CN111741668A - Wave absorber preparation method, wave absorber and application thereof - Google Patents
Wave absorber preparation method, wave absorber and application thereof Download PDFInfo
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- CN111741668A CN111741668A CN202010800730.5A CN202010800730A CN111741668A CN 111741668 A CN111741668 A CN 111741668A CN 202010800730 A CN202010800730 A CN 202010800730A CN 111741668 A CN111741668 A CN 111741668A
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- H05K9/0073—Shielding materials
- H05K9/0081—Electromagnetic shielding materials, e.g. EMI, RFI shielding
- H05K9/0083—Electromagnetic shielding materials, e.g. EMI, RFI shielding comprising electro-conductive non-fibrous particles embedded in an electrically insulating supporting structure, e.g. powder, flakes, whiskers
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Abstract
The invention discloses a preparation method of a wave absorber, wherein the wave absorber comprises wave absorber powder and thermoplastic polymer which are uniformly mixed, a pre-established wave absorber three-dimensional graph is taken as a forming target, and the wave absorber three-dimensional graph is decomposed into a multi-layer two-dimensional structure with the target thickness; the method comprises the steps of applying heating and melting effects to raw materials of the wave absorber through rapid forming equipment, simultaneously applying a magnetic field with magnetic lines parallel to a two-dimensional structure, melting a thermoplastic polymer, bonding and coating wave absorber powder, and forming the wave absorber with a three-dimensional structure by parallel arrangement of the bonded and coated wave absorber powder under the effect of the magnetic field; the preparation process is simple, the scale production is easy to realize, the prepared wave absorber has a three-dimensional structure, a splicing structure of plane wave absorbers is avoided, the thickness is adjustable, the shape is regularly and flatly arranged, and the electromagnetic wave shielding function is excellent.
Description
Technical Field
The invention belongs to the field of wave-absorbing materials, and particularly relates to a preparation method of a wave absorber, and the invention also relates to the wave absorber obtained by the preparation method and application thereof.
Background
With the rapid development of electronic products, the problem of electromagnetic wave interference between various components is getting more and more serious under the influence of the trend of high frequency and high integration. Because the wave absorber material can absorb electromagnetic waves instead of reflect the electromagnetic waves, the wave absorber material has the advantage that other conductive shielding materials cannot be replaced, so that the wave absorber material is more and more widely applied to electronic products in order to reduce the interference of the electromagnetic waves. Particularly, among various wave absorber materials, the soft magnetic alloy has the characteristics of high magnetic saturation strength, high magnetic conductivity, small coercive force and the like, and is widely applied to electronic equipment. The working principle mainly comprises: when electromagnetic waves are incident to the surface of the alloy, except for reflection and transmission, part of the electromagnetic wave energy causes the generation of eddy current and is converted into heat energy to consume the electromagnetic wave energy; because of the attachment effect, the generation of the eddy current only occurs on the surface layer of the material and does not enter the material body, and in order to enhance the absorption effect, the soft magnetic alloy can be made into a sheet shape to achieve the purpose of attenuation layer by layer, so that the optimal absorption effect can be achieved by adopting the minimum material amount.
At present, two mature methods are used for preparing soft magnetic alloy wave-absorbing materials, wherein one method is to disperse the flaky powder in a medium consisting of a solvent and a polymer adhesive, then prepare a coating in a coating mode, in the preparation process, the flaky soft magnetic alloy powder is arranged in parallel, the solvent is volatilized and removed, and thus a planar wave-absorbing coating with a certain thickness is obtained, and then the planar wave-absorbing coating is pasted on the periphery of an electronic component to be protected in a pasting mode. However, this preparation method and the resulting wave-absorbing coating have the following disadvantages: (1) a large amount of solvent is used in the preparation process; (2) limited thickness, typically no more than 0.5 mm; (3) only planar coatings can be obtained. The other method is that the soft magnetic alloy and the polymer are mixed together by an internal mixing method and then are extruded into sheets by an open mill; the flaky soft magnetic alloy powder of the wave absorber material obtained by the method is disorderly arranged, the absorption effect cannot be fully exerted, and the thickness of the flaky soft magnetic alloy powder is controllable, but only a product with a flaky structure can be prepared.
