CN111739857B - Shell for power semiconductor device - Google Patents
Shell for power semiconductor device Download PDFInfo
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- CN111739857B CN111739857B CN202010770100.8A CN202010770100A CN111739857B CN 111739857 B CN111739857 B CN 111739857B CN 202010770100 A CN202010770100 A CN 202010770100A CN 111739857 B CN111739857 B CN 111739857B
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/38—Cooling arrangements using the Peltier effect
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01D—SEPARATION
- B01D53/00—Separation of gases or vapours; Recovering vapours of volatile solvents from gases; Chemical or biological purification of waste gases, e.g. engine exhaust gases, smoke, fumes, flue gases, aerosols
- B01D53/26—Drying gases or vapours
- B01D53/265—Drying gases or vapours by refrigeration (condensation)
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01D—SEPARATION
- B01D2257/00—Components to be removed
- B01D2257/80—Water
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01D—SEPARATION
- B01D2258/00—Sources of waste gases
- B01D2258/06—Polluted air
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Abstract
The invention discloses a shell for a power semiconductor device, which relates to the technical field of power semiconductor application and solves the problem that a semiconductor refrigerating sheet is difficult to adapt to the dehumidification requirement of outdoor power equipment; and a cold end temperature adjusting mechanism for adjusting the cold end temperature of the semiconductor refrigerating sheet to the dew point temperature by cooling or storing heat on the hot end of the semiconductor refrigerating sheet is arranged on the multi-position semiconductor carrier plate. The cold end temperature adjusting mechanism is used for carrying out heat dissipation cooling or heat storage heating on the hot end of the semiconductor refrigeration sheet, and adjusting the temperature of the cold end of the semiconductor refrigeration sheet to be within a dew point temperature range when the outdoor temperature is too high or too low so as to meet the dehumidification requirement of outdoor power equipment.
Description
Technical Field
The invention relates to the technical field of power semiconductor application, in particular to a shell for a power semiconductor device.
Background
Power equipment includes the terminal box, high low-voltage control cabinet, high low-voltage switch cabinet, looped netowrk cabinet, box-type substation, dry-type transformer and instrument box etc. most electronic equipment all sets up in the open air, especially powerful power equipment, and because circuit and electronic component are more in the power equipment, in early morning, when air humidity such as rainy season is higher, if do not dehumidify power equipment, then the inside electronic component of power equipment and circuit are very easily because of the dew that the surface condenses takes place the short circuit, trouble such as electricity generation, consequently, it is especially important to power equipment's dehumidification.
Because the semiconductor refrigeration piece has advantages such as the small, small and with low costs of consumption, it is more ideal to dehumidify the air in the power equipment through the semiconductor refrigeration piece, and the initial principle of semiconductor refrigeration piece is through keeping the cold junction temperature of semiconductor refrigeration piece in dew point temperature range to make the moisture in the near air of semiconductor refrigeration piece cold junction condense into the drop of water and fall at the cold junction surface.
The difference in temperature of semiconductor refrigeration piece cold junction and hot junction is fixed, and the cold junction temperature of semiconductor refrigeration piece rises or reduces along with hot end temperature in step promptly, and the cold junction temperature of semiconductor refrigeration piece is higher than dew point temperature then can lead to its moisture that can't condense in the air, and the cold junction temperature of semiconductor refrigeration piece is less than dew point temperature then can lead to the water of condensing to freeze at the cold junction surface to lead to dehumidification function inefficacy.
Because power equipment sets up in the open air usually, in hot summer and chilly winter, the effect of semiconductor refrigeration piece dehumidification is not good even can't dehumidify to make this kind of dehumidification mode that has low cost and be convenient for the installation and arrange through the semiconductor refrigeration piece dehumidification difficult to adapt to the poor dehumidification requirement of outdoor power equipment big difference in temperature range all the year.
Disclosure of Invention
Therefore, the invention provides a shell for a power semiconductor device, which aims to solve the problem that in the prior art, a semiconductor refrigeration piece is difficult to adapt to the dehumidification requirement of outdoor power equipment due to the fact that the semiconductor refrigeration piece has poor dehumidification effect or even cannot dehumidify at high temperature and low temperature.
