CN111740638A - Composite energy collector and sensing integrated microsystem - Google Patents
Composite energy collector and sensing integrated microsystem Download PDFInfo
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- CN111740638A CN111740638A CN202010651134.5A CN202010651134A CN111740638A CN 111740638 A CN111740638 A CN 111740638A CN 202010651134 A CN202010651134 A CN 202010651134A CN 111740638 A CN111740638 A CN 111740638A
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- 239000002783 friction material Substances 0.000 claims description 11
- 239000004020 conductor Substances 0.000 claims description 3
- 238000006243 chemical reaction Methods 0.000 abstract description 5
- 238000013461 design Methods 0.000 description 5
- 238000010586 diagram Methods 0.000 description 4
- 238000003466 welding Methods 0.000 description 4
- 230000009471 action Effects 0.000 description 3
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- 238000011160 research Methods 0.000 description 3
- 239000002033 PVDF binder Substances 0.000 description 2
- 238000011161 development Methods 0.000 description 2
- 238000009826 distribution Methods 0.000 description 2
- 230000005611 electricity Effects 0.000 description 2
- 229920001721 polyimide Polymers 0.000 description 2
- 229920002981 polyvinylidene fluoride Polymers 0.000 description 2
- 238000000926 separation method Methods 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
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- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 239000004205 dimethyl polysiloxane Substances 0.000 description 1
- 235000013870 dimethyl polysiloxane Nutrition 0.000 description 1
- 238000004146 energy storage Methods 0.000 description 1
- 238000003912 environmental pollution Methods 0.000 description 1
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- CXQXSVUQTKDNFP-UHFFFAOYSA-N octamethyltrisiloxane Chemical compound C[Si](C)(C)O[Si](C)(C)O[Si](C)(C)C CXQXSVUQTKDNFP-UHFFFAOYSA-N 0.000 description 1
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- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02N—ELECTRIC MACHINES NOT OTHERWISE PROVIDED FOR
- H02N1/00—Electrostatic generators or motors using a solid moving electrostatic charge carrier
- H02N1/04—Friction generators
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- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02N—ELECTRIC MACHINES NOT OTHERWISE PROVIDED FOR
- H02N2/00—Electric machines in general using piezoelectric effect, electrostriction or magnetostriction
- H02N2/18—Electric machines in general using piezoelectric effect, electrostriction or magnetostriction producing electrical output from mechanical input, e.g. generators
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- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02N—ELECTRIC MACHINES NOT OTHERWISE PROVIDED FOR
- H02N2/00—Electric machines in general using piezoelectric effect, electrostriction or magnetostriction
- H02N2/18—Electric machines in general using piezoelectric effect, electrostriction or magnetostriction producing electrical output from mechanical input, e.g. generators
- H02N2/181—Circuits; Control arrangements or methods
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- General Electrical Machinery Utilizing Piezoelectricity, Electrostriction Or Magnetostriction (AREA)
Abstract
The invention discloses a composite energy collector, relates to the technical field of micro energy, and solves the problems of low output power and limited energy conversion efficiency of the existing single energy collector, and the key points of the technical scheme are as follows: the PCB supporting device comprises a top layer PCB supporting plate, a bottom layer PCB supporting plate and an elastic supporting body, wherein two ends of the elastic supporting body are respectively connected with the top layer PCB supporting plate and the bottom layer PCB supporting plate; a piezoelectric energy collector and a friction energy collector are arranged between the top layer PCB supporting plate and the bottom layer PCB supporting plate; the piezoelectric energy collector is in an arch bridge shape, and two ends of the piezoelectric energy collector are fixed with the bottom PCB supporting plate; the friction energy collector is arranged on the surface of the bottom PCB supporting plate and is positioned between two ends of the piezoelectric energy collector; the surface of the top layer PCB supporting plate is provided with the protruding supporting plate which has a contact extrusion effect with the convex surface of the piezoelectric energy collector, so that the output power of the energy collector can be improved, the energy conversion efficiency is improved, power is supplied to a high-power electronic device, and the application scene is wider.
Description
Technical Field
The invention relates to the technical field of micro energy, in particular to a composite energy collector and a sensing integrated micro system.
Background
The sensor is used as an instrument commonly used in daily life and industrial production, and has the advantages of low power, simple circuit, convenience in carrying and the like. Sensors can sense certain characteristics of their surroundings, and sensor-based portable electronic devices and smart sensor networks have been widely used in many fields.