However, in an actual application scenario, sometimes a wave absorbing body with a larger thickness is needed to achieve a better shielding effect, and meanwhile, the protection of the planar wave absorbing coating on the three-dimensional component needs to be realized by a splicing and pasting method, and the risk of leakage is inevitably increased at the joint.
In addition, through patent search, the applicant also finds that a 3D effect absorber is obtained by performing pretreatment by magnetic field rotational orientation and then performing compression molding, the process of magnetic field rotational orientation is particularly complicated, and the 3D effect absorber obtained by compression cannot realize the level arrangement of each layer, so that the electromagnetic wave shielding is limited (see CN104319050A directly); it is also proposed to perform magnetic field orientation during pressing, then perform layer-by-layer cutting, and then perform stacking molding, and the cutting process is time-consuming and labor-consuming and difficult to implement industrial popularization (see CN107256751A directly).
Therefore, the market urgently needs to develop a soft magnetic alloy wave absorber with adjustable thickness and controllable shape.
Disclosure of Invention
In view of the above, the present invention provides a method for preparing a wave absorber, a wave absorber and an application thereof, wherein the method is simple in preparation process and easy to implement mass production, and the prepared wave absorber has a three-dimensional structure, avoids a splicing structure of planar wave absorbers, has an adjustable thickness, is regularly and flatly arranged in shape, and has an excellent electromagnetic wave shielding function.
The technical scheme adopted by the invention is as follows:
a method for preparing a wave absorber, wherein the wave absorber comprises wave absorber powder and thermoplastic polymer which are uniformly mixed, a pre-created wave absorber three-dimensional graph is taken as a forming target, and the wave absorber three-dimensional graph is decomposed into a multilayer two-dimensional structure with a target thickness; the raw materials of the wave absorber are heated and melted by the rapid forming equipment, and a magnetic field with magnetic lines parallel to the two-dimensional structure is applied at the same time, so that the thermoplastic polymer is melted and the wave absorber powder is bonded and coated, and the bonded and coated wave absorber powder is arranged in parallel under the action of the magnetic field, and the wave absorber with the three-dimensional structure is obtained by forming.
Preferably, the operation steps include:
s10), mixing materials and preparing powder: uniformly mixing the wave absorber powder and the thermoplastic polymer in a mixing container, adding the mixture into a liquid dispersion medium under a stirring state, continuously stirring until the thermoplastic polymer is completely dissolved, and drying to obtain raw material powder;
s20), constructing a 3D model: the method comprises the steps of creating a required wave-absorbing body three-dimensional graph in advance according to a forming target, and decomposing the wave-absorbing body three-dimensional graph into a multilayer two-dimensional structure with the target thickness; wherein the step S20) may be performed before the step S10), or simultaneously with the step S10);
s30), laser multilayer fabrication: placing the raw material powder obtained in the step S10) into a raw material cylinder of a rapid prototyping device, and carrying out layer-by-layer prototyping by taking the multilayer two-dimensional structure obtained in the step S20) as a prototyping sequence to obtain a wave absorbing body with a three-dimensional structure, wherein the prototyping process of each layer comprises the following steps: the raw materials of the wave absorber are heated and melted by the rapid forming equipment, and a magnetic field with magnetic lines parallel to the two-dimensional structure is applied at the same time, so that the thermoplastic polymer is melted and the wave absorber powder is bonded and coated, and the bonded and coated wave absorber powder is arranged in parallel under the action of the magnetic field.
Preferably, in the step S10), the liquid dispersion medium adopts ethyl acetate or acetone.
