CN111736640A - Temperature control device and temperature control method - Google Patents
Temperature control device and temperature control method Download PDFInfo
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- CN111736640A CN111736640A CN202010861104.7A CN202010861104A CN111736640A CN 111736640 A CN111736640 A CN 111736640A CN 202010861104 A CN202010861104 A CN 202010861104A CN 111736640 A CN111736640 A CN 111736640A
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- temperature control
- temperature
- semiconductor
- control component
- measuring instrument
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- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05D—SYSTEMS FOR CONTROLLING OR REGULATING NON-ELECTRIC VARIABLES
- G05D23/00—Control of temperature
- G05D23/19—Control of temperature characterised by the use of electric means
- G05D23/20—Control of temperature characterised by the use of electric means with sensing elements having variation of electric or magnetic properties with change of temperature
Abstract
The invention discloses a temperature control device and a temperature control method, wherein the temperature control device comprises a temperature measuring instrument, a semiconductor temperature control part, a black body panel, a temperature sensor, a PID control unit and a motor drive unit, wherein the temperature measuring instrument shell is internally provided with the integrated semiconductor temperature control part, the basal plane on one side of the semiconductor temperature control part is provided with the black body panel, the basal plane on one side of the semiconductor temperature control part provided with the black body panel is provided with a buried hole, the temperature sensor is arranged in the buried hole, the basal plane on the other side of the semiconductor temperature control part is of a heat dissipation tooth-shaped structure, the output end of the PID control unit is connected with the input end of the motor drive unit, the motor drive unit is connected with the input end of the temperature measuring instrument. By the temperature control device and the temperature control method, the temperature measuring instrument has high-stability standard recurrence temperature, the temperature measuring result is accurate, and the temperature control uniformity of the temperature control part is high.
Description
Technical Field
The invention relates to the technical field of temperature control of electronic equipment, in particular to a temperature control device and a temperature control method based on a semiconductor temperature control component.
Background
In the electronic temperature measurement process, the electronic equipment is easily influenced by the environmental temperature, and particularly for the electronic equipment with the blackbody radiation source type standard, a blackbody radiation source with high stability is required, and the temperature reproduced by the standard is compared with the temperature reproduced by the detected electronic temperature measurement system to judge whether the temperature detection is qualified or not or give a calibration result. The accurate control of temperature of blackbody radiation source formula etalon not only can provide the standard recurrence temperature of high stability, guarantees that the temperature measurement result is accurate, can also be to the calibration, the demarcation of radiation electron temperature measurement system, therefore the temperature control and the regulation of high accuracy guarantee very important to electronic equipment's high accuracy.
The semiconductor temperature control component is used as a temperature control component with small volume, quick response, high precision and wide temperature control range, and is suitable for keeping the temperature control requirement of a blackbody radiation source type standard device in electronic equipment. The semiconductor temperature control component is based on a circuit composed of two different conductors A and B, heat is released and absorbed at a joint through current transduction according to the current direction, continuous temperature adjustment can be achieved, high-precision temperature control can be achieved through control of input current, thermal inertia is very small, refrigerating and heating time is fast, and the adjustable temperature range is wide. The semiconductor temperature control can continuously work, has no rotating part, can not generate a rotation effect, has no vibration and noise during working, has long service life and easy installation, and has the function of controlling the temperature uniformity.
Disclosure of Invention
The invention aims to provide a temperature control device and a temperature control method, which have the effect of accurately controlling the temperature while realizing high-strength impact vibration resistance of a temperature measuring instrument through an integrated semiconductor temperature control component and PID control.
In order to achieve the purpose, the invention adopts the technical scheme that:
a temperature control device comprises a temperature measuring instrument, a semiconductor temperature control component, a black body panel, a temperature sensor, a PID control unit and a motor drive unit, wherein the temperature measuring instrument is provided with a shell, the shell of the temperature measuring instrument is internally provided with the integrated semiconductor temperature control component, the basal surface on one side of the semiconductor temperature control component is provided with the black body panel, the temperature sensor is arranged in the semiconductor temperature control component, the basal surface on the other side of the semiconductor temperature control component is of a heat dissipation tooth-shaped structure, the output end of the PID control unit is connected with the input end of the motor drive unit, the motor drive unit is connected with the shell input end of the temperature measuring instrument through a filtering unit, and the shell.