At present, most of the traditional sensing microsystems are powered by batteries, but the service life of the batteries is limited, and the waste batteries are easy to pollute the environment and seriously affect the human health. With the development of miniaturization and low power consumption of intelligent electronic devices, the power consumption of electronic devices has been reduced from the milliwatt (mW) level to the microwatt (uW) level, so that obtaining energy from the environment to power sensors, portable electronic devices, has become an ideal and feasible solution.
The mechanisms for harvesting energy that have been reported in the past are the thermoelectric, photoelectric, electromagnetic, piezoelectric and triboelectric effects. However, the energy collectors manufactured by using a single energy collection mechanism have low output power and limited energy conversion efficiency. Therefore, how to research and design a composite energy collector and a sensing integrated microsystem is a problem which is urgently needed to be solved at present.
Disclosure of Invention
The invention aims to provide a composite energy collector which can improve the output power of the energy collector, improve the energy conversion efficiency, supply power to high-power electronic devices and have wider application scenes.
The technical purpose of the invention is realized by the following technical scheme: a composite energy collector comprises a top layer PCB supporting plate, a bottom layer PCB supporting plate and an elastic supporting body, wherein two ends of the elastic supporting body are respectively connected with the top layer PCB supporting plate and the bottom layer PCB supporting plate;
a piezoelectric energy collector and a friction energy collector are arranged between the top layer PCB supporting plate and the bottom layer PCB supporting plate;
the piezoelectric energy collector is in an arch bridge shape, and two ends of the piezoelectric energy collector are fixed with the bottom PCB supporting plate;
the friction energy collector is arranged on the surface of the bottom PCB supporting plate and is positioned between two ends of the piezoelectric energy collector;
and a convex support plate which has a contact and extrusion effect with the convex surface of the piezoelectric energy collector is arranged on the surface of the top layer PCB support plate.
Preferably, the piezoelectric energy collector comprises an upper insulating film, a piezoelectric upper electrode, a piezoelectric film, a piezoelectric lower electrode and a lower insulating film which are sequentially stacked, the piezoelectric upper electrode is fixed with the upper insulating film, and the piezoelectric lower electrode is fixed with the lower insulating film.
Preferably, the convex support plate is fixedly connected with the top end of the convex surface of the upper insulating film.
Preferably, the friction energy collector comprises a friction lower electrode, a friction material layer and a friction upper electrode which are sequentially arranged, the friction lower electrode is fixed with the surface of the bottom PCB supporting plate, and the friction material layer is coated on the surface of the friction lower electrode facing the friction upper electrode; the friction upper electrode is in an arch bridge shape and is fixed with the concave surface of the piezoelectric energy collector.
Preferably, the bottom layer PCB supporting plate is provided with two backing plates which correspond to two ends of the piezoelectric energy collector one by one, and the end part of the piezoelectric energy collector is fixedly connected with the corresponding pad surface; the thickness of the protruding supporting plate is not less than that of the cushion plate, and the total thickness of the cushion plate and the protruding supporting plate is less than the height of the elastic supporting body.
Preferably, the elastic supporting body is an electric conductor, and two ends of the elastic supporting body are respectively electrically connected with the circuits of the top layer PCB supporting plate and the bottom layer PCB supporting plate.
Preferably, the elastic support is a spring.
The invention also aims to provide a sensing integrated microsystem, which comprises a composite energy collector A, a power management circuit module B, an ultra-low quiescent current power supply module C, a sensing module D and a wireless module E, wherein the composite energy collector A is any one of the composite energy collectors;
the output end of the composite energy collector A is connected with the input end of the power management circuit module B;
the output end of the power management circuit module B is connected with the input end of the ultra-low quiescent current power module C;
the output end of the ultra-low quiescent current power supply module C is connected with the input ends of the sensing module D and the wireless module E;
the output end of the sensing module D is connected with the input end of the wireless module E.
Preferably, the power management circuit module B, the ultra-low quiescent current power module C, the sensing module D, and the wireless module E are all integrated on the top PCB support plate and/or the bottom PCB support plate in the composite energy harvester a.
Compared with the prior art, the invention has the following beneficial effects:
1. by utilizing the working principle of the contact separation type friction generator and the piezoelectric generator, the friction energy collector and the piezoelectric energy collector are integrated between the top layer PCB supporting plate and the bottom layer PCB supporting plate, the output power and the energy conversion efficiency of the energy collector can be improved, power is supplied to high-power electronic devices, and the application scene is wider.