Preferably, the wave absorbing agent powder is soft magnetic alloy powder; the thermoplastic polymer adopted in the application is selected from substances which have better fluidity when mixed materials are prepared into powder and processed, can be quickly bonded into a whole by solidification, polymerization or solidification and the like when being quickly molded, has good mechanical strength, and is preferably selected from one or a mixture of more of ABS, PLA, HIPS, Nylon, TPE, PC, PETG and TUP; the weight ratio of the wave absorbent powder to the thermoplastic polymer is 10-95: 5-90.
Preferably, the rapid prototyping device adopts a 3D laser printer, and the raw material of the wave absorbing body is heated and melted by laser.
Preferably, the laser power range is 10-200W, and the working temperature range is 50-200 ℃.
Preferably, the magnetic field strength is 10000-.
Preferably, the target thickness is not less than 100 microns.
Preferably, the particle diameter D of the wave absorber powder50In the range of 10-200 microns.
Preferably, the wave absorber is prepared by the preparation method.
Preferably, the wave absorber is applied to the electronic components or the communication equipment as a protective material.
It should be noted that the ABS of the present invention refers to a terpolymer of acrylonitrile (a), butadiene (B) and styrene (S), PLA is an abbreviation of polylactic acid, chinese means polylactic acid, HIPS means high impact polystyrene, Nylon is an abbreviation of Nylon, its chemical name is polyamide fiber, TPE is an abbreviation of Thermoplastic Elastomer, chinese means 1,1,2, 2-tetraphenylethylene, PC means polycarbonate, PETG is polyethylene terephthalate-1, 4-cylohexylenedimethylene terephthalate, TUP is an abbreviation of Thermoplastic Elastomer, and chinese means Thermoplastic polyurethane Elastomer.
The invention takes the wave-absorbing body three-dimensional graph created in advance as a forming target through the rapid forming principle of the 3D laser printer, the wave absorber three-dimensional graph is decomposed into a multilayer two-dimensional structure with target thickness, the raw material of the wave absorber is provided for layer-by-layer two-dimensional rapid forming to obtain the wave absorber with the three-dimensional structure, the splicing structure of the plane wave absorber is avoided, the thickness is adjustable, meanwhile, the invention also creatively provides that in the rapid forming process, applying a magnetic field with magnetic lines parallel to the two-dimensional structure while heating and melting to melt the thermoplastic polymer and bond and coat the absorbent powder, the bonded and coated wave absorbing agent powder is arranged in parallel under the action of a magnetic field, and finally the wave absorbing body obtained by molding is ensured to be regularly and flatly arranged in shape, so that the wave absorbing body has an excellent electromagnetic wave shielding function, is simple in preparation process and is easy to realize mass production; the wave absorber is particularly suitable for being used as a protective material for cables and outdoor cables with higher working environment temperature.
Drawings
FIG. 1 is a block diagram of the steps of a method for making a lower absorber according to an embodiment of the present invention;
FIG. 2 is a scanning electron micrograph of an absorber according to an embodiment of the present invention;
FIG. 3 is a graph of frequency versus reflectivity for a lower absorber according to an embodiment of the present invention.
Detailed Description
The embodiment of the invention discloses a preparation method of a wave absorber, wherein the wave absorber comprises wave absorber powder and thermoplastic polymer which are uniformly mixed, a pre-established wave absorber three-dimensional graph is taken as a forming target, and the wave absorber three-dimensional graph is decomposed into a multilayer two-dimensional structure with the target thickness; the raw materials of the wave absorber are heated and melted by the rapid forming equipment, and a magnetic field with magnetic lines parallel to the two-dimensional structure is applied at the same time, so that the thermoplastic polymer is melted and the wave absorber powder is bonded and coated, and the bonded and coated wave absorber powder is arranged in parallel under the action of the magnetic field, and the wave absorber with the three-dimensional structure is obtained by forming.
The embodiment of the invention also discloses a wave absorber which is prepared by adopting the preparation method.