In order to achieve the above purpose, the invention provides the following technical scheme:
a shell for a power semiconductor device comprises a multi-position semiconductor carrier plate and a condensate water tank, wherein the multi-position semiconductor carrier plate is used for installing a plurality of semiconductor refrigeration pieces in an array mode, the condensate water tank is located under the multi-position semiconductor carrier plate, a plurality of assembling holes used for installing the semiconductor refrigeration pieces and used for heat dissipation of hot ends of the semiconductor refrigeration pieces are formed in the multi-position semiconductor carrier plate in a penetrating mode, a dehumidification cavity is formed between the multi-position semiconductor carrier plate and the condensate water tank, and the condensate water tank is provided with a condensate water flowing hole communicated with the dehumidification cavity;
a cold end temperature adjusting mechanism for adjusting the cold end temperature of the semiconductor refrigerating sheet to the dew point temperature by cooling or storing heat at the hot end of the semiconductor refrigerating sheet is arranged on the multi-position semiconductor carrier plate;
cold junction temperature regulation mechanism establishes including the cover the outer just one end of many semiconductor support plates with the ventilation pipe that the condensate tank is connected, it is used for right to install in the exit end of ventilation pipe semiconductor refrigeration piece hot junction carries out radiating radiator fan, just install in the ventilation pipe and be located radiator fan with heat accumulation subassembly between the semiconductor refrigeration piece hot junction, pass through between the entry end of ventilation pipe and the exit end heat accumulation subassembly is closed or is switched on in order to realize the heat accumulation or cooperate radiator fan dispels the heat.
Further, the heat accumulation subassembly is including arranging a plurality of pivots that just are parallel to each other on same horizontal plane to and one end is rotated and is installed epaxial page or leaf board, it is a plurality of the page or leaf board is kept away from the one end of pivot is passed through synchronous drive mechanism and is connected, and is adjacent interaxial distance between the pivot is less than the width of page or leaf board, it is a plurality of the page or leaf board passes through synchronous drive mechanism drive is around corresponding the pivot synchronous rotation, through the page or leaf board rotates and makes adjacently clearance between the pivot is closed or is opened in order to realize ventilation duct's closure or switch on.
Furthermore, the cold end temperature adjusting mechanism further comprises a plurality of radiating fins which are arranged in the assembling holes, and one end of each radiating fin is connected with the hot end of the semiconductor chilling plate.
Further, cold junction temperature regulation mechanism is still right including being used for semiconductor refrigeration piece hot junction carries out the cooling subassembly of initiatively cooling, the cooling subassembly is including installing on the condensate tank and with the metal that semiconductor refrigeration piece cold end set up just relatively holds the water board, it is located a plurality of to install on the metal holds the water board the metal grid tray in the pilot hole outside, install in the many semiconductor support boards and connect semiconductor refrigeration piece hot junction with the metal mesh of metal grid tray, heat radiation fins one end is installed between the adjacent mesh on the metal mesh, the condensate water discharge orifice runs through the metal holds the water board intercommunication the condensate tank with remove the wet chamber.
Furthermore, the ventilation pipe is kept away from a plurality of bracing pieces are installed to condensate tank's tip, and are a plurality of the bracing piece is kept away from the toper overhead guard is installed to ventilation pipe's one end, be formed with in the toper overhead guard and be annular exhaust port, just install the annular in the exhaust port and separate the net.
Further, the metal holds the water board be the center to the sunken concave type of condensate tank one side, just the metal holds water board surface mounting has the metal dehumidification fin that a plurality of intervals set up, and is a plurality of the metal dehumidification fin is in order to be located metal holds water board center department the condensate underwater orifice is the radial distribution for the center.
Furthermore, the height of the metal dehumidifying fin is 1/3-1/2 of the height of the dehumidifying cavity.
Furthermore, the metal grid plate and the metal mesh are bonded through heat-conducting silicone grease.
Furthermore, an insulating layer for preventing accumulated water in the condensation water tank from being frozen and violently evaporated due to excessive heat absorption is arranged on the wall of the condensation water tank.