Furthermore, the side surface of the black body panel, which is far away from the semiconductor temperature control component, is coated with a black body material, a buried hole is formed in the basal surface of one side of the semiconductor temperature control component, which is provided with the black body panel, and a temperature sensor is arranged in the buried hole.
Furthermore, the semiconductor temperature control component substrate is made of aluminum alloy, and the number of the buried holes is 1-2.
Further, including blackbody window and display on the casing front, including radiator fan air intake on the casing back, including power button on the casing back, including the air outlet on the casing top surface.
Furthermore, the shell comprises a main control module and a cooling fan inside, the cooling fan is arranged on one side of the cooling tooth-shaped structure of the semiconductor temperature control component, and the semiconductor temperature control component, the temperature sensor and the cooling fan are respectively connected to the PID control unit of the main control module.
Furthermore, a heat insulating material is arranged on one side of the semiconductor temperature control component, which is far away from the heat radiating fan.
A temperature control method is applied to the temperature control device and comprises the following steps: setting a target control temperature value according to the current state of the semiconductor temperature control component; the sampling unit acquires a voltage signal sent by a temperature sensor in the semiconductor temperature control component; and (c) the PID control unit outputs a regulation and control signal to drive the semiconductor temperature control component to refrigerate or heat according to the voltage sampling value and the target control temperature value by adopting a PID closed-loop control algorithm, so that the temperature of the blackbody panel is kept stable.
And (c) further comprising the step (d) of judging whether the current temperature is stable or not after PID control is carried out, if so, sending a correction ending signal by a PID control unit, carrying out temperature measurement operation by a temperature measuring instrument, and if not, sequentially repeating the step (a) to the step (c).
The invention has the beneficial effects that:
1. the utility model provides a temperature control device, this temperature control device have the semiconductor temperature control part of integrative structural style processing, including one side basement face design for coating black body material plane panel structure, and have 1 to 2 buried holes at this side inside design of basal plane to place temperature sensor in the buried hole, the other side basement face design of semiconductor temperature control part is heat dissipation dentate structure. The structure has the effects of high-strength impact vibration resistance and accurate temperature control, the application range of equipment is expanded, and the adaptability to complex environments is enhanced; the heat dissipation structure is matched with a corresponding temperature control component such as a fan, so that the equipment can be normally used in a high-temperature environment, and the efficiency of regulating and controlling the temperature of the equipment is improved.
2. The temperature sensor, the fan and the semiconductor temperature control component are connected to the PID control unit, real-time temperature data of the black body panel are acquired from the temperature sensor through the PID control unit, and the temperature of the black body panel is adjusted by controlling the temperature of the semiconductor temperature control component, so that the standard recurrence temperature of high stability provided by a black body radiation source type standard in the electronic equipment is kept, the temperature adjustment is quick and accurate, and the high precision of the electronic equipment is improved.
To more clearly illustrate the structural features and effects of the present invention, the following detailed description is given with reference to the accompanying drawings and specific embodiments.
Drawings
FIG. 1 is a side view of a temperature control apparatus of the present invention;
FIG. 2 is a front view of the temperature control apparatus of the present invention;
FIG. 3 is a cross-sectional view of a temperature control apparatus of the present invention;
FIG. 4 is a rear view of the temperature control apparatus of the present invention;
FIG. 5 is a top view of the temperature control apparatus of the present invention;
FIG. 6 is a block diagram showing the structure of the temperature control apparatus according to the present invention.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Referring to fig. 1 to 6, this embodiment provides a temperature control device, which includes a temperature measuring instrument, a semiconductor temperature control unit, a black body panel, a temperature sensor, a PID control unit, and a motor drive unit, where the temperature measuring instrument has a housing 1, an integrated semiconductor temperature control unit 60 is disposed in the housing 1 of the temperature measuring instrument, the black body panel 40 is disposed on a basal plane of one side of the semiconductor temperature control unit 60, the temperature sensor is disposed in the semiconductor temperature control unit 60, the basal plane of the other side of the semiconductor temperature control unit 60 is a heat dissipation tooth-shaped structure, an output end of the PID control unit is connected to an input end of the motor drive unit, the motor drive unit is connected to an input end of the housing 1 of the temperature measuring instrument through a filter unit.