The embodiment of the invention also discloses application of the wave absorber as a protective material of a cable.
In order to make those skilled in the art better understand the technical solution of the present invention, the technical solution in the embodiment of the present invention will be clearly and completely described below with reference to the drawings in the embodiment of the present invention, and it is obvious that the described embodiment is only a part of the embodiment of the present invention, and not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Referring to fig. 1, a method for preparing a wave absorber includes the following steps:
s10), mixing materials and preparing powder: the wave absorber powder and the thermoplastic polymer are mixed inMixing uniformly in a mixing container, adding into liquid dispersion medium (ethyl acetate or acetone or other liquid dispersion medium with similar function) under stirring, continuously stirring until thermoplastic polymer is completely dissolved, and drying to obtain raw material powder; preferably, in this embodiment, the wave absorbing agent powder is soft magnetic alloy powder, and specifically, iron-silicon alloy, iron-aluminum alloy, iron-silicon-aluminum alloy, iron-nickel alloy, carbonyl iron powder, and the like can be selected; the thermoplastic polymer is one or a mixture of more of ABS, PLA, HIPS, Nylon, TPE, PC, PETG and TUP; the weight ratio of the wave absorbent powder to the thermoplastic polymer is 10-95:5-90, and the particle diameter D of the wave absorbent powder50In the range of 10-200 microns; particularly preferably, in the present embodiment, the wave absorber powder is ferrosilicon powder, and the thermoplastic polymer is ABS; the weight portion ratio of the ferrosilicon alloy powder to the ABS is 40:60, and the grain diameter D of the ferrosilicon alloy powder5060-80 microns;
s20), constructing a 3D model: creating a required wave-absorbing body three-dimensional graph in computer system software of an auxiliary printer of a 3D laser printer in advance according to a molding target, and decomposing the wave-absorbing body three-dimensional graph into a multilayer two-dimensional structure with the target thickness, wherein the target thickness is not less than 100 micrometers, specifically 100 and 500 micrometers, and also can be set to be more than 500 micrometers, which are specifically set according to actual requirements, and the embodiment is not particularly limited; it should be noted that step S20) in the present embodiment may be performed before step S10), or may be performed simultaneously with step S10), and this change in order does not affect the implementation effect of the present embodiment;
s30), laser multilayer fabrication: placing the raw material powder obtained in the step S10) into a raw material cylinder of a 3D laser printer, setting the laser power range of the 3D laser printer to be 10-200W, and setting the working temperature range to be 50-200 ℃; then, pre-powder-spreading work is carried out on a working area of the 3D laser printer until the powder-spreading is smooth, and then layer-by-layer forming is carried out by taking the multilayer two-dimensional structure of the step S20) as a forming sequence to obtain the wave-absorbing body with the three-dimensional structure, wherein the forming process of each layer comprises the following steps: heating and melting the raw materials of the wave absorber by using rapid forming equipment, applying a magnetic field with magnetic lines parallel to the two-dimensional structure at the same time, wherein the magnetic field intensity is 10000-100000GS, so that the thermoplastic polymer is melted and the wave absorber powder is bonded and coated, and the bonded and coated wave absorber powder is arranged in parallel under the action of the magnetic field;
preferably, this embodiment further includes S40), cleaning and finishing: naturally cooling the wave absorber with the three-dimensional structure obtained in the step S30), removing residual powder, and performing procedures such as cleaning, grinding or polishing according to needs to finally obtain a wave absorber finished product.
Referring to fig. 2, the applicant observes the finished wave absorber prepared by the present embodiment by a scanning electron microscope, and can see that the wave absorber has a three-dimensional structure and is regularly and flatly arranged in shape; as further shown in fig. 3, the applicant further uses a Reflectivity testing apparatus of a wave-absorbing material to perform frequency-Reflectivity curve detection on the finished wave-absorbing body manufactured by the implementation, where the abscissa in fig. 3 is frequency f, the unit is GHz, and the ordinate is Reflectivity, the unit is dB, and it is obvious from fig. 3 that, at a target frequency, the Reflectivity is an obvious valley value, and the wave-absorbing body has a very excellent electromagnetic wave shielding function.