The invention has the following advantages:
the invention carries out heat radiation cooling or heat storage heating on the hot end of the semiconductor refrigeration piece through the cold end temperature adjusting mechanism, thereby adjusting the temperature of the cold end of the semiconductor refrigeration piece to be within a dew point temperature range when the outdoor temperature is too high or too low, ensuring that the moisture in the air passing through the dehumidification cavity can be condensed into dew at the cold end of the semiconductor refrigeration piece and fall into a condensed water tank below, avoiding the defect that the dehumidification effect of the semiconductor refrigeration piece is not obvious or even loses efficacy in high-temperature and low-temperature environments, and meeting the dehumidification requirement of outdoor power equipment in a large temperature difference range all the year around.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below. It should be apparent that the drawings in the following description are merely exemplary, and that other embodiments can be derived from the drawings provided by those of ordinary skill in the art without inventive effort.
The structures, ratios, sizes, and the like shown in the present specification are only used for matching with the contents disclosed in the specification, so as to be understood and read by those skilled in the art, and are not used to limit the conditions that the present invention can be implemented, so that the present invention has no technical significance, and any structural modifications, changes in the ratio relationship, or adjustments of the sizes, without affecting the effects and the achievable by the present invention, should still fall within the range that the technical contents disclosed in the present invention can cover.
FIG. 1 is a schematic view of the overall structure of an embodiment of the present invention;
fig. 2 is a schematic view of a multi-bit semiconductor carrier structure according to an embodiment of the invention;
fig. 3 is a schematic structural diagram of a metal dehumidifying fin according to an embodiment of the present invention.
In the figure:
1-semiconductor refrigerating sheet; 2-a multi-bit semiconductor carrier plate; 3-a condensate tank; 4-assembly holes; 5-a dehumidification cavity; 6-condensate water down-flow hole; 7-a ventilation duct; 8-a heat dissipation fan; 9-a heat storage component; 10-heat dissipation fins; 11-a temperature reduction assembly; 12-a support bar; 13-a conical tip shroud; 14-ring-shaped separation net; 15-metal dehumidifying fins; 16-an insulating layer;
901-a rotating shaft; 902-sheet; 903-synchronous drive mechanism;
1101-metal water-bearing plate; 1102-a metal grid; 1103-metal mesh.
Detailed Description
The present invention is described in terms of particular embodiments, other advantages and features of the invention will become apparent to those skilled in the art from the following disclosure, and it is to be understood that the described embodiments are merely exemplary of the invention and that it is not intended to limit the invention to the particular embodiments disclosed. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
As shown in fig. 1 to 3, the invention discloses a housing for a power semiconductor device, which comprises a multi-position semiconductor carrier plate 2 for mounting a plurality of semiconductor chilling plates 1 in an array manner, and a condensate water tank 3 positioned under the multi-position semiconductor carrier plate 2, wherein a plurality of assembling holes 4 for mounting the semiconductor chilling plates 1 and for heat dissipation of the hot end of the semiconductor chilling plates 1 are arranged on the multi-position semiconductor carrier plate 2 in a penetrating manner, a dehumidification cavity 5 is formed between the multi-position semiconductor carrier plate 2 and the condensate water tank 3, and the condensate water tank 3 is provided with a condensate water flow hole 6 communicated with the dehumidification cavity 5.
And a cold end temperature adjusting mechanism for adjusting the cold end temperature of the semiconductor refrigerating sheet 1 to the dew point temperature by cooling or storing heat on the hot end of the semiconductor refrigerating sheet 1 is arranged on the multi-position semiconductor carrier plate 2.