2. The elastic support body has the effect of supporting the top PCB supporting plate and the bottom PCB supporting plate, and simultaneously serves as an electrode to play a role in conducting electricity so that the top PCB supporting plate and the bottom PCB supporting plate are communicated with each other, and the circuit design is simplified.
3. All circuits used in the sensing micro-system are integrated on one composite energy collector, and the energy collector and the sensor circuit are integrated together, so that the whole system is miniaturized and portable, the composite energy is used for replacing the traditional battery power supply mode, the utilization of green energy is realized, and the environmental pollution is reduced.
Drawings
The accompanying drawings, which are included to provide a further understanding of the embodiments of the invention and are incorporated in and constitute a part of this application, illustrate embodiment(s) of the invention and together with the description serve to explain the principles of the invention. In the drawings:
fig. 1 is a schematic view of the overall structure of a composite energy harvester in embodiment 1 of the present invention;
fig. 2 is a schematic view of a compression state of the composite energy harvester in embodiment 1 of the present invention;
fig. 3 is a schematic view of a connection structure of a protruding support plate and a top PCB support plate in embodiment 1 of the present invention;
FIG. 4 is a schematic diagram showing the distribution of top PCB support boards in embodiment 1 of the present invention;
fig. 5 is a schematic distribution diagram of a bottom PCB support board in embodiment 1 of the present invention;
FIG. 6 is a functional block diagram of a sensing integrated microsystem according to embodiment 2 of the present invention;
FIG. 7 is a waveform of voltage and current output by the friction energy harvester when the composite energy harvester is pressed;
fig. 8 is a waveform diagram of the voltage and current output by the piezoelectric energy harvester when the composite energy harvester is pressed.
Reference numbers and corresponding part names in the drawings:
1. an elastic support; 2. a top layer PCB support plate; 3. a protruding support plate; 4. an upper insulating film; 5. a piezoelectric upper electrode; 6. a piezoelectric film; 7. a piezoelectric lower electrode; 8. a lower insulating film; 9. a base plate; 10. a bottom PCB support plate; 11. rubbing the lower electrode; 12. a friction material layer; 13. the upper electrode was rubbed.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention is further described in detail below with reference to examples and accompanying drawings, and the exemplary embodiments and descriptions thereof are only used for explaining the present invention and are not meant to limit the present invention.
It will be understood that when an element is referred to as being "secured to" or "disposed on" another element, it can be directly on the other element or be indirectly on the other element. When an element is referred to as being "connected to" another element, it can be directly or indirectly connected to the other element.
It will be understood that the terms "length," "width," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," and the like, as used herein, refer to an orientation or positional relationship indicated in the drawings that is solely for the purpose of facilitating the description and simplifying the description, and do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and is therefore not to be construed as limiting the invention.
Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the present invention, "a plurality" means two or more unless specifically defined otherwise.
Example 1: a composite energy collector is shown in figures 1 and 2 and comprises a top layer PCB supporting plate 2, a bottom layer PCB supporting plate 10 and an elastic supporting body 1, wherein two ends of the elastic supporting body 1 are respectively connected with the top layer PCB supporting plate 2 and the bottom layer PCB supporting plate 10. A piezoelectric energy collector and a friction energy collector are arranged between the top layer PCB supporting plate 2 and the bottom layer PCB supporting plate 10. The piezoelectric energy collector is in an arch bridge shape, and two ends of the piezoelectric energy collector are fixed with the bottom layer PCB supporting plate 10. The friction energy collector is arranged on the surface of the bottom PCB supporting plate 10 and is positioned between two ends of the piezoelectric energy collector. And a convex support plate 3 which has contact and extrusion effects with the convex surface of the piezoelectric energy collector is fixed in the middle of the lower surface of the top layer PCB support plate 2.
As shown in fig. 1 and 2, the piezoelectric energy harvester includes an upper insulating film 4, a piezoelectric upper electrode 5, a piezoelectric film 6, a piezoelectric lower electrode 7, and a lower insulating film 8, which are sequentially stacked from top to bottom, the piezoelectric upper electrode 5 is fixed to the upper insulating film 4, and the piezoelectric lower electrode 7 is fixed to the lower insulating film 8. The convex supporting plate 3 is fixedly connected with the top end of the convex surface of the upper insulating film 4.
