CN219113781U

CN219113781U - Device for trimming polishing pad

Info

Publication number: CN219113781U
Application number: CN202222779036.7U
Authority: CN
Inventors: 杨昱; 卞梁
Original assignee: Jinzhou Thinkon Semiconductor Co ltd
Current assignee: Jinzhou Thinkon Semiconductor Co ltd
Priority date: 2022-10-20
Filing date: 2022-10-20
Publication date: 2023-06-02
Anticipated expiration: 2032-10-20

Abstract

The utility model relates to the technical field of silicon wafer polishing, in particular to a device for trimming a polishing pad. The device for finishing the polishing pad comprises a polishing disc, a fixing shaft and a scraping plate, wherein the polishing disc is rotatably sleeved on the fixing shaft and concentric with the fixing shaft, the polishing pad can be placed on the top surface of the polishing disc, the scraping plate is fixedly connected with the fixing shaft, and the bottom edge of the scraping plate can be abutted with the polishing pad on the polishing disc to scrape residues on the polishing pad. Because the polishing pad is connected to the polishing disc, when the polishing disc drives the polishing pad to rotate, the polishing disc rotates relative to the fixed shaft, and residues on the polishing pad are removed due to the fact that the bottom end of the scraping plate is abutted to the polishing pad, the polishing pad trimming device is simple in structure and capable of trimming the polishing pad, surface roughness of the polishing pad in the service life is improved, and the qualification rate of the flatness of the polished silicon wafer is improved.

Description

Device for trimming polishing pad

Technical Field

The utility model relates to the technical field of silicon wafer polishing, in particular to a device for trimming a polishing pad.

Background

Polishing is an important process in the silicon wafer manufacturing process flow. When the surface of the silicon wafer is polished, polishing liquid is sprayed to the surface of the silicon wafer while the silicon wafer rotates relative to the polishing pad, and a certain pressure is applied to the silicon wafer to enable the silicon wafer to abut against the polishing pad, and polishing is completed through the dual effects of chemical corrosion and mechanical polishing in the process, so that a damaged layer on the surface of the silicon wafer is removed, and the silicon wafer with high surface quality is obtained.

However, in the polishing process, the polishing solution and silicon wafer residues are accumulated for a long time, so that the polishing solution is blocked in tiny pores of the polishing pad, the polishing pad is not smooth in circulation, the removal amount of the silicon wafer is influenced, the surface of the polished surface is rough, the flatness of the polished silicon wafer is not qualified, the productivity is reduced, and the reject ratio of the product is increased.

Accordingly, there is a need for an apparatus for conditioning a polishing pad that conditions the surface of the polishing pad.

Disclosure of Invention

First, the technical problem to be solved

In view of the above-mentioned drawbacks and shortcomings of the prior art, the present utility model provides a device for polishing pad dressing, which can be used for dressing a polishing pad, improving the surface roughness of the polishing pad in the service life, and further improving the qualification rate of the polished silicon wafer flatness.

(II) technical scheme

In order to achieve the above purpose, the main technical scheme adopted by the utility model comprises the following steps:

the embodiment of the utility model provides a device for finishing a polishing pad, which comprises a polishing disc, a fixed shaft, a mounting assembly and a scraping plate; the polishing disc is rotatably sleeved on the fixed shaft and concentric with the fixed shaft, and the polishing pad can be placed on the top surface of the polishing disc; the scraper blade is fixedly connected with the fixed shaft, and the bottom edge of the scraper blade can be abutted with the polishing pad on the polishing disk to scrape residues on the polishing pad.

Preferably, the scraper is fixedly connected with the fixed shaft through the mounting assembly, and the scraper is oriented along the radial direction of the polishing disk; the mounting assembly comprises a first clamping block, a second clamping block and a connecting rod; the first clamping block is in butt joint with the second clamping block so as to be clamped on the fixed shaft; the connecting rod is fixed in the one end of first clamp splice, and the scraper blade can be dismantled with the connecting rod and be connected.

Preferably, the mounting assembly further comprises an adjusting rod, and the adjusting rod is provided with an opening along the length direction of the adjusting rod so as to accommodate the connecting rod; the scraper blade is connected on the connecting rod through the adjusting rod.

Preferably, the scraper is provided with a first adjustment groove in a direction perpendicular to the radial direction of the polishing disk, and the adjustment lever is connected with the first adjustment groove of the scraper through a first connecting piece.

Preferably, the adjusting rod is provided with a second adjusting groove along the length direction thereof, and the connecting rod is detachably connected with the second adjusting groove of the adjusting rod through a second connecting piece.

Preferably, the first clamping block is L-shaped in cross section.

Preferably, the connecting rod is rectangular in cross section.

Preferably, the angle between the scraper and the polishing disc is 45 degrees.

Preferably, the number of revolutions of the polishing disc is 40r/min.