The temperature of the cold end of the semiconductor refrigeration piece 1 is reduced after the semiconductor refrigeration piece is electrified, and the temperature difference between the hot end and the cold end of the semiconductor refrigeration piece 1 is fixed, namely, the temperature of the cold end of the semiconductor refrigeration piece 1 is correspondingly increased when the temperature of the hot end of the semiconductor refrigeration piece is increased, and conversely, the temperature of the cold end of the semiconductor refrigeration piece 1 is correspondingly reduced when the temperature of the hot end of the semiconductor refrigeration piece is reduced. Therefore, when the temperature of the cold end of the semiconductor refrigeration piece 1 is higher than the dew point temperature or lower than the dew point temperature, the defect that the moisture in the dehumidification cavity 5 cannot be condensed into dew or the dehumidification effect is poor is overcome, the temperature of the hot end of the semiconductor refrigeration piece 1 is regulated and controlled through the cold end temperature regulating mechanism, and therefore the temperature of the cold end of the semiconductor refrigeration piece 1 is kept within the dew point temperature range.
According to the embodiment of the invention, the hot end of the semiconductor refrigeration sheet 1 is subjected to heat dissipation and cooling or heat storage and heating through the cold end temperature adjusting mechanism, so that the temperature of the cold end of the semiconductor refrigeration sheet 1 is adjusted to be within a dew point temperature range when the outdoor temperature is too high or too low, moisture in the air passing through the dehumidification cavity 5 is ensured to be condensed into dew at the cold end of the semiconductor refrigeration sheet 1 and fall into the condensation water tank 3 below, the defect that the dehumidification effect of the semiconductor refrigeration sheet 1 is not obvious or even fails in high-temperature and low-temperature environments is avoided, and the dehumidification requirement of outdoor power equipment in a large temperature difference range all the year around is met.
The specific description of the cold-end temperature adjustment mechanism is as follows:
the cold end temperature adjusting mechanism comprises a ventilation guide pipe 7 which is sleeved outside the multi-position semiconductor carrier plate 2 and one end of the ventilation guide pipe is connected with the condensate water tank 3, a radiating fan 8 used for radiating the hot end of the semiconductor refrigerating sheet 1 is installed in the outlet end of the ventilation guide pipe 7, a heat storage assembly 9 located between the radiating fan 8 and the hot end of the semiconductor refrigerating sheet 1 is installed in the ventilation guide pipe 7, and the inlet end and the outlet end of the ventilation guide pipe 7 are closed or communicated through the heat storage assembly 9 to realize heat storage or are matched with the radiating fan 8 to radiate heat.
When ambient temperature is too low, in order to avoid the temperature of the cold end of the semiconductor refrigeration piece 1 to result in freezing of the surface thereof due to low freezing point, the ventilation duct 7 is sealed by operating the heat storage assembly 9, so that the heat released by the hot end of the semiconductor refrigeration piece 1 during working is reserved in the ventilation duct 7, the temperature of the hot end of the semiconductor refrigeration piece 1 is increased, and the temperature of the cold end of the semiconductor refrigeration piece 1 is increased to a dew point. On the contrary, when the ambient temperature is too high, the heat storage assembly 9 is operated to conduct the ventilation duct 7, and simultaneously, the heat generated by the hot end of the semiconductor refrigeration piece 1 is discharged out of the ventilation duct 7 through the fast flowing air flow by the cooling fan 8 rotating at a high speed, so that the temperature of the hot end of the semiconductor refrigeration piece 1 is reduced until the temperature of the cold end of the semiconductor refrigeration piece 1 drops to the dew point.
To the monitoring of 1 cold junction temperature of semiconductor refrigeration piece, the accessible sets up a plurality of temperature sensor in dehumidification chamber 5 and monitors, and the power of semiconductor refrigeration piece 1, the state of heat accumulation subassembly 9 and the start-stop and the power of radiator fan 8 all control and adjust based on temperature sensor's monitoring data to ensure that the moisture in the air that gets into in dehumidification chamber 5 can condense into the dew and descend to condensate tank 3 in.
The heat storage assembly 9 comprises a plurality of rotating shafts 901 which are arranged on the same horizontal plane and are parallel to each other, and a louver 902 with one end rotatably mounted on the rotating shafts 901, wherein one ends of the louver 902, which are far away from the rotating shafts 901, are connected through a synchronous driving mechanism 903, the axial distance between the adjacent rotating shafts 901 is smaller than the width of the louver 902, the louver 902 is driven by the synchronous driving mechanism 903 to rotate synchronously around the corresponding rotating shafts 901, and the louver 902 rotates to close or open the gap between the adjacent rotating shafts 901 so as to close or conduct the ventilation duct 7.
