 朗姆研究公司 | Damage-free High Efficiency Particle Removal Clean |
| CN102810459A (en) * | 2011-06-03 | 2012-12-05 | 中国科学院微电子研究所 | Method for cleaning wafer after chemical-mechanical |
| JP2015037137A (en) * | 2013-08-14 | 2015-02-23 | 株式会社ディスコ | Chuck table |
-
2020
- 2020-05-22 CN CN202010443516.9A patent/CN111744891B/en active Active
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20030084998A1 (en) * | 1998-07-30 | 2003-05-08 | Souichi Katagiri | Semiconductor device fabricating method |
| JP2001326205A (en) * | 2000-05-16 | 2001-11-22 | Disco Abrasive Syst Ltd | Method and device for cleaning chuck table of grinding device |
| CN1930665A (en) * | 2004-03-08 | 2007-03-14 | 日东电工株式会社 | Semiconductor device cleaning member and manufacturing method thereof |
| CN102387872A (en) * | 2009-04-14 | 2012-03-21 | 朗姆研究公司 | Apparatus and method for using a viscoelastic cleaning material to remove particles on a substrate |
| CN102803564A (en) * | 2009-06-24 | 2012-11-28 | 朗姆研究公司 | Damage-free High Efficiency Particle Removal Clean |
| CN102810459A (en) * | 2011-06-03 | 2012-12-05 | 中国科学院微电子研究所 | Method for cleaning wafer after chemical-mechanical |
| JP2015037137A (en) * | 2013-08-14 | 2015-02-23 | 株式会社ディスコ | Chuck table |
Also Published As
| Publication number | Publication date |
|---|---|
| CN111744891B (en) | 2022-06-10 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US20070197134A1 (en) | Polishing article with integrated window stripe | |
| US20020004358A1 (en) | Cluster tool systems and methods to eliminate wafer waviness during grinding | |
| KR20040031071A (en) | Grinding work holding disk, work grinding device and grinding method | |
| JPH09155730A (en) | Holding tool used for polishing workpiece and its manufacture | |
| JP3641956B2 (en) | Polishing slurry regeneration system | |
| JP2842161B2 (en) | Finishing method of green body | |
| CN111744891B (en) | Method for cleaning surface of adsorption table of grinding machine | |
| CN107716864A (en) | A kind of method for repairing and mending of silica sol ceramic mold shell shake line | |
| EP1216118A1 (en) | Polishing pad treatment for surface conditioning | |
| US20150165588A1 (en) | Chemical mechanical polishing conditioner with high quality abrasive particles | |
| CN105655240A (en) | Processing method of sapphire wafers | |
| CN110125822B (en) | Fixed grinding tool for grinding sapphire substrate wafer and preparation method thereof | |
| TW201805401A (en) | Polishing body and manufacturing method therefor | |
| CN101412286B (en) | Vacuum leading-in manufacturing method for engine room case having smooth surface | |
| CN104347357A (en) | Substrate machining method with polishing and follow-up cleaning being replaced by thinning | |
| US20050121969A1 (en) | Lubricant for wafer polishing using a fixed abrasive pad | |
| JP5172401B2 (en) | Manufacturing method of sheet-like abrasive | |
| CN207255878U (en) | A kind of surface polishing equipment of stone material | |
| CN219113781U (en) | Device for trimming polishing pad | |
| JP3983633B2 (en) | Grinding wheel and grinding method | |
| KR100413639B1 (en) | Method for fabricating polishing pad | |
| JP2008023625A (en) | Workpiece retaining material | |
| CN110743758B (en) | Repair process for coating damage of three-layer polyolefin coating exposed substrate | |
| JP3638138B2 (en) | Wafer holding disk manufacturing method and wafer polishing method | |
| JPS5833705Y2 (en) | Adsorption fixing device |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| TA01 | Transfer of patent application right |
Effective date of registration: 20210926 Address after: 710000 room 1-3-029, No. 1888, Xifeng South Road, high tech Zone, Xi'an, Shaanxi Province Applicant after: Xi'an yisiwei Material Technology Co.,Ltd. Applicant after: XI'AN ESWIN SILICON WAFER TECHNOLOGY Co.,Ltd. Address before: Room 1323, block a, city gate, No.1 Jinye Road, high tech Zone, Xi'an, Shaanxi 710065 Applicant before: XI'AN ESWIN SILICON WAFER TECHNOLOGY Co.,Ltd. |
|
| TA01 | Transfer of patent application right | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CP03 | Change of name, title or address |
Address after: Room 1-3-029, No. 1888, Xifeng South Road, high tech Zone, Xi'an, Shaanxi 710065 Patentee after: Xi'an Yisiwei Material Technology Co.,Ltd. Patentee after: XI'AN ESWIN SILICON WAFER TECHNOLOGY Co.,Ltd. Address before: 710000 room 1-3-029, No. 1888, Xifeng South Road, high tech Zone, Xi'an, Shaanxi Province Patentee before: Xi'an yisiwei Material Technology Co.,Ltd. Patentee before: XI'AN ESWIN SILICON WAFER TECHNOLOGY Co.,Ltd. |
|
| CP03 | Change of name, title or address |