As shown in fig. 1 and 2, the friction energy harvester is in a vertical contact separation mode, the friction energy harvester comprises a lower friction electrode 11, a friction material layer 12 and an upper friction electrode 13 which are sequentially arranged from bottom to top, the lower friction electrode 11 is fixed with the surface of the bottom PCB support plate 10, and the friction material layer 12 is coated on the surface of the lower friction electrode 11 facing the upper friction electrode 13. The friction upper electrode 13 is in an arch bridge shape and is fixed with the concave surface of the piezoelectric energy collector.
As shown in fig. 1 and 2, two backing plates 9 corresponding to two ends of the piezoelectric energy collector are symmetrically arranged on the bottom PCB support plate 10, and the ends of the piezoelectric energy collector are fixedly connected to the corresponding pad surfaces. The thickness of the convex supporting plate 3 is not less than that of the backing plate 9, and the total thickness of the backing plate 9 and the convex supporting plate 3 is less than the height of the elastic supporting body 1. Because the backing plate 9 has a certain height, when only the top layer PCB support plate 2 compresses the elastic support body 1 under the action of mechanical force, the upper friction electrode 13 of the friction energy collector cannot be contacted with the friction material, and the protruding support plate 3 can ensure that the upper friction electrode 13 is completely contacted with the friction material layer 12 when the elastic support body 1 is completely compressed.
As shown in fig. 1-3, in this embodiment, the top PCB support plate 2 and the bottom PCB support plate 10 are both cube shaped with a side length L. Backing plate 9 is fixed and is put at bottom PCB backup pad 10 both sides edge central point, and backing plate 9 is the cuboid, length X: x is more than 0 and less than L, and the width Y is as follows: y is more than 0 and less than L/2, and the height H is as follows: z is more than 0 and less than H. The convex support plate 3 is a cuboid, and has a length x: x is equal to L, width y: y is more than 0 and less than L-2Y, the thickness of the protruding support plate 3 is more than or equal to that of the backing plate 9, the total thickness of the backing plate 9 and the protruding support plate 3 is less than the height of the elastic support body 1, and a certain gap is required between the top layer PCB support plate 2 and the backing plate 9.
In this embodiment, the elastic supporting body 1 is an electrical conductor, and two ends of the elastic supporting body 1 are electrically connected to the circuits of the top PCB supporting plate 2 and the bottom PCB supporting plate 10, respectively. When the elastic support body 1 is used as an electrode to play a role in conducting electricity, a circuit between the top layer PCB support plate 2 and the bottom layer PCB support plate 10 is communicated, and a lead for connecting the circuits of the top layer PCB support plate 2 and the bottom layer PCB support plate 10 is replaced; the elastic support body 1 can make the top layer PCB support plate 2 move towards the bottom layer PCB support plate 10 under the action of the mechanical external force when the supporting function is performed.
In the present embodiment, the elastic support 1 is a spring.
As shown in fig. 4 and 5, the top PCB support plate 2 and the bottom PCB support plate 10 are placed at the same positions of four corners with the same pads a, b, c, d, e, f and g, the four elastic support bodies 1 are vertically welded to the corresponding pad positions, the bottom PCB support plate 10 is provided with wire welding points except for welding the pads of the elastic support bodies 1, the electrodes of the two energy collectors are led out with wires to the wire welding points, and the wire welding points can be communicated with the whole power management circuit module as output.
In this embodiment, the protruding support plate 3 and the pad 9 of the composite energy harvester are made of acrylic plates, the piezoelectric lower electrode 7 and the piezoelectric upper electrode 5 are made of aluminum, the upper insulating film 4 and the lower insulating film 8 are made of polyimide films (PI), the piezoelectric film 6 is made of polyvinylidene fluoride (PVDF), the friction lower electrode 11 and the friction upper electrode 13 are made of copper, and the friction material layer 12 is made of PDMS.
Example 2: a sensing integrated microsystem, as shown in fig. 6, includes a composite energy collector a, a power management circuit module B, an ultra-low quiescent current power supply module C, a sensing module D, and a wireless module E, where the composite energy collector a is the composite energy collector described in embodiment 1. The output end of the composite energy collector A is connected with the input end of the power management circuit module B. And the output end of the power management circuit module B is connected with the input end of the ultra-low quiescent current power module C. The output end of the ultra-low quiescent current power module C is connected with the input ends of the sensing module D and the wireless module E. The output end of the sensing module D is connected with the input end of the wireless module E. The composite energy collector A is an energy collector based on two energy collection mechanisms, can convert mechanical energy into electric energy under the action of external mechanical force, and is used for the sensing module D and the wireless module E after being processed by the power management circuit module B and the ultra-low quiescent current power module C.