The synchronous driving mechanism 903 is similar to a mechanism for driving a plurality of wind direction plates of an air conditioner air outlet or an exhaust fan air outlet to synchronously swing, for example, the synchronous driving mechanism 903 generally comprises a linkage rod connected with a plurality of blades 902 far away from one end of a rotating shaft 901, and a driven and rotated swing arm rotatably installed at one end of the linkage rod, the swing arm is coaxially arranged with the rotating shaft 901 at one end, the linkage rod is driven to swing around a plurality of rotating shafts 901 by being driven to rotate the swing arm, so that the plurality of blades 902 synchronously swing to be overlapped to realize the sealing of the ventilation duct 7, or the plurality of blades 902 are separated from each other by swinging to realize the conduction of the ventilation duct 7.
Preferably, cold junction temperature regulation mechanism still includes a plurality of heat radiation fins 10 of installing in pilot hole 4, and heat radiation fins 10's one end is connected with the hot junction of semiconductor refrigeration piece 1, increases the heat radiating area of semiconductor refrigeration piece 1 hot junction through a plurality of heat radiation fins 10 of being connected with semiconductor refrigeration piece 1 hot junction, cooperation radiator fan 8 uses, can derive the heat in semiconductor refrigeration piece 1 hot junction fast, avoid semiconductor refrigeration piece 1 hot junction overtemperature and lead to the dehumidification effect of its cold junction to reduce or become invalid.
Further, cold junction temperature regulation mechanism still includes the cooling subassembly 11 that is used for carrying out initiative cooling to 1 hot junction of semiconductor refrigeration piece, cooling subassembly 11 is including installing on condensate tank 3 and with 1 cold junction of semiconductor refrigeration piece normal phase metal water-receiving plate 1101 that sets up, install the metal grid plate 1102 that is located a plurality of pilot holes 4 outsides on the metal water-receiving plate 1101, install the metal mesh 1103 of connecting 1 hot junction of semiconductor refrigeration piece and metal grid plate 1102 in the semiconductor carrier plate 2 of multiposition, between the adjacent mesh on metal mesh 1103, condensate water orificial orifice 6 runs through metal water-receiving plate 1101 and communicates condensate tank 3 and dehumidification chamber 5.
When the ambient temperature is higher, on the one hand, the cold air generated by the cold end of the semiconductor chilling plate 1 is settled onto the metal water bearing plate 1101, so that the hot end of the semiconductor chilling plate 1 connected with the metal mesh 1103 is further cooled. When the temperature near the shell is too high due to long-time work of the power equipment in high-temperature environments such as summer, the heat at the hot end of the semiconductor chilling plate 1 is quickly led out through the radiating fins 10 and the radiating fan 8, but because the cooling effect of the radiating fan 8 and the radiating fins 10 is limited, part of the cooling heat at the cold end of the semiconductor chilling plate 1 is conducted to the hot end of the semiconductor chilling plate 1 sequentially through the metal water bearing plate 1101, the metal grid plate 1102 and the metal mesh 1103 which are connected with each other, the purpose of further cooling the hot end of the semiconductor is achieved, and the defect that the cold end of the semiconductor chilling plate 1 cannot reach the dew point temperature due to the fact that the temperature at the hot end of the semiconductor chilling plate 1 located outside the shell at the top of the power equipment.