The wave absorber finished product of the embodiment is applied as a protective material for electronic components or communication equipment, is particularly suitable for serving as a protective material for cables, and is particularly suitable for serving as a protective material for cables and outdoor cables with higher working environment temperature.
The embodiment adopts the rapid forming principle of the 3D laser printer, takes the pre-created wave-absorbing body three-dimensional graph as a forming target, the wave absorber three-dimensional graph is decomposed into a multilayer two-dimensional structure with target thickness, the raw material of the wave absorber is provided to be subjected to two-dimensional rapid forming layer by layer to obtain the wave absorber with the three-dimensional structure, the splicing structure of the plane wave absorber is avoided, the thickness is adjustable, meanwhile, the embodiment also creatively provides that in the rapid forming process, applying a magnetic field with magnetic lines parallel to the two-dimensional structure while heating and melting to melt the thermoplastic polymer and bond and coat the absorbent powder, the bonded and coated wave absorbing agent powder is arranged in parallel under the action of a magnetic field, and finally the wave absorbing body obtained by molding is ensured to be regularly and flatly arranged in shape, so that the wave absorbing body has an excellent electromagnetic wave shielding function, is simple in preparation process and is easy to realize mass production; the wave absorber of the embodiment is particularly suitable for being applied as a protective material for cables and outdoor cables with high working environment temperature.
It will be evident to those skilled in the art that the invention is not limited to the details of the foregoing illustrative embodiments, and that the present invention may be embodied in other specific forms without departing from the spirit or essential attributes thereof. The present embodiments are therefore to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.
Furthermore, it should be understood that although the present description refers to embodiments, not every embodiment may contain only a single embodiment, and such description is for clarity only, and those skilled in the art should integrate the description, and the embodiments may be combined as appropriate to form other embodiments understood by those skilled in the art.
Claims (10)
1. A method for preparing a wave absorber is characterized in that raw materials of the wave absorber comprise wave absorber powder and thermoplastic polymer which are uniformly mixed, a pre-created three-dimensional graph of the wave absorber is taken as a forming target, and the three-dimensional graph of the wave absorber is decomposed into a multi-layer two-dimensional structure with a target thickness; the raw materials of the wave absorber are heated and melted by the rapid forming equipment, and a magnetic field with magnetic lines parallel to the two-dimensional structure is applied at the same time, so that the thermoplastic polymer is melted and the wave absorber powder is bonded and coated, and the bonded and coated wave absorber powder is arranged in parallel under the action of the magnetic field, and the wave absorber with the three-dimensional structure is obtained by forming.
2. The method of claim 1, comprising the steps of:
s10), mixing materials and preparing powder: uniformly mixing the wave absorber powder and the thermoplastic polymer in a mixing container, adding the mixture into a liquid dispersion medium under a stirring state, continuously stirring until the thermoplastic polymer is completely dissolved, and drying to obtain raw material powder;
s20), constructing a 3D model: the method comprises the steps of creating a required wave-absorbing body three-dimensional graph in advance according to a forming target, and decomposing the wave-absorbing body three-dimensional graph into a multilayer two-dimensional structure with the target thickness; wherein the step S20) may be performed before the step S10), or simultaneously with the step S10);
s30), laser multilayer fabrication: placing the raw material powder obtained in the step S10) into a raw material cylinder of a rapid prototyping device, and carrying out layer-by-layer prototyping by taking the multilayer two-dimensional structure obtained in the step S20) as a prototyping sequence to obtain a wave absorbing body with a three-dimensional structure, wherein the prototyping process of each layer comprises the following steps: the raw materials of the wave absorber are heated and melted by the rapid forming equipment, and a magnetic field with magnetic lines parallel to the two-dimensional structure is applied at the same time, so that the thermoplastic polymer is melted and the wave absorber powder is bonded and coated, and the bonded and coated wave absorber powder is arranged in parallel under the action of the magnetic field.