As shown in fig. 4 and 5, the power management circuit module B, the ultra-low quiescent current power module C, the sensing module D, and the wireless module E are all integrated on the top PCB support plate 2 and/or the bottom PCB support plate 10 in the composite energy harvester a. Place friction bottom electrode 11, backing plate 9, the part design power management circuit module B outside the friction material layer 12 on bottom PCB backup pad 10 in the composite energy collector A, can design simultaneously and place all circuits or partial circuit in ultra-low quiescent current power module C, sensing module D, the wireless module E, place the required components and parts of circuit module, can walk the line design on the holistic bottom PCB backup pad 10. Similarly, the part of the top layer PCB supporting plate 2 which is fixedly protruded out of the supporting plate 3 can also be designed with all circuits or partial circuits in the ultra-low quiescent current power module C, the sensing module D and the wireless module E, components and parts required by the circuit module are placed, and the whole top layer PCB supporting plate 2 can be designed with wiring.
In this embodiment, the ultra-low quiescent current power module C is configured to output the power collected by the power management circuit module B to the following sensing module D and the wireless module E in a voltage-stabilizing manner. The sensing module D is used for detecting signals and sending out detected messages by using the wireless module E.
Experimental testing and analysis
The output performance of the hybrid energy harvester of example 1 and example 2 was tested, and the hybrid energy harvester was pressed by hand at a frequency of 5 HZ. For the triboelectric energy harvester, the voltage output was measured using a DS2302A oscilloscope produced by rig as shown in fig. 7(a), the output voltage between the two electrodes was about 500V at the maximum, and the current output was measured using an SR570 produced by Stanford Research System, and as a result, the triboelectric energy harvester could output a short-circuit current of 10 μ a at the maximum as shown in fig. 7 (b). For the piezoelectric energy harvester, the voltage output was measured using a DS2302A oscilloscope manufactured by rig, and as a result, as shown in fig. 8(a), the open circuit voltage between the two electrodes of the piezoelectric energy harvester could reach 25V or more at maximum, the current output was measured using SR570 manufactured by stanford research system, the short circuit current was about 10 μ a, and the open circuit voltage and short circuit current output of the piezoelectric energy harvester was relatively stable.
From the aspect of energy collection, the energy generated by the composite energy collector is stored by using the capacitor, and the stored energy can reach dozens of microwatts or even hundreds of microwatts according to different energy storage conditions. With the development of miniaturization and low power consumption of intelligent electronic devices, the power consumption of electronic devices has been reduced from milliwatt (mW) level to microwatt (uW) level, so that obtaining energy harvester from environment to power sensor, portable electronic devices, has become an ideal and feasible solution.
The above embodiments are provided to further explain the objects, technical solutions and advantages of the present invention in detail, it should be understood that the above embodiments are merely exemplary embodiments of the present invention and are not intended to limit the scope of the present invention, and any modifications, equivalents, improvements and the like made within the spirit and principle of the present invention should be included in the scope of the present invention.
Claims (9)
1. A composite energy collector is characterized by comprising a top layer PCB supporting plate (2), a bottom layer PCB supporting plate (10) and an elastic supporting body (1), wherein two ends of the elastic supporting body (1) are respectively connected with the top layer PCB supporting plate (2) and the bottom layer PCB supporting plate (10);
a piezoelectric energy collector and a friction energy collector are arranged between the top layer PCB supporting plate (2) and the bottom layer PCB supporting plate (10);
the piezoelectric energy collector is in an arch bridge shape, and two ends of the piezoelectric energy collector are fixed with the bottom layer PCB supporting plate (10);
the friction energy collector is arranged on the surface of the bottom PCB supporting plate (10) and is positioned between two ends of the piezoelectric energy collector;
the surface of the top layer PCB supporting plate (2) is provided with a convex supporting plate (3) which has contact extrusion effect with the convex surface of the piezoelectric energy collector.
2. The composite energy collector of claim 1, wherein the piezoelectric energy collector comprises an upper insulating film (4), a piezoelectric upper electrode (5), a piezoelectric film (6), a piezoelectric lower electrode (7) and a lower insulating film (8) which are sequentially stacked, the piezoelectric upper electrode (5) is fixed with the upper insulating film (4), and the piezoelectric lower electrode (7) is fixed with the lower insulating film (8).
3. The composite energy harvester according to claim 2, wherein the convex support plate (3) is fixedly connected with the top end of the convex surface of the upper insulating film (4).