When the ambient temperature is low, the heat dissipation fan 8 does not work, the synchronous driving mechanism 903 drives the plurality of blades to swing to be sequentially overlapped, and the ventilation duct 7 is sealed by the blades overlapped with each other in multiple directions so as to prevent heat loss of the hot end of the semiconductor refrigeration sheet 1. Because semiconductor refrigeration piece 1 is at the during operation, its hot junction radiating heat is 2~5 times of cold junction refrigerating heat, consequently, under radiator fan 8 stall and ventilation duct 7 seals the prerequisite of heat accumulation, the cooling effect of semiconductor refrigeration piece 1 cold junction is less to the heat accumulation effect of semiconductor refrigeration piece 1 hot junction and heats up the effect influence to make the cold junction temperature of semiconductor refrigeration piece 1 rise gradually to dew point temperature along with the hot junction temperature. And, because the heat at the hot junction of semiconductor refrigeration piece 1 at this moment is because unable the derivation, the heat at the hot junction of semiconductor refrigeration piece 1 passes through metal mesh 1103, metal grid 1102 and metal water-receiving plate 1101 and conducts to dehumidification chamber 5 in, is favorable to being located the ice-cube that is arranged in dehumidification chamber 5 on the semiconductor refrigeration piece 1 cold junction to melt fast, with the dehumidification effect of recovering semiconductor refrigeration piece 1 fast.
Preferably, a plurality of supporting rods 12 are installed at the end part of the ventilation guide pipe 7 far away from the condensed water tank 3, a conical top cover 13 is installed at one end of the plurality of supporting rods 12 far away from the ventilation guide pipe 7, an annular exhaust port is formed in the conical top cover 13, an annular separation net 14 is installed in the exhaust port, the conical top cover 13 and the annular separation net 14 are arranged, when the cooling fan 8 stops rotating, rain, snow, leaves and the like are prevented from falling into the ventilation guide pipe 7, and therefore the leaf plate 902 is prevented from being blocked and the hot end of the cooling fin 10 and the semiconductor refrigerating sheet 1 is kept clean.
Further, metal holds water board 1101 and is the concave type that the center is sunken to condensate tank 3 one side, is favorable to the metal to hold the convergence and the derivation of ponding on the water board 1101, and metal holds water board 1101 surface mounting has a plurality of metal dehumidification fins 15 that the interval set up, and a plurality of metal dehumidification fins 15 are the radial distribution with the condensate water that is located metal and holds water board 1101 center department down hole 6 as the center.
The air above the dehumidification cavity 5 is cooled and dried by the cold end of the semiconductor refrigeration sheet 1, and then is deposited on the metal water bearing plate 1101 below due to the high density, and the metal dehumidification fins 15 on the metal water bearing plate 1101 are cooled. Form a plurality of passageways that supply the air flow between a plurality of metal dehumidification fins 15 that are ray form distribution, the air that is located dehumidification chamber 5 below flows between a plurality of microthermal metal dehumidification fins 15, thereby make the moisture in the air condense on metal dehumidification fins 15 and be the dewdrop, dehumidify the air of dehumidification chamber 5 upper part and lower part simultaneously through 1 cold junction of semiconductor refrigeration piece and supplementary radiating fin, be favorable to increasing dehydrating unit's dehumidification efficiency.
Preferably, the height of the metal dehumidifying fin 15 is 1/3-1/2 of the height of the dehumidifying cavity 5, which is beneficial to horizontal flow and distribution of un-dehumidified air between the metal dehumidifying fin 15 and the cold end of the semiconductor refrigerating sheet 1, and the un-dehumidified air flows towards the metal dehumidifying fin 15 along with the air flow formed by the air cooled and dehumidified by the cold end of the semiconductor refrigerating sheet 1, so that the dehumidifying efficiency is further improved.
Preferably, metal grid plate 1102 and metal mesh 1103 are bonded together through heat conduction silicone grease, and metal grid plate 1102 and auxiliary radiating fins are formed integrally with metal water bearing plate 1101, so that the heat conduction efficiency between the cold end and the hot end of semiconductor chilling plate 1 is increased, and the purpose of quickly adjusting the temperature of the cold end of semiconductor chilling plate 1 is realized by matching with radiating fan 8 or heat storage assembly 9.
Preferably, the wall of the condensed water tank 3 is provided with an insulating layer 16 for preventing accumulated water in the condensed water tank from being frozen and violently evaporating due to excessive heat absorption, and the bottom of the condensed water tank 3 is provided with a drain pipe for draining the accumulated water.