3. The method for preparing a wave absorber according to claim 2, wherein in step S10), ethyl acetate or acetone is used as the liquid dispersion medium.
4. The method for producing a wave absorber according to claim 1 or 2, wherein the wave absorber powder is a soft magnetic alloy powder; the thermoplastic polymer is one or a mixture of more of ABS, PLA, HIPS, Nylon, TPE, PC, PETG and TUP; the weight ratio of the wave absorbent powder to the thermoplastic polymer is 10-95: 5-90.
5. The method for preparing the wave absorber according to claim 1 or 2, wherein the rapid prototyping device adopts a 3D laser printer, and the raw material of the wave absorber is heated and melted by laser.
6. The method according to claim 5, wherein the laser power is in the range of 10-200W and the operating temperature is in the range of 50-200 ℃.
7. The method according to claim 1 or 2, wherein the magnetic field strength is 10000-100000 GS.
8. The method of claim 1 or 2, wherein the target thickness is not less than 100 μm.
9. A wave absorber produced by the production method according to any one of claims 1 to 8.
10. Use of a absorber according to claim 9 as a protective material for electronic components or communication equipment.
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112358711A (en) * | 2020-11-19 | 2021-02-12 | 重庆大学 | Magnetic-thermal coupling tunable wave-absorbing material and preparation method thereof |
| CN113795133A (en) * | 2021-09-13 | 2021-12-14 | 合肥工业大学 | Preparation method of layered magnetic orientation photosensitive resin-based electromagnetic wave absorber |
| CN116144150A (en) * | 2023-01-04 | 2023-05-23 | 三峡大学 | Fe 3 O 4 FeSiAl/GR composite reinforced PLA-based 3D printing wave-absorbing wire and preparation method thereof |
| CN116144150B (en) * | 2023-01-04 | 2024-05-28 | 三峡大学 | Fe3O4FeSiAl/GR composite reinforced PLA-based 3D printing wave-absorbing wire and preparation method thereof |
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| US20070041072A1 (en) * | 2005-08-17 | 2007-02-22 | Li-Hsien Yen | Electromagnetic wave absorptive film and its fabrication |
| CN105252779A (en) * | 2015-11-25 | 2016-01-20 | 上海无线电设备研究所 | Three-dimensional forming manufacturing system and method for wave absorbing material |
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Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
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| US20070041072A1 (en) * | 2005-08-17 | 2007-02-22 | Li-Hsien Yen | Electromagnetic wave absorptive film and its fabrication |
| CN105252779A (en) * | 2015-11-25 | 2016-01-20 | 上海无线电设备研究所 | Three-dimensional forming manufacturing system and method for wave absorbing material |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112358711A (en) * | 2020-11-19 | 2021-02-12 | 重庆大学 | Magnetic-thermal coupling tunable wave-absorbing material and preparation method thereof |
| CN113795133A (en) * | 2021-09-13 | 2021-12-14 | 合肥工业大学 | Preparation method of layered magnetic orientation photosensitive resin-based electromagnetic wave absorber |
| CN113795133B (en) * | 2021-09-13 | 2024-01-26 | 合肥工业大学 | Preparation method of layered magnetically oriented photosensitive resin-based electromagnetic wave absorber |
| CN116144150A (en) * | 2023-01-04 | 2023-05-23 | 三峡大学 | Fe 3 O 4 FeSiAl/GR composite reinforced PLA-based 3D printing wave-absorbing wire and preparation method thereof |
| CN116144150B (en) * | 2023-01-04 | 2024-05-28 | 三峡大学 | Fe3O4FeSiAl/GR composite reinforced PLA-based 3D printing wave-absorbing wire and preparation method thereof |
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