4. The composite energy collector as claimed in claim 1, wherein the friction energy collector comprises a friction lower electrode (11), a friction material layer (12) and a friction upper electrode (13) which are sequentially arranged, the friction lower electrode (11) is fixed with the surface of the bottom layer PCB supporting plate (10), and the friction material layer (12) is coated on the surface of the friction lower electrode (11) facing the friction upper electrode (13); the friction upper electrode (13) is in an arch bridge shape and is fixed with the concave surface of the piezoelectric energy collector.
5. The composite energy collector as claimed in claim 1, wherein the bottom layer PCB support plate (10) is provided with two backing plates (9) corresponding to two ends of the piezoelectric energy collector one by one, and the end of the piezoelectric energy collector is fixedly connected with the corresponding pad surface; the thickness of the convex support plate (3) is not less than that of the backing plate (9), and the total thickness of the backing plate (9) and the convex support plate (3) is less than the height of the elastic support body (1).
6. The composite energy collector as claimed in claim 1, wherein the elastic support body (1) is an electric conductor, and two ends of the elastic support body (1) are electrically connected with the circuits of the top layer PCB support plate (2) and the bottom layer PCB support plate (10) respectively.
7. The composite energy harvester according to claim 1, characterized in that the elastic support (1) is a spring.
8. A sensing integrated microsystem is characterized by comprising a composite energy collector A, a power management circuit module B, an ultra-low quiescent current power supply module C, a sensing module D and a wireless module E, wherein the composite energy collector A is the composite energy collector of any one of claims 1 to 7;
the output end of the composite energy collector A is connected with the input end of the power management circuit module B;
the output end of the power management circuit module B is connected with the input end of the ultra-low quiescent current power module C;
the output end of the ultra-low quiescent current power supply module C is connected with the input ends of the sensing module D and the wireless module E;
the output end of the sensing module D is connected with the input end of the wireless module E.
9. The sensing integrated microsystem according to claim 8, wherein the power management circuit module B, the ultra-low quiescent current power module C, the sensing module D and the wireless module E are all integrated on the top PCB support plate (2) and/or the bottom PCB support plate (10) in the composite energy harvester a.
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| CN202010651134.5A CN111740638A (en) | 2020-07-08 | 2020-07-08 | Composite energy collector and sensing integrated microsystem |
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| CN202010651134.5A CN111740638A (en) | 2020-07-08 | 2020-07-08 | Composite energy collector and sensing integrated microsystem |
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Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102324871A (en) * | 2011-09-22 | 2012-01-18 | 中国科学院上海硅酸盐研究所 | Piezoelectric type energy harvesting unit and application thereof |
| CN103417240A (en) * | 2012-05-17 | 2013-12-04 | 财团法人工业技术研究院 | Physiological signal sensing structure, stethoscope thereof and manufacturing method thereof |
| CN104320018A (en) * | 2014-10-17 | 2015-01-28 | 上海交通大学 | Piezoelectric triboelectricity composite vibration energy harvester |
| CN107346949A (en) * | 2016-05-06 | 2017-11-14 | 中原大学 | Piezoelectric hunting device |
| CN107359808A (en) * | 2016-05-10 | 2017-11-17 | 三星电子株式会社 | Rub electric generator |
| CN108540013A (en) * | 2018-04-28 | 2018-09-14 | 西南交通大学 | A kind of piezoelectric energy recovery device of integrated adaptive mechanical switch |
-
2020
- 2020-07-08 CN CN202010651134.5A patent/CN111740638A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102324871A (en) * | 2011-09-22 | 2012-01-18 | 中国科学院上海硅酸盐研究所 | Piezoelectric type energy harvesting unit and application thereof |
| CN103417240A (en) * | 2012-05-17 | 2013-12-04 | 财团法人工业技术研究院 | Physiological signal sensing structure, stethoscope thereof and manufacturing method thereof |
| CN104320018A (en) * | 2014-10-17 | 2015-01-28 | 上海交通大学 | Piezoelectric triboelectricity composite vibration energy harvester |
| CN107346949A (en) * | 2016-05-06 | 2017-11-14 | 中原大学 | Piezoelectric hunting device |
| CN107359808A (en) * | 2016-05-10 | 2017-11-17 | 三星电子株式会社 | Rub electric generator |
| CN108540013A (en) * | 2018-04-28 | 2018-09-14 | 西南交通大学 | A kind of piezoelectric energy recovery device of integrated adaptive mechanical switch |
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Application publication date: 20201002 |