Avoid condensate tank 3 inside to produce the high pressure because of the overheated rapid evaporation of ponding through the heat preservation 16 that sets up to avoid the higher steam of temperature to pass through condensate water underflow hole 6 among the condensate tank 3 and overflow into dehumidification chamber 5, and avoided ponding in the condensate tank 3 to be frozen and lead to condensate tank 3 life to reduce, the heat preservation 16 that sets up promptly is favorable to prolonging condensate tank 3's life and guarantees the dehumidification effect.
Generally, a drain pipe for draining accumulated water is installed on the condensate water tank 3, and a check valve for draining air inside the condensate water tank 3 to balance air pressure inside and outside the condensate water tank 3 is installed on a side wall of the top end of the condensate water tank 3.
Although the invention has been described in detail above with reference to a general description and specific examples, it will be apparent to one skilled in the art that modifications or improvements may be made thereto based on the invention. Accordingly, such modifications and improvements are intended to be within the scope of the invention as claimed.
Claims (9)
1. The shell for the power semiconductor device is characterized by comprising a multi-position semiconductor carrier plate (2) and a condensate water tank (3), wherein the multi-position semiconductor carrier plate (2) is used for installing a plurality of semiconductor refrigerating pieces (1) in an array mode, the condensate water tank (3) is located under the multi-position semiconductor carrier plate (2), a plurality of assembling holes (4) used for installing the semiconductor refrigerating pieces (1) and used for dissipating heat of the hot end of the semiconductor refrigerating pieces (1) penetrate through the multi-position semiconductor carrier plate (2), a dehumidifying cavity (5) is formed between the multi-position semiconductor carrier plate (2) and the condensate water tank (3), and the condensate water tank (3) is provided with a condensate water flowing hole (6) communicated with the dehumidifying cavity (5);
a cold end temperature adjusting mechanism for adjusting the cold end temperature of the semiconductor refrigerating sheet (1) to the dew point temperature by cooling or heat accumulation of the hot end of the semiconductor refrigerating sheet (1) is arranged on the multi-position semiconductor carrier plate (2);
cold junction temperature regulation mechanism establishes including the cover outside many semiconductor support plates (2) and one end with ventilation pipe (7) that condensate tank (3) are connected, it is right to install in the exit end of ventilation pipe (7) semiconductor refrigeration piece (1) hot junction carries out radiating radiator fan (8), just install in ventilation pipe (7) and be located radiator fan (8) with heat accumulation subassembly (9) between semiconductor refrigeration piece (1) hot junction, pass through between the entry end of ventilation pipe (7) and the exit end heat accumulation subassembly (9) are closed or are switched on in order to realize the heat accumulation or the cooperation radiator fan (8) dispels the heat.
2. A housing for a power semiconductor device according to claim 1, wherein the heat storage assembly (9) comprises a plurality of rotating shafts (901) arranged on the same horizontal plane and parallel to each other, and a plurality of blades (902) rotatably mounted on the rotating shafts (901) at one ends, one ends of the plurality of blades (902) far from the rotating shafts (901) are connected by a synchronous driving mechanism (903), the distance between the adjacent rotating shafts (901) is smaller than the width of the blades (902), the plurality of blades (902) are driven by the synchronous driving mechanism (903) to rotate synchronously around the corresponding rotating shafts (901), and the gaps between the adjacent rotating shafts (901) are closed or opened by the rotation of the blades (902) to realize the closing or conduction of the ventilation duct (7).
3. A housing for a power semiconductor device according to claim 1, wherein said cold-end temperature regulating means further comprises a plurality of heat dissipating fins (10) mounted in said mounting holes (4) and having one end connected to the hot end of said semiconductor chilling plate (1).
4. The housing for the power semiconductor device according to claim 3, wherein the cold end temperature adjusting mechanism further comprises a cooling assembly (11) for actively cooling the hot end of the semiconductor chilling plate (1), the cooling assembly (11) comprises a metal water bearing plate (1101) installed on the condensation water tank (3) and arranged opposite to the cold end of the semiconductor chilling plate (1), a plurality of metal grid plates (1102) located outside the assembly holes (4) are installed on the metal water bearing plate (1101), a metal mesh (1103) connecting the hot end of the semiconductor chilling plate (1) and the metal grid plates (1102) is installed in the plurality of semiconductor bearing plates (2), one end of each heat dissipation fin (10) is installed between adjacent meshes on the metal mesh (1103), and the condensation water flowing hole (6) penetrates through the metal water bearing plate (1101) to communicate the condensation water tank (3) and the dehumidification cavity (mesh (1), (mesh opening) 5).