The side of the black body panel 40 far away from the semiconductor temperature control component 60 is coated with a black body material 50, a buried hole 30 is formed in a basal surface 20 of one side of the semiconductor temperature control component 60, which is provided with the black body panel 40, and a temperature sensor is arranged in the buried hole 30. The semiconductor temperature control component 60 substrate is made of aluminum alloy, and the number of the buried holes 30 is 1-2.
The shell 1 comprises a main control module 5 and a heat radiation fan 6 inside, the heat radiation fan 6 is arranged on one side of a heat radiation tooth-shaped structure 10 of a semiconductor temperature control component, and the semiconductor temperature control component 60, a temperature sensor and the heat radiation fan 6 are respectively connected to a PID control unit of the main control module 5. And a heat insulating material 4 is arranged on one side of the semiconductor temperature control component, which is far away from the heat radiating fan 6.
The temperature control method of the temperature control device comprises the following steps: step (a) setting a target control temperature value according to the current state of the semiconductor temperature control component 60; the sampling unit in the step (b) acquires a voltage signal sent by a temperature sensor in the semiconductor temperature control part 60; the PID control unit outputs a regulation signal to drive the semiconductor temperature control component 60 to refrigerate or heat by adopting a PID closed-loop control algorithm according to the voltage sampling value and the target control temperature value; and (d) after PID control is carried out, judging whether the current temperature is stable, if so, sending a correction ending signal by the PID control unit, carrying out temperature measurement operation by a temperature measuring instrument, and if not, repeating the steps (a) to (c) in sequence so as to keep the temperature of the black body panel 40 stable.
The semiconductor temperature control component 60 is processed in an integrated structure form, and comprises a blackbody panel 40 with a blackbody material coated on a basal surface on one side, 1 to 2 buried holes 30 are designed in the bottom surface of the lateral side, temperature sensors are placed in the buried holes, and a heat dissipation tooth-shaped structure 10 is designed on the basal surface on the other side of the semiconductor temperature control component. The structure has the temperature control and heat dissipation functions, and the shock and vibration resistance is enhanced. The semiconductor temperature control component 60 is manufactured into an integrated structure through the previous processing, and the integrated structure simplifies the assembly process, is beneficial to reducing the labor cost and effectively improves the batch production efficiency of the temperature measuring instrument; the integral structure effectively enhances the shock and vibration resistance, effectively reduces the loss of the equipment in transportation, simultaneously enlarges the application range of the equipment and enhances the adaptability to complex environments; the heat dissipation structure and the corresponding matched fan solve the heat dissipation problem of the equipment, so that the equipment can be normally used in a high-temperature environment.
In order to improve the temperature control efficiency, a cooling fan can be designed to accelerate the heat dissipation of the whole system and further improve the temperature control efficiency; the temperature sensor, the fan and the semiconductor temperature control component are connected to the PID control unit, real-time temperature data of the black body panel can be acquired from the temperature sensor through the PID control unit, and the temperature of the black body panel is adjusted by controlling the temperature of the semiconductor temperature control component, so that the effect of adjusting the temperature is achieved.
The foregoing is merely a preferred embodiment of the invention and is not intended to limit the invention in any manner. Those skilled in the art can make numerous possible variations and modifications to the present invention, or modify equivalent embodiments, using the methods and techniques disclosed above, without departing from the scope of the present invention. Therefore, all equivalent changes made according to the shape, structure and principle of the present invention without departing from the technical scheme of the present invention shall be covered by the protection scope of the present invention.
Claims (8)
1. The temperature control device comprises a temperature measuring instrument, a semiconductor temperature control component, a black body panel, a temperature sensor, a PID control unit and a motor drive unit, wherein the temperature measuring instrument is provided with a shell (1), and is characterized in that the shell (1) of the temperature measuring instrument is internally provided with the integrated semiconductor temperature control component (60), the basal surface of one side of the semiconductor temperature control component (60) is provided with the black body panel (40), the semiconductor temperature control component (60) is internally provided with the temperature sensor, the basal surface of the other side of the semiconductor temperature control component (60) is of a heat dissipation tooth-shaped structure (10), the output end of the PID control unit is connected with the input end of the motor drive unit, the motor drive unit is connected with the input end of the shell (1) of the temperature measuring instrument through a filtering unit, and the.