(III) beneficial effects

The beneficial effects of the utility model are as follows:

according to the device for trimming the polishing pad, the polishing disc, the fixed shaft and the scraping plate are arranged, the polishing pad is connected to the polishing disc, the scraping plate is fixed on the fixed shaft, the polishing disc rotates relative to the fixed shaft, and when the polishing disc drives the polishing pad to rotate, the bottom edge of the scraping plate is abutted with the polishing pad so as to remove residues on the polishing pad, so that the device for trimming the polishing pad is simple in structure, can trim the polishing pad, improves the surface roughness of the polishing pad in the service life, and further improves the qualification rate of the flatness of a polished silicon wafer.

Drawings

FIG. 1 is a schematic view of an apparatus for conditioning a polishing pad according to the present utility model;

FIG. 2 is a schematic view of the structure of FIG. 1 in a first direction;

FIG. 3 is a schematic view of the structure of FIG. 1 in a second direction;

fig. 4 is a schematic view of the structure of the squeegee of fig. 1.

[ reference numerals description ]

1: polishing disk;

2: a fixed shaft; 31: a first clamping block; 32: a second clamping block; 33: a connecting rod; 34: an adjusting lever; 341: a second regulating groove;

3: a mounting assembly;

4: a scraper; 41: a first adjustment tank.

Detailed Description

In order that the above-described aspects may be better understood, exemplary embodiments of the present utility model will be described in more detail below with reference to the accompanying drawings. While exemplary embodiments of the present utility model are shown in the drawings, it should be understood that the present utility model may be embodied in various forms and should not be limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the utility model to those skilled in the art.

As shown in fig. 1, an apparatus for dressing a polishing pad according to an embodiment of the present utility model includes a polishing disk 1, a fixed shaft 2, a mounting assembly 3, and a squeegee 4.

The polishing disc 1 is rotatably sleeved on the fixed shaft 2 and concentric with the fixed shaft, a polishing pad can be placed on the top surface of the polishing disc 1, the polishing pad is adhered to the polishing disc 1, in the practical application process, the polishing disc 1 is connected with a driving piece, the driving piece drives the polishing disc 1 to rotate, and when the driving piece drives the polishing disc 1 to rotate, the polishing disc 1 rotates relative to the fixed shaft 2. The scraper 4 is fixedly connected with the fixed shaft 2, and the bottom edge of the scraper 4 can be abutted with the polishing pad on the polishing disk 1 to scrape residues on the polishing pad. To ensure the scraping effect of the residue, the angle between the scraper 4 and the polishing disk 1 is 45 °.

Because the polishing pad is connected to the polishing disc 1, the scraping plate 4 is fixed on the fixed shaft 2, the polishing disc 1 rotates relative to the fixed shaft 2, when the polishing disc 1 drives the polishing pad to rotate, residues on the polishing pad are removed due to the fact that the bottom edge of the scraping plate 4 is abutted to the polishing pad, and therefore the polishing pad trimming device is simple in structure and capable of trimming the polishing pad, surface roughness of the polishing pad in the service life is improved, and the qualification rate of the flatness of polished silicon wafers is improved.

As shown in fig. 1 to 3, the scraper 4 is fixedly connected with the fixed shaft 2 through the mounting assembly 3, and the scraper 4 is oriented along the radial direction of the polishing disc 1, the mounting assembly 3 comprises a first clamping block 31, a second clamping block 32, a connecting rod 33 and an adjusting rod 34, the first clamping block 31 is connected with the second clamping block 32 in a butt joint mode and then is clamped on the fixed shaft 2 through a screw, the connecting rod 33 is fixed at one end of the first clamping block 31, and the scraper 4 is detachably connected with the connecting rod 33. To facilitate positioning of the second clamping block 32, the cross section of the first clamping block 31 is L-shaped, and the second clamping block 32 can be quickly abutted with the first clamping block 31.

As shown in fig. 1 and 4, the scraper 4 is connected to the connecting rod 33 through the adjusting rod 34, the adjusting rod 34 is provided with an opening along the length direction thereof to accommodate the connecting rod 33, the scraper 4 is provided with a first adjusting groove 41 along the radial direction perpendicular to the polishing disk 1, the adjusting rod 34 is connected with the first adjusting groove 41 of the scraper 4 through a first connecting piece, wherein the cross section of the connecting rod 33 is rectangular, and the shape of the opening on the adjusting rod 34 is rectangular matched with the connecting rod 33, so that the connecting rod 33 and the opening of the adjusting rod 34 can be positioned and installed. The first regulating groove 41 regulates the length of the blade 4 extending in the width direction thereof, that is, the pressure of the blade 4 against the polishing pad.

In the practical application process, the scraping plate 4 is a stainless steel plate with the length of 250mm, the width of 100mm and the thickness of 2mm, and meanwhile, the weight with the thickness of 2mm is suitable for correcting the polishing pad, and the periphery and the edge of the scraping plate 4 are rounded, so that the surface of an operator and the polishing pad are prevented from being scratched during use. And the first regulating grooves 41 are provided with 3, 3 first regulating grooves 41 are arranged at equal intervals along the length direction thereof. Wherein the first connecting piece is a bolt.