5. The casing for the power semiconductor device according to claim 1, wherein a plurality of support rods (12) are installed at the end part, far away from the condensed water tank (3), of the ventilation guide pipe (7), a conical top cover (13) is installed at one end, far away from the ventilation guide pipe (7), of the support rods (12), an annular exhaust port is formed in the conical top cover (13), and an annular partition net (14) is installed in the exhaust port.
6. The housing for the power semiconductor device according to claim 4, wherein the metal water bearing plate (1101) is concave with a center concave towards one side of the condensed water tank (3), a plurality of metal dehumidifying fins (15) are installed on the surface of the metal water bearing plate (1101) at intervals, and the plurality of metal dehumidifying fins (15) are distributed radially with the center of the condensed water flowing hole (6) at the center of the metal water bearing plate (1101).
7. A housing for power semiconductor devices according to claim 6, characterized in that the height of the metal dehumidifying fin (15) is 1/3-1/2 of the height of the dehumidifying chamber (5).
8. A housing for a power semiconductor device according to claim 4, characterized in that said metal grid (1102) and said metal mesh (1103) are bonded by means of a thermally conductive silicone grease.
9. A casing for power semiconductor devices according to claim 1, characterized in that the wall of the condensation water tank (3) is provided with an insulating layer (16) for preventing the accumulated water therein from freezing and from evaporating violently due to excessive heat absorption.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010770100.8A CN111739857B (en) | 2020-08-04 | 2020-08-04 | Shell for power semiconductor device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010770100.8A CN111739857B (en) | 2020-08-04 | 2020-08-04 | Shell for power semiconductor device |
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| Publication Number | Publication Date |
|---|---|
| CN111739857A CN111739857A (en) | 2020-10-02 |
| CN111739857B true CN111739857B (en) | 2020-11-20 |
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| CN202010770100.8A Active CN111739857B (en) | 2020-08-04 | 2020-08-04 | Shell for power semiconductor device |
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| CN112557705B (en) * | 2021-03-01 | 2021-04-27 | 山东广域科技有限责任公司 | Power transmission line on-line monitoring device with adjustable battery temperature |
| CN113203246B (en) * | 2021-04-23 | 2022-06-21 | 河北稳控科技有限公司 | Rapid temperature control device and method based on ceramic refrigerating sheet |
| CN116769591B (en) * | 2023-08-28 | 2023-10-31 | 四川杰莱美科技有限公司 | Real-time fluorescence quantitative PCR instrument |
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| CN1837452A (en) * | 2005-08-12 | 2006-09-27 | 俞宝良 | Semi-conductor dehumidifying clothes-drier and clothes-drying method |
| CN103531703A (en) * | 2013-10-24 | 2014-01-22 | 华东光电集成器件研究所 | Self-temperature-measuring semiconductor chilling plate |
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| CN208835037U (en) * | 2018-10-08 | 2019-05-07 | 深圳市豪亿为科技有限公司 | A kind of package of ic |
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| CN1837452A (en) * | 2005-08-12 | 2006-09-27 | 俞宝良 | Semi-conductor dehumidifying clothes-drier and clothes-drying method |
| CN103531703A (en) * | 2013-10-24 | 2014-01-22 | 华东光电集成器件研究所 | Self-temperature-measuring semiconductor chilling plate |
| CN206180396U (en) * | 2016-11-03 | 2017-05-17 | 南京乾鑫电器设备有限公司 | A displacement type condensation dehydrating unit for outdoor switching station |
| CN207663322U (en) * | 2017-12-29 | 2018-07-27 | 国家电网公司 | A kind of electric power cabinet dehumidification device |
| CN208835037U (en) * | 2018-10-08 | 2019-05-07 | 深圳市豪亿为科技有限公司 | A kind of package of ic |
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