2. The temperature control device according to claim 1, wherein the side of the blackbody panel (40) far away from the semiconductor temperature control part (60) is coated with a blackbody material (50), the semiconductor temperature control part (60) is provided with a buried hole (30) in the basal surface (20) of the blackbody panel (40), and a temperature sensor is arranged in the buried hole (30).
3. The temperature control device according to claim 2, wherein the base of the semiconductor temperature control component (60) is made of aluminum alloy, and the number of the buried holes (30) is 1 to 2.
4. The temperature control device according to claim 1, wherein the front surface of the housing (1) comprises the black body window (2) and the display (3), the back surface of the housing (1) comprises the air inlet (7) of the cooling fan, the back surface of the housing (1) comprises the power button (8), and the top surface of the housing (1) comprises the air outlet (9).
5. The temperature control device according to claim 1, wherein the housing (1) comprises a main control module (5) and a heat dissipation fan (6), the heat dissipation fan (6) is disposed at one side of the heat dissipation tooth structure (10) of the semiconductor temperature control component, and the semiconductor temperature control component (60), the temperature sensor and the heat dissipation fan (6) are respectively connected to the PID control unit of the main control module (5).
6. The temperature control device according to claim 5, characterized in that the side of the semiconductor temperature control component remote from the cooling fan (6) is provided with a heat insulating material (4).
7. A temperature control method applied to the temperature control device according to any one of claims 1 to 6, comprising: setting a target control temperature value according to the current state of a semiconductor temperature control component (60); the sampling unit acquires a voltage signal sent by a temperature sensor in a semiconductor temperature control component (60); and (c) the PID control unit outputs a regulation and control signal to drive the semiconductor temperature control component (60) to refrigerate or heat according to the voltage sampling value and the target control temperature value by adopting a PID closed-loop control algorithm, so that the temperature of the blackbody panel (40) is kept stable.
8. The temperature control method according to claim 7, further comprising the step (d) of judging whether the current temperature is stable after performing PID control, wherein if the temperature is stable, the PID control unit sends a correction ending signal, the temperature measuring instrument performs temperature measuring operation, and if the temperature is unstable, the steps (a) to (c) are sequentially repeated.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010861104.7A CN111736640A (en) | 2020-08-25 | 2020-08-25 | Temperature control device and temperature control method |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202010861104.7A CN111736640A (en) | 2020-08-25 | 2020-08-25 | Temperature control device and temperature control method |
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| CN111736640A true CN111736640A (en) | 2020-10-02 |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116803546A (en) * | 2023-08-25 | 2023-09-26 | 苏州市鸿正智能科技有限公司 | Coating equipment with temperature control function |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN203070124U (en) * | 2011-12-16 | 2013-07-17 | 中国航空工业集团公司洛阳电光设备研究所 | High-power precise temperature control circuit employing semiconductor cooler |
| CN103954365A (en) * | 2014-04-08 | 2014-07-30 | 洛阳理工学院 | Surface radiation source black body |
| CN104422520A (en) * | 2013-08-21 | 2015-03-18 | 北京航天计量测试技术研究所 | High-precision multi-mode blackbody radiation source |
-
2020
- 2020-08-25 CN CN202010861104.7A patent/CN111736640A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN203070124U (en) * | 2011-12-16 | 2013-07-17 | 中国航空工业集团公司洛阳电光设备研究所 | High-power precise temperature control circuit employing semiconductor cooler |
| CN104422520A (en) * | 2013-08-21 | 2015-03-18 | 北京航天计量测试技术研究所 | High-precision multi-mode blackbody radiation source |
| CN103954365A (en) * | 2014-04-08 | 2014-07-30 | 洛阳理工学院 | Surface radiation source black body |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116803546A (en) * | 2023-08-25 | 2023-09-26 | 苏州市鸿正智能科技有限公司 | Coating equipment with temperature control function |
| CN116803546B (en) * | 2023-08-25 | 2023-12-08 | 苏州市鸿正智能科技有限公司 | Coating equipment with temperature control function |
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Application publication date: 20201002 |
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