As shown in fig. 2, the adjusting rod 34 is provided with a second adjusting groove 341 along the length direction thereof, the connecting rod 33 is detachably connected with the second adjusting groove 341 of the adjusting rod 34 through a second connecting piece, the length of the adjusting rod 34 extending out along the length direction thereof is adjusted through the second adjusting groove 341, when the length of the adjusting rod 34 is too long, an operator applies a certain force at one end far away from the fixed shaft 2, so that the polishing pad is uniformly stressed, wherein the second connecting piece is a bolt.

In the practical application process, the number of revolutions of the polishing disk 1 is preferably 40r/min, and the pure water rinsing flow rate is preferably set to 10L/min, and the polishing pad is preferably dressed 2 times after each group of silicon wafers is polished.

In the description of the present utility model, it should be understood that the terms "first," "second," and the like are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include one or more such feature. In the description of the present utility model, the meaning of "a plurality" is two or more, unless explicitly defined otherwise.

In the present utility model, unless explicitly specified and limited otherwise, the terms "mounted," "connected," "secured," and the like are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally formed; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium; may be a communication between two elements or an interaction between two elements. The specific meaning of the above terms in the present utility model can be understood by those of ordinary skill in the art according to the specific circumstances.

In the present utility model, unless expressly stated or limited otherwise, a first feature is "on" or "under" a second feature, which may be in direct contact with the first and second features, or in indirect contact with the first and second features via an intervening medium. Moreover, a first feature "above," "over" and "on" a second feature may be a first feature directly above or obliquely above the second feature, or simply indicate that the first feature is higher in level than the second feature. The first feature being "under", "below" and "beneath" the second feature may be the first feature being directly under or obliquely below the second feature, or simply indicating that the first feature is level lower than the second feature.

In the description of the present specification, the terms "one embodiment," "some embodiments," "examples," "particular examples," or "some examples," etc., refer to particular features, structures, materials, or characteristics described in connection with the embodiment or example as being included in at least one embodiment or example of the present utility model. In this specification, schematic representations of the above terms are not necessarily directed to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples. Furthermore, the different embodiments or examples described in this specification and the features of the different embodiments or examples may be combined and combined by those skilled in the art without contradiction.

While embodiments of the present utility model have been shown and described above, it will be understood that the above embodiments are illustrative and not to be construed as limiting the utility model, and that alterations, modifications, substitutions and variations may be made in the above embodiments by those skilled in the art within the scope of the utility model.

Claims

1. A device for dressing a polishing pad, characterized by comprising a polishing disk (1), a fixed shaft (2), a mounting assembly (3) and a scraper (4);

the polishing disc (1) is rotatably sleeved on the fixed shaft (2) and concentric with the fixed shaft, and a polishing pad can be placed on the top surface of the polishing disc (1);

the scraping plate (4) is fixedly connected with the fixed shaft (2), and the bottom edge of the scraping plate (4) can be abutted with the polishing pad on the polishing disc (1) to scrape residues on the polishing pad.

2. The apparatus for conditioning a polishing pad according to claim 1, wherein:

the scraping plate (4) is fixedly connected with the fixed shaft (2) through a mounting component (3), and the scraping plate (4) is oriented along the radial direction of the polishing disc (1);

the mounting assembly (3) comprises a first clamping block (31), a second clamping block (32) and a connecting rod (33);

the first clamping block (31) is in butt joint with the second clamping block (32) so as to be clamped on the fixed shaft (2);

the connecting rod (33) is fixed at one end of the first clamping block (31), and the scraping plate (4) is detachably connected with the connecting rod (33).

3. The apparatus for conditioning a polishing pad according to claim 2, wherein:

the mounting assembly (3) further comprises an adjusting rod (34), and the adjusting rod (34) is provided with an opening along the length direction of the adjusting rod so as to accommodate the connecting rod (33);

the scraper (4) is connected to the connecting rod (33) through the adjusting rod (34).

4. The apparatus for conditioning a polishing pad as recited in claim 3, wherein:

the scraping plate (4) is provided with a first adjusting groove (41) along the direction perpendicular to the radial direction of the polishing disc (1), and the adjusting rod (34) is connected with the first adjusting groove (41) of the scraping plate (4) through a first connecting piece.

5. The apparatus for conditioning a polishing pad as recited in claim 3, wherein:

the adjusting rod (34) is provided with a second adjusting groove (341) along the length direction, and the connecting rod (33) is detachably connected with the second adjusting groove (341) of the adjusting rod (34) through a second connecting piece.

6. The apparatus for conditioning a polishing pad according to claim 2, wherein:

the cross section of the first clamping block (31) is L-shaped.

7. The apparatus for conditioning a polishing pad according to claim 2, wherein:

the cross section of the connecting rod (33) is rectangular.

8. The apparatus for conditioning a polishing pad according to claim 1, wherein:

the included angle between the scraping plate (4) and the polishing disc (1) is 45 degrees.

9. The apparatus for conditioning a polishing pad according to claim 1, wherein:

the revolution of the polishing disc (1) is 40r/min.